Wafer feeding and discharging mechanism

Abstract

The utility model discloses a wafer feeding and discharging mechanism, and relates to the technical field of wafer processing equipment, and the wafer feeding and discharging mechanism comprises a bearing table, a stock bin, a material taking part and a first driving module. The bearing table is provided with a channel extending in the first direction. The stock bin is located on one side of the bearing table in the first direction. The material taking part can slide in the channel and comprises a first clamping block, a second clamping block and a clamping driving part, the first clamping block is located below the second clamping block, and the clamping driving part is in driving connection with the first clamping block; the first driving module is in driving connection with the material taking piece. According to the wafer feeding and discharging mechanism, the first driving module can be matched with the material taking piece, and the carrier loaded with the wafer is transferred between the bearing table and the material bin, so that feeding and discharging of the wafer are achieved. The carrier can slowly fall on the bearing table under the action of gravity and bearing of the first clamping block, transferring of the material taking piece can be achieved only through cooperation of one first driving module and the material taking piece, and the structure is simple.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing equipment, and in particular to a wafer loading and unloading mechanism. Background Art

[0002] In order to facilitate the transportation of wafers, wafers are generally carried by carriers, such as iron sheets, and the carriers are stored in silos. When the wafers need to be processed or the processed wafers need to be recovered, the carriers need to be taken out of the silo or put back into the silo. In order to facilitate the entry and exit of the carriers in the silo, a receiving platform for the intermediate transfer body is generally added to the side of the silo, and the carriers are transferred between the receiving platform and the silo through a handling mechanism, and then the robot can directly take the carriers from the receiving platform or put the carriers directly on the receiving platform.

[0003] In the related art, the conveying mechanism includes a clamp, a translation drive module and a lifting drive module. The clamp is used to clamp the carrier. The translation drive module drives the clamp to translate between the receiving platform and the silo so that the carrier clamped by the clamp can be transferred between the receiving platform and the silo, while the lifting drive module drives the clamp to rise and fall relative to the receiving platform so that the clamp places the carrier on the receiving platform or grabs the carrier on the receiving platform. Therefore, the conveying mechanism requires at least two drive modules and the structure is relatively complex. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a wafer loading and unloading mechanism that can use fewer drive modules to achieve the transfer of the carrier between the receiving platform and the silo.

[0005] According to the wafer loading and unloading mechanism of the embodiment of the present application, it includes: a receiving platform, a material bin, a material picking member and a first driving module. The receiving platform is provided with a channel extending along the first direction; the material bin is located on one side of the receiving platform in the first direction; the material picking member can slide in the channel, and the material picking member includes a first clamping block, a second clamping block and a clamping driving member, the first clamping block is located below the second clamping block, the clamping driving member drives and connects the first clamping block, and is used to make the first clamping block approach or move away from the second clamping block, and make the clamping surface of the first clamping block higher or lower than the supporting surface of the receiving platform; the first driving module drives and connects the material picking member, and is used to drive the material picking member to move along the first direction.

[0006] According to the wafer loading and unloading mechanism of the embodiment of the present application, at least the following beneficial effects are achieved: the wafer loading and unloading mechanism of the present application can transfer the carrier carrying the wafer between the receiving platform and the silo through the first driving module in cooperation with the material taking piece, so as to realize the loading and unloading of the wafer. Since the material taking piece moves through the channel on the receiving platform, and in the process of the first clamping block and the second clamping block releasing the carrier, the first clamping block can enter the channel so that the clamping surface of the first clamping block can be lower than the supporting surface of the receiving platform, so that the carrier can slowly fall on the receiving platform under the action of gravity and the support of the first clamping block, thus, the process of the material taking piece placing the carrier on the receiving platform does not require the additional setting of the driving module, and the material taking piece can be transferred only by a first driving module in cooperation with the material taking piece, and the structure is simple. Moreover, when the first clamping block and the second clamping block cooperate to clamp the carrier, the clamping surface of the first clamping block is higher than the supporting surface of the receiving platform, so that in the process of the carrier being transferred, there is a gap between the carrier and the receiving platform, and there is no relative friction between the carrier and the receiving platform, thereby reducing the wear of the carrier and the receiving platform. In addition, the material taking part moves through the channel on the receiving table, so as to reduce the occupied space of the wafer loading and unloading mechanism of the present application.

