High-precision laser wafer thickness measuring instrument for batch measurement

Abstract

The utility model relates to the technical field of measuring instruments, in particular to a high-precision laser wafer thickness measuring instrument for batch measurement, which comprises a device body and further comprises a conveyor belt mechanism, the conveyor belt mechanism is arranged in the middle of the upper surface of the device body, and a plurality of limiting mechanisms are arranged on the surface of the conveyor belt mechanism; the measuring mechanism is arranged in the middle of one side of the upper surface of the device body; the upper ends of the multiple bases are fixedly connected with the periphery of the lower surface of the device body; according to the utility model, through the arrangement of the conveyor belt mechanism and the limiting mechanism, the centralized measurement of a plurality of measurement units is realized, the measurement efficiency is effectively improved, and the measurement speed and accuracy are improved, so that the production speed is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of measuring instruments, in particular to a high-precision laser wafer thickness measuring instrument capable of batch measurement. Background Art

[0002] High-precision laser wafer thickness measuring instrument is a device that uses laser technology for non-contact measurement. It is mainly used in the semiconductor industry to accurately measure the thickness of wafers. This device can measure problems such as uneven grinding thickness and polishing uniformity on the surface of the wafer, thereby eliminating packaging problems caused by uneven wafer thickness.

[0003] However, the current high-precision laser wafer thickness measurement is relatively cumbersome to operate due to its high precision and is still in the state of single measurement. Workers are required to place a single workpiece, measure it, and then replace it, resulting in a process in which efficiency cannot be further improved. Utility Model Content

[0004] The utility model aims to provide a high-precision laser wafer thickness measuring instrument for batch measurement to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A high-precision laser wafer thickness measuring instrument for batch measurement, comprising a device body, and also comprising:

[0007] A conveyor belt mechanism, the conveyor belt mechanism is arranged in the middle of the upper surface of the device body, and a plurality of limiting mechanisms are arranged on the surface of the conveyor belt mechanism;

[0008] A measuring mechanism, the measuring mechanism being arranged in the middle of one side of the upper surface of the device body;

[0009] A base, wherein the base is provided with a plurality of bases and the upper end is fixedly connected to the lower surface of the device body;

[0010] A controller is fixedly connected to one side of the measuring mechanism.

[0011] As a preferred solution of the utility model,

[0012] The conveyor belt mechanism comprises:

[0013] A conveyor belt, the conveyor belt is rotatably arranged in the middle of the upper surface of the device body, and a plurality of limit mechanisms are fixedly connected to the surface of the conveyor belt at equal intervals;

[0014] Transmission cylinders, two of which are provided and are respectively connected to the inner sides of the conveyor belt for transmission;

[0015] A rotating motor, the rotating motor is fixedly connected to one side of the device body, and the output end of the rotating motor passes through one side of the device body and is drivingly connected to one end of an adjacent transmission cylinder;

[0016] The limiting mechanism comprises:

[0017] A through hole, the through hole being opened through the middle of the upper surface of the conveyor belt;

[0018] A limit block, wherein two limit blocks are provided and are symmetrically arranged on both sides of the through hole, the lower end of the limit block is fixedly connected to the upper surface of the conveyor belt, and the upper end of the limit block is provided with a limit groove;

[0019] When the device is used, the rotating motor starts to perform a quantitative single rotation, and the user places the object to be measured in the limit groove on the upper surface of the limit block to ensure that the object is in a relatively fixed state. Subsequently, each time the rotating motor is started, the conveyor belt will be moved equidistantly to ensure that each time it moves, the adjacent limit mechanism will be moved to the detection position on the lower surface of the measuring mechanism to wait for measurement. Through the set conveyor belt mechanism and limit mechanism, multiple measuring units can be measured centrally, which effectively improves the measurement efficiency, and improves the measurement speed and accuracy, thereby increasing the production speed.

