Packaging structure and heat exchange device

Abstract

The utility model relates to a packaging structure and a heat exchange device, the packaging structure comprises a packaging shell, an insulation filling colloid, an insulation heat conduction colloid, a metal shielding cover and a grounding wire, the metal shielding cover is provided with a plurality of through holes penetrating through the side wall of the metal shielding cover, and the heating ends of one or more power elements are bonded to one end of the metal shielding cover through the insulation heat conduction colloid. The packaging shell hermetically covers one side, provided with the power element, of the metal shielding cover and encloses a shielding cavity with the metal shielding cover, the power element and the inner wall of the shielding cavity are arranged at an interval, the shielding cavity is filled with the insulating filling colloid, one end of the grounding wire is electrically connected to the metal shielding cover, and the other end of the grounding wire is grounded. According to the packaging structure and the heat exchange device provided by the invention, on the premise that effective electromagnetic shielding can be performed on the IGBT module, the problems that the IGBT module is poor in heat dissipation performance and complex in structure are solved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of power components, and in particular to a packaging structure and a heat exchange device. Background Art

[0002] With the rapid development of new energy technologies, the heat dissipation of power components has increased rapidly, and the requirements for thermal management of power components have become increasingly higher. Among various types of power components, taking IGBT modules as an example, the voltage of their application is also getting higher and higher, so there is usually a ceramic insulation layer on the heat dissipation side of the IGBT module. The ceramic insulation layer needs to have a good electromagnetic shielding effect on the one hand, and also needs to have high thermal conductivity on the other hand.

[0003] However, although the thermal conductivity of ceramic materials with high thermal conductivity (such as aluminum nitride) on the market can generally reach 100W / mK-200W / mK, the cost of such ceramic materials with high thermal conductivity is extremely high and is not suitable for large-scale mass production of general industrial products.

[0004] Correspondingly, the thermal conductivity of common ceramic materials (such as aluminum oxide) basically does not exceed 30W / mK, that is, although common ceramic materials have electromagnetic shielding, their thermal resistance is relatively high. In addition, the IGBT module is bonded to the DBC substrate by welding or thermal grease, and the DBC substrate is bonded to the heat sink by thermal grease, and the DBC substrate is usually composed of two layers of copper substrates with a ceramic substrate sandwiched between them. Therefore, the heat dissipation of the existing IGBT module needs to pass through at least one layer of thermal grease, two layers of copper substrates and one layer of ceramic substrate to contact and transfer heat with the surface of the heat sink. As a result, the heat dissipation of the existing IGBT module is poor and cannot match its own increasing power. Utility Model Content

[0005] Based on this, it is necessary to provide a packaging structure and a heat exchange device to solve the problems of poor heat dissipation and complex structure of the existing IGBT module while ensuring effective electromagnetic shielding of the IGBT module.

[0006] The packaging structure provided in the present application includes a packaging shell, an insulating filling colloid, an insulating thermally conductive colloid, a metal shielding cover and a grounding wire. The metal shielding cover is provided with a plurality of through holes penetrating its side wall. The heating ends of one or more power elements are bonded to one end of the metal shielding cover through the insulating thermally conductive colloid. The packaging shell sealing cover is provided on a side of the metal shielding cover where the power element is provided and is surrounded by the metal shielding cover to form a shielding cavity. The power element and the inner wall of the shielding cavity are spaced apart. The insulating filling colloid is filled in the shielding cavity. One end of the grounding wire is electrically connected to the metal shielding cover, and the other end is grounded.

[0007] In one embodiment, the packaging structure further includes a metal substrate, the metal substrate is arranged between the packaging shell and the metal shielding cover, and the packaging shell sealing cover is arranged on one side of the metal substrate and is surrounded by the metal substrate to form a filling cavity, the power element is arranged in the filling cavity, and the power element is bonded to one end of the metal substrate through an insulating thermal conductive colloid, and the insulating filling colloid is filled in the filling cavity. The metal shielding cover is arranged on the side of the metal substrate away from the power element and is electrically connected to the metal substrate, one end of the grounding wire is electrically connected to the metal shielding cover through the metal substrate, and the other end is grounded.

[0008] In one embodiment, there are multiple metal shielding covers, and the multiple metal shielding covers are stacked.

[0009] In one embodiment, the metal shielding cover is a polyhedron structure.