[0007] According to some embodiments of the present application, the channel runs through a side of the receiving platform facing away from the silo, so that a first opening is formed on one side of the receiving platform, and the material picking piece can leave the channel through the first opening.

[0008] According to some embodiments of the present application, the channel runs through a side of the receiving platform close to the silo to form a second opening on one side of the receiving platform, and the material picking member can at least partially leave the channel through the second opening.

[0009] According to some embodiments of the present application, the first driving module includes a slide rail, a slide seat and a driver, the slide rail extends along a first direction, the slide rail is at least partially disposed in the channel, the slide seat is slidably disposed on the slide rail, the material picking member is disposed on the slide seat, and the driver drives and connects the slide seat to make the slide seat slide along the slide rail.

[0010] According to some embodiments of the present application, a second driving module is further included, the silo is formed with a plurality of accommodating cavities along the second direction, the accommodating cavities are used to store a carrier carrying wafers, and the second driving module is driven and connected to the silo to drive the silo to move along the second direction.

[0011] According to some embodiments of the present application, a sensor is further included, which is electrically connected to the material picking piece. The receiving platform is provided with a first installation groove extending along a first direction. The sensor is detachably connected to the receiving platform and installed in the first installation groove. The sensor is used to sense the load-bearing state of the receiving platform.

[0012] According to some embodiments of the present application, a positioning module is further included. The positioning module is disposed on the receiving platform and is used to position a carrier carrying a wafer on the receiving platform.

[0013] According to some embodiments of the present application, the positioning module includes a positioning drive and two positioning parts, the two positioning parts are arranged on the receiving platform, and the two positioning parts are respectively located on both sides of the channel, and the positioning drive drives at least one of the positioning parts to make the two positioning parts approach or move away from each other.

[0014] According to some embodiments of the present application, the positioning drive member is driven and connected to one of the positioning parts to move the positioning part along a third direction; the other positioning part is fixedly arranged on the receiving platform; a second mounting groove extending along the third direction is provided on the receiving platform, and a mounting hole is provided on the positioning drive member, and the second mounting groove and the mounting hole are used to pass fasteners to allow the positioning drive member and the receiving platform to be relatively fixed.

[0015] According to some embodiments of the present application, the clamping drive member also drives the second clamping block to move the second clamping block closer to or away from the first clamping block.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1 This is a schematic structural diagram of a wafer loading and unloading mechanism according to an embodiment of the present application;

[0019] Figure 2 A top view of a wafer loading and unloading mechanism according to an embodiment of the present application;

[0020] Figure 3 An exploded view of a wafer loading and unloading mechanism according to an embodiment of the present application;

[0021] Figure 4 This is another exploded view of the wafer loading and unloading mechanism according to an embodiment of the present application.

[0022] Reference numerals:

[0023] The receiving platform 100, the supporting surface 101, the channel 110, the first opening 111, the second opening 112, the first installation groove 120, and the second installation groove 130;

[0024] Silo 200, accommodating chamber 210;

[0025] The material taking member 300, the first clamping block 310, the clamping surface 311, the second clamping block 320, and the clamping driving member 330;

[0026] A first driving module 400, a slide rail 410, a slide seat 420, and a driver 430;

[0027] A second driving module 500;

[0028] Positioning module 600, positioning driving member 610, mounting hole 611, positioning portion 620;

[0029] The first position 710 and the second position 720 . DETAILED DESCRIPTION

[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0031] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0034] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0035] Reference Figure 1 According to the embodiment of the present application, the wafer loading and unloading mechanism includes: a receiving platform 100, a material bin 200, a material picking component 300 and a first driving module 400.

