SMT reflow soldering machine

Abstract

The utility model discloses an SMT reflow soldering machine, which belongs to the technical field of reflow soldering and comprises a reflow soldering case, guide grooves are formed in the front side walls of two guide frames in a penetrating manner, two moving shafts are slidably connected to the interiors of the two guide grooves, and connecting columns are fixedly connected to the lower ends of two connecting frames. The lower ends of the two connecting columns are both connected with downward pressing columns, and the lower ends of the two downward pressing columns are connected with a downward pressing plate. The circuit board welding device has the advantages that an object on a circuit board is pressed downwards through the lower pressing plate so that the object can be tightly attached to the circuit board, the position of the lower pressing plate can be guided through the guide frame and the guide groove, when welding liquid melts, the guide groove can guide the lower pressing plate to press the circuit board downwards, and when the circuit board moves, the lower extending plate can guide the object to be tightly attached to the circuit board. And the lower extension plate and the lower pressing plate can be synchronously pushed to move, so that the circuit board can be pressed downwards, an object can be more tightly attached to the circuit board, and the reflow soldering effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of plant specimen preparation, in particular to an SMT reflow soldering machine. Background Art

[0002] The solder used in the reflow soldering technology is solder paste. Apply a proper amount of solder paste in the appropriate form on the pads of the circuit board in advance, and then place the SMT components in the corresponding positions. The solder paste has a certain viscosity to fix the components. Then let the circuit board with the components mounted enter the DC soldering equipment. The conveying system drives the circuit board through the various set temperature zones in the equipment. The solder paste is dried, preheated, melted, moistened, and cooled to solder the components to the printed circuit board. The core link of reflow soldering is to use an external heat source to heat the solder to melt it and flow and infiltrate it again to complete the soldering process of the circuit board.

[0003] When general SMT reflow soldering machines on the market are reflow soldering on circuit boards, they will not press down objects on the circuit board when sensing temperature, which will affect the stability of the connection between subsequent objects and the circuit board. For this reason, we propose an SMT reflow soldering machine. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an SMT reflow soldering machine.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: an SMT reflow soldering machine, including a reflow soldering machine case, a reflow bin is penetrated through the left side of the reflow soldering machine case, a reflow conveying rack is fixedly connected to the inner wall of the reflow bin, two guide racks are fixedly connected to the upper end of the reflow conveying rack, the front side walls of the two guide racks are penetrated with guide grooves, the insides of the two guide grooves are slidably connected with two movable shafts, and the two movable shafts on the front and rear sides of the reflow conveying rack are rotatably connected to the sides close to each other, the lower ends of the two connecting racks are fixedly connected to connecting columns, the lower ends of the two connecting columns are connected to lower pressure columns, and the lower ends of the two lower pressure columns are connected to lower pressure plates.

[0006] Preferably, a conveying groove is provided in the middle of the reflow conveying rack, a circuit board is slidably connected inside the conveying groove, and the lower pressing plate can cooperate with the circuit board.

[0007] Preferably, a lifting groove is provided inside the connecting column, a limiting groove is provided on the inner wall of the lifting groove, and the upper end of the pressing column extends into the lifting groove and is slidably connected to the inner wall of the lifting groove.

[0008] Preferably, a side wall at the upper end of the lower pressure column is fixedly connected to a limiting block, and the limiting block extends to the inside of the limiting groove, and the limiting block is slidably connected to the inner wall of the limiting groove.

[0009] Preferably, a lower extension plate is fixedly connected to the right side of the lower end of the lower pressing plate, and the lower extension plate extends to the right side of the circuit board.

[0010] Preferably, a movable groove is opened on the lower side of the conveying groove on the reflux conveying rack, and a stable top plate is slidably connected inside the movable groove. A connecting push plate is fixedly connected to the right side of the upper end of the stable top plate, and the connecting push plate extends to the right side of the circuit board and is located between the circuit board and the lower extension plate, and the upper wall of the stable top plate is in contact with the lower wall of the circuit board.

