Electronic product PCB low-temperature self-heating circuit system

Abstract

The utility model provides an electronic product PCB low-temperature self-heating circuit system, and belongs to the technical field of printed circuit boards. Comprising two element layers and two heating layers, the two element layers are located on the topmost layer and the bottommost layer respectively, the two heating layers are located between the two element layers, and heating loops are arranged on the heating layers. And the heating loop is used for ensuring that electronic components on the element layer normally work in a low-temperature environment. According to the utility model, through the cooperation of the heating layer and the temperature switches K1 and K2, the purpose of ensuring the stable performance of the semiconductor component in a low-temperature environment is achieved, and through the organic cooperation of the temperature switches K3 and K4, the heating layer and the power supply, the purpose of preventing the semiconductor component from being damaged by low-temperature starting is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a low-temperature self-heating circuit system of a PCB of an electronic product. Background Art

[0002] In an era of rapid technological development and increasingly close connections, the international situation is in constant dynamic change. Innovation and progress in the high-tech field play an extremely critical role in the comprehensive development plans of various countries. As a significant product of contemporary advanced technology, electronic products have been fully integrated into many aspects of social production and life, and their role in special operating scenarios and key situations such as emergency rescue has become increasingly significant, profoundly affecting the operating mode and development direction of various industries.

[0003] However, semiconductor materials, as the core components of electronic products, have an inherent defect of being extremely sensitive to low temperature environments; when the ambient temperature is below -55°C, the physical properties of most semiconductor products will change significantly, causing their performance to drop sharply or even fail completely. In a severely cold environment, this low-temperature failure phenomenon makes it impossible for electronic components to work properly, and thus causes the entire electronic product to lose its function. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a low-temperature self-heating circuit system for a PCB of an electronic product, so as to solve the technical problem that in a severely cold environment, the semiconductor components of a traditional electronic product cannot work normally, thereby causing the entire electronic product to lose its function, and that when the electronic product is directly started in a low-temperature environment, the instantaneous current shock and the low-temperature environment may cause the semiconductor components to malfunction or be damaged.

[0005] Technical solution: To achieve the above purpose, the present invention is implemented through the following technical solution: a low-temperature self-heating circuit system for PCB of electronic products, comprising: a component layer and a heating layer, wherein two component layers are provided, and two heating layers are provided, wherein the two component layers are respectively located at the topmost layer and the bottommost layer, and the two heating layers are located between the two component layers, and a heating circuit is provided on the heating layer, wherein the heating circuit is used to ensure that the electronic components on the component layer work normally under low temperature environment; a plurality of temperature switches, including K1, K2, K3 and K4, wherein K1 and K2 are connected in series in the heating circuit, and K3 and K4 are connected in parallel and then connected in series in the power supply circuit of the electronic product, wherein K1 and K2 are used to control the temperature by sensing the temperature. The on and off of the heating circuit, the K3 and K4 are used to control the on and off of the power supply circuit of the electronic product by sensing the temperature, so as to realize the reliable operation of the electronic product under extremely cold conditions, wherein the heating layer adopts materials with good thermal conductivity and high temperature resistance (such as metal foil or special ceramic materials) to ensure that the heat can be evenly and effectively transferred to the component layer, and the component layers and the component layer and the heating layer are isolated by high-precision and high-reliability insulating media (such as special epoxy resin materials) to ensure electrical insulation performance; the line width, thickness and line spacing of the heating circuit are optimized according to the required heating power, heating speed and overall PCB layout to ensure that the heat is evenly distributed and no local overheating occurs. The temperature response error of the temperature switches K1, K2, K3 and K4 is controlled within a very small range to ensure the accuracy and stability of temperature control.

[0006] In a further embodiment, a current limiting resistor is connected to the power supply line of the heating circuit to limit the current during heating to prevent excessive current from damaging the heating layer. The power capacity of the current limiting resistor needs to be greater than the maximum power value that may occur during normal operation, and has a certain safety margin (such as more than 1.5 times). The temperature coefficient is low, and the resistance value changes little under different temperature environments, ensuring a stable limiting effect on the current. The connection between the current limiting resistor and the heating circuit adopts a reliable welding process to ensure a firm electrical connection and a low contact resistance.

