Tool clamp for wafer cleaning

Abstract

The utility model provides a tool clamp for wafer cleaning, and relates to the technical field of tool clamps for wafer cleaning, the tool clamp comprises a clamp frame, hook holes are symmetrically arranged on one side of the clamp frame, clamping grooves are symmetrically arranged on the inner wall of the clamp frame in a clamping mode, a device convenient to take out is arranged on the inner wall of the clamp frame, and the hook holes are communicated with the clamping grooves. According to the utility model, through the arrangement of the convenient-to-take-out device, after a wafer is cleaned, the limiting rods are rotated to one end to a certain angle on one side of the clamp frame, one end of each limiting rod is moved away from the corresponding ejector rod, and then the wafer can be taken out conveniently. And then the ejector rod can be manually pulled outwards to a certain position in the inner walls of the mounting groove and the clamping groove, the cleaned wafer can be ejected out from the inner wall of the clamp frame and the inner wall of the clamping groove, the wafer can be conveniently taken out, later continuous use is facilitated, and the wafer cleaning machining efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of tooling fixtures for wafer cleaning, in particular to a tooling fixture for wafer cleaning. Background Art

[0002] The wafer cleaning fixture is a fixture used to limit and fix the quartz wafer when the quartz wafer is being cleaned and processed.

[0003] When the quartz wafer is fixed in position using a fixture during the cleaning process, the wafer is clamped into the slot on the inner wall of the fixture, and then the hook is hung inside the hook hole on the fixture, and the wafer is placed in the cleaning liquid for cleaning. When some wafers with smaller height dimensions are placed in the slot on the fixture, the wafer fits closely to the inner wall of the slot, which makes it difficult to take out the wafer, thereby reducing the efficiency of the wafer cleaning process. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and provides a tooling fixture for wafer cleaning.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a tooling fixture for wafer cleaning, comprising a fixture frame, one side of the fixture frame is symmetrically provided with hook holes, the inner wall of the fixture frame is symmetrically provided with card slots, the inner wall of the fixture frame is provided with a device for facilitating removal, the inner wall of the card slot is symmetrically provided with a limiting device, the device for facilitating removal comprises an ejection rod, the inner wall of the fixture frame and the inner wall of the card slot are both provided with mounting grooves, the mounting grooves are slidably connected to the ejection rod, and one side of the fixture frame is symmetrically rotatably connected with a plurality of limiting rods.

[0006] The effect achieved by the above components is as follows: by setting a device that facilitates removal, when the clamp frame is used to limit and fix the quartz wafer during the cleaning process, the wafer will be placed in the card groove of the inner wall of the clamp frame so that it abuts against one side of the ejector rod, and then the hook will be hung inside the hook hole on the clamp frame, and it will be placed in the cleaning liquid for cleaning. After cleaning it, the limit rod is first rotated to one end on one side of the clamp frame to a certain angle, so that one end of it is moved away from the ejector rod, and then the ejector rod can be manually pulled outward to a certain position in the inner walls of the mounting groove and the card groove, so that the cleaned wafer can be ejected from the inner wall of the clamp frame and the inner wall of the card groove, which is convenient for taking it out, thereby facilitating its continued use later, thereby improving the processing efficiency of wafer cleaning.

[0007] Preferably, a handle block is symmetrically fixedly connected to one side of the ejector rod, and the longitudinal section of the handle block is in a T-shape.

[0008] The effect achieved by the above components is that by providing the handle block, the contact area of ​​one side of the ejector rod can be increased, making it easier to grasp one side of the ejector rod when pulling it.

[0009] Preferably, both ends of the ejector rod are fixedly connected to first limit blocks, and the inner walls of the slots near the two ends of the clamp frame are symmetrically provided with limit grooves, and the inner walls of the limit grooves are slidably connected to the outer surfaces of the first limit blocks.

[0010] The effect achieved by the above components is: by setting the limiting groove and the first limiting block, the two ends of the ejection rod can be limited, so that it is not easy to shake when sliding up and down, and the movement is more stable.

[0011] Preferably, one side of the limiting rod is fixedly connected with an anti-sliding block, and the anti-sliding block is made of rubber.

