Flexible splicing type aluminum substrate with high thermal conductivity

By setting a heat sink and breathable hole on the aluminum substrate and designing a fixing device, the high thermal conductivity and flexible splicing of the aluminum substrate are achieved, and the problems of poor heat dissipation and inconvenient installation of the existing aluminum substrate are solved.

CN222564168UActive Publication Date: 2025-03-04GUANGDONG JINGXIN MICRO TECH CO LTD
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Patent Information

Application Number
CN202420591379.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-26
Publication Date
2025-03-04
Estimated Expiration
2034-03-26

AI Technical Summary

Technical Problem

The existing aluminum substrate has poor heat dissipation after long-term use and is not easy to install in areas with small spaces.

Method used

A flexible spliced ​​aluminum substrate with high thermal conductivity is designed. By fixing the heat sink and breathable holes on the front of the aluminum substrate, air circulation is enhanced, and fixing and connecting the fixing device on the outer surface of the frame is fixedly realized, so as to achieve flexible splicing and fixing of the aluminum substrate.

Benefits of technology

It effectively improves the heat dissipation performance of aluminum substrates, facilitates installation and splicing in narrow areas, and solves the problems of poor heat dissipation and inconvenient installation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a flexible splicing type aluminum substrate with high thermal conductivity, which comprises an aluminum substrate, the outer surface of the aluminum substrate is fixedly connected with a frame, the front surface of the aluminum substrate is fixedly connected with a radiating fin, the radiating fin is internally provided with three air holes, the outer surface of the frame is fixedly connected with a fixing device, and the fixing device is fixedly connected with the aluminum substrate. The fixing device comprises connecting rods fixedly connected with the top and the bottom of the frame, and the left sides of the two connecting rods are fixedly connected with connecting bases. According to the flexible splicing type aluminum substrate with the high thermal conductivity, cooling fins and air holes are fixedly arranged on the front faces of the aluminum substrates, air circulation is facilitated, the aluminum substrate body is effectively cooled, when splicing is needed, the two aluminum substrates can be taken to be placed left and right, the aluminum substrate on the right side is moved leftwards, and a spring box is moved to a convex inclined block; and when the clamping rod and the movable wheel move to the leftmost side of the clamping groove, the clamping rod and the movable wheel are reset by the spring, so that the two aluminum substrates are fixedly clamped.
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Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, in particular to a flexible spliced ​​aluminum substrate with high thermal conductivity. Background Art

[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board is composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Very few applications are multi-layer boards, which can be made of ordinary multi-layer boards, insulating layers, and aluminum bases.

[0003] The existing aluminum substrate can only be used normally, but has poor performance. After long-term use, the heat dissipation is poor. In a small space, if the aluminum substrate is too large, it will not be easy to install. Therefore, a flexible splicing aluminum substrate with high thermal conductivity is proposed to solve the above problems. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a flexible spliced ​​aluminum substrate with high thermal conductivity, which has the advantages of strong practicality and simple operation, and solves the problem that the aluminum substrate has poor heat dissipation after long-term use and is inconvenient to install.

[0005] To achieve the above object, the utility model provides the following technical solution: a flexible spliced ​​aluminum substrate with high thermal conductivity, comprising an aluminum substrate, a frame fixedly connected to the outer surface of the aluminum substrate, a heat sink fixedly connected to the front of the aluminum substrate, three air holes opened inside the heat sink, and a fixing device fixedly connected to the outer surface of the frame;

[0006] The fixing device includes a connecting rod fixedly connected to the top and bottom of the frame, the two connecting rods are fixedly connected to a connecting seat on the left side, the two connecting seats are fixedly connected to a spring box on the left side, the two spring boxes are fixedly connected to springs inside, the two springs are fixedly connected to a clamping rod at the bottom, the two clamping rods are fixedly connected to movable wheels, the top and bottom of the frame are fixedly connected to clamping blocks, the two clamping blocks are provided with clamping grooves inside, and the two clamping grooves are fixedly connected to convex inclined blocks inside.

[0007] Furthermore, limiting grooves are provided inside the two spring boxes, limiting rings are fixedly connected to the outer surfaces of the two clamping rods, and the two limiting rings are located inside the limiting grooves.

[0008] Furthermore, telescopic holes are provided at the top and bottom of the two spring boxes, and the two clamping rods are movably connected to the inside of the telescopic holes.

[0009] Furthermore, the top and bottom shapes of the two spring boxes are both arc-shaped, and the shapes of the two connecting rods are both 7-shaped.

[0010] Furthermore, the number of the heat sinks is four and they are evenly distributed on the front side of the aluminum substrate.

[0011] Furthermore, the number of the heat dissipation holes is twelve, and the shapes of the heat dissipation holes are all circular.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] The flexible splicing aluminum substrate with high thermal conductivity is convenient for air circulation by fixing heat sinks and air holes on the front of the aluminum substrate, which effectively dissipates heat from the aluminum substrate body. When splicing is required, the two aluminum substrates can be placed left and right, and the right aluminum substrate can be moved to the left. When the spring box moves to the convex inclined block, the clamping rod and the movable wheel will shrink. When it moves to the leftmost side of the card slot, the spring will reset the clamping rod and the movable wheel, thereby fixing and clamping the two aluminum substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 The utility model structure Figure 1 Enlarged view of point A in the middle.

