Surface-mounted ceramic resistor

Abstract

The utility model discloses a surface-mounted ceramic resistor, and particularly relates to the technical field of surface-mounted resistors, the surface-mounted ceramic resistor comprises a ceramic substrate, a ceramic resistor chip is arranged in the ceramic substrate, outer electrodes are arranged on two sides of the ceramic resistor chip, and a protection mechanism is arranged on the surface of the ceramic substrate. Wherein a heat dissipation mechanism is arranged at the bottom of the ceramic resistor chip and comprises a first heat dissipation plate arranged at the bottom of the ceramic resistor chip, a plurality of heat dissipation strips are arranged at the bottom of the first heat dissipation plate, a plurality of heat dissipation holes are formed in the surfaces of the heat dissipation strips, and a second heat dissipation plate is arranged at the bottoms of the heat dissipation strips. According to the utility model, the heat dissipation efficiency can be improved, so that the overall temperature of the resistor is quickly reduced, the fireproof effect is enhanced, the ceramic substrate is protected from being damaged by external factors, and the service life of the ceramic substrate is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip resistors, and more specifically, to a chip ceramic resistor. Background Art

[0002] Chip ceramic resistors have the advantages of small size, light weight, high installation density, strong shock resistance, strong anti-interference ability, and good high-frequency characteristics. Existing chip ceramic resistors usually have standard specifications and standard dimensions. However, due to the different final application products, the required specific power is also different. Therefore, chip ceramic resistors need to be developed and customized according to the corresponding products, resulting in high costs. In some applications, workers also need to manually weld to achieve connection and fixation, which will affect work efficiency.

[0003] Patent application publication number: CN220474407U chip ceramic resistor, by connecting and fixing the first electrode of the plug-in ceramic resistor chip to one end of the metal lead through soldering, and then wrapping the metal lead and the plug-in ceramic resistor chip with a molten insulating layer until solidified, and finally the exposed second electrode and the welding end of the metal lead can work together to achieve electrical connection with the external PCB board. Through the above arrangement, the existing plug-in ceramic resistor chip can be directly used as the main material according to processing requirements, without customized research and development, which greatly reduces the cost of the chip ceramic resistor. At the same time, the insulating layer takes into account the three functions of insulation, protection and suction cup, which increases the overall service life and convenience of the resistor.

[0004] However, in actual use, the structure can quickly discharge the heat generated during the operation of the chip through the strip grooves through the setting of the strip grooves, thereby reducing the overall temperature of the resistor. However, the strip grooves are only grooves opened inside the insulating layer. When the ceramic resistor chip works under high temperature conditions, the heat generated is difficult to dissipate, resulting in slow heat dissipation efficiency and affecting the use effect. Utility Model Content

[0005] In order to overcome the above defects of the prior art, the utility model provides a chip ceramic resistor to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A chip-type ceramic resistor comprises a ceramic substrate, a ceramic resistor chip is arranged inside the ceramic substrate, external electrodes are arranged on both sides of the ceramic resistor chip, a protection mechanism is arranged on the surface of the ceramic substrate, and a heat dissipation mechanism is arranged on the bottom of the ceramic resistor chip;

[0008] The heat dissipation mechanism includes a first heat dissipation plate arranged at the bottom of the ceramic resistor chip, a plurality of heat dissipation strips are arranged at the bottom of the first heat dissipation plate, and a plurality of heat dissipation holes are opened on the surfaces of the plurality of heat dissipation strips, a second heat dissipation plate is arranged at the bottom of the heat dissipation strip, and a plurality of through holes are opened on the surfaces of the second heat dissipation plate, a placement groove is opened inside the ceramic substrate, and a refractory layer is arranged inside the placement groove.

[0009] By adopting the above technical solution: in order to improve the efficiency of heat dissipation, the overall temperature of the resistor can be quickly reduced.

[0010] As a further description of the above technical solution: the protection mechanism includes a fixed groove opened on the surface of the ceramic substrate, a plurality of springs are arranged inside the fixed groove, a buffer plate is arranged on one side of the plurality of springs, a slide groove is opened inside the ceramic substrate, a slider is arranged inside the slide groove, and one side of the slider is fixedly connected to the surface of the buffer plate.

[0011] By adopting the above technical solution: in order to protect the surface of the ceramic substrate and prevent it from being damaged by bumps, which would affect the use effect.

[0012] As a further description of the above technical solution: the interior of the refractory layer is arranged as a hollow structure, the top of the refractory layer is arranged with a heat insulating layer, the first heat sink and the second heat sink are made of brass, the heat sink strip is made of aluminum alloy, the surface of the ceramic substrate is provided with a rubber sleeve, the surface of the ceramic resistor chip is provided with a resistor film, and the resistor film is made of ruthenium dioxide.

[0013] By adopting the above technical solution: in order to improve the use effect of the device, strengthen the fire prevention effect and improve safety.

