Test fixture
By designing a test fixture that includes a base test bench, a test probe row and a detachable chip accommodation row, the problem of changing the test fixture in the prior art to adapt to the chips of different packaging types is solved, and flexible testing of chips of different packaging types is achieved.
Patent Information
- Application Number
- CN202420867544.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-04-24
AI Technical Summary
When testing different types of packaging chips, existing test fixtures need to be replaced, resulting in poor applicability.
A test fixture is designed, including a base test bench, a test probe row and a chip accommodation row. By setting a first groove and a second groove on the base test bench and assembling a test probe row in the second groove, the chip accommodation row can be detached in the first groove, and testing of chips of different packaging types can be realized.
Testing of different packaging types of chips can be done without changing the test fixture, improving the applicability of the test fixture.
Smart Images
Figure CN222561731U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip testing, and in particular to a testing fixture. Background Art
[0002] In the semiconductor packaging process, after the chip is packaged, it is necessary to perform a test process on the chip to determine whether it is a good product. Usually, the chip to be tested is placed in the test frame of a special test fixture to fix the chip position. After the chip position is fixed, the upper cover of the test fixture is pressed down to press the chip so that the chip pins are fully in contact with the test probes of the bottom test board, thereby achieving electrical connection and performing electrical testing on the chip.
[0003] However, when testing different types of packaged chips, existing test fixtures have different test contacts. For example, BGA package has solder ball test points, while LGA package has pad test points. Different test fixtures need to be replaced to test the corresponding packaged chips, resulting in poor applicability of the test fixtures. Utility Model Content
[0004] The purpose of the utility model is to provide a test fixture, which can test different packaging types without changing the test fixture and has better applicability.
[0005] The embodiment of the utility model is achieved as follows:
[0006] In the first aspect, the utility model provides a test fixture, including a base test platform, a test probe row and a chip accommodating row, wherein a first groove is arranged on the base test platform, a second groove is arranged in the middle of the bottom wall of the first groove, the test probe row is correspondingly assembled in the second groove and is used to connect with an external test circuit, the chip accommodating row is detachably assembled in the first groove and covers the test probe row, and a chip accommodating groove for accommodating a chip to be tested is arranged on the chip accommodating row, and the test probe row is used to make electrical contact with the chip to be tested.
[0007] In an optional embodiment, the shape of the chip accommodating row is adapted to the shape of the first groove, a plurality of through holes are provided on the bottom wall of the chip accommodating groove, a plurality of probe bumps are provided on the test probe row, and the plurality of probe bumps are respectively arranged in the plurality of through holes so that the plurality of probe bumps are in point contact with the chip to be tested.
[0008] In an optional embodiment, the shape of the test probe row is adapted to the shape of the second groove, and a test pad is also provided on the edge of the second groove, and the test pad is used to be electrically connected to an external test circuit. The edge of the test probe row is provided with wing contacts, and the wing contacts are electrically connected to the probe bumps, and the wing contacts are correspondingly engaged with the test pads.
[0009] In an optional embodiment, there are multiple test pads, which are arranged around the periphery of the second groove, and there are multiple wing contacts, which are arranged around the periphery of the test probe row and protrude outward.
[0010] In an optional implementation, the test pad is spaced apart from a side wall of the first groove.
[0011] In an optional embodiment, the first groove, the second groove and the chip receiving groove are all rectangular, a plurality of the probe bump arrays are distributed on the test probe row, and a plurality of the through hole arrays are distributed in the chip receiving groove.
[0012] In an optional embodiment, the test fixture further includes a pressing cover plate, which is covered on the base test platform and is used to press the chip to be tested.
[0013] In an optional embodiment, a hinge is provided on one side edge of the pressed cover plate, and the hinge is connected to one side edge of the base test platform so that the pressed cover plate is hinged to the base test platform.
[0014] In an optional embodiment, a buckle is further provided on one side edge of the pressed cover away from the hinge, and a slot is further provided on one side edge of the base test platform away from the hinge, and the buckle is correspondingly buckled in the slot.
[0015] In an optional embodiment, a pressing boss is further provided in the middle of the bottom side of the pressing cover plate, and the pressing boss protrudes relative to the pressing cover plate toward the base test platform for pressing on the surface of the chip to be tested.
