Material carrying structure for circuit board electroplating pool

Abstract

The utility model provides a material carrying structure for a circuit board electroplating pool. The material carrying structure comprises an electroplating pool, a support frame, a jig and a carrying manipulator, the jig comprises a bearing rod and a stand column. The stand column is provided with an outer limiting block and an inner limiting block. An electroplating bath is arranged on the electroplating pool, a positioning seat is arranged on the supporting frame, and a lifting air cylinder is arranged between the positioning seat and the electroplating pool; the carrying manipulator comprises a track, a sliding table, a cargo boom and a material taking rod, and angle iron is arranged on the material taking rod. When the carrying manipulator transfers the jig, the lifting cylinder pushes the outer limiting block to lift the jig, then the angle iron hooks the inner limiting block, finally the jig is lifted from the electroplating bath by the cargo boom, and the angle iron is fixed on the material taking rod and is an immovable part, so that the jig is not easy to fall off in the carrying process, and the failure rate can be effectively reduced. And the sliding table can slide along the track, so that the cargo boom can slide for a long distance, the single cargo boom can meet the taking and placing requirements of the jig, and the equipment manufacturing cost and the maintenance difficulty are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a material handling structure used in a circuit board electroplating pool. Background Art

[0002] Electroplating is one of the production processes of circuit boards. It is a process in which a layer of metal (such as nickel) that is solderable and not easily oxidized is plated on the circuit board to protect the circuit on the circuit board.

[0003] During electroplating, the circuit board is first mounted on a jig and then placed in an electroplating tank for electroplating. Circuit boards are mass-produced products, and multiple circuit boards need to be mounted on the jig, and multiple electroplating tanks are needed to electroplate circuit boards of different batches. On the one hand, the number and mass of circuit boards mounted on the jig are large, which places high load-bearing requirements on the robotic arm. In addition, when the existing robotic arm transports the jig, it grabs the jig through its movable claws. When the robotic arm transports the jig, the movable claws bear the gravity of the circuit board on the jig, which is prone to malfunctions, such as jamming and deformation. On the other hand, in the electroplating process, the circuit boards need to be placed in different tanks for electroplating, cleaning and other operations. The existing robotic arm has insufficient displacement distance, and multiple robotic arms need to be set up on the electroplating tank for sequential transportation, which results in high equipment manufacturing and maintenance costs. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a material handling structure for a circuit board electroplating pool, thereby overcoming the problem that the handling structure is easily damaged during the electroplating process and reducing the manufacturing and maintenance costs of the handling structure.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A material handling structure for a circuit board electroplating pool, comprising: an electroplating pool, a support frame, a fixture and a handling manipulator;

[0007] The fixture comprises a load-bearing rod and columns located at both ends of the load-bearing rod, the load-bearing rod is used to mount the circuit board to be electroplated, and the columns are provided with an outer limit block and an inner limit block;

[0008] The electroplating pool is provided with an electroplating tank, the electroplating pool is arranged in the support frame, the support frame is provided with a positioning seat matching the outer limit block, and a lifting cylinder is provided at the interval between the positioning seat and the electroplating pool;

[0009] The transport robot includes a track, a slide, a lifting arm located on the slide and a material picking rod located on the lifting arm. The slide is arranged on the track, the lifting arm is used to drive the material picking rod to approach or move away from the electroplating pool, and the material picking rod is provided with an angle iron matching the inner limit block.

[0010] In one of the embodiments, a hanging bracket is further included, wherein the hanging bracket is located at the end of the electroplating tank, and a supporting portion is provided on the top of the hanging bracket, and the supporting portion is used to support the fixture.

[0011] In one of the embodiments, an escape zone is provided on the suspension bracket, and a liquid receiving box is provided in the escape zone.

[0012] In one embodiment, the cross-sections of the angle iron, the outer limit block and the inner limit block are all in a "V" shape.

[0013] In one of the embodiments, a guide groove is provided on the positioning seat, the width of the guide groove decreases from the top of the positioning seat to the bottom of the positioning seat, and the outer limit block is in contact with the groove wall of the guide groove.

[0014] In one of the embodiments, a limiting column is further provided on the support frame, and the limiting column is located on a side away from the electroplating pool.

[0015] In one of the embodiments, a V-shaped block is provided at the output end of the lifting cylinder.

[0016] In one embodiment, there are multiple electroplating tanks, and the multiple electroplating tanks are spaced apart along the long side of the electroplating pool.

