Computer double-heat-dissipation device

Abstract

The utility model belongs to the technical field of computers, and particularly relates to a computer double-heat-dissipation device which comprises a computer case and a front cover plate, the front cover plate is installed on the front face of the computer case, and the inner rear end of the computer case is provided with the double-heat-dissipation device. According to the computer double-heat-dissipation device, a water pump is started, cooling liquid in a liquid storage box is pumped into a liquid conveying pipe through a liquid pumping pipe, the cooling liquid flows into a snake-shaped heat dissipation pipe, heat conducted out by a heat conduction plate is rapidly absorbed and cooled through the snake-shaped heat dissipation pipe, and therefore heat dissipation is conducted on a mainboard and the like in a computer case; the cooling liquid after heat absorption flows back into the liquid storage box through a backflow pipe, circulation use of the cooling liquid is achieved, a snake-shaped heat dissipation pipe cools air on the back face of a heat conduction plate when carrying out heat absorption and cooling on the heat conduction plate, a heat dissipation fan is started to blow cold air into the computer case through air inlet holes in the heat conduction plate, and the heat dissipation efficiency is improved. And therefore, electronic components in the computer case can be better cooled and radiated.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a double heat dissipation device for computers. Background Art

[0002] At present, most edge computing devices have a fanless cooling design. The heat generated by the processor is transferred to the surface of the outer shell through heat pipes. The surface of the outer shell is equipped with heat dissipation fins, and the heat is dissipated to the outside air through the surface of the heat dissipation fins. The total surface area of ​​the heat dissipation fins determines the heat dissipation capacity, which also determines the maximum power consumption of the processor. Therefore, when the actual project needs to improve the computing performance of the edge device processor, since the higher the computing performance of the processor, the higher the heat generated, this requires increasing the total surface area of ​​the outer shell fins to meet the heat dissipation requirements. Increasing the total surface area of ​​the outer shell heat dissipation fins requires redesigning and processing the outer shell, which increases time and financial costs.

[0003] For example, Chinese patent announcement number CN220933456U discloses a computer dual heat dissipation device. When in use, the heat emitted by the operation processor in the PCB circuit board is conducted to the heat dissipation top cover and dissipated through the fins on the heat dissipation top cover, which can be regarded as the first heat dissipation. Under the blowing action of the axial flow fan, the colder air from the outside is blown on the fins, and the heat on the fins is quickly taken away and flows into the external environment through the surroundings of the axial flow fan, which can be regarded as the second heat dissipation, so it is called "double heat dissipation". The hollow arrows shown in the figure are the flow direction of the colder air from the outside, and the black solid arrows in the figure are the flow direction of the air that is heated after heat exchange with the fins. It can be seen that by adding an axial flow fan, the heat dissipation efficiency of the fins can be effectively improved. In this way, without increasing the total heat dissipation area of ​​the fins, a processor with higher computing performance can be used without redesigning the housing and the heat dissipation top cover, and the heat dissipation requirements of the processor with improved computing performance can also be met.

[0004] However, the computer dual heat dissipation device in the above application dissipates heat through an axial fan in combination with heat dissipation fins. However, when the overall temperature is high in summer, its heat dissipation efficiency will decrease. Therefore, it has certain limitations.

[0005] For this reason, we urgently need to provide a computer dual heat dissipation device. Utility Model Content

[0006] The purpose of the utility model is to provide a computer dual heat dissipation device to solve the problem that the computer dual heat dissipation device proposed in the above background technology uses an axial fan and heat dissipation fins to dissipate heat, but its heat dissipation efficiency will decrease when the overall temperature is high in summer.

[0007] To achieve the above purpose, the utility model provides the following technical solutions: a computer dual heat dissipation device, including a computer case and a front cover, the front cover is installed on the front of the computer case, and the internal rear end of the computer case is provided with a dual heat dissipation device.

[0008] The dual heat dissipation device includes a water-cooling heat dissipation unit and an air-cooling heat dissipation unit.

[0009] The water-cooling heat dissipation unit includes a heat conduction plate, a liquid storage tank, a water pump, and a heat dissipation component. The heat conduction plate is installed on the inner rear side of the computer case, the liquid storage tank is installed on the inner rear end of the computer case, the water pump is installed on the top left side of the liquid storage tank, and the heat dissipation component is installed on the back of the heat conduction plate.

[0010] A further improvement is that the heat dissipation assembly includes an infusion tube, a serpentine heat dissipation pipe, and a return pipe. The infusion tube is installed at the water outlet of the water pump, the serpentine heat dissipation pipe is installed on the back of the heat conduction plate, and its left end is connected to the top of the infusion tube, and the return pipe is fixedly connected to the right end of the serpentine heat dissipation pipe, and its bottom extends into the interior of the liquid storage tank.