[0016] The beneficial effects of the embodiments of the utility model include:
[0017] The test fixture provided by the embodiment of the utility model has a first groove and a second groove on the base test table, the second groove is located in the middle of the bottom wall of the first groove, the test probe row is correspondingly assembled in the second groove, the chip accommodating row can be detachably assembled in the first groove, and covered on the test probe row, and a chip accommodating groove is provided on the chip accommodating row, and the chip accommodating groove is partially connected to the bottom side of the chip accommodating groove, so that the test probe row can be in electrical contact with the chip to be tested in the chip accommodating groove. In actual testing, when testing BGA packaged chips, the chip to be tested can be loaded into the chip accommodating groove, and tested after pressing, and when testing LGA packaged chips, the chip accommodating row can be directly removed, and the chip to be tested can be directly placed on the test probe row for testing. Compared with the prior art, the utility model can be tested for different packaging types without changing the test fixture, and has better applicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 A schematic diagram of the overall structure of the test fixture provided by the embodiment of the utility model;
[0020] Figure 2 A schematic diagram of a partial decomposition structure of a test fixture provided in an embodiment of the utility model;
[0021] Figure 3 for Figure 1 Schematic diagram of the structure of the middle pressure cover plate.
[0022] icon:
[0023] 100-test fixture; 110-base test platform; 111-first groove; 113-second groove; 115-test pad; 117-card slot; 130-test probe row; 131-probe bump; 133-flank contact; 150-chip accommodating row; 151-chip accommodating slot; 153-through hole; 170-pressed cover; 171-hinge; 173-clip; 175-pressed boss. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0027] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] As disclosed in the background technology, different test fixtures are usually used for BGA (Ball Grid Array) packaging and LGA (Land Grid Array) packaging in the prior art. In the BGA packaging, the pins of the chip are arranged in a grid at the bottom of the chip in the form of spherical solder joints, so it is necessary to put them into grooves so that the probes can be inserted into the grooves and make electrical contact with the pins. In the LGA packaging, the bottom of the chip is not inserted into the socket of the PCB board through pins, but is connected to the corresponding pads on the circuit board through a series of closely arranged contacts (tentacle-shaped or flat-topped), so it needs to be directly in contact with the probe. In the prior art, different test fixtures need to be used for different packaging structures to better achieve electrical connection with the probe, which is very troublesome.
[0031] In order to solve the above problems, the utility model provides a novel test fixture, which can realize the test of BGA package and LGA package. The test fixture is introduced in detail below.
[0032] Please refer to Figures 1 to 3 This embodiment provides a test fixture 100 that can test different package types without replacing the test fixture 100, and has better applicability.
[0033] The test fixture 100 provided in this embodiment includes a base test platform 110, a test probe row 130 and a chip accommodating row 150. A first groove 111 is provided on the base test platform 110, and a second groove 113 is provided in the middle of the bottom wall of the first groove 111. The test probe row 130 is correspondingly assembled in the second groove 113 and is used to connect with an external test circuit. The chip accommodating row 150 is detachably assembled in the first groove 111 and covers the test probe row 130. A chip accommodating groove 151 for accommodating a chip to be tested is provided on the chip accommodating row 150, and the test probe row 130 is used to make electrical contact with the chip to be tested.
[0034] It should be noted that the second groove 113 is located in the middle of the bottom wall of the first groove 111, and the test probe row 130 is correspondingly assembled in the second groove 113. The chip accommodating row 150 can be detachably assembled in the first groove 111 and covered on the test probe row 130. The chip accommodating row 150 is provided with a chip accommodating groove 151, so that the test probe row 130 can be in electrical contact with the chip to be tested in the chip accommodating groove 151. In actual testing, when testing a BGA packaged chip, the chip to be tested can be loaded into the chip accommodating groove 151 and tested after pressing. When testing an LGA packaged chip, the chip accommodating row 150 can be directly removed, and the chip to be tested can be directly placed on the test probe row 130 for testing.
[0035] It is worth noting that the depth of the second groove 113 here matches the thickness of the test probe row 130 , and the depth of the first groove 111 matches the thickness of the chip receiving row 150 .
