Integrated machine cover of plasma cleaning equipment of integrated array microwave source

Abstract

A plasma cleaning equipment integrated machine cover of an integrated array microwave source comprises a machine cover body installed on a cleaning machine body through a hinge, and a sealing strip is arranged on the lower end face of the machine cover body. The movable array microwave sources are arranged in the machine cover, workpieces of different shapes and sizes can be flexibly adapted by adjusting the positions and the directions of the microwave sources, and large-area cleaning of plasmas can be achieved through energy provided by the multiple microwave sources. And due to the design of the integrated machine cover, the equipment can better keep the stability of the working environment and the continuity and high efficiency of the cleaning process in the cleaning process, and meanwhile, the cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the electrical field, and in particular relates to an integrated machine cover of plasma cleaning equipment with an integrated array microwave source. Background Art

[0002] Microwave plasma technology is a technology that uses microwave electromagnetic fields to excite gas to generate plasma. In the plasma state, the free electrons and ions in the gas are highly activated and have high energy and activity. This technology is widely used in plasma processing (deposition, etching and cleaning, etc.), plasma diagnosis, material surface modification and other fields. Traditional cleaning methods, such as solvent wiping and mechanical grinding, may damage the surface of the material or fail to completely remove pollutants, while microwave plasma cleaning technology can achieve efficient and uniform surface cleaning without damaging the material. Plasma cleaning technology is based on the physicochemical effect of plasma. By exciting the gas to the plasma state, high-energy ions, electrons and excited atoms are generated with high speed and activity, which can react with pollutants and oxides on the surface of the material, decompose or desorb them, thereby achieving the cleaning effect. Plasma cleaning technology has important applications in many fields. In electronic manufacturing, the manufacture of microelectronic devices requires a highly clean surface to ensure stable performance. Plasma cleaning can effectively remove oxides, organic pollutants, etc., to ensure the quality and reliability of the device. In the field of optics, the manufacture of high-precision optical components requires a dust-free and pollution-free surface. Plasma cleaning technology can achieve non-contact surface cleaning to avoid potential physical damage. In addition, this technology is also widely used in aerospace, materials science and other fields. In plasma cleaning technology, the commonly used process methods mainly include the following:

[0003] 1. Reduction-Oxidation Cleaning (ROC): This method uses redox reactions to remove oxides and pollutants on the surface of materials by introducing reducing gases (such as hydrogen) and oxidizing gases (such as oxygen) into the plasma. Hydrogen can reduce surface oxides, while oxygen can oxidize organic pollutants. This method can clean a variety of pollutants, but it requires precise control of the ratio and concentration of the gases.

[0004] 2. Physical collision cleaning: This method uses high-speed ions and molecules in the plasma to collide with the surface of the material, thereby stripping off the pollutants and oxides on the surface. This method is suitable for hard materials and can effectively remove some firmly attached pollutants.

[0005] 3. Discharge cleaning: This method uses the discharge phenomenon generated in plasma, such as glow discharge, arc discharge, etc., to generate high-energy electrons and ions, thereby decomposing or stripping pollutants and oxides on the surface of the material. This method is suitable for situations where high-energy cleaning is required.

[0006] 4. Chemical reaction cleaning: This method introduces specific gases into the plasma to react chemically with pollutants on the surface of the material, thereby converting them into volatile compounds to achieve a cleaning effect. For example, the introduction of fluorine gas (F2) can react with oxides to generate volatile gases, thereby achieving the removal of oxides.

[0007] 5. Reactive Ion Beam Etching (RIBE): This method uses the energy of the ion beam and the chemical reaction of the gas to remove pollutants and oxides on the surface of the material by introducing gas and ion beam. The ion beam can provide sufficient energy, and the gas can achieve chemical reaction, thereby achieving the cleaning effect.

[0008] Disadvantages of existing technology:

[0009] 1. Large space and complex system. The microwave source and plasma generating equipment of traditional microwave plasma equipment are usually separated, requiring additional space to accommodate the microwave source. The equipment occupies a large area. The microwave source and plasma generating equipment are usually connected and controlled through transmission lines, and the system is complex.