[0036] Reference Figure 1 The receiving platform 100 is provided with a channel 110 extending along the first direction. Figure 1 The material bin 200 is located on one side of the receiving platform 100 in the first direction. The material taking member 300 can slide in the channel 110. Figure 3 and Figure 4 The material taking member 300 includes a first clamping block 310, a second clamping block 320 and a clamping driving member 330. The first clamping block 310 is located below the second clamping block 320. The clamping driving member 330 drives and connects the first clamping block 310 to make the first clamping block 310 approach or move away from the second clamping block 320, and to make the clamping surface 311 of the first clamping block 310 higher or lower than the supporting surface 101 of the receiving platform 100. Figure 1 The first driving module 400 is driven and connected to the material picking member 300, and is used to drive the material picking member 300 to move along the first direction.

[0037] It is understandable that the silo 200 is used to store a carrier carrying wafers, and the carrier is, for example, an iron sheet. In some application scenarios, the silo 200 is used to store a carrier carrying wafers to be processed. In order to load the carrier to the processing station, refer to Figure 1 and Figure 2, the first driving module 400 drives the material picking member 300 to move along the first direction, the material picking member 300 slides in the channel 110, and the material picking member 300 approaches the silo 200 and reaches the first position 710. When the material picking member 300 reaches the first position 710, the material picking member 300 is located beside the silo 200, and the carrier in the silo 200 is located between the first clamping block 310 and the second clamping block 320, the clamping driving member 330 drives the first clamping block 310 to approach the second clamping block 320, and the first clamping block 310 cooperates with the second clamping block 320 to clamp the carrier. At this time, the clamping surface 311 of the first clamping block 310 is slightly higher than the supporting surface 101 of the receiving platform 100, so that there is a certain distance between the carrier and the receiving platform 100 to avoid friction between the carrier and the receiving platform 100 during the transportation process. Subsequently, the first driving module 400 drives the material picking member 300 to move along the first direction, and the material picking member 300 moves away from the material bin 200 and reaches the second position 720. When the material picking member 300 reaches the second position 720, the carrier clamped by the first clamping block 310 and the second clamping block 320 is located above the receiving platform 100. Next, the clamping driving member 330 drives the first clamping block 310 away from the second clamping block 320, and the first clamping block 310 and the second clamping block 320 release the carrier, and the carrier can fall on the supporting surface 101 of the receiving platform 100 under the action of gravity, but the carrier is at least partially placed on the first clamping block 310. After the first clamping block 310 is lower than the supporting surface 101 of the receiving platform 100, the carrier will completely fall on the bearing surface, and the first clamping block 310 has a buffering effect on the process of the carrier falling on the receiving platform 100. The receiving platform 100 is used to transfer the carrier. After the carrier falls on the receiving platform 100, the first driving module 400 drives the material picker 300 to move away from the carrier on the receiving platform 100 to avoid interfering with the subsequent transfer process of the carrier. Then, the carrier on the receiving platform 100 is transferred to the processing station by a robot or manually, thereby completing the loading of the wafer.

[0038] In some other application scenarios, the silo 200 is used to store carriers carrying processed wafers. In order to unload the carriers at the processing station into the silo 200, first, the first drive module 400 drives the material picking part 300 to move to the second position 720 away from the side of the silo 200, and then, the carrier at the processing station is transferred to the receiving table 100 by a robot or manually. Then, the first drive module 400 drives the material picking part 300 to move along the first direction and close to the silo 200, and reaches the second position 720, and at this time the first clamping block 310 is away from the second clamping block 320, the clamping surface 311 of the first clamping block 310 is lower than the support surface 101 of the receiving table 100, and the clamping surface 311 of the first clamping block 310 is located in the channel 110. When the material picking piece 300 reaches the second position 720, the carrier on the receiving platform 100 is located between the first clamping block 310 and the second clamping block 320, the first clamping block 310 is located in the channel 110, and the clamping drive 330 drives the first clamping block 310 to approach the second clamping block 320, the first clamping block 310 cooperates with the second clamping block 320 to clamp the carrier on the receiving platform 100, and at this time, the clamping surface 311 of the first clamping block 310 is higher than the supporting surface 101 of the receiving platform 100, so that the first clamping block 310 can cooperate with the second clamping block 320 to hold up the carrier, so that a certain distance can be formed between the carrier and the receiving platform 100 to avoid friction between the carrier and the receiving platform 100 during transportation. Then, the first driving module 400 drives the material picking component 300 to approach the silo 200 and move to the first position 710 so that the carrier is located in the silo 200. The clamping driving component 330 drives the first clamping block 310 away from the second clamping block 320. The first clamping block 310 and the second clamping block 320 release the carrier to allow the carrier to fall into the silo 200, thereby completing the unloading of the wafer.