[0016] In the figure: 1 aluminum base plate, 2 frame, 3 heat sink, 4 air vent, 5 connecting rod, 6 clamping block, 7 clamping slot, 8 convex inclined block, 9 connecting seat, 10 spring box, 11 spring, 12 clamping rod, 13 movable wheel, 14 limiting slot, 15 limiting ring. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-2 In this embodiment, a flexible spliced ​​aluminum substrate with high thermal conductivity includes an aluminum substrate 1, a frame 2 is fixedly connected to the outer surface of the aluminum substrate 1, a heat sink 3 is fixedly connected to the front of the aluminum substrate 1, three air holes 4 are opened inside the heat sink 3, and a fixing device is fixedly connected to the outer surface of the frame 2.

[0019] Among them, the fixing device includes a connecting rod 5 fixedly connected to the top and bottom of the frame 2, the two connecting rods 5 are fixedly connected to a connecting seat 9 on the left side, the two connecting seats 9 are fixedly connected to a spring box 10 on the left side, the two spring boxes 10 are fixedly connected with a spring 11 inside, the two springs 11 are fixedly connected to the bottom with a clamping rod 12, the two clamping rods 12 are fixedly connected with a movable wheel 13, the frame 2 is fixedly connected with a clamping block 6 on the top and bottom, the two clamping blocks 6 are provided with a clamping groove 7 inside, the two clamping grooves 7 are fixedly connected with a convex inclined block 8 inside, the two spring boxes 10 are provided with a telescopic hole on the top and bottom, and the two clamping rods 12 are movably connected to the inside of the telescopic hole.

[0020] In this embodiment, the two spring boxes 10 are provided with limiting grooves 14 inside, and the outer surfaces of the two clamping rods 12 are fixedly connected to limiting rings 15. The two limiting rings 15 are located inside the limiting grooves 14 to prevent the clamping rods 12 from displacement when they are contracted.

[0021] In this embodiment, the tops and bottoms of the two spring boxes 10 are both arc-shaped, and the two connecting rods 5 are both 7-shaped, which can reduce the friction when the spring boxes 10 move into the slots 7.

[0022] In this embodiment, there are four heat sinks 3 evenly distributed on the front of the aluminum substrate 1 , and twelve air holes 4 are circular in shape, which can effectively dissipate heat for the aluminum substrate 1 .

[0023] The working principle of the above embodiment is:

[0024] The flexible splicing aluminum substrate with high thermal conductivity is convenient for air circulation by fixing the heat sink 3 and the air vent 4 on the front of the aluminum substrate 1, so as to effectively dissipate the heat of the aluminum substrate 1 body. When splicing is required, the two aluminum substrates 1 can be placed left and right, and the aluminum substrate 1 on the right can be moved to the left. When the spring box 10 moves to the convex inclined block 8, the clamping rod 12 and the movable wheel 13 will shrink. When it moves to the leftmost side of the clamping slot 7, the spring 11 will reset the clamping rod 12 and the movable wheel 13, so that the two aluminum substrates 1 are fixed and clamped.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flexible spliced ​​aluminum substrate with high thermal conductivity, comprising an aluminum substrate (1), characterized in that: The outer surface of the aluminum substrate (1) is fixedly connected to a frame (2), the front surface of the aluminum substrate (1) is fixedly connected to a heat sink (3), three air holes (4) are provided inside the heat sink (3), and the outer surface of the frame (2) is fixedly connected to a fixing device; The fixing device comprises a connecting rod (5) fixedly connected to the top and bottom of the frame (2); the left sides of the two connecting rods (5) are fixedly connected to a connecting seat (9); the left sides of the two connecting seats (9) are fixedly connected to a spring box (10); the insides of the two spring boxes (10) are fixedly connected to a spring (11); the bottoms of the two springs (11) are fixedly connected to a clamping rod (12); the two clamping rods (12) are fixedly connected to a movable wheel (13); the top and bottom of the frame (2) are fixedly connected to a clamping block (6); the insides of the two clamping blocks (6) are provided with a clamping groove (7); the insides of the two clamping grooves (7) are fixedly connected to a convex inclined block (8).

2. The high thermal conductivity flexible splicing aluminum substrate according to claim 1, characterized in that: The two spring boxes (10) are each provided with a limiting groove (14) inside, the outer surfaces of the two clamping rods (12) are each fixedly connected to a limiting ring (15), and the two limiting rings (15) are both located inside the limiting groove (14).

3. The high thermal conductivity flexible splicing aluminum substrate according to claim 1, characterized in that: The tops and bottoms of the two spring boxes (10) are both provided with telescopic holes, and the two clamping rods (12) are both movably connected to the inside of the telescopic holes.

4. The high thermal conductivity flexible splicing aluminum substrate according to claim 1, characterized in that: The tops and bottoms of the two spring boxes (10) are both arc-shaped, and the two connecting rods (5) are both 7-shaped.

5. The high thermal conductivity flexible splicing aluminum substrate according to claim 1, characterized in that: The number of the heat sinks (3) is four and they are evenly distributed on the front side of the aluminum substrate (1).

6. The high thermal conductivity flexible splicing aluminum substrate according to claim 1, characterized in that: The number of the air holes (4) is twelve, and all of them are circular in shape.