[0010] In one embodiment, the metal shield is a porous plate structure.

[0011] In one embodiment, the metal shielding cover is a curved structure.

[0012] In one embodiment, the metal shielding cover is a porous mesh structure.

[0013] In one embodiment, the plurality of through holes are evenly distributed on the side wall of the metal shielding cover.

[0014] In one embodiment, the insulating thermally conductive colloid is thermally conductive silicone grease.

[0015] The present application also provides a heat exchange device, which is used to dissipate heat from power elements. The heat exchange device includes the packaging structure and the heat pipe heat exchanger described in any one of the above embodiments. The heat pipe heat exchanger includes an evaporation section and a condensation section that are connected. The evaporation section is provided with a liquid working medium. The packaging structure is provided with a metal shielding cover at one end that is sealed and embedded in the evaporation section and immersed in the liquid working medium.

[0016] Compared with the prior art, the packaging structure and heat exchange device provided in the present application, by setting an insulating thermally conductive colloid, enable the power element to be installed on the metal shielding cover through the insulating thermally conductive colloid, and the power element and the inner wall of the shielding cavity are set at intervals, so that the metal shielding cover can play a better electromagnetic shielding role for the power element.

[0017] Furthermore, by providing a grounding wire, the electric charge on the metal shielding cover can be transferred to the earth environment through the grounding wire, thereby preventing the metal shielding cover from accumulating excessive electric charge.

[0018] Furthermore, since the heating end of the power element is connected to the metal shielding cover, and the insulating thermally conductive colloid is a heat conductor, the heat generated by the power element can be dissipated promptly through the insulating thermally conductive colloid and the metal shielding cover, thereby greatly improving the heat dissipation effect of the packaging structure.

[0019] Furthermore, compared with the DBC substrate structure in the prior art, the packaging structure in the present application does not require the setting of a double-layer copper substrate or a ceramic substrate. Obviously, the packaging structure in the present application has a simpler structure and a greatly reduced volume, which is conducive to significantly reducing the manufacturing cost of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a heat exchange device according to an embodiment of the present application;

[0022] Figure 2 A schematic diagram of a packaging structure according to an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the packaging structure of another embodiment provided in the present application.

[0024] Figure numerals: 100, packaging shell; 110, shielding cavity; 111, filling cavity; 112, spacer cavity; 120, insulating filling colloid; 200, insulating thermally conductive colloid; 300, metal shielding cover; 310, perforation; 400, grounding wire; 500, power element; 600, metal substrate; 700, heat pipe heat exchanger; 710, evaporation section; 720, condensation section. DETAILED DESCRIPTION

[0025] With the rapid development of new energy technologies, the heat dissipation of power components has increased rapidly, and the requirements for thermal management of power components have become increasingly higher. Among various types of power components, taking IGBT modules as an example, the voltage of their application is also getting higher and higher, so there is usually a ceramic insulation layer on the heat dissipation side of the IGBT module. The ceramic insulation layer needs to have a good electromagnetic shielding effect on the one hand, and also needs to have high thermal conductivity on the other hand.

[0026] However, although the thermal conductivity of ceramic materials with high thermal conductivity (such as aluminum nitride) on the market can generally reach 100W / mK-200W / mK, the cost of such ceramic materials with high thermal conductivity is extremely high and is not suitable for large-scale mass production of general industrial products.

[0027] Correspondingly, the thermal conductivity of common ceramic materials (such as aluminum oxide) basically does not exceed 30W / mK, that is, although common ceramic materials have electromagnetic shielding, their thermal resistance is relatively high. In addition, the IGBT module is bonded to the DBC substrate by welding or thermal grease, and the DBC substrate is bonded to the heat sink by thermal grease, and the DBC substrate is usually composed of two layers of copper substrates with a ceramic substrate sandwiched between them. Therefore, the heat dissipation of the existing IGBT module needs to pass through at least one layer of thermal grease, two layers of copper substrates and one layer of ceramic substrate to contact and transfer heat with the surface of the heat sink. As a result, the heat dissipation of the existing IGBT module is poor and cannot match its own increasing power.

[0028] In order to solve the problems of poor heat dissipation and complex structure of existing IGBT modules while ensuring effective electromagnetic shielding of the IGBT modules, the present application provides a packaging structure and a heat exchange device.