[0036] In the present embodiment, the shape of the chip accommodating row 150 is adapted to the shape of the first groove 111, the bottom wall of the chip accommodating groove 151 is provided with a plurality of through holes 153, and a plurality of probe bumps 131 are provided on the test probe row 130, and the plurality of probe bumps 131 are correspondingly arranged in the plurality of through holes 153, so that the plurality of probe bumps 131 are in point contact with the chip to be tested. Specifically, the chip accommodating row 150 can be just embedded in the first groove 111, and the plurality of through holes 153 can penetrate the chip accommodating groove 151. After the chip accommodating row 150 is installed in place, the plurality of probe bumps 131 can be correspondingly extended into the plurality of through holes 153, and the pin solder balls at the bottom of the chip to be tested (BGA package) can also be correspondingly extended into the plurality of through holes 153, so that the plurality of probe bumps 131 are in electrical contact with the chip to be tested, thereby achieving testing. When testing the LGA package, the chip accommodating row 150 can be removed to directly expose the multiple probe bumps 131, and the chip to be tested can be directly placed on the probe bumps 131 to achieve point-to-surface contact, and the test can also be implemented.
[0037] In this embodiment, the shape of the test probe row 130 is adapted to the shape of the second groove 113, and the edge of the second groove 113 is also provided with a test pad 115, and the test pad 115 is used to be electrically connected to an external test circuit, and the edge of the test probe row 130 is provided with a wing contact 133, and the wing contact 133 is electrically connected to the probe bump 131, and the wing contact 133 is correspondingly engaged with the test pad 115. Specifically, the test pad 115 is connected to the test circuit on the machine, so that the probe bump 131 is electrically connected to the test circuit, so as to better realize chip testing.
[0038] In this embodiment, there are multiple test pads 115, which are arranged around the periphery of the second groove 113, and there are multiple wing contacts 133, which are arranged around the periphery of the test probe row 130 and protrude outward. Specifically, the wing contacts 133 are sheet-like structures. After the test probe row 130 is installed in place, the wing contacts 133 can overlap the corresponding test pads 115, thereby realizing the electrical connection between the test probe row 130 and the test pads 115.
[0039] In this embodiment, the test pad 115 is spaced apart from the side wall of the first groove 111. Specifically, the size of the first groove 111 is larger than the size of the second groove 113, and the test pad 115 is spaced apart from the side wall of the first groove 111, so that sufficient installation space is left. This arrangement ensures that the wing contacts 133 will not interfere with the side wall of the first groove 111 when overlapping, and ensures the smooth installation of the test probe row 130.
[0040] In this embodiment, the first groove 111, the second groove 113 and the chip receiving groove 151 are all rectangular, a plurality of probe bumps 131 are arrayed on the test probe row 130, and a plurality of through holes 153 are arrayed in the chip receiving groove 151. Specifically, in this embodiment, the test probe row 130, the chip receiving row 150 and the chip to be tested are all conventional rectangular structures, and the size of the first groove 111 is larger than the size of the second groove 113, and the size of the second groove 113 is larger than the size of the chip receiving groove 151.
[0041] Furthermore, the test fixture 100 further includes a pressing cover plate 170, which is covered on the base test platform 110 and used to press the chip to be tested. Specifically, the pressing cover plate 170 can be freely pressed on the base test platform 110, and can also be freely removed, so as to facilitate the disassembly and assembly of the chip to be tested.
[0042] In this embodiment, a hinge 171 is provided on one side edge of the pressed cover plate 170, and the hinge 171 is connected to one side edge of the substrate test platform 110, so that the pressed cover plate 170 is hinged to the substrate test platform 110. Specifically, the pressed cover plate 170 is hinged to the substrate test platform 110 by the hinge 171, which, on the one hand, realizes the installation and positioning of the pressed cover plate 170, so that the pressed cover plate 170 and the substrate test platform 110 are an integral structure, and on the other hand, it is also convenient for the pressed cover plate 170 to be opened and closed.
[0043] In this embodiment, a buckle 173 is further provided on one side edge of the press cover plate 170 away from the hinge 171, and a slot 117 is further provided on one side edge of the substrate test platform 110 away from the hinge 171, and the buckle 173 is correspondingly buckled in the slot 117. Specifically, the buckle 173 is detachably buckled in the slot 117, and when the buckle 173 is buckled into the slot 117, the press cover plate 170 can be firmly covered on the substrate test platform 110, ensuring the press effect on the chip to be tested.