[0011] Preferably, four mounting plates are fixedly connected to the upper end of the lower pressure plate, and two mounting plates form a group, and a rotating rod is rotatably connected between the two groups of mounting plates. The lower pressure column extends between a group of mounting plates, and the lower end of the lower pressure column is rotatably connected to the rotating rod.

[0012] By adopting the above technical solution, the lower pressing plate is used to press down the object on the circuit board, so that the object fits more closely on the circuit board. The guide frame and the guide groove can guide the position of the lower pressing plate. When the welding liquid melts, the guide groove will guide the lower pressing plate to press down the circuit board. When the circuit board moves, the lower extension plate and the lower pressing plate can be pushed to move synchronously. The rotation connection between the lower pressing column and the mounting plate is used to facilitate the tilting movement of the lower pressing plate, so that the circuit board can be pressed down, so that the object fits more closely on the circuit board, and the effect of reflow soldering is increased.

[0013] By adopting the above technical solution, when the circuit board moves, the stable top plate can be driven to move synchronously by connecting the push plate, so that the stable top plate can always be located at the lower side of the circuit board to provide support for the circuit board. The downward movement length of the lower pressure column can be limited by the limit groove to prevent the lower pressure plate from being over-pressed and causing damage to the circuit board. In this way, support can be provided for the circuit board, thereby preventing damage to the circuit board when the circuit board is pressed down. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the three-dimensional structure of the reflux conveying frame of the utility model;

[0016] Figure 3 It is a schematic diagram of the three-dimensional structure of the guide frame part of the utility model;

[0017] Figure 4 This is a schematic diagram of the three-dimensional structure of the lower pressing plate of the utility model;

[0018] Figure 5 This is a schematic diagram of the three-dimensional structure of the connecting column of the utility model;

[0019] Figure 6 This is a schematic diagram of the three-dimensional structure of the stable top plate of the utility model;

[0020] Figure 7 It is a schematic diagram of the three-dimensional structure of the lower pressure column of the utility model.

[0021] In the figure: 1. Reflow oven chassis; 2. Reflow chamber; 3. Reflow conveyor rack; 4. Conveyor trough; 5. Moving trough; 6. Circuit board; 7. Guide rack; 8. Guide trough; 9. Lower pressure plate; 10. Moving shaft; 11. Connecting rack; 12. Connecting column; 13. Lifting trough; 14. Limiting slot; 15. Lower pressure column; 16. Limiting block; 17. Lower extension plate; 18. Stabilizing top plate; 19. Connecting push plate; 20. Mounting plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Embodiment 1:

[0024] See also Figure 1-Figure 7 The utility model provides a technical solution: an SMT reflow soldering machine, comprising a reflow soldering machine chassis 1, a reflow bin 2 is penetrated through the left side of the reflow soldering machine chassis 1, a reflow conveying frame 3 is fixedly connected to the inner wall of the reflow bin 2, and two guide frames 7 are fixedly connected to the upper end of the reflow conveying frame 3, and the front side walls of the two guide frames 7 are penetrated with guide grooves 8, and the insides of the two guide grooves 8 are slidably connected with two moving shafts 10, and the two moving shafts 10 on the front and rear sides of the reflow conveying frame 3 are rotatably connected to the sides close to each other with connecting frames 11, the lower ends of the two connecting frames 11 are fixedly connected with connecting columns 12, the lower ends of the two connecting columns 12 are connected with lower pressure columns 15, and the lower ends of the two lower pressure columns 15 are connected with lower pressure plates 9.