[0029] See also Figure 1-Figure 3 The packaging structure includes a packaging shell 100, an insulating filling colloid 120, an insulating thermally conductive colloid 200, a metal shielding cover 300 and a grounding wire 400. The metal shielding cover 300 is provided with a plurality of through holes 310 penetrating its side wall. The heating end of one or more power components 500 (including but not limited to IGBT modules, chips and batteries, etc.) is bonded to one end of the metal shielding cover 300 through the insulating thermally conductive colloid 200. The sealing cover of the packaging shell 100 is arranged on one side of the metal shielding cover 300 where the power components 500 are arranged and is surrounded by the metal shielding cover 300 to form a shielding cavity 110. The power components 500 and the inner wall of the shielding cavity 110 are arranged at intervals. The insulating filling colloid 120 is filled in the shielding cavity 110. One end of the grounding wire 400 is electrically connected to the metal shielding cover 300, and the other end is grounded.

[0030] It should be noted that the power device 500 is disposed in the shielding cavity 110 .

[0031] It should be noted that “the power element 500 is spaced apart from the inner wall of the shielding cavity 110 ” means that no part of the power element 500 is in direct contact with the inner wall of the shielding cavity 110 .

[0032] Furthermore, it should be noted that the working principle of the metal shielding cover 300 is to utilize the reflection and absorption effect of metal on electromagnetic waves, so that the electromagnetic waves cannot penetrate the metal shielding cover 300 .

[0033] In this way, by setting the insulating thermally conductive colloid 200, the power element 500 is installed on the metal shielding cover 300 through the insulating thermally conductive colloid 200, and the power element 500 and the inner wall of the shielding cavity 110 are set apart, so that the metal shielding cover 300 can play a better electromagnetic shielding role for the power element 500.

[0034] Furthermore, by providing the grounding wire 400 , the charges on the metal shielding cover 300 can be transferred to the earth environment through the grounding wire 400 , thereby preventing the metal shielding cover 300 from accumulating excessive charges.

[0035] Furthermore, since the heating end of the power element 500 is connected to the metal shielding cover 300, and the insulating thermally conductive colloid 200 is a heat conductor, the heat generated by the power element 500 can be dissipated promptly through the insulating thermally conductive colloid 200 and the metal shielding cover 300, thereby greatly improving the heat dissipation effect of the packaging structure.

[0036] Furthermore, compared with the DBC substrate structure in the prior art, the packaging structure in the present application does not require the setting of a double-layer copper substrate or a ceramic substrate. Obviously, the packaging structure in the present application has a simpler structure and a greatly reduced volume, which is conducive to significantly reducing the manufacturing cost of the packaging structure.

[0037] In one embodiment, the metal shielding cover 300 is made of aluminum, silver, copper or other metal materials, which are not listed here one by one.

[0038] In one embodiment, if Figure 2 As shown, the metal shielding cover 300 is a polyhedron structure.

[0039] With such arrangement, adjacent faces of the polyhedron structure form an angle, which is beneficial to enhancing the electromagnetic shielding capability of the metal shielding cover 300 .

[0040] Specifically, the metal shielding cover 300 is a hexahedron structure, an octahedron structure, a decahedron structure, etc., which are not listed here one by one.

[0041] Furthermore, in one embodiment, the metal shielding cover 300 is a porous plate structure.

[0042] Such arrangement is conducive to the processing of the metal shielding cover 300 to form a polyhedron structure.

[0043] Specifically, the metal shielding cover 300 may be processed with a plurality of through holes 310 by stamping or drilling, or the metal shielding cover 300 with a plurality of through holes 310 may be processed by integral casting or 3D printing.

[0044] In another embodiment, if Figure 1 and Figure 3As shown, the metal shielding cover 300 is a curved structure.

[0045] Such a configuration is conducive to reducing the volume of the metal shielding cover 300, and further reducing the volume of the entire heat exchange device. In addition, the arc surface structure is easy to process and is conducive to installation and manufacturing.

[0046] Furthermore, in one embodiment, the metal shielding cover 300 is a porous mesh structure.

[0047] Such a configuration is conducive to punching the metal shielding cover 300 into a corresponding arc-shaped structure.

[0048] Specifically, the metal shielding cover 300 may be formed by weaving metal wires or by cross-welding metal wires.

[0049] In one embodiment, the plurality of through holes 310 are evenly distributed on the sidewall of the metal shield 300 .