[0020] As a preferred solution of the utility model,

[0021] The measuring mechanism comprises:

[0022] A measuring box, wherein a plurality of measuring box bases are fixedly connected to both sides of the lower end of the measuring box, and the lower ends of the measuring box bases are fixedly connected to both sides of the upper surface of the device body;

[0023] A mounting seat, the upper end of which is fixedly connected to the top of the measuring box, and the lower end of which is provided with a plurality of upper measuring mechanisms;

[0024] A lower measuring mechanism, wherein a plurality of lower measuring mechanisms are provided and are arranged vertically corresponding to the upper measuring mechanism, and the lower measuring mechanism is arranged on the inner side of one end of the conveyor belt;

[0025] The upper measuring mechanism comprises:

[0026] An upper measuring base, the upper measuring base is fixedly connected to the lower surface of the mounting seat, and an upper measuring laser head is fixedly connected to one side of the lower surface of the upper measuring base;

[0027] An upper measurement receiving plate, the upper end of which is fixedly connected to the lower surface of the upper measurement base;

[0028] The lower measuring mechanism comprises:

[0029] A lower measuring base, the two ends of which are fixedly connected to the two ends of the inner side of the upper surface of the device body;

[0030] A lower measurement receiving plate, wherein the lower measurement receiving plate is fixedly connected to one side of the upper surface of the lower measurement base;

[0031] A lower measuring laser head, wherein the lower end of the lower measuring laser head is fixedly connected to the other side of the upper surface of the lower measuring base;

[0032] The lower measuring laser head is vertically arranged corresponding to the upper measuring receiving plate, and the upper measuring laser head is vertically arranged corresponding to the lower measuring receiving plate;

[0033] When the measured crystal workpiece is transmitted between the upper measuring mechanism and the lower measuring mechanism, the lasers emitted by the upper measuring laser head and the lower measuring laser head are received and collected by the corresponding lower measuring receiving plate and the upper measuring receiving plate, and are in an empty measurement state. When the workpiece is transmitted to the specified position, it is now between the upper measuring mechanism and the lower measuring mechanism. Then the upper measuring laser head and the lower measuring laser head respectively emit laser beams to the upper and lower surfaces of the wafer workpiece. The laser beams are reflected on the surface of the wafer workpiece and return to the upper measuring laser head and the lower measuring laser head. After the upper measuring laser head receives the reflected light in combination with the lower measuring laser head, the thickness of the wafer is calculated by measuring the optical path difference, that is, the interference fringe spacing of the upper and lower laser beams on the wafer surface. The measurement data is transmitted to the controller. After processing and calculation, the thickness distribution information of the wafer is obtained. At the same time, the measurement box always covers the lasers of the lower and upper measuring laser heads during the entire measurement, so as to ensure that the staff will not be affected by misoperation. Through the setting of the measuring mechanism, the accuracy of the laser measurement is effectively improved, the accuracy of the measurement is guaranteed, and the staff is protected from accidental injury, thereby improving the safety of the measurement.

[0034] Compared with the prior art, the beneficial effects of the utility model are:

[0035] 1. In the utility model, when the device starts to be used, the rotating motor starts to perform a quantitative single rotation, and the user places the object to be measured in the limit groove on the upper surface of the limit block to ensure that the object is in a relatively fixed state. Subsequently, after each start of the rotating motor, the conveyor belt will be moved equidistantly to ensure that each movement will move the adjacent limit mechanism to the detection position on the lower surface of the measuring mechanism to wait for measurement. Through the provided conveyor belt mechanism and limit mechanism, multiple measuring units can be measured in a centralized manner, which effectively improves the measurement efficiency, and improves the measurement speed and accuracy, thereby increasing the production speed.

[0036] 2. In the present invention, when the measured crystal workpiece is transmitted between the upper measuring mechanism and the lower measuring mechanism, the lasers emitted by the upper measuring laser head and the lower measuring laser head are received and collected by the corresponding lower measuring receiving plate and the upper measuring receiving plate, and are in an empty measuring state. When the workpiece is transmitted to the specified position, it is between the upper measuring mechanism and the lower measuring mechanism. Then the upper measuring laser head and the lower measuring laser head respectively emit laser beams to irradiate the upper and lower surfaces of the wafer workpiece. The laser beams are reflected on the surface of the wafer workpiece and return to the upper measuring laser head and the lower measuring laser head. The upper measuring laser head After the lower measuring laser head receives the reflected light, the thickness of the wafer is calculated by measuring the optical path difference, that is, the spacing of the interference fringes of the upper and lower laser beams on the wafer surface. The measurement data is transmitted to the controller, and after processing and calculation, the thickness distribution information of the wafer is obtained. At the same time, the measuring box always covers the lower measuring laser head and the upper measuring laser head during the entire measurement, and the laser does not emit, to ensure that the staff will not be affected by misoperation; through the setting of the measuring mechanism, the accuracy of laser measurement is effectively improved, the accuracy of measurement is guaranteed, and the staff is protected from accidental injury, thereby improving the safety of measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0038] Figure 2 It is a schematic diagram of the overall internal structure of the utility model;

[0039] Figure 3 This is a schematic diagram of the structure of the limiting mechanism of the utility model;

[0040] Figure 4 It is a schematic diagram of the structure of the measuring mechanism of the utility model.