[0012] The effect achieved by the above components is: by setting the anti-sliding block, the contact friction force on one side of the limiting rod can be increased, so that when one end of the limiting rod abuts against the ejection rod to limit and fix it, it is not easy to move away by itself, and the limit is more secure.

[0013] Preferably, the limiting device comprises a limiting plate, and a plurality of springs are symmetrically fixedly connected to the inner wall of the slot, and one end of the spring is fixedly connected to one side of the limiting plate.

[0014] The effect achieved by the above components is: by setting the limit plates, when the chip is placed in the card slot for limit fixing, the two limit plates will be squeezed outward to a certain distance, causing its spring to contract, and at the same time the spring will drive the limit plates to reset and abut against the surface of the placed chip, limiting it so that it is not easy to shake in the card slot during cleaning. At the same time, according to the thickness of the placed chip, the degree of deformation and contraction of the spring will be different, and the distance of resetting the limit plates will also be different, so that chips of different thicknesses can be limited.

[0015] Preferably, a plurality of telescopic rods are symmetrically fixedly connected to the inner wall of the slot, one end of the telescopic rod is fixedly connected to one side of the limit plate, and the telescopic rod is connected to the spring sleeve.

[0016] The effect achieved by the above components is that by arranging the telescopic rod, the inner wall of the spring can be supported, so that it is not easy to be damaged during use, thereby increasing the service life of the spring.

[0017] Preferably, a protective pad is fixedly connected to one side of the limiting plate, and the protective pad is made of silicone material.

[0018] The effect achieved by the above components is: by providing the protective pad, the softness of the surface of the limiting plate can be increased, so that the chip is not easily scratched or damaged when it abuts against the limiting plate.

[0019] Preferably, both sides of the limiting plate are fixedly connected with second limiting blocks, and the second limiting blocks are fixed in an inclined manner on one side of the limiting plate close to the bottom and the inner wall opening of the clamp frame.

[0020] The effect achieved by the above components is: by setting the second limit block, it is convenient for the wafer to be clamped between the two limit plates, and it is also convenient for the ejection rod to slide out.

[0021] Compared with the prior art, the advantages and positive effects of the utility model are:

[0022] In the utility model, by arranging a device for facilitating removal, when the clamp frame is used to limit and fix the quartz wafer during the cleaning process, the wafer will be placed and clamped into the clamping groove of the inner wall of the clamp frame so that it abuts against one side of the ejector rod, and then the hook will be hung inside the hook hole of the clamp frame and placed in the cleaning liquid for cleaning. After cleaning, the limiting rod is first rotated to one end on one side of the clamp frame to a certain angle, so that one end of it is moved away from the ejector rod, and then the ejector rod can be manually pulled outwards to a certain position in the inner walls of the installation groove and the clamping groove, so that the cleaned wafer can be ejected from the inner wall of the clamp frame and the inner wall of the clamping groove, which is convenient for taking it out, thereby facilitating its continued use at a later time, thereby improving the processing efficiency of wafer cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0024] Figure 2 It is a three-dimensional structural schematic diagram of the fixture frame of the utility model;

[0025] Figure 3 for Figure 2 A three-dimensional schematic diagram of the structure of the middle part;

[0026] Figure 4 It is a three-dimensional structural schematic diagram of the ejector rod of the utility model;

[0027] Figure 5 for Figure 4 A three-dimensional schematic diagram of the structure of the middle part;

[0028] Figure 6 It is a schematic diagram of the three-dimensional structure of the limiting plate of the utility model;

[0029] Figure 7 for Figure 6 Schematic diagram of the central structure.

[0030] Legend: 1. Clamp frame; 2. Easy-to-take-out device; 3. Limit device; 4. Hook hole; 5. Card slot; 21. Mounting slot; 22. Limit rod; 23. Ejector rod; 24. Handle block; 25. First limit block; 26. Limit slot; 27. Anti-sliding block; 31. Spring; 32. Limit plate; 33. Telescopic rod; 34. Protective pad; 35. Second limit block. DETAILED DESCRIPTION

