Automatic rubber coating machine for PCB production

Abstract

The utility model discloses an automatic rubber coating machine for PCB production, which relates to the technical field of rubber coating machines and comprises two support plates, a rubber film roll and a rubber coating device, a plurality of transmission rollers are arranged between the two support plates, the rubber coating device is arranged between the two support plates, and the rubber film roll is detachably arranged between the two support plates. The device further comprises an attaching assembly, an adjusting assembly, a guide assembly and a cooling assembly, the guide assembly comprises L-shaped plates, sliding plates and guide wheels, the two L-shaped plates are fixedly connected between the two supporting plates, the two sliding plates are jointly arranged on the upper surfaces of the two L-shaped plates, and the lower surfaces of the two sliding plates are rotationally connected with the multiple guide wheels through pin shafts. According to the utility model, guide adjustment can be carried out through the adjusting assembly according to circuit boards with different widths and thicknesses, so that the rubber coating machine is stronger in applicability.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating machines, in particular to an automatic glue coating machine for PCB board production. Background Art

[0002] The existing automatic encapsulation machinery uses a roller conveyor table to transport the circuit board to the encapsulation device for coating with adhesive film. After the encapsulation is completed, it is transported to the unloading place through the roller conveyor mechanism, and then transferred to the unloading table by the unloading robot to complete the encapsulation process.

[0003] According to the announcement number: CN213522562U, it involves the field of circuit board processing technology, specifically refers to a gluing machine for circuit board production. The above-mentioned gluing machine for circuit board production guides and transports the circuit board with the assistance of a guide wheel, but its guide wheel is fixed and cannot be adjusted according to circuit boards of different sizes, which makes the gluing machine's ability to gluing circuit boards of different sizes limited and its applicability is low.

[0004] Based on this, an automatic glue encapsulation machine for PCB board production is now provided, which can eliminate the disadvantages of the existing devices. Utility Model Content

[0005] The utility model aims to provide an automatic glue-coating machine for PCB board production, so as to solve the problem that the existing glue-coating machine cannot be adjusted according to circuit boards of different sizes and has low applicability.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An automatic glue coating machine for PCB board production, comprising a support plate, a glue film roll, and a glue coating device, wherein a plurality of transmission rollers are arranged between the two support plates, a glue coating device is arranged between the two support plates, a glue film roll is detachably arranged between the two support plates, and also comprising a bonding component, an adjustment component, a guide component, and a cooling component, wherein the guide component comprises an L-shaped plate, a sliding plate, and a guide wheel, wherein two L-shaped plates are fixedly connected between the two support plates, two sliding plates are commonly arranged on the upper surfaces of the two L-shaped plates, and the lower surfaces of the two sliding plates are rotatably connected to a plurality of guide wheels via pins, the bonding component is arranged on the side wall of the support plate, and is used to make the circuit board and the glue film fit more closely, the cooling component is arranged between the two support plates, and is used to cool the glue film softened by hot air, and the adjustment component is arranged on the side wall of the support plate, and is used to facilitate the adjustment of the guide component.

[0008] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0009] In an optional solution: the guide wheel is a cone.

[0010] In an optional scheme: the adjustment component includes a bidirectional screw and a synchronous pulley, the two sliding plates are slidingly connected to the upper surface of the L-shaped plate, two bidirectional screws are rotatably connected between the two support plates through bearings, the two bidirectional screws are commonly threadedly connected to the two sliding plates, the parts of the two bidirectional screws located outside the support plates are fixedly connected to the synchronous pulleys, and the two synchronous pulleys are jointly cooperated with a synchronous belt.

[0011] In an optional solution: the side wall of the support plate is fixedly connected to a first motor via a bracket, and an output end of the first motor is fixedly connected to one of the bidirectional screws.