[0014] Technical effects and advantages of the utility model:

[0015] 1. By setting a heat dissipation mechanism, compared with the prior art, the heat emitted by the ceramic resistor chip is first conducted to the first heat dissipation plate, and then the first heat dissipation plate conducts the heat to the heat dissipation bar, and part of the heat is dissipated through the heat dissipation holes, and then the heat dissipation bar conducts the heat to the second heat dissipation plate, and the heat is completely dissipated through the through holes, thereby improving the heat dissipation effect of the ceramic resistor chip and playing a fire prevention role. The interior of the refractory layer is set as a hollow structure, thereby increasing the heat insulation performance of the refractory layer, better protecting the ceramic matrix, and preventing the ceramic matrix from catching fire, thereby improving the fire resistance of the chip resistor;

[0016] 2. By setting up a protective mechanism, compared with the prior art, when the ceramic substrate is subjected to external collision, the rubber sleeve arranged on the surface of the ceramic substrate is a soft structure, which can withstand a part of the force of the external collision. At the same time, the external force squeezes the buffer plate, and the buffer plate drives the spring to move, so that the buffer plate drives the slider to move inside the slide groove, thereby ensuring stability and playing a buffering role, protecting the ceramic substrate from damage caused by external factors, thereby improving the service life of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0018] Figure 2 It is a schematic diagram of the heat dissipation mechanism structure of the utility model.

[0019] Figure 3 It is a front cross-sectional structural schematic diagram of the utility model.

[0020] Figure 4 It is a schematic diagram of the top cross-sectional structure of the utility model.

[0021] Figure 5 It is a schematic diagram of the protection mechanism structure of the utility model.

[0022] The accompanying drawings are marked as follows: 1. ceramic substrate; 2. ceramic resistor chip; 3. external electrode; 4. first heat sink; 5. heat sink bar; 6. heat dissipation hole; 7. second heat sink; 8. placement groove; 9. refractory layer; 10. fixing groove; 11. spring; 12. buffer plate; 13. slider; 14. thermal insulation layer; 15. resistor film. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The embodiments of this application disclose Figure 1-5 A chip ceramic resistor shown includes a ceramic substrate 1, a ceramic resistor chip 2 is arranged inside the ceramic substrate 1, external electrodes 3 are arranged on both sides of the ceramic resistor chip 2, a protection mechanism is arranged on the surface of the ceramic substrate 1, and a heat dissipation mechanism is arranged on the bottom of the ceramic resistor chip 2;

[0025] The heat dissipation mechanism includes a first heat dissipation plate 4 arranged at the bottom of the ceramic resistor chip 2, a plurality of heat dissipation strips 5 are arranged at the bottom of the first heat dissipation plate 4, a plurality of heat dissipation holes 6 are opened on the surfaces of the plurality of heat dissipation strips 5, a second heat dissipation plate 7 is arranged at the bottom of the heat dissipation strips 5, a plurality of through holes are opened on the surfaces of the second heat dissipation plate 7, a placement groove 8 is opened inside the ceramic substrate 1, a refractory layer 9 is arranged inside the placement groove 8, the heat emitted by the ceramic resistor chip 2 is first conducted to the first heat dissipation plate 4, then the first heat dissipation plate 4 conducts the heat to the heat dissipation strip 5, and a plurality of heat dissipation holes 6 are opened on the surface of the heat dissipation strip 5, which will dissipate part of the heat, and then the heat dissipation strip 5 conducts the heat to the second heat dissipation plate 7, and the through holes opened on the surface of the second heat dissipation plate 7 will completely dissipate the heat, thereby improving the heat dissipation effect of the ceramic resistor chip 2 and extending the service life of the chip resistor.

[0026] Reference Figure 4-5 As shown, the protection mechanism includes a fixed groove 10 opened on the surface of the ceramic substrate 1, a plurality of springs 11 are arranged inside the fixed groove 10, a buffer plate 12 is arranged on one side of the plurality of springs 11, a slide groove is opened inside the ceramic substrate 1, a slider 13 is arranged inside the slide groove, one side of the slider 13 is fixedly connected to the surface of the buffer plate 12, and the rubber sleeve arranged on the surface of the ceramic substrate 1 is a soft structure, which can withstand a part of the force caused by external collision. At the same time, the external force squeezes the buffer plate 12, and the buffer plate 12 drives the spring 11 to move, so that the buffer plate 12 drives the slider 13 to move inside the slide groove, thereby ensuring stability, playing a buffering role, protecting the ceramic substrate 1 from damage caused by external factors, and thus improving the service life of the ceramic substrate 1.