[0031] Embodiment 1, as Figure 1-7 As shown, a tooling fixture for wafer cleaning includes a fixture frame 1, one side of the fixture frame 1 is symmetrically provided with a hook hole 4, the inner wall of the fixture frame 1 is symmetrically provided with a card slot 5, the inner wall of the fixture frame 1 is provided with a convenient removal device 2, the inner wall of the card slot 5 is symmetrically provided with a limiting device 3, the convenient removal device 2 includes an ejection rod 23, the inner wall of the fixture frame 1 and the inner wall of the card slot 5 are both provided with an installation groove 21, the installation groove 21 is slidably connected to the ejection rod 23, and one side of the fixture frame 1 is symmetrically rotatably connected with a plurality of limiting rods 22. When the clamp frame 1 is used to limit and fix the quartz wafer during the cleaning process, the wafer will be placed and clamped into the slot 5 on the inner wall of the clamp frame 1 so that it abuts against one side of the ejector rod 23, and then the hook will be hung inside the hook hole 4 on the clamp frame 1, and it will be placed in the cleaning liquid for cleaning. After cleaning it, the limiting rod 22 is first rotated to one end on one side of the clamp frame 1 to a certain angle, so that one end of it is moved away from the ejector rod 23, and then the ejector rod 23 can be manually pulled outward to a certain position in the inner walls of the mounting groove 21 and the slot 5, so that the cleaned wafer can be ejected from the inner wall of the clamp frame 1 and the inner wall of the slot 5, which is convenient for taking it out, thereby facilitating its continued use later, thereby improving the processing efficiency of wafer cleaning.

[0032] Reference Figure 2-5 As shown, this embodiment discloses that a handle block 24 is symmetrically fixedly connected to one side of the ejector rod 23, and the longitudinal section of the handle block 24 is in a T-shape. By providing the handle block 24, the contact area of ​​one side of the ejector rod 23 can be increased, so that it is convenient to grasp one side when pulling it. The first limit block 25 is fixedly connected to both ends of the ejector rod 23, and the inner wall of the card slot 5 near the two ends of the clamp frame 1 is symmetrically provided with a limit groove 26, and the inner wall of the limit groove 26 is slidably connected to the outer surface of the first limit block 25. By providing the limit groove 26 and the first limit block 25, the two ends of the ejector rod 23 can be limited, so that it is not easy to shake when sliding up and down, and the movement is more stable.

[0033] Reference Figure 2-5As shown, this embodiment discloses that one side of the limit rod 22 is fixedly connected with an anti-sliding block 27, and the anti-sliding block 27 is made of rubber. By providing the anti-sliding block 27, the contact friction force on one side of the limit rod 22 can be increased, so that when one end of the limit rod 22 abuts against the ejection rod 23 to limit and fix it, it is not easy to move away by itself, and the limit is more secure.

[0034] Reference Figure 6 and Figure 7 As shown, the embodiment discloses that the limiting device 3 includes a limiting plate 32, and the inner wall of the card slot 5 is symmetrically fixedly connected with a plurality of springs 31, and one end of the spring 31 is fixedly connected to one side of the limiting plate 32. When the wafer is placed in the card slot 5 for limiting and fixing, the two limiting plates 32 will be squeezed outward to a certain distance, so that the springs 31 will shrink, and at the same time, the springs 31 will drive the limiting plates 32 to reset and abut on the surface of the placed wafer, limiting it, so that it is not easy to shake in the card slot 5 during cleaning, and at the same time, according to the thickness of the placed wafer, the degree of deformation and shrinkage of the spring 31 will be different, and the distance of resetting the limiting plates 32 will also be different, so that wafers of different thicknesses can be limited.

[0035] Reference Figure 6 and Figure 7 As shown, the present embodiment discloses that the inner wall of the card slot 5 is symmetrically fixedly connected with a plurality of telescopic rods 33, one end of the telescopic rod 33 is fixedly connected with one side of the limit plate 32, and the telescopic rod 33 is sleeved and connected with the spring 31. By setting the telescopic rod 33, the inner wall of the spring 31 can be supported, so that it is not easy to be damaged during use, and the service life of the spring 31 is improved. A protective pad 34 is fixedly connected to one side of the limit plate 32, and the protective pad 34 is made of silicone. By setting the protective pad 34, the softness of the surface of the limit plate 32 can be increased, so that the wafer is not easy to be scratched and damaged when it abuts against the limit plate 32. Both sides of the limit plate 32 are fixedly connected with a second limit block 35, and the second limit block 35 is fixed in an inclined manner on one side of the limit plate 32 near the bottom and the inner wall opening of the clamp frame 1. By setting the second limit block 35, it is convenient for the wafer to be stuck between the two limit plates 32, and it is also convenient for the ejection rod 23 to slide out.