[0039] Therefore, the wafer loading and unloading mechanism of the present application can transfer the carrier carrying the wafer between the receiving platform 100 and the silo 200 through the first driving module 400 in cooperation with the material picking member 300, so as to realize the loading and unloading of the wafer. Since the material picking member 300 moves through the channel 110 on the receiving platform 100, and in the process of the first clamping block 310 and the second clamping block 320 releasing the carrier, the first clamping block 310 can enter the channel 110, so that the clamping surface 311 of the first clamping block 310 can be lower than the supporting surface 101 of the receiving platform 100, so that the carrier can slowly fall on the receiving platform 100 under the action of gravity and the support of the first clamping block 310, thus, the process of the material picking member 300 placing the carrier on the receiving platform 100 does not require the additional setting of the driving module, and the material picking member 300 can be transferred only by a first driving module 400 in cooperation with the material picking member 300, and the structure is simple. Furthermore, when the first clamping block 310 and the second clamping block 320 cooperate to clamp the carrier, the clamping surface 311 of the first clamping block 310 is higher than the supporting surface 101 of the receiving platform 100, so that during the transportation of the carrier, there is a gap between the carrier and the receiving platform 100, and there is no relative friction between the carrier and the receiving platform 100, thereby reducing the wear of the carrier and the receiving platform 100. Furthermore, the material removal member 300 moves through the channel 110 on the receiving platform 100, so as to reduce the occupied space of the wafer loading and unloading mechanism of the present application.

[0040] Specifically, in this embodiment, the first direction is a horizontal direction. In other embodiments, the first direction may also be a direction inclined relative to the horizontal plane.

[0041] In order to reduce the occupied space of the receiving platform 100, refer to Figure 2 The channel 110 passes through the side of the receiving platform 100 away from the silo 200 , so that a first opening 111 is formed on one side of the receiving platform 100 , and the material removal piece 300 can leave the channel 110 through the first opening 111 .

[0042] For example, when it is necessary to place the carrier captured by the material-retrieving member 300 on the receiving platform 100, the first driving module 400 drives the material-retrieving member 300 holding the carrier away from the silo 200 along the first direction and reaches the second position 720, and the clamping driving member 330 can leave the channel 110 through the first opening 111, leaving only the first clamping block 310 in the channel 110, and the second clamping block 320 is located above the channel 110, so that the carriers clamped by the first clamping block 310 and the second clamping block 320 can fall normally onto the receiving platform 100. Subsequently, when it is necessary to remove the carrier on the receiving platform 100, the material-retrieving member 300 can completely leave the channel 110 through the first opening 111, leaving the first clamping block 310 and the second clamping block 320 completely out of the channel 110, and the first clamping block 310 and the second clamping block 320 away from the carrier, so as to prevent the first clamping block 310 and the second clamping block 320 from interfering with the robot grasping the carrier. Similarly, when the material picking member 300 is required to grab the carrier on the receiving platform 100, before the carrier is placed on the receiving platform 100, the material picking member 300 can be driven by the first driving module 400 to move away from the material bin 200 along the first direction, so that the material picking member 300 reaches the second position 720 away from the side of the material bin 200, and the material picking member 300 completely leaves the channel 110 to avoid interfering with the robot arm placing the carrier on the receiving platform 100. After placing the carrier on the receiving platform 100, the first driving module 400 drives the material picking member 300 to move closer to the material bin 200 along the first direction, so that the material picking member 300 reaches the second position 720, and the carrier on the receiving platform 100 is located between the first clamping block 310 and the second clamping block 320, so that the carrier on the receiving platform 100 can be clamped by the first clamping block 310 and the second clamping block 320.