[0017] In one of the embodiments, each of the electroplating tanks is provided with a water inlet pipe and a drain pipe.

[0018] In one of the embodiments, the slide is provided with a guide wheel, and the guide wheel is in contact with the outer wall of the track.

[0019] The above-mentioned material handling structure for the circuit board electroplating pool has the following advantages:

[0020] 1. When the handling manipulator transfers the fixture, the lifting cylinder pushes the outer limit block to lift the fixture, and then the angle iron hooks the inner limit block, and finally the lifting arm lifts the fixture from the electroplating tank. The angle iron is fixed on the material picking rod as a non-movable part, so it is not easy to fall off during the handling of the fixture, which can effectively reduce the failure rate.

[0021] 2. The slide can slide along the track, allowing the crane arm to slide over a long distance. A single crane arm can meet the needs of picking up and placing the fixture, reducing the equipment manufacturing cost and maintenance difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 is a schematic diagram of a material handling structure for a circuit board electroplating bath;

[0024] Figure 2 This is a schematic diagram of the jig placed on the electroplating bath;

[0025] Figure 3 It is a structural diagram of the fixture;

[0026] Figure 4 It is a schematic diagram of the coordination between the handling robot and the electroplating pool;

[0027] Figure 5 for Figure 4 Magnified view at A.

[0028] Figure numerals: 10, material handling structure for circuit board electroplating pool; 100, electroplating pool; 110, electroplating tank; 111, water inlet pipe; 112, drain pipe; 200, support frame; 210, positioning seat; 211, guide groove; 220, limit column; 300, fixture; 310, load-bearing rod; 320, column; 321, outer limit block; 322, inner limit block; 400, handling manipulator; 410, track; 420, slide; 421, guide wheel; 430, lifting arm; 440, material picking rod; 441, angle iron; 500, lifting cylinder; 510, V-shaped block; 600, suspension bracket; 610, support part; 620, avoidance area; 630, liquid receiving box; DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] See also Figure 1 and Figure 4 The utility model provides a material handling structure 10 for a circuit board electroplating pool, which includes: an electroplating pool 100, a support frame 200, a fixture 300 and a handling robot 400. The electroplating pool 100 contains a solution for electroplating, and the support frame 200 is arranged on the outer wall of the electroplating pool 100 to support the fixture 300.

[0033] See also Figure 2 and Figure 3 The fixture 300 includes a load-bearing rod 310 and columns 320 located at both ends of the load-bearing rod 310. The load-bearing rod 310 and the two columns 320 together form a "C"-shaped structure (such as Figure 3 As shown in the figure, a hook is provided on the load-bearing rod 310, and the circuit board to be electroplated is hung on the hook. The load-bearing rod 310 can simultaneously mount multiple circuit boards, and the column 320 is provided with an outer limit block 321 and an inner limit block 322. The outer limit block 321 and the inner limit block 322 are respectively arranged on the opposite side surfaces of the column 320, the outer limit block 321 is located on the side away from the center of the fixture 300, and the inner limit block 322 is located on the side close to the center of the fixture 300, so that the inner limit blocks 322 on the two columns 320 are arranged facing each other.

[0034] See also Figure 1 and Figure 2 The electroplating tank 100 is provided with an electroplating tank 110. Preferably, the number of the electroplating tanks 110 is multiple, and the multiple electroplating tanks 110 are spaced apart along the long side direction of the electroplating tank 100. The long side of the electroplating tank 100 refers to the side with the longest side of the electroplating tank 100. Furthermore, each electroplating tank 110 is provided with a water inlet pipe 111 and a drain pipe 112. The electroplating solution is injected into the electroplating tank 110 through the water inlet pipe 111, and the waste liquid is discharged through the drain pipe 112, thereby improving the electroplating efficiency.

[0035] See also Figure 1 and Figure 5 The electroplating pool 100 is arranged in the support frame 200, and the support frame 200 is provided with a positioning seat 210 matching the outer limit block 321. There are multiple positioning seats 210, two positioning seats 210 form a group, and each electroplating tank 110 is provided with a group of positioning seats 210. When the fixture 300 is placed in the electroplating tank 110, the outer limit blocks 321 on the two columns 320 contact the positioning seats 210 at the target electroplating tank 110, and the positioning seat 210 provides support force to the outer limit block 321, thereby fixing the fixture 300 on the electroplating tank 110, allowing the circuit board to be immersed in the electroplating tank 110 for electroplating. A lifting cylinder 500 is provided at the interval between the positioning seat 210 and the electroplating pool 100. After the electroplating process is completed, the lifting cylinder 500 is started, and a thrust is applied to the outer limit block 321 to lift the fixture 300 and raise the inner limit block 322 to facilitate the handling of the transport robot 400.

