Wafer box detection device

Abstract

The utility model discloses a wafer box detection device, which is characterized in that when receiving a wafer box, the wafer box is disassembled and assembled through a Z-axis module and an X-axis module, and under the dual detection of a disassembly and assembly part and a first sensor, the assembly condition and the use condition of a cover in the wafer box can be detected. Workers can quickly carry out corresponding processing work according to the feedback result, so that the detection efficiency and the processing efficiency are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection, in particular to a wafer box detection device. Background Art

[0002] The assembled wafer boxes need to go through a quality inspection process to check the qualified rate of the wafer box assembly. The traditional method is to use the naked eye to observe whether there are any missing parts in the wafer box, and to manually operate to determine whether there are any usage problems with the wafer box. This method is time-consuming, labor-intensive and inefficient. Utility Model Content

[0003] The purpose of the utility model is to propose a wafer box detection device in view of the technical problems existing in the background technology.

[0004] In order to achieve the above technical purpose, the technical solution adopted by the utility model is as follows:

[0005] A wafer box detection device is used to detect the assembly structure of the cover of the wafer box, wherein a locking piece that is engaged with the wafer box is provided in the cover, the wafer box detection device comprises a cabinet, a Z-axis module installed on the cabinet, and an X-axis module installed on the cabinet, a first sensor is provided on the cabinet, the first sensor is used to identify the locking piece, the Z-axis module is used to detect the assembly structure of the cover, the X-axis module is used to fix the wafer box and drive the wafer box close to or away from the Z-axis module, the Z-axis module comprises a movable plate, an adsorption portion installed on the movable plate, a disassembly portion installed on the movable plate, and a first drive portion, which is used to adsorb the cover, the disassembly portion is used to drive the locking piece, assemble or disassemble the cover to the wafer box and record execution data, and the first drive portion is connected to the movable plate to drive the movable plate close to or away from the first sensor.

[0006] Preferably, the adsorption portion includes a plurality of suction cups and a plurality of second sensors, the plurality of suction cups are respectively installed at the diagonal positions of the movable plate, and the plurality of second sensors are respectively installed at the four corners of the movable plate.

[0007] Preferably, a rotatable turntable is provided inside the cover, and the turntable is driven and connected to a locking plate to drive the cover and the wafer box to be unlocked or locked. The disassembly and assembly part includes a first drive motor and a connecting part installed on the output end of the first drive motor. The connecting part can be connected to the turntable, and under the drive of the first drive motor, the cover is unlocked or locked to the wafer box. The first drive motor records the execution data.

[0008] Preferably, the first driving unit includes a guide rail installed in the cabinet, a second driving motor and a slide, the first end of the slide can be slidably installed on the guide rail, the second end of the slide extends out of the cabinet and is fixedly connected to the movable plate, the second driving motor is installed on the guide rail and is driven and connected to the slide to drive the slide to move along the direction of the guide rail.

[0009] Preferably, the X-axis module includes a mounting seat and a second driving unit drivingly connected to the mounting seat, the second driving unit is installed in the cabinet and has the same structure as the first driving unit, and the mounting seat is used to install the wafer box.

[0010] Preferably, the mounting seat is provided with a positioning block and a fixing member, the wafer box is installed at a mounting position determined by the positioning block, and is installed on the mounting seat by the fixing member.

[0011] Preferably, a card slot is provided on the wafer box, and the fixing member includes a third drive motor and a card block installed on the output end of the third drive motor, wherein when the wafer box is installed on the mounting seat, the third drive motor drives the card block to enter the card slot and engage with it.

[0012] Compared with the prior art, the utility model has the following beneficial technical effects: when the wafer box detection device receives a wafer box, the wafer box is disassembled and assembled through the Z-axis module and the X-axis module, and under the dual detection of the disassembly and assembly part and the first sensor, the assembly condition and use condition of the cover in the wafer box can be detected, and the staff can quickly perform corresponding processing work by feedbacking the results, effectively improving the detection efficiency and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of an embodiment of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the Z-axis module and the X-axis module in the embodiment of the utility model;

[0015] Figure 3 This is an exploded schematic diagram of the Z-axis module in the embodiment of the utility model;

[0016] Figure 4 The structure of the X-axis module in the embodiment of the utility model is shown in FIG. Figure 1 ;

[0017] Figure 5 The structure of the X-axis module in the embodiment of the utility model is shown in FIG. Figure 2 ;

[0018] Figure 6 This is a diagram showing the use status of the first driving motor and the wafer box in the embodiment of the utility model;

[0019] Figure 7 This is a schematic diagram of the use state of the first driving motor and the cover in the embodiment of the utility model;

[0020] Figure 8 for Figure 7 Cross-sectional view of the middle AA section.