[0007] In a further embodiment, the positive electrode of the power supply is connected to one end of the current limiting resistor, the other end of the current limiting resistor is connected to one end of K1, and the other end of K1 is connected to one end of the heating circuit; the negative electrode of the power supply is connected to one end of K2, and the other end of K2 is connected to the other end of the heating circuit to form a complete heating circuit power supply circuit, wherein the output voltage fluctuation range of the power supply is controlled to a minimum value within the normal operating temperature range, and has multiple protection functions such as overvoltage protection, overcurrent protection and short circuit protection to prevent circuit failure from causing damage to the power supply and the entire system; the connecting wires between the power supply and the current limiting resistor and the temperature switch are made of materials with good low-temperature performance and low resistivity (such as silver alloy wire), and the wire diameter of the wire is reasonably selected according to the current size to ensure the high efficiency and reliability of power transmission.

[0008] In a further embodiment, the positive electrode of the power supply is connected to the input end of K3 and K4, and the output end of K3 and K4 is connected to the positive power input end of the electronic product power supply circuit on the component layer to realize power supply control of the electronic product power supply circuit, wherein the connection between K3 and K4 and the power supply and the electronic product power supply circuit adopts a high-reliability connector or welding method to ensure the stability of the connection and electrical conductivity.

[0009] In a further embodiment, K1 and K2 are normally closed switches, and K3 and K4 are normally open switches, wherein the shells of the temperature switches of K1, K2, K3 and K4 are encapsulated with materials that are resistant to high and low temperatures and have good insulation properties (such as engineering plastics), ensuring that the internal components are not affected by the external environment and improving the reliability and stability of the switches; the contacts of the switches are made of highly conductive, wear-resistant metal materials (such as silver alloys) to ensure good electrical contact performance after multiple on-off operations.

[0010] In a further embodiment, K1 and K2 are in a normally closed state when the temperature is lower than -25°C, and in a normally open state when the temperature is higher than -25°C, wherein the temperature characteristic curves of K1 and K2 are precisely calibrated and tested, and have good linearity within the temperature change range near -25°C, thereby ensuring the accuracy of temperature control; their action repeatability is high, and they can stably switch on and off at the set temperature point in multiple temperature cycle tests.

[0011] In a further embodiment, K3 and K4 are in a normally open state when the temperature is lower than -40°C, and in a normally closed state when the temperature is higher than -40°C, wherein: K3 and K4 have good temperature stability, and their temperature switch characteristics remain basically unchanged during long-term use, and are not significantly affected by environmental factors such as humidity and vibration; their installation position is close to electronic components, and can accurately sense the actual temperature of the electronic components, thereby improving the effectiveness of temperature control.

[0012] In a further embodiment, a plurality of heating wires are connected in series in the heating circuit. When the power is on, the heating wires generate heat and conduct the heat to the top and bottom component layers of the PCB, playing the role of heating the component layer. The layout of the heating wires in the heating layer is evenly distributed and reasonably spaced from each other, ensuring that the heat is evenly distributed on the entire PCB board to avoid local overheating. The connection between the heating wire and the heating circuit adopts a reliable welding process to ensure a firm electrical connection and low contact resistance, thereby preventing uneven heating or short circuit failures caused by poor connection. The total resistance value of the heating wire is accurately calculated and determined based on the power supply voltage and the required heating power, so that it can achieve the expected heating effect during normal operation, while not exceeding its rated power, ensuring safe and reliable operation.

[0013] Beneficial effects: 1. Through the coordinated cooperation of the heating layer, temperature switches K1 and K2, the purpose of ensuring the stable performance of semiconductor components in low-temperature environments is achieved; the heating layer is located between the component layers, and its internal heating circuit works under the precise control of the temperature switches K1 and K2; when the ambient temperature is lower than -25°C, K1 and K2 are closed, the heating circuit is turned on, and the heating wire begins to heat up. This heat is conducted to the component layer through the heating layer, providing a suitable operating temperature environment for semiconductor components; in a low-temperature environment, semiconductor components obtain stable heat supplementation, thus avoiding performance degradation or failure due to low temperature.

[0014] 2. With the organic cooperation of temperature switches K3 and K4, heating layer and power supply, the purpose of avoiding damage to semiconductor components caused by low-temperature startup is achieved; in a low-temperature environment, when the temperature is lower than -40°C, K3 and K4 are in a normally open state, and the power supply circuit of the electronic product is cut off, preventing the direct impact of the low-temperature environment on semiconductor components; at the same time, the heating layer starts to work under the control of temperature switches K1 and K2 to heat the component layer; as the temperature gradually rises, when it reaches -40°C and above, K3 and K4 are closed, the power supply supplies power to the power supply circuit of the electronic product, and the electronic product starts; thus, when starting the electronic product in a low-temperature environment, the situation of semiconductor components being damaged by the combined effects of instantaneous large current impact and low-temperature environment is avoided; the effect of protecting semiconductor components from damage during low-temperature startup and improving the safety and reliability of electronic products starting in a low-temperature environment is achieved, ensuring that electronic products can be safely and stably started and enter normal operating state under extremely cold conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] Figure 2 Schematic diagram of the circuit of low-temperature self-heating electronic products.