[0036] See also Figure 1 and Figure 4 The handling robot 400 includes a track 410, a slide 420, a lifting arm 430 located on the slide 420, and a picking rod 440 located on the lifting arm 430. The slide 420 is arranged on the track 410, and the track 410 extends along the long side direction of the electroplating pool 100. The slide 420 can slide along the track 410, thereby driving the lifting arm 430 to move from one end of the electroplating pool 100 to the other end of the electroplating pool 100. The picking rod 440 is arranged on the lifting arm 430, and the lifting arm 430 drives the picking rod 440 to rise or fall, so that the picking rod 440 is away from or close to the electroplating pool 100. The picking rod 440 is provided with an angle iron 441 that matches the inner limit block 322.

[0037] During the electroplating process, the circuit board is hung on the load-bearing rod 310, and the fixture 300 is placed in the electroplating tank 100, so that the outer limit block 321 contacts the positioning seat 210, and the positioning seat 210 provides support force to the outer limit block 321, so that the load-bearing rod 310 is suspended in the electroplating tank 110, and the circuit board is immersed in the solution inside the electroplating tank 110. It should be noted that when the outer limit block 321 contacts the positioning seat 210, the setting height of the inner limit block 322 is lower than the material removal rod 440 (such as Figure 2 As shown), at this time, the transport robot 400 cannot pick up the fixture 300.

[0038] After the electroplating is completed, the jig 300 needs to be taken out. At this time, the transport robot 400 is started, and the slide 420 slides along the track 410 to the top of the target jig 300 .

[0039] Next, the lifting cylinder 500 is started, applying a thrust to the outer limit block 321 to lift the fixture 300. At this time, the inner limit block 322 rises. At this time, the inner limit block 322 is located within the grasping range of the transport robot 400. Specifically, the lifting arm 430 drives the material picking rod 440 to descend, so that the angle iron 441 moves to the bottom of the inner limit block 322. When the lifting arm 430 drives the material picking rod 440 to rise, the angle iron 441 hooks the inner limit block 322 in the rising diagram, thereby driving the fixture 300 to rise, thereby lifting it out of the electroplating tank 110.

[0040] After the jig 300 is completely out of the electroplating tank 110 , the slide 420 is started again, and moves the jig 300 along the track 410 , placing the jig 300 into the next electroplating tank 110 or transferring the jig 300 to the next workstation.

[0041] From the above working process, it can be seen that the material handling structure 10 for the circuit board electroplating pool has the following advantages:

[0042] 1. When the handling robot 400 transfers the fixture 300, the lifting cylinder 500 pushes the outer limit block 321 to lift the fixture 300, and then the angle iron 441 hooks the inner limit block 322, and finally the lifting arm 430 lifts the fixture 300 from the electroplating tank 110. The angle iron 441 is fixed on the material picking rod 440 as a non-movable component, so it is not easy to fall off during the handling of the fixture 300, which can effectively reduce the failure rate.

[0043] 2. The slide 420 can slide along the track 410, so that the lifting arm 430 can slide a long distance. A single lifting arm 430 can meet the requirements of taking and placing the fixture 300, reducing the equipment manufacturing cost and maintenance difficulty.

[0044] In one embodiment, the material handling structure 10 for the circuit board electroplating tank further includes a hanging bracket 600, the hanging bracket 600 is located at the end of the electroplating tank 100, a support portion 610 is provided on the top of the hanging bracket 600, the support portion 610 is used to support the fixture 300, and an escape area 620 is provided on the hanging bracket 600, and a liquid receiving box 630 is provided in the escape area 620. The fixture 300 taken out of the electroplating tank 110 is transferred to the hanging bracket 600 by the handling manipulator 400, and the support portion 610 contacts the outer limit block 321 to provide a supporting force, so that the fixture 300 is suspended in the escape area 620, so that the electroplated circuit board is hung above the liquid receiving box 630 for static, and the liquid receiving box 630 receives the solution dripping on the circuit board.