[0021] Figure numbers: 100 wafer box, 101 cover, 102 locking piece, 103 turntable, 104 card slot, 200 cabinet, 201 first sensor, 300 Z-axis module, 301 movable plate, 302 adsorption part, 3021 suction cup, 3022 second sensor, 303 disassembly and assembly part, 3031 first drive motor, 3032 connecting part, 304 first drive part, 3041 guide rail, 3042 second drive motor, 3043 slide, 400 X-axis module, 401 mounting seat, 402 second drive part, 403 positioning block, 404 fixing part, 4041 third drive motor, 4042 card block. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0023] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0025] The specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0026] like Figure 1-Figure 8As shown, the utility model proposes a wafer box detection device, which is used to detect the assembly structure of the cover 101 of the wafer box 100, wherein the cover 101 is provided with a locking piece 102 that is engaged with the wafer box 100, and the wafer box detection device includes a cabinet 200, a Z-axis module 300 installed on the cabinet 200, and an X-axis module 400 installed on the cabinet 200, wherein the cabinet 200 is provided with a first sensor 201, the first sensor 201 is used to identify the locking piece 102, the Z-axis module 300 is used to detect the assembly structure of the cover 101, and the X-axis module 400 is used to fix The wafer box 100 is fixed, and the wafer box 100 is driven to approach or move away from the Z-axis module 300. The Z-axis module 300 is used to adsorb the cover 101. The Z-axis module 300 includes a movable plate 301, an adsorption portion 302 installed on the movable plate 301, a disassembly portion 303 installed on the movable plate 301, and a first driving portion 304. The disassembly portion 303 is used to drive the locking piece 102 to assemble or disassemble the cover 101 on the wafer box 100 and record execution data. The first driving portion 304 is drivingly connected to the movable plate 301 to drive the movable plate 301 to approach or move away from the first sensor 201.

[0027] Specifically, in the present embodiment, for the assembly of the wafer box 100, the wafer box 100 is placed on the X-axis module 400, wherein the wafer box 100 is covered with a lid 101 on one side facing the Z-axis module 300, and the wafer box 100 is driven by the X-axis film group 400 to be close to the Z-axis module 300, and the adsorption portion 302 on the movable plate 301 is adsorbed on the lid 101, and the disassembly and assembly portion 303 is connected with the locking piece 102 and obtains execution data, wherein it is mainly noted that the execution data refers to the driving torque data of the disassembly and assembly portion 303 and the locking piece 102 when driving, and it can be judged according to the driving torque data whether the locking piece 102 is properly installed in the lid 101 and whether the driving of the locking piece 102 is normal, and after the disassembly and assembly portion 303 removes the lid 101 from the wafer box 100, the entire movable plate 301 is moved by the first driving portion 304. 01 moves to the first sensor 201, and the first sensor 201 records the position information of the cover 101 at this time, wherein the wafer box detection device is preset with the centering data of the cover 101 and the wafer box 100, and the disassembly and assembly part 303 matches the position information recorded by the first sensor 201 and the preset centering data, and executes to move the cover 101 back to the opening of the wafer box 100. At this time, the center of the cover 101 corresponds to the center of the opening of the wafer box 100, and the automatic centering function is realized. Whether the above-mentioned locking piece 102 is properly installed and whether the drive is normal is based on the driving torque data provided by the disassembly and assembly part 300. The staff can quickly process according to the corresponding detection results without manual detection. Through automated detection methods, the detection efficiency and detection accuracy are improved, and manual manpower is reduced.

[0028] Furthermore, the adsorption part 302 includes a plurality of suction cups 3021 and a plurality of second sensors 3022 . The plurality of suction cups 3021 are respectively installed at the diagonal positions of the movable plate 301 , and the plurality of second sensors 3022 are respectively installed at the four corners of the movable plate 301 .

[0029] Specifically, in this embodiment, a structure of two suction cups 3021 and four second sensors 3022 is adopted. Figure 3 As shown, when the X-axis module 400 approaches the Z-axis module 300 , the four second sensors 3022 recognize the approach of the cover 101 and transmit signals to the two suction cups 3021 , so that the two suction cups 3021 can accurately adsorb the cover 101 .