[0041] In the figure: 1. device body; 2. conveyor belt mechanism; 3. base; 4. measuring mechanism; 5. controller; 6. limit mechanism; 7. rotating motor; 8. measuring box; 9. mounting seat; 10. upper measuring mechanism; 11. lower measuring mechanism; 12. conveyor belt; 13. transmission cylinder; 14. measuring box base; 15. through hole; 16. limit block; 17. lower measuring base; 18. lower measuring receiving plate; 19. lower measuring laser head; 20. upper measuring base; 21. upper measuring laser head; 22. upper measuring receiving plate. DETAILED DESCRIPTION

[0042] In order to make the technical means, objectives and effects of the present invention easy to understand, the embodiments of the present invention are described in detail below with reference to specific drawings.

[0043] It should be noted that all terms used in the present invention for directional and positional indications, such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "top", "lower", "lateral", "longitudinal", "center", etc., are only used to explain the relative positional relationship and connection conditions between the components in a certain state (as shown in the accompanying drawings), and are only for the convenience of describing the present invention, rather than requiring the present invention to be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0044] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0046] See also Figure 1-4 , the utility model provides a technical solution:

[0047] A high-precision laser wafer thickness measuring instrument for batch measurement, comprising a device body 1, and also comprising:

[0048] The conveyor belt mechanism 2 is arranged in the middle of the upper surface of the device body 1, and a plurality of limiting mechanisms 6 are arranged on the surface of the conveyor belt mechanism 2;

[0049] The measuring mechanism 4 is arranged in the middle of one side of the upper surface of the device body 1;

[0050] A base 3, which is provided with a plurality of bases and has an upper end fixedly connected to the lower surface of the device body 1;

[0051] The controller 5 is fixedly connected to one side of the measuring mechanism 4 .

[0052] As an example of the present invention,

[0053] The conveyor belt mechanism 2 comprises:

[0054] A conveyor belt 12, which is rotatably arranged in the middle of the upper surface of the device body 1, and a plurality of limit mechanisms 6 are fixedly connected to the surface of the conveyor belt 12 at equal intervals;

[0055] A transmission cylinder 13, two transmission cylinders 13 are provided and are respectively connected to the inner sides of the conveyor belt 12 for transmission;

[0056] A rotating motor 7, the rotating motor 7 is fixedly connected to one side of the device body 1, and the output end of the rotating motor 7 passes through one side of the device body 1 and is drivingly connected to one end of the adjacent transmission cylinder 13;

[0057] The limiting mechanism 6 comprises:

[0058] A through hole 15, the through hole 15 is opened through the middle of the upper surface of the conveyor belt 12;

[0059] The limit blocks 16 are provided with two in total and are symmetrically arranged on both sides of the through hole 15. The lower ends of the limit blocks 16 are fixedly connected to the upper surface of the conveyor belt 12, and the upper ends of the limit blocks 16 are provided with limit grooves;

[0060] When the device starts to be used, the rotating motor 7 starts to perform a quantitative single rotation, and the user places the object to be measured in the limit groove on the upper surface of the limit block 16 to ensure that the object is in a relatively fixed state. Subsequently, each time the rotating motor 7 is started, the conveyor belt 12 is moved equidistantly to ensure that each time it moves, the adjacent limit mechanism 6 is moved to the detection position on the lower surface of the measuring mechanism 4 to wait for measurement. Through the provision of the conveyor belt mechanism 2 and the limit mechanism 6, multiple measuring units can be measured in a centralized manner, which effectively improves the measurement efficiency, and improves the measurement speed and accuracy, thereby increasing the production speed.