[0012] In an optional scheme: the laminating component includes an electric push rod, a laminating roller, and a lifting block. The upper surfaces of the two support plates are fixedly connected to the electric push rods, the opposite side walls of the two support plates are provided with lifting block grooves, the inner side walls of the two lifting block grooves are slidably connected to the lifting blocks, the upper surfaces of the two lifting blocks are respectively fixedly connected to the output ends of the two electric push rods, and the two lifting blocks are rotatably connected to a laminating roller through a rotating shaft.

[0013] In an optional solution: the cross-section of the lifting block is T-shaped.

[0014] In an optional scheme: the cooling component includes a fixed plate, an air jet, an air intake cylinder, a second motor, fan blades, and a rotating shaft. A fixed plate is fixedly connected between the two support plates. A plurality of air vents are opened on the side wall of the fixed plate. Several of the air vents are connected by pipes, and several of the air vents are provided with air jets. The side wall of the support plate is fixedly connected to the air intake cylinder through a bracket. The air intake cylinder is connected to the fixed plate through a pipe. The pipe between the air intake cylinder and the fixed plate passes through the support plate. The inner side wall of the air intake cylinder is fixedly connected to the second motor through a bracket. The output end of the second motor is fixedly connected to the rotating shaft, and the circumferential side wall of the rotating shaft is fixedly connected to a plurality of fan blades.

[0015] In an optional solution: a dustproof net is provided on the upper surface of the air intake cylinder, and the output end of the second motor passes through the dustproof net.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. The utility model starts a first motor, which drives one of the bidirectional screws to rotate. One of the bidirectional screws drives the other bidirectional screw to rotate through a synchronous pulley and a synchronous belt, so that the two sliding plates move toward each other. The two sliding plates can be adjusted according to circuit boards of different widths and thicknesses. Through the guide wheel under the sliding plate, when the airflow lift is too large, the circuit board can be suspended in contact with the guide wheel, effectively preventing the circuit board from deviating from the conveying track.

[0018] 2. The utility model starts the electric push rod, which drives the lifting block to move up and down, and the lifting block drives the bonding roller to move up and down for adjustment, so as to facilitate the bonding roller to compact and bond circuit boards of different thicknesses. The airflow ejected from the air jet port makes the circuit board after the rubber coating fit better with the bonding roller, and the extrusion force exerted on the circuit board when bonding with the bonding roller can be achieved by controlling the size of the airflow, so as to effectively avoid damage to the circuit board due to excessive pressure during the compaction and bonding process between the bonding roller and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model.

[0020] Figure 2 This is a first viewing angle diagram of the present invention.

[0021] Figure 3 This is a first viewing angle diagram of the adjustment component of the utility model.

[0022] Figure 4 This is a second viewing angle diagram of the adjustment component of the utility model.

[0023] Figure 5 It is a schematic diagram of the structure of the bonding component of the utility model.

[0024] Figure 6 This is a schematic diagram of the structure of the blowing component of the utility model.

[0025] Figure 7 It is a schematic diagram of the structure of the air intake cylinder of the utility model.

[0026] Notes on figure numbers: 1 support plate, 2 film roll, 3 glue coating device, 4 electric push rod, 5 L-shaped plate, 6 fixed plate, 7 laminating roller, 8 lifting block, 9 sliding plate, 10 bidirectional screw, 11 synchronous pulley, 12 guide wheel, 13 first motor, 14 air jet, 15 air intake pipe, 16 dust screen, 17 second motor, 18 fan blades, 19 rotating shaft. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] Example 1

[0029] In one embodiment, Figure 1-Figure 7As shown, an automatic glue coating machine for PCB board production includes a support plate 1, a glue film roll 2, and a glue coating device 3. A plurality of transmission rollers are arranged between the two support plates 1. A glue coating device 3 is arranged between the two support plates 1. A glue film roll 2 is detachably arranged between the two support plates 1. It also includes a bonding component, an adjustment component, a guide component, and a cooling component. The guide component includes an L-shaped plate 5, a sliding plate 9, and a guide wheel 12. Two L-shaped plates 5 are fixedly connected between the two support plates 1. Two sliding plates 9 are commonly arranged on the upper surfaces of the two L-shaped plates 5. The lower surfaces of the two sliding plates 9 are rotatably connected to a plurality of guide wheels 12 through pins. The bonding component is arranged on the side wall of the support plate 1 to make the circuit board and the glue film fit better. The cooling component is arranged between the two support plates 1 to cool the glue film softened by hot air. The adjustment component is arranged on the side wall of the support plate 1 to facilitate the adjustment of the guide component.