[0044] In this embodiment, a pressing boss 175 is further provided at the middle of the bottom side of the pressing cover plate 170. The pressing boss 175 protrudes relative to the pressing cover plate 170 toward the substrate test platform 110 and is used to be pressed on the surface of the chip to be tested. Specifically, the shape of the pressing boss 175 is adapted to the shape of the chip to be tested, so that the chip to be tested can be pressed.
[0045] It should be noted that, in this embodiment, the pressing boss 175 can be made of elastic material, so that it has a certain elastic margin, and will not damage the chip under test while ensuring the pressing of the chip under test. Of course, in other preferred embodiments of the utility model, the setting of the pressing cover plate 170 can also be omitted, and other pressing fixtures with split structures can be used to press the chip under test, which has a better degree of freedom.
[0046] In summary, the present embodiment provides a test fixture 100, wherein a first groove 111 and a second groove 113 are provided on a base test table 110, wherein the second groove 113 is located in the middle of the bottom wall of the first groove 111, and a test probe row 130 is correspondingly assembled in the second groove 113, and a chip accommodating row 150 is detachably assembled in the first groove 111 and covers the test probe row 130, and a chip accommodating groove 151 is provided on the chip accommodating row 150, and a portion of the chip accommodating groove 151 is connected to the bottom side of the chip accommodating groove 151, so that the test probe row 130 can be in electrical contact with the chip to be tested in the chip accommodating groove 151. In actual testing, when testing a BGA packaged chip, the chip to be tested can be loaded into the chip accommodating groove 151 and tested after pressing, and when testing an LGA packaged chip, the chip accommodating row 150 can be directly removed, and the chip to be tested can be directly placed on the test probe row 130 for testing. Compared with the prior art, the present invention can test different packaging types without replacing the test fixture 100, and has better applicability.
[0047] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A test fixture, characterized in that: It includes a base test platform, a test probe row and a chip accommodating row, wherein a first groove is arranged on the base test platform, a second groove is arranged in the middle of the bottom wall of the first groove, the test probe row is correspondingly assembled in the second groove and is used to connect with an external test circuit, the chip accommodating row is detachably assembled in the first groove and covers the test probe row, and a chip accommodating groove for accommodating a chip to be tested is arranged on the chip accommodating row, and the test probe row is used to make electrical contact with the chip to be tested.
2. The test fixture according to claim 1, characterized in that: The shape of the chip accommodating row is adapted to the shape of the first groove, a plurality of through holes are provided on the bottom wall of the chip accommodating groove, a plurality of probe bumps are provided on the test probe row, and the plurality of probe bumps are respectively arranged in the plurality of through holes so that the plurality of probe bumps are in point contact with the chip to be tested.
3. The test fixture according to claim 2, characterized in that: The shape of the test probe row is adapted to the shape of the second groove. A test pad is also provided at the edge of the second groove. The test pad is used to be electrically connected to an external test circuit. The edge of the test probe row is provided with wing contacts. The wing contacts are electrically connected to the probe bumps, and the wing contacts are correspondingly engaged with the test pads.
4. The test fixture according to claim 3, characterized in that: There are a plurality of test pads, which are arranged around the periphery of the second groove. There are a plurality of wing contacts, which are arranged around the periphery of the test probe row and protrude outward.
5. The test fixture according to claim 3, characterized in that: The test pad is spaced apart from a side wall of the first groove.
6. The test fixture according to claim 3, characterized in that: The first groove, the second groove and the chip receiving groove are all rectangular, a plurality of probe bump arrays are distributed on the test probe row, and a plurality of through hole arrays are distributed in the chip receiving groove.
7. The test fixture according to any one of claims 1 to 6, characterized in that: The test fixture further comprises a pressing cover plate, which is covered on the base test platform and used for pressing the chip to be tested.
8. The test fixture according to claim 7, characterized in that: A hinge is provided on one side edge of the pressed cover plate, and the hinge is connected to one side edge of the substrate test platform so that the pressed cover plate is hinged to the substrate test platform.
9. The test fixture according to claim 8, characterized in that: A buckle is also provided on one side edge of the pressed cover away from the hinge, and a slot is also provided on one side edge of the base test platform away from the hinge, and the buckle is correspondingly buckled in the slot.
10. The test fixture according to claim 7, characterized in that: A pressing boss is also provided in the middle of the bottom side of the pressing cover plate. The pressing boss protrudes relative to the pressing cover plate toward the base test platform and is used for pressing on the surface of the chip to be tested.