[0050] This is beneficial to uniform heat dissipation of the power element 500 on the one hand, and beneficial to more uniform electromagnetic shielding effect at various locations on the other hand.

[0051] But not limited thereto, in other embodiments, the distribution of the through holes 310 may also be uneven. For example, the distribution density of the through holes 310 of the metal shielding cover 300 corresponding to the heating surface of the power element 500 is higher to improve the heat dissipation effect.

[0052] In one embodiment, the insulating thermally conductive adhesive 200 is thermally conductive silicone grease.

[0053] The thermal grease not only has strong adhesion, making the connection between the power element 500 and the metal shielding cover 300 more stable, but also has strong thermal conductivity and good insulation. On the one hand, it is beneficial to the heat dissipation of the power components, and on the other hand, it is beneficial to prevent the metal shielding cover 300 from being directly electrically connected to the power element 500 and affecting the shielding effect.

[0054] But not limited thereto, in other embodiments, the insulating thermally conductive colloid 200 may also be a polyurethane adhesive.

[0055] In one embodiment, the insulating filling colloid 120 includes but is not limited to epoxy resin glue, silicone rubber glue, polyurethane glue, etc., which are not listed here one by one.

[0056] In one embodiment, if Figure 1-Figure 3As shown, the packaging structure also includes a metal substrate 600, which is arranged between the packaging shell 100 and the metal shielding cover 300, that is, the metal substrate 600 is arranged in the shielding cavity 110, and the sealing cover of the packaging shell 100 is arranged on one side of the metal substrate 600 and is surrounded by the metal substrate 600 to form a filling cavity 111, the power element 500 is arranged in the filling cavity 111, and the power element 500 is welded or bonded to one end of the metal substrate 600 through the insulating thermal conductive colloid 200, and the insulating filling colloid 120 is filled in the filling cavity 111.

[0057] The metal shield 300 is disposed on a side of the metal substrate 600 away from the power element 500 and is electrically connected to the metal substrate 600. One end of the ground wire 400 is electrically connected to the metal shield 300 through the metal substrate 600, and the other end is grounded.

[0058] It should be noted that the metal substrate 600 can be made of a copper substrate, an aluminum substrate, a silver substrate, etc., which are not listed here one by one.

[0059] Furthermore, the packaging shell 100 and the metal substrate 600 may be connected by bonding, snap-fitting or other connection methods, which are not listed here one by one.

[0060] The metal shielding cover 300 and the metal substrate 600 are welded or conductively bonded.

[0061] It should be noted that the metal shielding cover 300 and the metal substrate 600 are arranged to form a partition cavity 112 to improve the electromagnetic shielding effect. The partition cavity 112 and the filling cavity 111 together constitute the shielding cavity 110 .

[0062] By providing the metal substrate 600 , on the one hand, the difficulty of installing the power element 500 and the grounding wire 400 is greatly reduced, and on the other hand, multiple power elements 500 can be in contact with the metal substrate 600 for heat dissipation, that is, the heat dissipation effect of the power element 500 is improved.

[0063] In one embodiment, if Figure 1 As shown, there may be more than one metal shielding cover 300 , and the multiple metal shielding covers 300 are stacked, that is, the outer metal shielding cover 300 covers the side of the inner metal shielding cover 300 away from the power element 500 .

[0064] Such a configuration is beneficial to further improve the electromagnetic shielding effect of the metal shielding cover 300 .

[0065] See also Figure 1The present application also provides a heat exchange device, which is used to dissipate heat from a power element 500. The heat exchange device includes the packaging structure described in any one of the above embodiments and the heat pipe heat exchanger 700. The heat pipe heat exchanger 700 includes an evaporation section 710 and a condensation section 720 that are connected. The evaporation section 710 is provided with a liquid working medium. The packaging structure is provided with a metal shielding cover 300 at one end that is sealed and embedded in the evaporation section 710 and immersed in the liquid working medium.

[0066] It should be noted that one end of the packaging structure having the packaging shell 100 is disposed outside the evaporation section 710 .

[0067] It should be noted that the working fluid is usually an insulating fluid, including but not limited to pure water, ethanol, ammonia, water, acetone and methanol.