[0030] In one embodiment, Figure 4 As shown, the guide wheel 12 is a cone. Since the guide wheel 12 is a cone, the guide wheel 12 can apply lateral and longitudinal forces to the circuit board, and the guide can also prevent the circuit board from deviating from the conveying track when the airflow lift is too large.

[0031] In one embodiment, Figure 3 and Figure 4 As shown, the adjustment assembly includes a bidirectional screw 10 and a synchronous pulley 11, two sliding plates 9 are slidably connected to the upper surface of the L-shaped plate 5, two bidirectional screws 10 are rotatably connected between the two support plates 1 through a bearing, the two bidirectional screws 10 are threadedly connected to the two sliding plates 9, and the parts of the two bidirectional screws 10 located outside the support plate 1 are fixedly connected to the synchronous pulley 11, and the two synchronous pulleys 11 are matched with a synchronous belt. One of the bidirectional screws 10 drives the other bidirectional screw 10 to rotate through the synchronous pulley 11 and the synchronous belt, so that the two sliding plates 9 move toward each other, and can be adjusted according to circuit boards of different widths and thicknesses. Through the guide wheel 12 under the sliding plate 9, when the airflow lift is too large, the circuit board can be suspended in contact with the guide wheel 12, effectively preventing the circuit board from deviating from the conveying track.

[0032] In one embodiment, Figure 3 As shown, the side wall of the support plate 1 is fixedly connected with a first motor 13 through a bracket, and the output end of the first motor 13 is fixedly connected to one of the bidirectional screws 10. When the first motor 13 is started, the first motor 13 drives one of the bidirectional screws 10 to rotate.

[0033] In one embodiment, Figure 5As shown, the laminating assembly includes an electric push rod 4, a laminating roller 7, and a lifting block 8. The upper surfaces of the two support plates 1 are fixedly connected with the electric push rod 4. The opposite side walls of the two support plates 1 are provided with lifting block grooves. The inner side walls of the two lifting block grooves are slidably connected with the lifting blocks 8. The upper surfaces of the two lifting blocks 8 are respectively fixedly connected with the output ends of the two electric push rods 4. The two lifting blocks 8 are rotatably connected with the laminating roller 7 through the rotating shaft. The electric push rod 4 is started, and the electric push rod 4 drives the lifting block 8 to move up and down, and the lifting block 8 drives the laminating roller 7 to move up and down, and is adjusted to facilitate the compaction and lamination of the laminating roller 7 with circuit boards of different thicknesses. The airflow ejected from the air jet 14 makes the circuit board after the rubber coating more compact with the laminating roller 7, and the extrusion force on the circuit board when laminating with the laminating roller 7 can be achieved by controlling the size of the airflow, effectively avoiding damage to the circuit board due to excessive pressure during the compaction and laminating process between the laminating roller 7 and the circuit board.

[0034] In one embodiment, Figure 5 As shown, the cross section of the lifting block 8 is T-shaped. The lifting block 8 is limited.