[0043] It is understandable that the size of the receiving platform 100 can be designed to be the same as the size of the carrier, or slightly larger than the size of the carrier. By allowing the clamping drive 330 to leave the first opening 111 and allowing the first clamping block 310 and the second clamping block 320 to be located at the edge of the receiving platform 100, the material picking member 300 can normally place the carrier on the receiving platform 100 and can normally clamp the carrier on the receiving platform 100, and the first clamping block 310 and the second clamping block 320 can leave the channel 110 through the first opening 111 to avoid the process of picking and placing the carrier on the receiving platform 100. Therefore, by opening the first opening 111 for the material picking member 300 to pass through the channel 110, the size of the receiving platform 100 along the first direction is not affected by the size of the material picking member 300, and the size of the receiving platform 100 can be made the same as or as close to the same as the size of the carrier, thereby reducing the size of the receiving platform 100 and reducing the space occupied by the receiving platform 100.

[0044] In order to facilitate the material 300 to take and place the carrier relative to the silo 200, refer to Figure 2The channel 110 runs through one side of the receiving platform 100 close to the silo 200 , so that a second opening 112 is formed on one side of the receiving platform 100 , and the material removal piece 300 can at least partially leave the channel 110 through the second opening 112 .

[0045] For example, when the material picking piece 300 needs to take out the carrier from the silo 200, or when the material picking piece 300 needs to put the carrier into the silo 200, the first driving module 400 drives the material picking piece 300 to move toward the silo 200, and the first clamping block 310 and the second clamping block 320 leave the channel through the second port 112 and pass through the receiving platform 100, so that the first clamping block 310 and the second clamping block 320 can be closer to the silo 200.

[0046] It is understandable that, by providing the second opening 112 for the material taking piece 300 to pass through the channel 110, the first clamping block 310 and the second clamping block 320 can be closer to the material bin 200, so that the first clamping block 310 and the second clamping block 320 can take and place the carrier relative to the material bin 200. Moreover, even if the dimensions of the first clamping block 310 and the second clamping block 320 along the first direction are set to be small, or if the material bin 200 is far away from the receiving platform 100, it can be ensured that the first clamping block 310 and the second clamping block 320 can clamp the carrier in the material bin 200 or put the carrier into the material bin 200.

[0047] In some other embodiments, the size of the receiving platform 100 is set to be larger, so that the channel 110 is longer and the channel 110 has enough space to accommodate the material removal piece 300, so that the first opening 111 or the second opening 112 can be omitted.

[0048] For the specific structure of the first driving module 400, refer to Figure 3 The first driving module 400 includes a slide rail 410, a slide seat 420 and a driver 430. The slide rail 410 extends along a first direction. The slide rail 410 is at least partially disposed in the channel 110. The slide seat 420 is slidably disposed on the slide rail 410. The material picking member 300 is disposed on the slide seat 420. The driver 430 drives the slide seat 420 to slide along the slide rail 410.

[0049] It is understandable that the driver 430 drives the slide 420 to slide along the slide rail 410 in the first direction, so as to drive the material picking member 300 on the slide 420 to slide in the first direction. In addition, the slide rail 410 is partially disposed in the channel 110, and the channel 110 accommodates part of the slide rail 410, thereby reducing the occupied space of the first driving module 400.

[0050] It should be noted that in order to enable the silo 200 to store more carriers, Figure 1The silo 200 is formed with a plurality of accommodating cavities 210 along the second direction, and the accommodating cavities 210 are used to store carriers carrying wafers. In order to enable the material taking member 300 to take and place carriers relative to each layer of the accommodating cavities 210, refer to Figure 1 The wafer loading and unloading mechanism of the present application further includes a second driving module 500, and the second driving module 500 drives the connected silo 200 to drive the silo 200 to move along the second direction.

[0051] It can be understood that each accommodating cavity 210 is used to store a carrier. When it is necessary to take out the carrier in a certain layer of accommodating cavity 210 or put the carrier into a certain layer of accommodating cavity 210, the accommodating cavity 210 is defined as a target accommodating cavity 210, and the second driving module 500 drives the hopper 200 to move along the second direction to move the target accommodating cavity 210 to a position relative to the material picking piece 300, so as to facilitate the material picking piece 300 to pick up and place the carrier relative to the target accommodating cavity 210.