[0018] The reference numerals in the figure are: 1, component layer; 2, heating layer. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the practical embodiment clearer, the technical solution in the practical embodiment is clearly and completely described. Obviously, the described embodiment is a part of the practical embodiment, not all of the embodiments. Based on the embodiments in this practical, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this practical.

[0020] The embodiment of the present application provides a low-temperature self-heating circuit system for PCB of electronic products, which solves the technical problems that the semiconductor components of traditional electronic products cannot work normally in severe cold environments, thus causing the entire electronic product to lose its function, and the instantaneous current shock and low temperature environment may cause the semiconductor components to malfunction or be damaged when the electronic products are directly started in a low-temperature environment. In actual use, the electronic products can operate normally in extremely cold conditions (<-40℃), and the performance of semiconductor components can be stabilized in a low-temperature environment to achieve the purpose of safe startup.

[0021] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0022] Reference Figure 1-2A low-temperature self-heating circuit system for a PCB of an electronic product comprises: a component layer 1 and a heating layer 2, wherein two component layers 1 are provided, and two heating layers 2 are provided, wherein the two component layers 1 are respectively located at the topmost layer and the bottommost layer, and the two heating layers 2 are located between the two component layers 1, and a heating circuit is provided on the heating layer 2, wherein the heating circuit is used to ensure that the electronic components on the component layer 1 work normally under a low-temperature environment; a plurality of temperature switches, including K1, K2, K3 and K4, wherein K1 and K2 are connected in series in the heating circuit, and K3 and K4 are connected in parallel and in series in the power supply circuit of the electronic product, wherein K1 and K2 are used to control the on-off of the heating circuit by sensing the temperature, and wherein K3 and K4 are used to control the on-off of the power supply circuit of the electronic product by sensing the temperature, so as to realize the reliable operation of the electronic product under extremely cold conditions.

[0023] By using two heating layers 2 with heating circuits between the component layers 1, the electronic components of the component layer 1 are heated and heated in a low temperature environment to ensure normal operation. The heating circuit can efficiently convert electrical energy into thermal energy through reasonable layout and conductive material selection. Heat is generated at low temperatures and transmitted to the component layer 1 by virtue of the good thermal conductivity of the heating layer 2, thereby overcoming the adverse effects of low temperature on the performance of components and maintaining the integrity of the functions of electronic products. By virtue of the design of temperature switches K1 and K2 connected in series in the heating layer 2 circuit and K3 and K4 connected in parallel and then in series in the power supply circuit of the electronic product, the heating circuit and the power supply circuit are automatically and accurately controlled according to the ambient temperature to ensure that the electronic products can work reliably in extremely cold conditions. K1 and K2 are closed to start heating when the temperature is lower than -25°C and disconnected to avoid overheating when the temperature is higher than -25°C. K3 and K4 cut off the power supply circuit when the temperature is lower than -40°C and close when the temperature is higher than -40°C to enable the electronic products to start and work normally. This intelligent temperature control mechanism allows the circuit system to adapt to the extremely cold environment and ensures the stable and reliable operation of electronic products.

[0024] The current limiting resistor is connected to the power supply line of the heating circuit and is used to limit the current during heating to prevent the heating layer 2 from being damaged by excessive current.

[0025] By connecting the current limiting resistor to the power supply line of the heating circuit, the effect of limiting the current size during heating and preventing the heating layer 2 from being damaged by excessive current is achieved. The current limiting resistor accurately selects the resistance value based on factors such as the resistance of the resistance wire of the heating layer 2, the power supply voltage and the required heating power. When the current passes through, it generates a certain voltage drop according to Ohm's law, thereby effectively limiting the current size. This ensures that the heating layer 2 will not be damaged by overheating, burning, etc. due to excessive current during normal operation.

[0026] The positive pole of the power supply is connected to one end of the current limiting resistor, the other end of the current limiting resistor is connected to one end of K1, and the other end of K1 is connected to one end of the heating circuit; the negative pole of the power supply is connected to one end of K2, and the other end of K2 is connected to the other end of the heating circuit to form a complete heating circuit power supply circuit.

