Dispensing structure convenient to fix and used for integrated circuit packaging
By designing an integrated circuit dispensing structure including workbench, fixed plate, guide rail, housing, placement plate, guide frame, slider, motor and turntable, the problem of position shift during the integrated circuit packaging process is solved, and more stable packaging effect and improved production quality are achieved.
Patent Information
- Application Number
- CN202420532441.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-19
AI Technical Summary
Integrated circuits are easily affected by external factors during packaging, which affects packaging effect and production quality.
A dispensing structure including a workbench, a fixing plate, a guide rail, a casing, a placement plate, a guide frame, a slide plate, a motor and a turntable is designed. The rotary plate drives the connecting block to rotate through the motor, so that the slide plate slides in the guide frame, and the clamping block slides in the through groove to achieve clamping and positioning of the integrated circuit.
It effectively prevents the position deviation of the integrated circuit during the dispensing process, and improves the stability and quality of the packaging.
Smart Images
Figure CN222568218U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of glue dispensing for integrated circuit packaging, in particular to a glue dispensing structure for integrated circuit packaging which is easy to fix. Background Art
[0002] An integrated circuit is a circuit with specific functions that integrates a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., as well as the connections between these components, through semiconductor technology. It is a new type of semiconductor device developed from the late 1950s to the 1960s.
[0003] When workers package integrated circuits, they need to dispense glue at the packaging location. During the glue dispensing process, the integrated circuit is easily affected by external factors and may shift in position, thereby affecting the integrated circuit packaging effect and reducing the quality of integrated circuit production.
[0004] Based on this, a dispensing structure for integrated circuit packaging that is easy to fix is now provided, which can eliminate the disadvantages of existing devices. Utility Model Content
[0005] The utility model aims to provide a dispensing structure for integrated circuit packaging which is easy to fix, so as to solve the problem in the background technology that the integrated circuit is easily affected by external factors and thus has positional displacement.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A dispensing structure for integrated circuit packaging that is easy to fix, comprises a workbench, a fixing plate is provided on the workbench, a guide rail is fixedly connected to the outer surface of the fixing plate, a shell is provided on the top of the guide rail, and the character is that the top of the workbench is located on the inner side of the fixing plate and is fixedly connected to a placement plate, the inner top wall of the placement plate is fixedly connected to a guide frame, the inner side wall of the guide frame is slidably connected to a slide plate, one end of the slide plate is fixedly connected to a clamping block, one end of the slide plate is fixedly connected to a connecting block, a motor is fixedly connected to the inside of the placement plate, the output shaft of the motor is fixedly connected to a turntable via a coupling, and an arc groove is provided inside the turntable.
[0008] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:
[0009] In an optional solution: the outer side wall of the housing is rotatably connected with a baffle, the top of the housing is provided with an empty slot, the interior of the empty slot is slidably connected with a spring block, and one side of the baffle is fixedly connected with a spring buckle.
[0010] By arranging the casing, the baffle and the spring block to cooperate with each other, the inside of the casing can be injected with glue by opening the baffle.
[0011] In an optional solution: a limiting hole is provided on the inner side wall of the housing, and the size of the limiting hole matches the size of the spring buckle.
[0012] The baffle can be limited by setting the limiting holes and the casing.
[0013] In an optional solution: the spring block is arranged horizontally and vertically above the spring buckle.
[0014] By arranging the spring block and the spring buckle, the spring block can be used to press the spring buckle to release the limiting connection formed by the baffle and the casing.
[0015] In an optional solution: a glue injector is arranged inside the housing, and the baffle is arranged horizontally and vertically in front of the glue injector.
[0016] By setting up a glue injector, integrated circuits can be packaged and glued.
[0017] In an optional solution: the guide frame is shaped as a cross frame, and the number of the slide plates is four groups.
[0018] By arranging the slide plates and the guide frame, the four groups of slide plates can slide along the track of the guide frame.
[0019] In an optional solution: a through groove is provided at the top end of the placement plate, and a clamping block is provided through the through groove.
[0020] By arranging the placement plate, the through groove and the clamping block, the clamping block can be used to limit and clamp the integrated circuit placed on the placement plate.
[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0022] 1. The utility model places an integrated circuit on the top of a placement plate, starts a motor to drive a turntable to rotate, and the rotation of the turntable drives a connecting block inside the arc groove to rotate, so that a slide plate with a connecting block fixedly connected at one end slides in a guide frame, and a clamping block is fixedly connected at one end of the slide plate, so that the clamping block slides in the through groove to clamp the placed integrated circuit, thereby preventing the integrated circuit from being offset during the dispensing process.
[0023] 2. The utility model squeezes the spring block that is slidably connected inside the empty slot, so that the spring block squeezes the spring buckle that is engaged in the limiting hole, thereby releasing the behavioral connection formed by the baffle plate and the casing that are fixedly connected with the spring buckle on one side, making it convenient for the user to add colloid into the glue injection machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a three-dimensional schematic diagram of the glue dispensing machine of the present utility model.
[0025] Figure 2 It is a three-dimensional schematic diagram of the clamping structure of the utility model.
[0026] Figure 3 It is a top view of the clamping structure of the utility model.
[0027] Figure 4 It is a three-dimensional schematic diagram of the casing of the utility model.
[0028] Figure 5 It is a schematic diagram of the interior of the convenient feeding structure of the utility model.