[0025] See also Figure 4 The right side of the lower end of the lower pressing plate 9 is fixedly connected with a lower extension plate 17, and the lower extension plate 17 extends to the right side of the circuit board 6. The upper end of the lower pressing plate 9 is fixedly connected with four mounting plates 20, and two mounting plates 20 form a group. A rotating rod is rotatably connected between the two groups of mounting plates 20. The lower pressing column 15 extends between a group of mounting plates 20, and the lower end of the lower pressing column 15 is rotatably connected to the rotating rod;

[0026] In this embodiment, the lower pressing plate 9 is moved along the guide groove 8 to press down the circuit board 6 , thereby pressing down the objects to be welded on the circuit board 6 so that the objects fit more closely on the circuit board 6 .

[0027] Specifically, the lower pressure plate 9 is used to press down the objects on the circuit board 6 so that the objects can fit more closely on the circuit board 6. The guide frame 7 and the guide groove 8 can guide the position of the lower pressure plate 9. When the welding liquid melts, the guide groove 8 will guide the lower pressure plate 9 to press down the circuit board 6. When the circuit board 6 moves, the lower extension plate 17 and the lower pressure plate 9 can be pushed to move synchronously. The lower pressure column 15 is connected with the mounting plate 20 by rotation to facilitate the tilting movement of the lower pressure plate 9.

[0028] Embodiment 2:

[0029] See also Figure 1-Figure 7 The utility model provides a technical solution: an SMT reflow soldering machine, a reflow bin 2 is penetrated on the left side of a reflow soldering machine case 1, a reflow conveying frame 3 is fixedly connected to the inner wall of the reflow bin 2, two guide frames 7 are fixedly connected to the upper end of the reflow conveying frame 3, the front side walls of the two guide frames 7 are penetrated with guide grooves 8, the insides of the two guide grooves 8 are slidably connected with two moving shafts 10, and the two moving shafts 10 on the front and rear sides of the reflow conveying frame 3 are rotatably connected to the sides close to each other with connecting frames 11, the lower ends of the two connecting frames 11 are fixedly connected with connecting columns 12, the lower ends of the two connecting columns 12 are connected with lower pressure columns 15, and the lower ends of the two lower pressure columns 15 are connected with lower pressure plates 9.

[0030] See also Figure 2-Figure 6 A lifting groove 13 is provided inside the connecting column 12, and a limiting groove 14 is provided on the inner wall of the lifting groove 13. The upper end of the lower pressure column 15 extends to the inside of the lifting groove 13 and is slidably connected with the inner wall of the lifting groove 13. The side wall of the upper end of the lower pressure column 15 is fixedly connected with a limiting block 16, and the limiting block 16 extends to the inside of the limiting groove 14, and the limiting block 16 is slidably connected with the inner wall of the limiting groove 14. The right side of the lower end of the lower pressure plate 9 is fixedly connected with a lower extension plate 17, and the lower extension plate 17 extends to the right side of the circuit board 6. A moving groove 5 is provided on the reflow conveying frame 3 at the lower side of the conveying groove 4. A stable top plate 18 is slidably connected inside the moving groove 5. A connecting push plate 19 is fixedly connected to the right side of the upper end of the stable top plate 18, and the connecting push plate 19 extends to the right side of the circuit board 6 and is located between the circuit board 6 and the lower extension plate 17. The upper wall of the stable top plate 18 contacts the lower wall of the circuit board 6.

[0031] In this embodiment, the stabilizing top plate 18 can be used to support the circuit board 6 to prevent damage to the circuit board 6 when pressed down, and the connecting push plate 19 can cooperate with the lower extension plate 17 and the circuit board 6 to be pushed synchronously.

[0032] Specifically, when the circuit board 6 moves, the stabilizing top plate 18 can be driven to move synchronously by connecting the push plate 19, so that the stabilizing top plate 18 can always be located at the lower side of the circuit board 6 to provide support for the circuit board 6. The downward movement length of the lower pressure column 15 can be limited by the limit groove 14 to prevent the lower pressure plate 9 from being over-pressed and causing damage to the circuit board 6.