[0027] By connecting the positive pole of the power supply to the current limiting resistor, K1 and one end of the heating circuit in sequence, and the negative pole to K2 and the other end of the heating circuit, it is achieved to provide stable electric energy for the heating circuit and form a complete power supply circuit to drive the heating process. The power supply acts as an energy source, and the electric energy output by it is adjusted by the current limiting resistor and flows to the heating circuit along a predetermined path. In this process, K1 and K2 are turned on or off in time under temperature control to accurately control the power-on state of the heating circuit. This connection method ensures that the heating circuit can obtain the required electric energy at the right time, so that the heating wire can heat up normally, thereby providing heat for the electronic components of the element layer 1, maintaining its normal operating temperature in a low temperature environment, and ensuring the effective realization of the heating function.

[0028] The positive pole of the power supply is connected to the input terminals of K3 and K4, and the output terminals of K3 and K4 are connected to the positive power input terminal of the electronic product power supply circuit on the component layer to realize power supply control of the electronic product power supply circuit.

[0029] By connecting the positive pole of the power supply to the input terminals of K3 and K4, and connecting the output terminals of K3 and K4 to the positive input Power+ of the power supply circuit of the electronic product, the effect of controlling the on and off of the power supply circuit of the electronic product according to the temperature and providing a stable power supply for the electronic product is achieved. In a low temperature environment, K3 and K4 control the on and off of the power supply circuit according to temperature changes; when the temperature is below -40°C, they remain open and cut off the power supply to prevent the low temperature from damaging the semiconductor components; when the temperature reaches -40°C and above, they close to connect the power supply to the power supply circuit of the electronic product, providing a stable power input for the electronic product. This connection method ensures that the electronic product starts and works under appropriate temperature conditions, avoids the current shock and component damage risks caused by low temperature startup, and ensures the reliability and safety of power supply for electronic products in extremely cold environments.

[0030] K1 and K2 are normally closed switches, and K3 and K4 are normally open switches.

[0031] By designing K1 and K2 as normally closed switches, the heating circuit can remain conductive in the initial state or when a specific high temperature condition is not reached. By setting K3 and K4 as normally open switches, the power supply circuit of electronic products can be automatically cut off in the initial state and low temperature environment.

[0032] The K1 and K2 are in a normally closed state when the temperature is lower than -25°C, and are in a normally open state when the temperature is higher than -25°C.

[0033] By switching between K1 and K2, which are normally closed when the temperature is below -25°C and normally open when the temperature is above -25°C, the heating circuit can be precisely controlled to avoid overheating and affecting the electronic components. In a low temperature environment, K1 and K2 are closed to keep the heating circuit working and increase the temperature of the electronic components; when the temperature rises to -25°C or above, they are promptly switched to the normally open state, cutting off the current in the heating circuit and stopping heating; this precise temperature control function avoids the continuous heating of the heating layer 2 causing the temperature around the electronic components to be too high, prevents damage to the electronic components or abnormal performance caused by overheating, ensures that the electronic components always work within a suitable temperature range, and improves the stability and reliability of the entire circuit system.

[0034] The K3 and K4 are in a normally open state when the temperature is lower than -40°C, and are in a normally closed state when the temperature is higher than -40°C.

[0035] The characteristic of K3 and K4 as -40℃ normally open switches can cut off the power supply circuit of electronic products in low temperature environment and prevent the damage of semiconductor components caused by low temperature startup. When the ambient temperature is lower than -40℃, K3 and K4 remain in the normally open state, effectively isolating the power supply from the power supply circuit of electronic products, avoiding the current shock and low temperature damage that semiconductor components may suffer when directly powered on and started at low temperature. This characteristic provides low temperature protection for semiconductor components, ensuring that they will not be damaged due to improper startup in low temperature environment, laying the foundation for subsequent normal startup and operation at appropriate temperature.

[0036] A plurality of heating wires are connected in series in the heating circuit. When powered on, the heating wires generate heat and conduct the heat to the top and bottom component layers 1 of the PCB, thereby heating the component layer 1 .

[0037] By connecting multiple heating wires in series in the heating circuit and conducting heat to the component layer 1 through power-on, the effect of efficiently generating heat and evenly raising the temperature of the component layer 1 to ensure the normal operation of electronic components is achieved. The heating wire is made of a metal alloy material with high resistivity and strong oxidation resistance, and can generate a large amount of heat according to Joule's law when powered on; multiple heating wires connected in series increase the total heating power, and their layout in the heating circuit is designed so that the heat can be evenly distributed throughout the heating layer 2; the heat is transferred to the component layer 1 through the heating layer 2, effectively raising the temperature around the electronic components.