[0036] Working principle: when the clamp frame 1 is used to limit and fix the quartz wafer during the cleaning process, the wafer will be placed and clamped into the slot 5 on the inner wall of the clamp frame 1 so that it abuts against one side of the ejector rod 23, and then the hook will be hung inside the hook hole 4 on the clamp frame 1, and it will be placed in the cleaning liquid for cleaning. After cleaning it, the limit rod 22 is first rotated to one end on one side of the clamp frame 1 to a certain angle, so that one end and the anti-sliding block 27 are removed from the ejector rod 23, and then the handle block 24 can be manually held to pull the ejector rod 23 outward to a certain position in the inner wall of the mounting groove 21 and the slot 5, so that the cleaned wafer can be ejected from the inner wall of the clamp frame 1 and the inner wall of the slot 5, which is convenient for taking it out, thereby facilitating its continued use later, thereby improving the processing efficiency of wafer cleaning.

[0037] When the wafer is placed into the card slot 5 for limiting and fixing, the two limiting plates 32 will be squeezed outward to a certain distance, causing the spring 31 and the telescopic rod 33 to shrink. At the same time, the spring 31 will drive the limiting plate 32 to reset and abut against the surface of the wafer, limiting it so that it is not easy to shake in the card slot 5 during cleaning. At the same time, according to the thickness of the wafer placed, the degree of deformation and contraction of the spring 31 will be different, and the distance of resetting the limiting plate 32 will also be different, so that wafers of different thicknesses can be limited.

Claims

1. A fixture for wafer cleaning, comprising a fixture frame (1), characterized in that: One side of the clamp frame (1) is symmetrically provided with hook holes (4), the inner wall of the clamp frame (1) is symmetrically provided with a slot (5), the inner wall of the clamp frame (1) is provided with a convenient removal device (2), the inner wall of the slot (5) is symmetrically provided with a limiting device (3), the convenient removal device (2) comprises an ejection rod (23), the inner wall of the clamp frame (1) and the inner wall of the slot (5) are both provided with a mounting groove (21), the mounting groove (21) is slidably connected to the ejection rod (23), and one side of the clamp frame (1) is symmetrically rotatably connected with a plurality of limiting rods (22).

2. A wafer cleaning fixture according to claim 1, characterized in that: A handle block (24) is symmetrically fixedly connected to one side of the ejection rod (23); the handle block (24) has a T-shaped longitudinal section.

3. A wafer cleaning fixture according to claim 1, characterized in that: Both ends of the ejection rod (23) are fixedly connected to first limit blocks (25), and the inner walls of the clamping slot (5) near the two ends of the clamp frame (1) are symmetrically provided with limit grooves (26), and the inner walls of the limit grooves (26) are slidably connected to the outer surfaces of the first limit blocks (25).

4. A wafer cleaning fixture according to claim 1, characterized in that: An anti-sliding block (27) is fixedly connected to one side of the limiting rod (22); the anti-sliding block (27) is made of rubber.

5. The wafer cleaning fixture according to claim 1, characterized in that: The limiting device (3) comprises a limiting plate (32), and a plurality of springs (31) are symmetrically fixedly connected to the inner wall of the clamping slot (5), and one end of the spring (31) is fixedly connected to one side of the limiting plate (32).

6. A wafer cleaning fixture according to claim 5, characterized in that: A plurality of telescopic rods (33) are symmetrically fixedly connected to the inner wall of the slot (5); one end of the telescopic rod (33) is fixedly connected to one side of the limit plate (32); and the telescopic rod (33) is sleeve-connected to the spring (31).

7. A wafer cleaning fixture according to claim 5, characterized in that: A protective pad (34) is fixedly connected to one side of the limiting plate (32), and the protective pad (34) is made of silica gel.

8. The wafer cleaning fixture according to claim 5, characterized in that: Second limit blocks (35) are fixedly connected to both sides of the limit plate (32), and the second limit blocks (35) are fixed in an inclined manner on one side of the limit plate (32) close to the bottom and inner wall opening of the clamp frame (1).

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