[0011] A further improvement is that the interior of the liquid storage tank is filled with coolant, and the suction pipe of the water pump extends into the inner bottom of the liquid storage tank. The water pump is started to pump the coolant inside the liquid storage tank to the inside of the infusion pipe through the suction pipe, and then flows to the inside of the serpentine heat dissipation pipe. The heat conducted away by the heat conduction plate is quickly absorbed and cooled by the serpentine heat dissipation pipe, thereby dissipating the heat of the motherboard and the like inside the computer case. The coolant after absorbing heat flows back into the interior of the liquid storage tank through the reflux pipe, thereby realizing the recycling of the coolant.

[0012] A further improvement is that a through groove is opened at the bottom of the back side of the computer case, and a refrigerator is installed on the back side of the liquid storage tank and is located inside the through groove. The refrigerator is used to cool the coolant after returning to the liquid storage tank to ensure the heat dissipation effect of the coolant.

[0013] A further improvement is that the air-cooling heat dissipation unit includes a ventilation port, a cooling fan, and a dust screen, wherein the ventilation port is opened on the upper back of the computer case, the cooling fan is installed on the rear inner wall of the computer case, and the dust screen is installed inside the ventilation port.

[0014] A further improvement is that there are two groups of air-cooling heat dissipation units, which are symmetrically installed on the upper and lower sides of the back of the computer case with the center line of the computer case as the axis, and the ventilation port and the cooling fan are on the same horizontal line.

[0015] A further improvement is that air inlet holes are evenly opened on the heat conducting plate. When the serpentine heat pipe absorbs heat and cools the heat conducting plate, it also cools the air on the back of the heat conducting plate. The cooling fan is started to blow cold air into the computer case through the air inlet holes on the heat conducting plate, thereby better cooling and dissipating the heat of the electronic components inside the computer case. The dustproof net is provided to prevent dust from entering the computer case through the ventilation port and causing damage to the internal electronic components.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The computer dual heat dissipation device starts the water pump to pump the coolant in the liquid storage tank to the inside of the liquid delivery tube through the liquid extraction pipe, and then flows to the inside of the serpentine heat dissipation pipe. The heat conducted by the heat conduction plate is quickly absorbed and cooled by the serpentine heat dissipation pipe, thereby dissipating the heat of the motherboard and the like inside the computer case. The coolant after absorbing the heat flows back into the liquid storage tank through the reflux pipe, thereby realizing the recycling of the coolant.

[0018] 2. The computer dual heat dissipation device, the serpentine heat pipe absorbs heat and cools the heat conducting plate, and also cools the air on the back of the heat conducting plate. The cooling fan is started to blow cold air through the air inlet holes on the heat conducting plate to the inside of the computer case, so as to better cool and dissipate the heat of the electronic components inside the computer case. The dustproof net is provided to prevent dust from entering the computer case through the ventilation port and causing damage to the internal electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view structural schematic diagram of the utility model;

[0020] Figure 2 It is a rear view structural schematic diagram of the utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional split structure of the dual heat dissipation device of the utility model;

[0022] Figure 4 It is a schematic diagram of the independent rear cross-sectional structure of the water-cooling heat dissipation unit of the present invention.

[0023] In the figure: 1. computer case; 2. front cover; 301. heat conduction plate; 302. liquid storage tank; 303. water pump; 304. heat dissipation component; 3041. infusion tube; 3042. serpentine heat pipe; 3043. return pipe; 305. refrigerator; 306. ventilation port; 307. cooling fan; 308. dust net. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0026] Embodiment 1:

[0027] A computer dual heat dissipation device comprises a computer case 1 and a front cover plate 2. The front cover plate 2 is installed on the front side of the computer case 1. The rear end of the computer case 1 is provided with a dual heat dissipation device.

[0028] The dual heat dissipation device includes a water-cooled heat dissipation unit.

[0029] The water cooling unit includes a heat conducting plate 301, a liquid storage tank 302, a water pump 303, and a heat dissipation assembly 304. The heat conducting plate 301 is installed at the inner rear side of the computer case 1, the liquid storage tank 302 is installed at the inner rear end of the computer case 1, the water pump 303 is installed at the top left side of the liquid storage tank 302, and the heat dissipation assembly 304 is installed on the back of the heat conducting plate 301.

[0030] The heat dissipation assembly 304 includes an infusion tube 3041, a serpentine heat dissipation pipe 3042, and a return pipe 3043. The infusion tube 3041 is installed at the water outlet of the water pump 303, the serpentine heat dissipation pipe 3042 is installed on the back of the heat conduction plate 301, and its left end is connected to the top of the infusion tube 3041, and the return pipe 3043 is fixedly connected to the right end of the serpentine heat dissipation pipe 3042, and its bottom extends into the interior of the liquid storage tank 302.