[0061] As an example of the present invention,

[0062] The measuring mechanism 4 comprises:

[0063] A measuring box 8, with a plurality of measuring box bases 14 fixedly connected to both sides of the lower end of the measuring box 8, and the lower ends of the measuring box bases 14 are fixedly connected to both sides of the upper surface of the device body 1;

[0064] A mounting seat 9, the upper end of which is fixedly connected to the top of the measuring box 8, and a plurality of upper measuring mechanisms 10 are arranged at the lower end of the mounting seat 9;

[0065] A lower measuring mechanism 11, wherein a plurality of lower measuring mechanisms 11 are provided and are vertically arranged corresponding to the upper measuring mechanism 10, and the lower measuring mechanism 11 is arranged on the inner side of one end of the conveyor belt 12;

[0066] The upper measuring mechanism 10 comprises:

[0067] An upper measuring base 20, the upper measuring base 20 is fixedly connected to the lower surface of the mounting base 9, and an upper measuring receiving plate 22 is fixedly connected to one side of the lower surface of the upper measuring base 20;

[0068] An upper measuring laser head 21, the upper end of which is fixedly connected to the lower surface of the upper measuring base 20;

[0069] The lower measuring mechanism 11 comprises:

[0070] A lower measuring base 17, two ends of which are fixedly connected to two ends of the inner side of the upper surface of the device body 1;

[0071] A lower measurement receiving plate 18, the lower measurement receiving plate 18 is fixedly connected to one side of the upper surface of the lower measurement base 17;

[0072] A lower measuring laser head 19, the lower end of which is fixedly connected to the other side of the upper surface of the lower measuring base 17;

[0073] The lower measuring laser head 19 is vertically arranged corresponding to the upper measuring receiving plate 22, and the upper measuring receiving plate 21 is vertically arranged corresponding to the lower measuring receiving plate 18;

[0074] When the crystal workpiece to be measured is transmitted between the upper measuring mechanism 10 and the lower measuring mechanism 11, the lasers emitted by the upper measuring laser head 21 and the lower measuring laser head 19 are received and collected by the corresponding lower measuring receiving plate 18 and the upper measuring receiving plate 22, and are in an empty measurement state. After the workpiece is transmitted to the specified position, it is now between the upper measuring mechanism 10 and the lower measuring mechanism 11. Subsequently, the upper measuring laser head 21 and the lower measuring laser head 19 emit laser beams respectively, irradiating the upper and lower surfaces of the wafer workpiece. The laser beams are reflected on the surface of the wafer workpiece and return to the upper measuring laser head 21 and the lower measuring laser head 19. After receiving the reflected light, the laser head 21 combines with the lower measuring laser head 19 to calculate the thickness of the wafer by measuring the optical path difference, that is, the spacing of the interference fringes of the upper and lower laser beams on the wafer surface. The measurement data is transmitted to the controller 5, and after processing and calculation, the thickness distribution information of the wafer is obtained. At the same time, the measuring box 8 always covers the laser of the lower measuring laser head 19 and the upper measuring laser head 21 during the entire measurement, so as to ensure that the staff will not be affected by misoperation; through the setting of the measuring mechanism 4, the accuracy of the laser measurement is effectively improved, the accuracy of the measurement is guaranteed, and the staff is protected from accidental injury, thereby improving the safety of the measurement.

[0075] Working principle: When the device starts to be used, the rotating motor 7 starts to perform a quantitative single rotation, and the user places the object to be measured in the limit groove on the upper surface of the limit block 16 to ensure that the object is in a relatively fixed state. Then, each time the rotating motor 7 is started, the conveyor belt 12 will be moved equidistantly to ensure that each movement will move the adjacent limit mechanism 6 to the detection position on the lower surface of the measuring mechanism 4 to wait for measurement. When the crystal workpiece to be measured is transmitted between the upper measuring mechanism 10 and the lower measuring mechanism 11, the lasers emitted by the upper measuring laser head 21 and the lower measuring laser head 19 are received and collected by the corresponding lower measuring receiving plate 18 and the upper measuring receiving plate 22, and are in an empty measurement state. After the workpiece is transmitted to the specified position, it is now between the upper measuring mechanism 10 and the lower measuring mechanism 11. Then the upper measuring laser head 21 and the lower measuring laser head 19 are connected to the upper measuring laser head 21 and the lower measuring laser head 19. The measuring laser head 19 emits laser beams respectively to irradiate the upper and lower surfaces of the wafer workpiece. The laser beams are reflected on the surface of the wafer workpiece and return to the upper measuring laser head 21 and the lower measuring laser head 19. After receiving the reflected light, the upper measuring laser head 21 combines with the lower measuring laser head 19 to calculate the thickness of the wafer by measuring the optical path difference, that is, the spacing of the interference fringes of the upper and lower laser beams on the wafer surface. The measurement data is transmitted to the controller 5, and after processing and calculation, the thickness distribution information of the wafer is obtained. At the same time, the measuring box 8 always covers the lasers of the lower measuring laser head 19 and the upper measuring laser head 21 during the entire measurement, so as to ensure that the staff will not be affected by misoperation. By setting up the measuring mechanism 4, the accuracy of laser measurement is effectively improved, the accuracy of measurement is guaranteed, and the staff is protected from accidental injury, thereby improving the safety of measurement.