[0027] Reference Figure 2-5 As shown, the interior of the refractory layer 9 is set as a hollow structure, and a heat-insulating layer 14 is set on the top of the refractory layer 9. The first heat sink 4 and the second heat sink 7 are made of brass, and the heat dissipation strip 5 is made of aluminum alloy. The surface of the ceramic substrate 1 is provided with a rubber sleeve, and the surface of the ceramic resistor chip 2 is provided with a resistor film 15. The resistor film 15 is made of ruthenium dioxide. The ceramic resistor chip 2 is protected by the resistor film 15 and the resistor film 15 is made of ruthenium dioxide. At the same time, a heat-insulating layer 14 is set on the top of the refractory layer 9. The heat-insulating layer 14 is made of quartz glass. In order to play a fire-proof role, quartz glass has the characteristics of high temperature resistance and explosion-proof. At the same time, the interior of the refractory layer 9 is set as a hollow structure, thereby increasing the heat-insulating performance of the refractory layer 9 and better protecting the ceramic substrate 1.

[0028] Working principle of the utility model: when the utility model is used, through the heat dissipation mechanism, when the temperature of the ceramic resistor chip 2 inside the ceramic matrix 1 is too high, since the first heat dissipation plate 4 and the second heat dissipation plate 7 are made of brass and aluminum alloy, and both brass and alloy have good thermal conductivity, the heat emitted by the ceramic resistor chip 2 is first conducted to the first heat dissipation plate 4, and then the first heat dissipation plate 4 conducts the heat to the heat dissipation bar 5, and the surface of the heat dissipation bar 5 is provided with a plurality of heat dissipation holes 6, which will dissipate part of the heat, and then the heat dissipation bar 5 conducts the heat to the second heat dissipation plate 7, and the through holes opened on the surface of the second heat dissipation plate 7 will completely dissipate the heat, thereby improving the heat dissipation effect of the ceramic resistor chip 2 and extending the service life of the chip resistor;

[0029] When the ceramic substrate 1 is under high temperature conditions, the ceramic resistor chip 2 is protected to a certain extent by the resistor film 15, and the resistor film 15 is made of ruthenium dioxide. At the same time, a heat insulation layer 14 is arranged on the top of the refractory layer 9. The heat insulation layer 14 is made of quartz glass. In order to play a fire prevention role, the quartz glass has the characteristics of high temperature resistance and explosion prevention. At the same time, the interior of the refractory layer 9 is arranged as a hollow structure, thereby increasing the heat insulation performance of the refractory layer 9, better protecting the ceramic substrate 1, and preventing the ceramic substrate 1 from catching fire;

[0030] In order to prevent the device from being damaged by external collision factors, a protective mechanism is used. When the ceramic substrate 1 is hit by the external factors, the rubber sleeve arranged on the surface of the ceramic substrate 1 is a soft structure, which can withstand a part of the force caused by the external collision. At the same time, the external force squeezes the buffer plate 12, and the buffer plate 12 drives the spring 11 to move, so that the buffer plate 12 drives the slider 13 to move inside the slide groove, thereby ensuring stability and playing a buffering role, protecting the ceramic substrate 1 from damage caused by external factors, thereby improving the service life of the ceramic substrate 1.

[0031] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A chip ceramic resistor, comprising a ceramic substrate (1), characterized in that: A ceramic resistor chip (2) is arranged inside the ceramic substrate (1), external electrodes (3) are arranged on both sides of the ceramic resistor chip (2), a protection mechanism is arranged on the surface of the ceramic substrate (1), and a heat dissipation mechanism is arranged on the bottom of the ceramic resistor chip (2); The heat dissipation mechanism comprises a first heat dissipation plate (4) arranged at the bottom of the ceramic resistor chip (2); a plurality of heat dissipation bars (5) are arranged at the bottom of the first heat dissipation plate (4); a plurality of heat dissipation holes (6) are arranged on the surface of the plurality of heat dissipation bars (5); a second heat dissipation plate (7) is arranged at the bottom of the heat dissipation bars (5); a plurality of through holes are arranged on the surface of the second heat dissipation plate (7); a placement groove (8) is arranged inside the ceramic base (1); a fire-resistant layer (9) is arranged inside the placement groove (8).

2. A chip ceramic resistor according to claim 1, characterized in that: The protection mechanism comprises a fixing groove (10) opened on the surface of a ceramic substrate (1), a plurality of springs (11) are arranged inside the fixing groove (10), and a buffer plate (12) is arranged on one side of each of the plurality of springs (11).

3. A chip ceramic resistor according to claim 1, characterized in that: A slide groove is provided inside the ceramic base (1), a slider (13) is provided inside the slide groove, and one side of the slider (13) is fixedly connected to the surface of the buffer plate (12).

4. The chip ceramic resistor according to claim 1, characterized in that: The interior of the fire-resistant layer (9) is arranged as a hollow structure, and a heat-insulating layer (14) is arranged on the top of the fire-resistant layer (9).

5. The chip ceramic resistor according to claim 1, characterized in that: The first heat sink (4) and the second heat sink (7) are made of brass, and the heat sink (5) is made of aluminum alloy.

6. The chip ceramic resistor according to claim 1, characterized in that: The surface of the ceramic substrate (1) is covered with a rubber sleeve, and the surface of the ceramic resistor chip (2) is provided with a resistor film (15), and the resistor film (15) is made of ruthenium dioxide.

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