[0068] In such a configuration, since the heating end of the power element 500 is bonded to the metal shielding cover 300, and the metal shielding cover 300 is provided with a perforation 310, the liquid working medium in the evaporation section 710 can pass through the perforation 310 into the interior of the metal shielding cover 300 and dissipate the heat of the power element 500. When the power element 500 releases heat, the liquid working medium absorbs heat and vaporizes and enters the condensation section 720. Thereafter, the gaseous working medium releases heat and liquefies in the condensation section 720 and flows back into the evaporation section 710.

[0069] Furthermore, it should be noted that when a metal substrate 600 is provided, the liquid working medium dissipates heat from the power element 500 by contacting the metal substrate 600. Specifically, the metal substrate 600 is partially or completely immersed in the liquid working medium.

[0070] From the above, it can be seen that the present application cleverly utilizes the electromagnetic shielding characteristics of the metal shielding cover 300 and the permeability of the liquid working medium, so that the power element 500 can be affected by the electromagnetic shielding effect of the metal shielding cover 300 without affecting the heat dissipation of the power element 500. Compared with the DBC substrate structure in the prior art that needs to go through a multi-layer structure to contact the liquid cooling plate for heat dissipation, the heat exchange device in the present application greatly improves the heat dissipation effect of the power element 500.

[0071] Furthermore, since there is no need to weld the copper base plate and the liquid cooling plate (usually an aluminum alloy), the difficulty of assembling the heat exchange device in the present application is greatly reduced.

[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

[0074] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0075] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0076] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0077] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0078] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

Claims

1. A packaging structure, characterized in that: The invention comprises a packaging shell (100), an insulating filling colloid (120), an insulating thermally conductive colloid (200), a metal shielding cover (300) and a grounding wire (400); the metal shielding cover (300) is provided with a plurality of through holes (310) penetrating its side wall; the heating end of one or more power elements (500) is bonded to one end of the metal shielding cover (300) through the insulating thermally conductive colloid (200); the sealing cover of the packaging shell (100) is arranged on one side of the metal shielding cover (300) where the power element (500) is arranged and is surrounded by the metal shielding cover (300) to form a shielding cavity (110); the power element (500) and the inner wall of the shielding cavity (110) are arranged at intervals; the insulating filling colloid (120) is filled in the shielding cavity (110); one end of the grounding wire (400) is electrically connected to the metal shielding cover (300) and the other end is grounded.

2. The packaging structure according to claim 1, characterized in that: It also comprises a metal substrate (600), the metal substrate (600) being arranged between the packaging shell (100) and the metal shielding cover (300), and the sealing cover of the packaging shell (100) being arranged on one side of the metal substrate (600) and surrounding the metal substrate (600) to form a filling cavity (111), the power element (500) being arranged in the filling cavity (111), and the power element (500) being bonded to one end of the metal substrate (600) through the insulating thermal conductive colloid (200), and the insulating filling colloid (120) being filled in the filling cavity (111); The metal shielding cover (300) is disposed on a side of the metal substrate (600) away from the power element (500) and is electrically connected to the metal substrate (600); one end of the grounding wire (400) is electrically connected to the metal shielding cover (300) through the metal substrate (600), and the other end is grounded.

3. The packaging structure according to claim 1, characterized in that: There are multiple metal shielding covers (300), and the multiple metal shielding covers (300) are stacked in layers.

4. The packaging structure according to claim 1, characterized in that: The metal shielding cover (300) is a polyhedron structure.

5. The packaging structure according to claim 4, characterized in that: The metal shielding cover (300) is a porous plate structure.

6. The packaging structure according to claim 1, characterized in that: The metal shielding cover (300) is a curved surface structure.

7. The packaging structure according to claim 6, characterized in that: The metal shielding cover (300) is a porous mesh structure.

8. The packaging structure according to claim 1, characterized in that: The plurality of through holes (310) are evenly distributed on the side wall of the metal shielding cover (300).

9. The packaging structure according to claim 1, characterized in that: The insulating heat-conducting colloid (200) is heat-conducting silicone grease.

10. A heat exchange device, characterized in that: Used to dissipate heat for a power element (500), the heat exchange device comprises a heat pipe heat exchanger (700) and a packaging structure according to any one of claims 1 to 9, the heat pipe heat exchanger (700) comprises an evaporation section (710) and a condensation section (720) that are connected, a liquid working medium is provided in the evaporation section (710), and the packaging structure is provided with one end of the metal shielding cover (300) sealed and embedded in the evaporation section (710) and immersed in the liquid working medium.

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