[0045] It should be noted that the cross-sections of the angle iron 441, the outer limit block 321 and the inner limit block 322 are all in a "V" shape. The angle iron 441 is the material-picking part on the handling robot 400. When picking up materials, the angle iron 441 is moved to the bottom of the inner limit block 322. When the lifting arm 430 lifts the material-picking rod 440, the angle iron 441 can hook the inner limit block 322. Since the cross-sections of both are in a "V" shape, the outer wall of the angle iron 441 contacts the inner limit block 322 and guides the inner limit block 322 to slide toward the center of the angle iron 441, ensuring that the fixture 300 can be picked up by the handling robot 400 and will not fall off during translation.

[0046] See also Figure 5 Similarly, the support part 610 and the positioning seat 210 are provided with a guide groove 211 matching the outer limit block 321, the groove width of the guide groove 211 decreases from the top of the positioning seat 210 to the bottom of the positioning seat 210, and the outer limit block 321 fits with the groove wall of the guide groove 211. The outer limit block 321 is guided by the groove wall of the guide groove 211 to slide toward the center of the positioning seat 210 (or the support part 610), providing support force for the fixture 300 while limiting the position.

[0047] Preferably, see Figure 4 and Figure 5 A V-shaped block 510 is provided at the output end of the lifting cylinder 500. When the lifting cylinder 500 lifts the fixture 300, the V-shaped block 510 cooperates with the outer limit block 321 to place the fixture 300 horizontally offset.

[0048] In one embodiment, please refer to Figure 2 and Figure 5 The support frame 200 is also provided with a limiting column 220, which is located on a side away from the electroplating tank 100. When the fixture 300 is placed in the electroplating tank 110, the support frame 200 is located at the end of the outer limiting block 321 to limit the outer limiting block 321.

[0049] See also Figure 1 and Figure 4 In order to make the handling robot 400 more stable, a guide wheel 421 is provided on the slide 420, and the guide wheel 421 is in contact with the outer wall of the track 410. The slide 420 and the lifting arm 430 are mechanical accessories with linear reciprocating translation capability realized by the cooperation of a motor and a transmission mechanism (such as a screw mechanism, a gear transmission mechanism, a pulley mechanism, and a sprocket transmission mechanism).

[0050] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A material handling structure for a circuit board electroplating pool, characterized in that: include: Electroplating tank, support frame, fixture and handling robot; The fixture comprises a load-bearing rod and columns located at both ends of the load-bearing rod, the load-bearing rod is used to mount the circuit board to be electroplated, and the columns are provided with an outer limit block and an inner limit block; The electroplating pool is provided with an electroplating tank, the electroplating pool is arranged in the support frame, the support frame is provided with a positioning seat matching the outer limit block, and a lifting cylinder is provided at the interval between the positioning seat and the electroplating pool; The transport robot includes a track, a slide, a lifting arm located on the slide and a material picking rod located on the lifting arm. The slide is arranged on the track, the lifting arm is used to drive the material picking rod to approach or move away from the electroplating pool, and the material picking rod is provided with an angle iron matching the inner limit block.

2. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: It also includes a hanging bracket, which is located at the end of the electroplating tank. A supporting part is provided on the top of the hanging bracket, and the supporting part is used to support the fixture.

3. The material handling structure for a circuit board electroplating pool according to claim 2, characterized in that: The suspension bracket is provided with an escape area, and a liquid receiving box is arranged in the escape area.

4. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: The cross sections of the angle iron, the outer limit block and the inner limit block are all in a "V" shape.

5. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: The positioning seat is provided with a guide groove, the groove width of which decreases from the top of the positioning seat toward the bottom of the positioning seat, and the outer limit block is in contact with the groove wall of the guide groove.

6. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: The support frame is also provided with a limiting column, and the limiting column is located on a side away from the electroplating pool.

7. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: A V-shaped clamping block is provided at the output end of the lifting cylinder.

8. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: There are multiple electroplating tanks, and the multiple electroplating tanks are distributed at intervals along the long side direction of the electroplating pool.

9. The material handling structure for a circuit board electroplating pool according to claim 8, characterized in that: Each of the electroplating tanks is provided with a water inlet pipe and a drain pipe.

10. The material handling structure for a circuit board electroplating pool according to claim 1, characterized in that: The slide is provided with a guide wheel, and the guide wheel is in contact with the outer wall of the track.

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