[0030] There are four locking pieces 102 and they are respectively arranged at the four corners of the cover 101. The four second sensors 3022 respectively sense the installation conditions of the four locking pieces. It should be noted that the detection of the locking piece 102 by the above-mentioned disassembly and assembly part 303 cannot directly determine the existence of the locking piece 102. Therefore, the second sensor 3022 is required to fundamentally detect the existence of the locking piece 102. The detected data processing can be divided into: one is that the driving torque data detected by the disassembly and assembly part 303 is normal, at this time, it can be determined that the locking piece 102 exists in the cover 101 and is installed. If the installation is normal, the subsequent detection of the second sensor 3022 is to further verify the detection result of the disassembly and assembly part 303; secondly, if the driving torque data detected by the disassembly and assembly part 303 is abnormal, then there is a problem that the locking plate 102 is installed abnormally or the locking plate 102 does not exist. At this time, the locking plate 102 is detected again by the second sensor 3022, which can determine the abnormal installation or existing problem of the locking plate 102, so that the staff can quickly find the abnormality and deal with it, and improve the detection efficiency and accuracy through automated detection methods.

[0031] Furthermore, a rotatable turntable 103 is provided in the cover 101, and the turntable 103 is driven and connected to the locking piece 102 to drive the cover 101 and the wafer box 100 to be unlocked or locked. The disassembly and assembly part 303 includes a first driving motor 3031 and a connecting member 3032 installed on the output end of the first driving motor 3031. The connecting member 3032 can be connected to the turntable 103, and under the drive of the first driving motor 3031, the cover 101 is unlocked or locked to the wafer box 100. The first driving motor 3031 records the execution data.

[0032] Specifically, as attached Figure 8As shown, in the present embodiment, the connecting piece 3032 is a T-shaped component, and the hole at the center of the turntable 103 is a shape structure that matches the connecting piece 3032. The turntable 103 is provided with a guide groove that is drive-connected to the locking piece 102. The structural shape of the guide groove is that one end is close to the center hole of the turntable 103, and the other end is away from it. It should be noted that the locking piece 102 is in a slidable state inside the cover 101. When the first driving motor 3031 drives the turntable 103 to rotate forward or reverse, the locking piece 102 will move closer to or away from the center of the turntable 103, and the corresponding end of the locking piece 102 will lock or unlock the connection with the wafer box 100.

[0033] Furthermore, the first driving unit 304 includes a guide rail 3041 installed in the cabinet 200, a second driving motor 3042 and a slide 3043, the first end of the slide 3043 is slidably installed on the guide rail 3041, the second end of the slide 3043 extends out of the cabinet 200 and is fixedly connected to the movable plate 301, the second driving motor 3042 is installed on the guide rail 3041 and is drivingly connected to the slide 3043 to drive the slide 3043 to move along the direction of the guide rail 3041.

[0034] Furthermore, the X-axis module 400 includes a mounting base 401 and a second driving unit 402 driven and connected to the mounting base 401. The second driving unit 402 is installed in the cabinet 200 and adopts the same structure as the first driving unit 304. The mounting base 401 is used to install the wafer box 100, and the mounting base 401 has a positioning block 403 and a fixing member 404. The wafer box 100 determines the installation position through the positioning block 403 and is installed on the mounting base 401 through the fixing member 404.

[0035] It should be noted that when the wafer box 100 and the cover 101 are manually assembled, it is difficult for the cover 101 to be accurately placed at the center position of the opening of the wafer box 100. Therefore, a first positioning pin is provided at the suction cup 3021, and a first positioning hole is correspondingly provided on the cover 101. The Z-axis module 300 absorbs the cover 101 through the suction cup 3021, and the first positioning pin is docked with the first positioning hole. At this time, the Z-axis module 300 has determined the center position of the cover 101. Furthermore, the mounting seat 401 is also provided with a second positioning pin, and a second positioning hole is correspondingly provided on the wafer box 100. When the wafer box 100 is placed on the mounting seat 401, , the second positioning pin is docked with the second positioning hole. At this time, the X-axis module 400 has determined the center position of the opening of the wafer box 100, and the Z-axis membrane group 300 moves the cover 101 to the first sensor 201. The first sensor 201 records the current position information of the center of the cover 101, which is recorded as the first position information here. It should be noted again that the wafer box detection device is used for the preset centering setting value, that is, the cover 101 moves from the first position information to the center position of the opening of the wafer box 100, so that the cover 101 and the wafer box 100 can complete the automatic assembly and the automatic centering operation at the same time.

[0036] Furthermore, a card slot 104 is provided on the wafer box 100, and the fixing member 404 includes a third driving motor 4041 and a card block 4042 installed on the output end of the third driving motor 4041, wherein when the wafer box 100 is installed on the mounting base 401, the third driving motor 4041 drives the card block 4042 to enter the card slot 104 and engage with it.