[0038] During use, in a low temperature environment, the circuit starts to work; since K1 and K2 are normally closed switches, in the initial state, the heating circuit is in a conducting state, and the current starts from the positive pole of the power supply, passes through the current limiting resistor, passes through K1, then flows into the heating circuit, and then returns to the negative pole of the power supply through K2. The multiple heating wires in the heating circuit generate heat due to the passage of current, and the heat is conducted to the component layer 1 located at the top and bottom through the two heating layers 2, thereby ensuring the temperature environment of the electronic components on the component layer 1, so that they can maintain certain performance at low temperatures; at the same time, K3 and K4 are normally open switches, and in a low-temperature environment, the power supply circuit of the electronic product is in a disconnected state, thereby avoiding the instantaneous current shock and the low-temperature environment from damaging the semiconductor components when the electronic product is started at low temperatures; as the heating process continues, when the temperature gradually rises to a certain level (higher than the operating temperature of K1 and K2), K1 and K2 become disconnected, and the heating circuit stops heating; when the temperature rises to the operating temperature of K3 and K4 (at this time, the temperature is suitable for the normal operation of the electronic product), K3 and K4 are closed, and the power supply supplies power to the positive terminal of the power input of the power supply circuit of the electronic product through K3 and K4, and the electronic product starts normally and runs stably, thereby realizing the reliable operation of the electronic product under extremely cold conditions.

[0039] The figures depicted in the attached drawings are example figures, and their purpose is only to more intuitively demonstrate the key structure and connection relationship of the low-temperature self-heating circuit system of the PCB of an electronic product of the utility model; in actual applications, the appearance and size of the device can be adjusted and optimized according to specific needs.

Claims

1. A low-temperature self-heating circuit system for a PCB of an electronic product, comprising a component layer (1) and a heating layer (2), characterized in that: There are two component layers (1), and there are two heating layers (2), the two component layers (1) are respectively located at the topmost layer and the bottommost layer, the two heating layers (2) are located between the two component layers (1), and a heating circuit is provided on the heating layer (2), and the heating circuit is used to ensure that the electronic components on the component layer (1) work normally in a low temperature environment; A plurality of temperature switches, including K1, K2, K3 and K4, wherein K1 and K2 are connected in series in a heating circuit, and K3 and K4 are connected in parallel and then connected in series in an electronic product power supply circuit, wherein K1 and K2 are used to control the on-off of the heating circuit by sensing the temperature, and wherein K3 and K4 are used to control the on-off of the electronic product power supply circuit by sensing the temperature, so as to realize reliable operation of the electronic product under extremely cold conditions.

2. The electronic product PCB low-temperature self-heating circuit system according to claim 1, characterized in that: Also includes: The current limiting resistor is connected to the power supply line of the heating circuit and is used to limit the current during heating to prevent the heating layer (2) from being damaged by excessive current.

3. The electronic product PCB low-temperature self-heating circuit system according to claim 2, characterized in that: Also includes: A power supply, the positive electrode of which is connected to one end of a current limiting resistor, the other end of the current limiting resistor is connected to one end of K1, and the other end of K1 is connected to one end of a heating circuit; The negative electrode of the power supply is connected to one end of K2, and the other end of K2 is connected to the other end of the heating circuit to form a complete heating circuit power supply circuit.

4. The electronic product PCB low-temperature self-heating circuit system according to claim 3, characterized in that: The positive electrode of the power supply is connected to the input ends of K3 and K4, and the output ends of K3 and K4 are connected to the positive power input end of the electronic product power supply circuit on the component layer (1) to realize power supply control of the electronic product power supply circuit.

5. The electronic product PCB low-temperature self-heating circuit system according to claim 1, characterized in that: K1 and K2 are normally closed switches, and K3 and K4 are normally open switches.

6. The electronic product PCB low-temperature self-heating circuit system according to claim 5, characterized in that: The K1 and K2 are in a normally closed state when the temperature is lower than -25°C, and are in a normally open state when the temperature is higher than -25°C.

7. The electronic product PCB low-temperature self-heating circuit system according to claim 5, characterized in that: The K3 and K4 are in a normally open state when the temperature is lower than -40°C, and are in a normally closed state when the temperature is higher than -40°C.

8. The electronic product PCB low-temperature self-heating circuit system according to claim 1, characterized in that: A plurality of heating wires are connected in series in the heating circuit. When energized, the heating wires generate heat and conduct the heat to the top and bottom component layers (1) of the PCB, thereby heating the component layers (1).

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