[0033] Working principle: when it is necessary to reflow soldering the circuit board 6, the required lower pressure plate 9 and stable top plate 18 are installed, and then the circuit board 6 is placed in the conveying groove 4 of the reflow conveying frame 3, so that the circuit board 6 moves inside the conveying groove 4, and then the circuit board 6 will push the lower extension plate 17 and the lower pressure plate 9 to move, and use the connecting column 12 and the lower pressure column 15 to synchronously drive the connecting frame 11 and the moving shaft 10 to move, so that the moving shaft 10 is under the action of the guide groove 8 of the guide frame 7. When it moves to the set position, it will prompt the lower pressure plate 9 to press down on the circuit board 6, so that the objects on the circuit board 6 are more closely attached to the circuit board 6, and when the circuit board 6 moves, it can synchronously push the connecting push plate 19 to move, thereby driving the stable top plate 18 to move, so that the stable top plate 18 is located on the lower side of the circuit board 6, providing support for the lower pressure plate 9 to press down on the circuit board 6, and preventing damage to the circuit board 6 during pressing down.

[0034] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An SMT reflow soldering machine, comprising a reflow soldering machine box (1), characterized in that: A reflow bin (2) is provided on the left side of the reflow soldering machine case (1), a reflow conveying frame (3) is fixedly connected to the inner wall of the reflow bin (2), two guide frames (7) are fixedly connected to the upper end of the reflow conveying frame (3), the front side walls of the two guide frames (7) are provided with guide grooves (8), the interiors of the two guide grooves (8) are slidably connected with two movable shafts (10), and the two movable shafts (10) on the front and rear sides of the reflow conveying frame (3) are rotatably connected to the sides close to each other with a connecting frame (11), the lower ends of the two connecting frames (11) are fixedly connected to a connecting column (12), the lower ends of the two connecting columns (12) are connected to a lower pressure column (15), and the lower ends of the two lower pressure columns (15) are connected to a lower pressure plate (9).

2. The SMT reflow soldering machine according to claim 1, characterized in that: A conveying groove (4) is provided in the middle of the reflow conveying rack (3), a circuit board (6) is slidably connected inside the conveying groove (4), and the lower pressing plate (9) can cooperate with the circuit board (6).

3. The SMT reflow soldering machine according to claim 1, characterized in that: A lifting groove (13) is provided inside the connecting column (12), a limiting groove (14) is provided on the inner wall of the lifting groove (13), and the upper end of the pressing column (15) extends into the interior of the lifting groove (13) and is slidably connected to the inner wall of the lifting groove (13).

4. The SMT reflow soldering machine according to claim 1, characterized in that: The side wall at the upper end of the lower pressure column (15) is fixedly connected to a limiting block (16), and the limiting block (16) extends into the interior of the limiting groove (14), and the limiting block (16) is slidably connected to the inner wall of the limiting groove (14).

5. The SMT reflow soldering machine according to claim 1, characterized in that: A lower extension plate (17) is fixedly connected to the right side of the lower end of the lower pressing plate (9), and the lower extension plate (17) extends to the right side of the circuit board (6).

6. The SMT reflow soldering machine according to claim 1, characterized in that: The reflow conveying frame (3) is provided with a movable groove (5) at the lower side of the conveying groove (4), and a stabilizing top plate (18) is slidably connected inside the movable groove (5). A connecting push plate (19) is fixedly connected to the right side of the upper end of the stabilizing top plate (18), and the connecting push plate (19) extends to the right side of the circuit board (6) and is located between the circuit board (6) and the lower extension plate (17), and the upper wall of the stabilizing top plate (18) is in contact with the lower wall of the circuit board (6).

7. The SMT reflow soldering machine according to claim 6, characterized in that: The upper end of the lower pressure plate (9) is fixedly connected to four mounting plates (20), and two mounting plates (20) form a group. A rotating rod is rotatably connected between the two groups of mounting plates (20). The lower pressure column (15) extends between one group of mounting plates (20), and the lower end of the lower pressure column (15) is rotatably connected to the rotating rod.

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