[0029] Notes on the figure numbers: 1. Workbench; 2. Placement plate; 3. Fixing plate; 4. Guide rail; 5. Empty slot; 6. Casing; 7. Baffle; 8. Spring block; 9. Clamp block; 10. Motor; 11. Slide plate; 12. Connecting block; 13. Turntable; 14. Guide frame; 15. Arc slot; 16. Spring buckle. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] In one embodiment, Figure 1-Figure 5 As shown, a dispensing structure for integrated circuit packaging that is easy to fix includes a workbench 1, a fixing plate 3 is provided on the workbench 1, a guide rail 4 is fixedly connected to the outer surface of the fixing plate 3, and a shell 6 is provided on the top of the guide rail 4. It is characterized in that the top of the workbench 1 is located on the inner side of the fixing plate 3 and is fixedly connected to a placement plate 2, the inner top wall of the placement plate 2 is fixedly connected to a guide frame 14, the inner side wall of the guide frame 14 is slidably connected to a slide plate 11, one end of the slide plate 11 is fixedly connected to a clamping block 9, one end of the slide plate 11 is fixedly connected to a connecting block 12, the inside of the placement plate 2 is fixedly connected to a motor 10, the output shaft of the motor 10 is fixedly connected to a turntable 13 through a coupling, and the inside of the turntable 13 is provided with an arc groove 15.
[0032] The outer wall of the casing 6 is rotatably connected with a baffle 7, a top of the casing 6 is provided with a hollow groove 5, the interior of the hollow groove 5 is slidably connected with a spring block 8, and one side of the baffle 7 is fixedly connected with a spring buckle 16; by arranging the casing 6, the baffle 7, and the spring block 8 to cooperate with each other, the interior of the casing 6 can be injected with glue by opening the baffle 7.
[0033] The inner wall of the housing 6 is provided with a limiting hole, and the size of the limiting hole is matched with the size of the spring buckle 16 . By setting the limiting hole and the housing 6 , the baffle 7 can be limited.
[0034] The spring block 8 is arranged horizontally and vertically above the spring buckle 16. By arranging the spring block 8 and the spring buckle 16, the spring block 8 can press the spring buckle 16 to release the limiting connection formed by the baffle 7 and the housing 6.
[0035] A glue injector is arranged inside the housing 6, and a baffle 7 is arranged horizontally and vertically in front of the glue injector. By arranging the glue injector, the integrated circuit can be sub-packaged and glued.
[0036] The guide frame 14 is shaped as a cross frame, and the number of the slide plates 11 is four groups. By arranging the slide plates 11 and the guide frame 14 , the four groups of slide plates 11 can slide along the track of the guide frame 14 .
[0037] A through groove is provided at the top of the placement board 2, and a clamping block 9 is provided inside the through groove. By providing the placement board 2, the through groove and the clamping block 9, the clamping block 9 can limit and clamp the integrated circuit placed on the placement board 2.
[0038] Working principle: by placing the integrated circuit on the top of the placement plate 2, the motor 10 is started to drive the turntable 13 to rotate, so that the rotation of the turntable 13 drives the connection block 12 inside the arc groove 15 to rotate, so that the slide plate 11 with the connection block 12 fixedly connected at one end slides in the guide frame 14, and the clamping block 9 is fixedly connected at one end of the slide plate 11, so that the clamping block 9 slides in the through groove to clamp the placed integrated circuit;
[0039] By squeezing the spring block 8 slidably connected inside the empty slot 5, the spring block 8 squeezes the spring buckle 16 engaged in the limiting hole, so that the behavioral connection formed by the baffle 7 and the casing 6 on one side of which the spring buckle 16 is fixedly connected can be released, making it convenient for the user to add colloid into the glue injection machine.
[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A dispensing structure for integrated circuit packaging that is easy to fix, comprising a workbench (1), a fixing plate (3) being provided on the workbench (1), a guide rail (4) being fixedly connected to the outer surface of the fixing plate (3), a housing (6) being provided at the top end of the guide rail (4), characterized in that: The top end of the workbench (1) is located on the inner side of the fixed plate (3) and is fixedly connected to a placement plate (2); the inner top wall of the placement plate (2) is fixedly connected to a guide frame (14); the inner side wall of the guide frame (14) is slidably connected to a slide plate (11); one end of the slide plate (11) is fixedly connected to a clamping block (9); one end of the slide plate (11) is fixedly connected to a connecting block (12); the interior of the placement plate (2) is fixedly connected to a motor (10); the output shaft of the motor (10) is fixedly connected to a turntable (13) via a coupling; an arc groove (15) is provided inside the turntable (13).
2. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 1, characterized in that: The outer wall of the housing (6) is rotatably connected to a baffle (7), the top of the housing (6) is provided with a hollow groove (5), the interior of the hollow groove (5) is slidably connected to a spring block (8), and one side of the baffle (7) is fixedly connected to a spring buckle (16).
3. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 2, characterized in that: The inner side wall of the housing (6) is provided with a limiting hole, and the size of the limiting hole is matched with the size of the spring buckle (16).
4. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 2, characterized in that: The spring block (8) is arranged horizontally and vertically above the spring buckle (16).
5. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 2, characterized in that: A glue injector is arranged inside the casing (6), and a baffle (7) is arranged horizontally and vertically in front of the glue injector.
6. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 1, characterized in that: The guide frame (14) is in the shape of a cross frame, and the number of the slide plates (11) is four groups.
7. The glue dispensing structure for integrated circuit packaging that is easy to fix according to claim 1, characterized in that: A through groove is provided at the top end of the placement plate (2), and a clamping block (9) is provided through the interior of the through groove.