[0010] 2. High energy loss: In traditional designs, microwave signals need to be transmitted to the plasma generator through connecting cables, which will result in signal loss and energy waste.

[0011] 3. Low stability: The connection between the separated microwave source and plasma generator may cause signal instability and interference.

[0012] 4. High cost: Traditionally designed microwave plasma systems have many components, complex manufacturing processes, and inefficient energy acquisition during the cleaning process also increases system costs.

[0013] 5. The position and direction of the feed antenna cannot be moved: In the traditional design, the feed antenna is directly connected to the plasma generator and connected to the separate microwave source through a transmission line. Therefore, after the structural design of the plasma generator is determined, the position and direction of the feed antenna are also fixed and cannot be moved, which limits the flexibility of cleaning. Utility Model Content

[0014] In order to solve the above problems, we innovatively proposed to integrate the microwave source into the cover of the plasma cleaning equipment, similar to integrating modules with different functions into the same chip in an integrated circuit. We wrote a process script to automatically control the switching and power of the microwave source, completing the integrated design of the equipment. The functional integration improves the equipment performance and realizes the continuity, stability and efficiency of the microwave plasma cleaning process.

[0015] The purpose of the utility model can be achieved through the following technical solutions:

[0016] An integrated cover of a plasma cleaning device with an integrated array microwave source includes a cover mounted on a cleaning machine body by a hinge, and a sealing strip is provided on the lower end surface of the cover. The cover has a movable array microwave source built in, and can flexibly adapt to workpieces of different shapes and sizes by adjusting the position and direction of the microwave source. The energy provided by multiple microwave sources can achieve large-area plasma cleaning. The design of the integrated cover enables the equipment to better maintain the stability of the working environment, the consistency and efficiency of the cleaning process during the cleaning process, while reducing costs.

[0017] Beneficial effects of the utility model:

[0018] 1. Space efficiency: The microwave source and plasma of traditional microwave plasma equipment are usually separated and connected by a transmission line, which requires additional space to accommodate the microwave source. Integrating the microwave source into the cover of the plasma generator can significantly reduce the footprint of the equipment and improve space utilization.

[0019] 2. Simplified design: Separate microwave sources and plasma generators require additional connections, controls, and maintenance, while the integrated design eliminates these complexities and simplifies the design and operation of the entire system.

[0020] 3. Reduce energy loss: In traditional designs, microwave signals need to be transmitted to the plasma generator through connecting cables, which results in signal loss and energy waste. Integrating the microwave source directly into the generator cover can reduce this energy loss.

[0021] 4. Improved stability: The connections between the separate microwave source and plasma generator may cause signal instability and interference. The integrated design eliminates these connections and improves the stability and reliability of the system.

[0022] 5. Reduce costs: Integrating the microwave source into the plasma generator cover can reduce the number of components, simplify the manufacturing process, and save material and labor costs, thereby reducing the cost of the entire system.

[0023] 6. Movable array source: The traditional array microwave source cannot change position and direction after the design structure is determined. This array microwave source integrated on the cover is fixed on the slide rail of the track and can adjust the position and direction in the working state to achieve efficient use of microwave energy. The array microwave source distribution structure increases the plasma excitation area and also increases the plasma cleaning surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic diagram of the structure of the utility model installed on the cleaning machine body;

[0026] Figure 2 This is a bottom view of the integrated machine cover proposed by the utility model;

[0027] Figure 3 This is a cross-sectional view of the integrated machine cover proposed by the utility model.