[0037] Specifically, the wafer box 100 needs to be positioned in advance when it is installed on the mounting seat 401 to determine the installation position for subsequent inspection work to avoid errors that affect the normal working process. The mounting seat 401 is also provided with positioning columns, as shown in the attached Figure 4 As shown, in order to quickly position the wafer box 100, the use of the fixing member 404 can be selected by magnetic attraction, fasteners or screw fixing. In this embodiment, an automatic snap-on method is adopted. When the wafer box 100 is placed on the mounting seat 401, the third driving motor 4041 drives the clamping block 4042 to rotate and engage with the clamping slot 104 to fix the wafer box 100 on the mounting seat 401.

[0038] The above is a wafer box detection device or multiple implementations provided in combination with specific content, and it is not considered that the specific implementation of the utility model is limited to these descriptions. Any method, structure, etc. similar to or identical to the utility model, or a number of technical deductions or replacements based on the concept of the utility model, should be considered as the protection scope of the utility model.

Claims

1. A wafer box detection device, used for detecting the assembly structure of a cover (101) of a wafer box (100), wherein: The cover (101) is provided with a locking piece (102) for engaging with the wafer box (100), and is characterized in that the wafer box detection device comprises: A cabinet (200), wherein a first sensor (201) is provided on the cabinet (200), and the first sensor (201) is used to identify the locking piece (102); A Z-axis module (300) installed on the cabinet (200) and used to detect the assembly structure of the cover (101); An X-axis module (400) installed on the cabinet (200), which is used to fix the wafer box (100) and drive the wafer box (100) to approach or move away from the Z-axis module (300); The Z-axis module (300) comprises: Movable plate (301); An adsorption portion (302) mounted on the movable plate (301) and used for adsorbing the cover (101); An assembly and disassembly portion (303) mounted on the movable plate (301), used to drive the locking piece (102), assemble or disassemble the cover (101) to the wafer box (100) and record execution data; A first driving unit (304) is drivingly connected to the movable plate (301) to drive the movable plate (301) to move closer to or farther from the first sensor (201).

2. The wafer box detection device according to claim 1, characterized in that: The adsorption portion (302) comprises a plurality of suction cups (3021) and a plurality of second sensors (3022); the plurality of suction cups (3021) are respectively installed at the diagonal positions of the movable plate (301); and the plurality of second sensors (3022) are respectively installed at the four corners of the movable plate (301).

3. The wafer box detection device according to claim 1, characterized in that: A rotatable turntable (103) is provided inside the cover (101), and the turntable (103) is drivingly connected to the locking plate (102) to drive the cover (101) and the wafer box (100) to be unlocked or locked. The disassembly and assembly part (303) includes a first driving motor (3031) and a connecting member (3032) installed on the output end of the first driving motor (3031). The connecting member (3032) can be connected to the turntable (103) and, under the drive of the first driving motor (3031), the cover (101) is unlocked or locked to the wafer box (100). The first driving motor (3031) records execution data.

4. The wafer box detection device according to claim 1, characterized in that: The first driving unit (304) comprises a guide rail (3041) installed in the cabinet (200), a second driving motor (3042) and a slide (3043); the first end of the slide (3043) is slidably installed on the guide rail (3041); the second end of the slide (3043) extends out of the cabinet (200) and is fixedly connected to the movable plate (301); the second driving motor (3042) is installed on the guide rail (3041) and is drivingly connected to the slide (3043) to drive the slide (3043) to move along the guide rail (3041).

5. The wafer box detection device according to claim 1, characterized in that: The X-axis module (400) includes a mounting seat (401) and a second driving unit (402) drivingly connected to the mounting seat (401), wherein the second driving unit (402) is installed in the cabinet (200) and has the same structure as the first driving unit (304), and the mounting seat (401) is used to install the wafer box (100).

6. The wafer box detection device according to claim 5, characterized in that: The mounting seat (401) is provided with a positioning block (403) and a fixing member (404); the wafer box (100) determines the mounting position through the positioning block (403) and is mounted on the mounting seat (401) through the fixing member (404).

7. The wafer box detection device according to claim 6, characterized in that: The wafer box (100) is provided with a card slot (104), and the fixing member (404) includes a third driving motor (4041) and a card block (4042) installed at the output end of the third driving motor (4041), wherein when the wafer box (100) is installed on the mounting seat (401), the third driving motor (4041) drives the card block (4042) to enter the card slot (104) and engage with it.

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