[0052] Specifically, in this embodiment, the second direction is a vertical direction. In other embodiments, the second direction may also be a direction inclined relative to the vertical plane.

[0053] In order to sense whether the carrier on the receiving platform 100 is in place, the wafer loading and unloading mechanism of the present application also includes a sensor (not shown in the figure), which is electrically connected to the material picking member 300. Figure 3 A first mounting groove 120 extending along a first direction is provided on the receiving platform 100 . The sensor is detachably connected to the receiving platform 100 and is installed in the first mounting groove 120 . The sensor is used to sense the bearing state of the receiving platform 100 .

[0054] It is understandable that when the robot or the person places the carrier on the receiving platform 100, the sensor can sense the carrier and transmit the signal to the material picking part 300, and the material picking part 300 goes to the second position 720 to pick up the material after receiving the signal. Alternatively, after the material picking part 300 transfers the carrier to the top of the receiving platform 100, the sensor can sense the carrier and transmit the signal to the material picking part 300, and the material picking part 300 releases the carrier after receiving the signal to let the carrier fall onto the receiving platform 100.

[0055] It should also be noted that for carriers of different sizes, the installation position of the sensor also needs to be adjusted accordingly. Figure 3 The first installation groove 120 for installing the sensor is extended along the first direction, so that the sensor can be arranged at different positions in the first installation groove 120 to adapt to carriers of different sizes.

[0056] In order to improve the position accuracy of loading and unloading of the carrier, refer to Figure 1The wafer loading and unloading mechanism of the present application further includes a positioning module 600 , which is disposed on the receiving platform 100 and is used to position a carrier carrying wafers on the receiving platform 100 .

[0057] It can be understood that after the carrier is located on the receiving platform 100, the positioning module 600 can position the carrier, thereby improving the positioning accuracy of the carrier relative to the silo 200, allowing the carrier to be accurately pushed into the corresponding position in the silo 200, and improving the positioning accuracy of the robot arm relative to the carrier during the process of grabbing the carrier.

[0058] For the specific structure of the positioning module 600, refer to Figure 3 The positioning module 600 includes a positioning drive 610 and two positioning parts 620. The two positioning parts 620 are arranged on the receiving platform 100, and the two positioning parts 620 are respectively located on both sides of the channel 110. The positioning drive 610 drives at least one positioning part 620 to make the two positioning parts 620 approach or move away from each other.

[0059] It is understandable that after the carrier is located on the receiving platform 100 , the carrier is located between the two positioning portions 620 , and the positioning drive 610 drives at least one positioning portion 620 to bring the two positioning portions 620 closer to each other and clamp the carrier to achieve positioning of the carrier.

[0060] Specifically, in this embodiment, one of the positioning parts 620 is fixedly disposed on the receiving platform 100 and is integrally formed with the receiving platform 100, and the other positioning part 620 is movable relative to the receiving platform 100 and is connected to the driving end of the positioning driver 610, and can move closer to or farther from the fixed positioning part 620. In some other embodiments, both positioning parts 620 are movably disposed, and the positioning driver 610 drives the two positioning parts 620 simultaneously.

[0061] To adapt to different sizes of carriers, refer to Figure 4 The positioning drive member 610 drives and connects one of the positioning parts 620 to move the positioning part 620 along the third direction; the other positioning part 620 is fixedly arranged on the receiving platform 100; the receiving platform 100 is provided with a second mounting groove 130 extending along the third direction, and the positioning drive member 610 is provided with a mounting hole 611. The second mounting groove 130 and the mounting hole 611 are used to penetrate fasteners to relatively fix the positioning drive member 610 and the receiving platform 100.