[0076] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision laser wafer thickness measuring instrument for batch measurement, comprising a device body (1), characterized in that: Also includes: A conveyor belt mechanism (2), the conveyor belt mechanism (2) being arranged in the middle of the upper surface of the device body (1), and a plurality of limiting mechanisms (6) being arranged on the surface of the conveyor belt mechanism (2); A measuring mechanism (4), the measuring mechanism (4) being arranged in the middle of one side of the upper surface of the device body (1); A base (3), wherein the base (3) is provided with a plurality of parts and the upper end is fixedly connected to the lower surface of the device body (1) at all sides; A controller (5), wherein the controller (5) is fixedly connected to one side of the measuring mechanism (4); The measuring mechanism (4) comprises: A measuring box (8), wherein a plurality of measuring box bases (14) are fixedly connected to both sides of the lower end of the measuring box (8), and the lower ends of the measuring box bases (14) are fixedly connected to both sides of the upper surface of the device body (1); A mounting seat (9), the upper end of which is fixedly connected to the top of the measuring box (8), and the lower end of which is provided with a plurality of upper measuring mechanisms (10); A plurality of lower measuring mechanisms (11) are provided and are arranged vertically corresponding to the upper measuring mechanism (10). The lower measuring mechanism (11) is arranged on the inner side of one end of the conveyor belt (12).

2. The high-precision laser wafer thickness measuring instrument for batch measurement according to claim 1, characterized in that: The conveyor belt mechanism (2) comprises: A conveyor belt (12), the conveyor belt (12) being rotatably arranged in the middle of the upper surface of the device body (1), and a plurality of limiting mechanisms (6) being fixedly connected to the surface of the conveyor belt (12) at equal intervals; A transmission cylinder (13), wherein two transmission cylinders (13) are provided and are respectively connected to the inside of two ends of the conveyor belt (12) for transmission; A rotating motor (7) is fixedly connected to one side of the device body (1); an output end of the rotating motor (7) passes through one side of the device body (1) and is drivingly connected to one end of an adjacent transmission cylinder (13).

3. The high-precision laser wafer thickness measuring instrument for batch measurement according to claim 1, characterized in that: The limiting mechanism (6) comprises: A through hole (15), wherein the through hole (15) is opened through the middle of the upper surface of the conveyor belt (12); A limit block (16), wherein two limit blocks (16) are provided and are symmetrically arranged on both sides of the through hole (15); the lower end of the limit block (16) is fixedly connected to the upper surface of the conveyor belt (12); and the upper end of the limit block (16) is provided with a limit groove.

4. The high-precision laser wafer thickness measuring instrument for batch measurement according to claim 1, characterized in that: The upper measuring mechanism (10) comprises: An upper measuring base (20), the upper measuring base (20) being fixedly connected to the lower surface of the mounting base (9), and an upper measuring receiving plate (22) being fixedly connected to one side of the lower surface of the upper measuring base (20); An upper measuring laser head (21), wherein the upper end of the upper measuring laser head (21) is fixedly connected to the lower surface of the upper measuring base (20).

5. The high-precision laser wafer thickness measuring instrument for batch measurement according to claim 4, characterized in that: The lower measuring mechanism (11) comprises: A lower measuring base (17), wherein two ends of the lower measuring base (17) are fixedly connected to two ends of the inner side of the upper surface of the device body (1); A lower measurement receiving plate (18), wherein the lower measurement receiving plate (18) is fixedly connected to one side of the upper surface of the lower measurement base (17); A lower measuring laser head (19), wherein the lower end of the lower measuring laser head (19) is fixedly connected to the other side of the upper surface of the lower measuring base (17).

6. The high-precision laser wafer thickness measuring instrument for batch measurement according to claim 5, characterized in that: The lower measurement laser head (19) is vertically arranged corresponding to the upper measurement receiving plate (22), and the upper measurement laser head (21) is vertically arranged corresponding to the lower measurement receiving plate (18).

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