[0028] As shown in the figure: 1. Cleaning machine body, 2. Machine cover, 3. Sealing ring, 4. Movable plate, 5. Vertical slide rail, 6. Horizontal slide rail, 7. Pulley, 8. Array microwave source, 9. Coaxial feeding antenna. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] like Figure 1-3 As shown, an integrated cover of a plasma cleaning device with an integrated array microwave source includes a cover mounted on a cleaning machine body by a hinge, and a sealing strip is provided on the lower end surface of the cover. The cover has a movable array microwave source built in, and can flexibly adapt to workpieces of different shapes and sizes by adjusting the position and direction of the microwave source. The energy provided by multiple microwave sources can achieve large-area plasma cleaning. The design of the integrated cover enables the equipment to better maintain the stability of the working environment, the consistency and efficiency of the cleaning process during the cleaning process, while reducing costs.

[0031] A cavity is provided in the machine cover, and an opening is provided at the bottom. A movable plate is provided in the cavity of the machine cover, and four groups of array microwave sources are installed at the bottom of the movable plate. A coaxial feeding wire is connected to the bottom of the array microwave source, facing the cleaning cavity of the cleaning machine body, to achieve plasma cleaning.

[0032] Vertical slide rails are arranged on both sides of the cavity of the cover, and both sides of the movable plate are installed on the vertical slide rails through pulleys; a horizontal slide rail is arranged at the bottom of the movable plate, and the top of the array microwave source is installed on the horizontal slide rail through pulleys; motors for driving pulleys are arranged on both sides of the movable plate and the top of the array microwave source. Through the combination of the motor and the slide rail, the position of the microwave source can be adjusted, and microwave energy can be radiated to different positions when moving, which can flexibly adapt to workpieces of different shapes and sizes. The energy provided by multiple microwave sources can realize large-area cleaning of plasma; the up and down movement can adjust the distance from the coaxial feeding antenna to the bottom of the cleaning cavity to realize the tuning function, and ensure the efficient use of microwave energy.

[0033] The cover also has a built-in control system connected to the array microwave source and the motor for controlling functions such as pulley movement and microwave energy emission. This is a mature existing technology and will not be described in detail.

[0034] In the traditional design, a single microwave source is separated from the plasma generator, and an additional transmission line is required for connection and control, resulting in a large equipment footprint, a complex system, and energy loss in the energy transmission process; parameter differences between multiple devices affect system stability and process consistency, and the manufacturing and maintenance costs of multiple devices are high. This innovative design proposes to integrate a movable array microwave source into the cover of the plasma cleaning equipment, write a process script to automatically control the moving position and power of the array microwave source, complete the integrated design of the equipment, increase space utilization, and reduce system complexity. The use of array-distributed multi-microwave sources can input higher-power microwaves into the cavity through multiple coaxial feeding antenna units to ensure the excitation of a larger area of ​​plasma. This design integrates functions to improve equipment performance and achieve the consistency, stability, and efficiency of the microwave plasma cleaning process.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0036] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. An integrated cover for plasma cleaning equipment with an integrated array microwave source, comprising a cover mounted on a cleaning machine body by a hinge, characterized in that: The cover has a built-in movable array microwave source: A cavity is provided in the cover, a movable plate is provided in the cavity, vertical slide rails are provided on both sides of the cavity of the cover, and both sides of the movable plate are installed on the vertical slide rails through pulleys; A horizontal slide rail is provided at the bottom of the movable plate, and the top of the array microwave source is installed on the horizontal slide rail through a pulley; a coaxial feeding wire is connected to the bottom of the array microwave source, and the coaxial feeding wire faces the cleaning cavity of the cleaning machine body.

2. The integrated cover of plasma cleaning equipment with integrated array microwave source according to claim 1, characterized in that: The bottom of the machine cover is provided with an opening, and the bottom of the movable plate is equipped with four groups of array microwave sources.

3. The integrated cover of plasma cleaning equipment with integrated array microwave source according to claim 1 or 2, characterized in that: Motors for driving pulleys are respectively arranged on both sides of the movable plate and on the top of the array microwave source.

4. The integrated cover of plasma cleaning equipment with integrated array microwave source according to claim 1, characterized in that: A sealing strip is arranged on the lower end surface of the machine cover.

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