[0035] In one embodiment, Figure 6 As shown, the cooling component includes a fixed plate 6, an air jet 14, an air intake cylinder 15, a second motor 17, fan blades 18, and a rotating shaft 19. The fixed plate 6 is fixedly connected between the two support plates 1. A plurality of air vents are provided on the side wall of the fixed plate 6. The plurality of air vents are connected through pipes, and the plurality of air vents are all provided with air jets 14. The side wall of the support plate 1 is fixedly connected to the air intake cylinder 15 through a bracket. The air intake cylinder 15 is connected to the fixed plate 6 through a pipe. The pipe between the air intake cylinder 15 and the fixed plate 6 runs through the support plate 1. The inner wall of the air intake cylinder 15 is fixedly connected to the second motor 17 through a bracket. The output end of the second motor 17 is fixedly connected to the rotating shaft 19, and a plurality of fan blades 18 are fixedly connected to the circumferential side wall of the rotating shaft 19. The second motor 17 is started, and the second motor 17 drives the rotating shaft 19 to rotate, and the rotating shaft 19 drives the fan blades 18 to rotate. The fan blades 18 drive the external wind to enter the fixed plate 6 through the pipeline, and then discharge it through the air jet 14. The circuit board after the rubber coating is pushed by the airflow blown out of the air jet 14. The lift of the airflow reduces the pressure applied by the circuit board to the transmission roller, reduces the friction between the transmission roller and the circuit board, thereby reducing the probability of the outer film of the circuit board after the rubber coating being damaged, and the airflow blown by the air jet 14 can accelerate the cooling speed of the outer film of the circuit board, so that the hardening speed of the film is accelerated.

[0036] Example 2

[0037] In one embodiment, Figure 6 As shown, a dustproof net 16 is provided on the upper surface of the air inlet cylinder 15, and the output end of the second motor 17 passes through the dustproof net 16 to prevent dust from being blown onto the circuit board.

[0038] The above embodiment discloses an automatic glue coating machine for PCB board production, wherein a plurality of transmission rollers are controlled to rotate by independent motors, and the circuit boards are transported by the transmission rollers. During the transportation process, the circuit boards are coated with glue by the glue film roll 2 and the glue coating device 3;

[0039] Start the electric push rod 4, which drives the lifting block 8 to move up and down, and the lifting block 8 drives the laminating roller 7 to move up and down, and adjusts it to facilitate the laminating roller 7 to compact and fit with circuit boards of different thicknesses. The airflow ejected from the air jet 14 makes the circuit board after the rubber coating fit more closely with the laminating roller 7, and the squeezing force on the circuit board when laminating with the laminating roller 7 can be achieved by controlling the size of the airflow, effectively avoiding damage to the circuit board due to excessive pressure during the compaction and lamination process between the laminating roller 7 and the circuit board;

[0040] The second motor 17 is started, and the second motor 17 drives the rotating shaft 19 to rotate, and the rotating shaft 19 drives the fan blades 18 to rotate, and the fan blades 18 drive the external wind to enter the fixed plate 6 through the pipeline, and then discharge it through the air jet 14, and the circuit board after the rubber coating is pushed by the airflow blown out of the air jet 14, and the lift of the airflow reduces the pressure applied by the circuit board to the conveying roller, reduces the friction between the conveying roller and the circuit board, thereby reducing the probability of the outer film of the circuit board after the rubber coating being damaged, and the airflow blown by the air jet 14 can accelerate the cooling speed of the outer film of the circuit board, so that the hardening speed of the film is accelerated;

[0041] The first motor 13 is started, and the first motor 13 drives one of the bidirectional screws 10 to rotate. One of the bidirectional screws 10 drives the other bidirectional screw 10 to rotate through the synchronous pulley 11 and the synchronous belt, so that the two sliding plates 9 move toward each other, and can be adjusted according to circuit boards of different widths and thicknesses. Through the guide wheel 12 under the sliding plate 9, when the airflow lift is too large, the circuit board can be suspended in the air and contact the guide wheel 12, effectively preventing the circuit board from deviating from the conveying track;

[0042] Since the guide wheel 12 is a cone, the guide wheel 12 can apply lateral and longitudinal forces to the circuit board. The guidance can also prevent the circuit board from deviating from the conveying track when the airflow lift is too large.