[0031] The interior of the liquid storage tank 302 is filled with cooling liquid, and the suction pipe of the water pump 303 extends into the bottom of the interior of the liquid storage tank 302. The water pump 303 is started to pump the cooling liquid in the liquid storage tank 302 to the interior of the infusion pipe 3041 through the suction pipe, and then flows to the interior of the serpentine heat dissipation pipe 3042. The heat conducted away by the heat conduction plate 301 is quickly absorbed and cooled by the serpentine heat dissipation pipe 3042, thereby dissipating the heat of the motherboard and the like inside the computer case 1. The cooling liquid after absorbing heat flows back into the interior of the liquid storage tank 302 through the reflux pipe 3043, thereby realizing the recycling of the cooling liquid.

[0032] A through groove is provided at the bottom of the back of the computer case 1, and a refrigerator 305 is installed on the back of the liquid storage tank 302 and is located inside the through groove. The refrigerator 305 is used to cool the coolant after returning from the liquid storage tank 302 to ensure the heat dissipation effect of the coolant.

[0033] Embodiment 2:

[0034] Based on the first embodiment, the dual heat dissipation device includes an air-cooled heat dissipation unit, which includes a ventilation port 306, a cooling fan 307, and a dustproof net 308. The ventilation port 306 is opened on the upper back of the computer case 1, the cooling fan 307 is installed on the rear inner wall of the computer case 1, and the dustproof net 308 is installed inside the ventilation port 306.

[0035] There are two groups of air-cooling heat dissipation units, which are symmetrically installed on the upper and lower sides of the back of the computer case 1 with the center line of the computer case 1 as the axis, and the ventilation port 306 and the cooling fan 307 are on the same horizontal line.

[0036] Air inlet holes are evenly distributed throughout the heat conducting plate 301. When the serpentine heat pipe 3042 absorbs heat and cools the heat conducting plate 301, it also cools the air on the back of the heat conducting plate 301. The cooling fan 307 is started to blow cold air into the computer case 1 through the air inlet holes on the heat conducting plate 301, thereby better cooling and dissipating the heat of the electronic components inside the computer case 1. The dustproof net 308 is provided to prevent dust from entering the computer case 1 through the ventilation port 306 and causing damage to the internal electronic components.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A computer dual heat dissipation device, comprising a computer case (1) and a front cover (2), wherein the front cover (2) is mounted on the front of the computer case (1), and is characterized in that: The rear end of the computer case (1) is provided with a double heat dissipation device; The dual heat dissipation device includes a water-cooling heat dissipation unit and an air-cooling heat dissipation unit; The water-cooling heat dissipation unit comprises a heat conduction plate (301), a liquid storage tank (302), a water pump (303), and a heat dissipation component (304); the heat conduction plate (301) is installed at the inner rear side of the computer case (1); the liquid storage tank (302) is installed at the inner rear end of the computer case (1); the water pump (303) is installed at the top left side of the liquid storage tank (302); and the heat dissipation component (304) is installed at the back side of the heat conduction plate (301).

2. A computer dual heat sink device according to claim 1, characterized in that: The heat dissipation assembly (304) comprises a liquid infusion tube (3041), a serpentine heat dissipation tube (3042), and a return pipe (3043). The liquid infusion tube (3041) is installed at the water outlet of the water pump (303). The serpentine heat dissipation tube (3042) is installed at the back of the heat conduction plate (301), and the left end thereof is connected to the top of the liquid infusion tube (3041). The return pipe (3043) is fixedly connected to the right end of the serpentine heat dissipation tube (3042), and the bottom thereof extends into the interior of the liquid storage tank (302).

3. A computer dual heat sink device according to claim 1, characterized in that: The interior of the liquid storage tank (302) is filled with cooling liquid, and the liquid suction pipe of the water pump (303) extends into the inner bottom of the liquid storage tank (302).

4. A computer dual heat sink device according to claim 1, characterized in that: A through slot is provided at the bottom of the back of the computer case (1), and a cooler (305) is installed on the back of the liquid storage tank (302) and is located inside the through slot.

5. A computer dual heat sink device according to claim 1, characterized in that: The air-cooling heat dissipation unit comprises a ventilation port (306), a heat dissipation fan (307), and a dust-proof net (308); the ventilation port (306) is opened on the upper back of the computer case (1); the heat dissipation fan (307) is installed on the rear inner wall of the computer case (1); and the dust-proof net (308) is installed inside the ventilation port (306).

6. A computer dual heat sink device according to claim 5, characterized in that: There are two groups of air-cooling and heat-dissipating units, which are symmetrically installed on the upper and lower sides of the back of the computer case (1) with the center line of the computer case (1) as the axis, and the ventilation port (306) and the heat dissipating fan (307) are on the same horizontal line.

7. A computer dual heat sink device according to claim 1, characterized in that: Air inlet holes are evenly distributed throughout the heat conducting plate (301).

Images