[0062] It is understandable that the fastener penetrates the second mounting groove 130 and the mounting hole 611 so as to relatively fix the positioning drive member 610 and the receiving platform 100. It should be noted that for carriers of different sizes, the relative positions of the mounting hole 611 and the second mounting groove 130 can be adjusted, so that the positioning drive member 610 moves in the third direction to adjust the distance between the two positioning parts 620, so as to adapt to carriers of different sizes.

[0063] Specifically, the third direction is a horizontal direction and is perpendicular to the first direction.

[0064] Regarding the clamping method of the material picking member 300, refer to Figure 3 In this embodiment, the clamping driving member 330 also drives the second clamping block 320 to move the second clamping block 320 closer to or away from the first clamping block 310 .

[0065] It can be understood that the clamping driving member 330 drives the first clamping block 310 and the second clamping block 320 to move closer or farther synchronously to clamp the carrier or release the carrier.

[0066] In other embodiments, the clamping driving member 330 may also only drive the first clamping block 310 .

[0067] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. Wafer loading and unloading mechanism, characterized in that: include: A receiving platform, wherein the receiving platform is provided with a channel extending along a first direction; A material bin, the material bin being located on one side of the receiving platform in the first direction; A material picking member, the material picking member can slide in the channel, the material picking member comprises a first clamping block, a second clamping block and a clamping driving member, the first clamping block is located below the second clamping block, the clamping driving member drives and connects the first clamping block, and is used to make the first clamping block approach or move away from the second clamping block, and make the clamping surface of the first clamping block higher or lower than the supporting surface of the receiving platform; The first driving module is drivingly connected to the material picking member and is used to drive the material picking member to move along a first direction.

2. The wafer loading and unloading mechanism according to claim 1, characterized in that: The channel runs through a side of the receiving platform away from the material bin, so that a first opening is formed on one side of the receiving platform, and the material taking piece can leave the channel through the first opening.

3. The wafer loading and unloading mechanism according to claim 1, characterized in that: The channel runs through a side of the receiving platform close to the material bin, so that a second opening is formed on one side of the receiving platform, and at least a part of the material taking member can leave the channel through the second opening.

4. The wafer loading and unloading mechanism according to claim 1, characterized in that: The first driving module includes a slide rail, a slide seat and a driver. The slide rail extends along a first direction. The slide rail is at least partially disposed in the channel. The slide seat is slidably disposed on the slide rail. The material picking member is disposed on the slide seat. The driver drives and connects the slide seat to make the slide seat slide along the slide rail.

5. The wafer loading and unloading mechanism according to claim 1, characterized in that: It also includes a second driving module. The silo is formed with a plurality of accommodating cavities along the second direction. The accommodating cavities are used to store carriers carrying wafers. The second driving module is drivingly connected to the silo to drive the silo to move along the second direction.

6. The wafer loading and unloading mechanism according to claim 1, characterized in that: It also includes a sensor, which is electrically connected to the material picking piece. The receiving platform is provided with a first installation groove extending along a first direction. The sensor is detachably connected to the receiving platform and installed in the first installation groove. The sensor is used to sense the load-bearing state of the receiving platform.

7. The wafer loading and unloading mechanism according to claim 1, characterized in that: It also includes a positioning module, which is arranged on the receiving platform and is used to position a carrier carrying wafers on the receiving platform.

8. The wafer loading and unloading mechanism according to claim 7, characterized in that: The positioning module includes a positioning drive and two positioning parts. The two positioning parts are arranged on the receiving platform and are respectively located on both sides of the channel. The positioning drive drives at least one of the positioning parts to make the two positioning parts approach or move away from each other.

9. The wafer loading and unloading mechanism according to claim 8, characterized in that: The positioning drive member is driven and connected to one of the positioning parts to move the positioning part along a third direction; the other positioning part is fixedly arranged on the receiving platform; a second mounting groove extending along the third direction is provided on the receiving platform, and a mounting hole is provided on the positioning drive member, and the second mounting groove and the mounting hole are used to pass fasteners to allow the positioning drive member and the receiving platform to be relatively fixed.

10. The wafer loading and unloading mechanism according to claim 1, characterized in that: The clamping driving member is also driven to connect to the second clamping block, so as to make the second clamping block approach to or move away from the first clamping block.

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