[0043] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An automatic glue coating machine for PCB board production, comprising a support plate (1), a glue film roll (2), and a glue coating device (3), a plurality of transmission rollers are arranged between two of the support plates (1), a glue coating device (3) is arranged between the two support plates (1), and a glue film roll (2) is detachably arranged between the two support plates (1), characterized in that: It also includes a bonding component, an adjustment component, a guide component, and a cooling component. The guide component includes an L-shaped plate (5), a sliding plate (9), and a guide wheel (12). Two L-shaped plates (5) are fixedly connected between the two support plates (1). Two sliding plates (9) are commonly arranged on the upper surfaces of the two L-shaped plates (5). The lower surfaces of the two sliding plates (9) are rotatably connected to a plurality of guide wheels (12) via pins. The bonding component is arranged on the side wall of the support plate (1) to make the circuit board and the adhesive film more closely bonded. The cooling component is arranged between the two support plates (1) to cool the adhesive film after being softened by hot air. The adjustment component is arranged on the side wall of the support plate (1) to facilitate the adjustment of the guide component.

2. The automatic encapsulating machine for PCB board production according to claim 1, characterized in that: The guide wheel (12) is a cone.

3. The automatic encapsulating machine for PCB production according to claim 2, characterized in that: The adjustment assembly comprises a bidirectional screw (10) and a synchronous pulley (11); the two sliding plates (9) are slidably connected to the upper surface of the L-shaped plate (5); the two bidirectional screws (10) are rotatably connected between the two support plates (1) via bearings; the two bidirectional screws (10) are threadedly connected to the two sliding plates (9); the parts of the two bidirectional screws (10) located outside the support plates (1) are fixedly connected to the synchronous pulley (11); and the two synchronous pulleys (11) are jointly matched with a synchronous belt.

4. The automatic encapsulating machine for PCB board production according to claim 3 is characterized in that: The side wall of the support plate (1) is fixedly connected to a first motor (13) via a bracket, and an output end of the first motor (13) is fixedly connected to one of the bidirectional screw rods (10).

5. The automatic encapsulating machine for PCB board production according to claim 4 is characterized in that: The laminating assembly comprises an electric push rod (4), a laminating roller (7), and a lifting block (8); the upper surfaces of the two support plates (1) are fixedly connected to the electric push rods (4); the opposite side walls of the two support plates (1) are provided with lifting block grooves; the inner side walls of the two lifting block grooves are slidably connected to the lifting blocks (8); the upper surfaces of the two lifting blocks (8) are respectively fixedly connected to the output ends of the two electric push rods (4); and the two lifting blocks (8) are rotatably connected to the laminating roller (7) via a rotating shaft.

6. The automatic encapsulating machine for PCB board production according to claim 5, characterized in that: The lifting block (8) has a T-shaped cross section.

7. The automatic encapsulating machine for PCB board production according to claim 6, characterized in that: The cooling component comprises a fixed plate (6), an air jet (14), an air intake cylinder (15), a second motor (17), fan blades (18), and a rotating shaft (19). The fixed plate (6) is fixedly connected between the two support plates (1). The side wall of the fixed plate (6) is provided with a plurality of air vents, and the plurality of air vents are connected through a pipeline. The plurality of air vents are all provided with an air jet (14). The side wall of the support plate (1) is fixedly connected with an air intake cylinder (15) through a bracket. The air intake cylinder (15) is connected with the fixed plate (6) through a pipeline. The pipeline between the air intake cylinder (15) and the fixed plate (6) passes through the support plate (1). The inner side wall of the air intake cylinder (15) is fixedly connected with the second motor (17) through a bracket. The output end of the second motor (17) is fixedly connected with the rotating shaft (19), and the circumferential side wall of the rotating shaft (19) is fixedly connected with a plurality of fan blades (18).

8. The automatic encapsulating machine for PCB production according to claim 7, characterized in that: A dustproof net (16) is provided on the upper surface of the air inlet cylinder (15), and the output end of the second motor (17) passes through the dustproof net (16).

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