Electroplating equipment

Abstract

The utility model discloses electroplating equipment which is characterized by comprising an equipment rack, an electroplating bath outer wall, an electroplating bath inner wall and a suspension rod, the electroplating tank outer wall and the electroplating tank inner wall are arranged on the equipment rack, a communicated electroplating tank is formed between the electroplating tank outer wall and the electroplating tank inner wall, and a hollow area is defined by the electroplating tank inner wall in the inward direction; the suspension rod is arranged in the hollow area, and one end of the suspension rod is arranged in the equipment rack. The electroplating bath is annular, the anodes are arranged on the inner wall and the outer wall of the electroplating bath, and the cathodes are arranged on the fixing pieces of the lifting appliance, so that metal ions can be deposited on the inner surface and the outer surface of the annular device to be electroplated respectively.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating equipment, and in particular to an electroplating equipment suitable for internal and external plating. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics. Electroplating equipment mainly includes electroplating tanks, power supplies, anodes, cathodes, electroplating solutions and workpieces to be plated. During the electroplating process, the workpiece to be plated needs to be connected to the cathode, and then the power is turned on. The metal ions in the electrolyte are gradually adsorbed onto the workpiece to be plated to form a coating.

[0003] In the prior art, in the process of preparing molds or other tools by electroplating, they are generally formed by flat plating. For example, in the process of preparing nickel molds by electroplating, a roller mold is generally required. The roller mold cannot be directly prepared by electroplating a sheet nickel mold and then wrapping the sheet mold on the roller by a roller wrapping method. Furthermore, in the prior art, the structure is prepared on the inner surface of the roller mold, basically by a reverse roller wrapping method. The existing electroplating equipment cannot directly electroplate the inner surface of the roller mold to form a mold structure. Therefore, it is urgent to design an electroplating equipment that can be used for internal and external plating to solve the technical problems existing in the prior art and meet new design requirements. Utility Model Content

[0004] Based on this, it is necessary to provide an electroplating equipment suitable for internal and external plating to solve the above technical problems.

[0005] A technical solution of this application is:

[0006] A plating device, characterized in that it includes an equipment frame, an outer wall of a plating tank, an inner wall of a plating tank and a hanging rod; the outer wall of the plating tank and the inner wall of the plating tank are arranged on the equipment frame, a connected plating tank is formed between the outer wall of the plating tank and the inner wall of the plating tank, and the inner wall of the plating tank surrounds a hollow area inwardly; the hanging rod is arranged in the hollow area, and one end of the hanging rod is arranged in the equipment frame.

[0007] In one embodiment, a fixing piece is provided at the other end of the hanging rod, and a device to be electroplated is provided on the fixing piece.

[0008] In one embodiment, an anode electrode is provided on the outer wall of the electroplating tank, a cathode electrode is provided on the fixing member, and a device to be plated is arranged on the fixing member, the cathode electrode is electrically connected to the device to be plated, and the side to be plated of the device to be plated faces the anode electrode.

[0009] In one embodiment, an anode electrode is provided on the inner wall of the electroplating tank, a cathode electrode is provided on the fixing member, and a device to be plated is arranged on the fixing member, the cathode electrode is electrically connected to the device to be plated, and the side to be plated of the device to be plated faces the anode electrode.

[0010] In one embodiment, the fixing member is fixedly connected to the other end of the suspension rod via a hanger, and the fixed connection is detachable.

[0011] In one embodiment, a lifting device is further included, and the lifting device is connected to the lifting fixture via a winding rope, so that the lifting fixture and the fixing member are lifted up and away from the electroplating tank.

[0012] In one embodiment, the lifting device is arranged in a sliding track, so that the lifting device moves along the sliding track.

[0013] In one embodiment, the suspension rod is provided at one end of the equipment frame and is also provided with a driving component, wherein the suspension rod is driven to rotate by the driving component.

[0014] In one embodiment, the width of the hollow area is not less than 330 mm.

[0015] In one embodiment, the rotation speed of the suspension rod is not less than 1.5R / min.

[0016] Beneficial effects of the present application: The electroplating equipment provided by the present application sets the electroplating tank in a ring shape, and by setting anodes on the inner and outer walls of the electroplating tank and setting cathodes on the fixing parts of the hanger, it is possible to deposit metal ions on the inner and outer surfaces of the ring-shaped device to be electroplated respectively; the hanger can be lifted by a lifting device, reducing the amount of manpower required for lifting, greatly reducing manpower and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of an electroplating device for this application;

[0018] Figure 2a-2b This is a schematic diagram of a top view of an electroplating tank in an electroplating device of the present application;

[0019] Figure 3 A schematic diagram of a hoisting structure of an electroplating equipment for this application;

[0020] Figure 4This is a schematic diagram of the internal plating structure of an electroplating equipment of the present application;

[0021] Figure 5 This is a schematic diagram of the external plating structure of an electroplating equipment in the present application. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] An electroplating device for internal and external plating, the electroplating device for internal and external plating can be used to prepare annular nickel molds, products / molds that require texture structures inside or outside, and products / molds that require texture structures inside and outside. Of course, the electroplating device can also electroplate protective layers of some metal products; the electroplating device includes:

[0025] Equipment rack; the equipment rack is used to support the equipment, and some electrical components may be arranged inside the equipment rack, such as a driving device for a hanging rod, a control device for tank liquid filtering, or some tank liquid pipelines, etc.;

[0026] The electroplating tank body comprises an electroplating tank, an outer wall of the electroplating tank and an inner wall of the electroplating tank, wherein the outer wall of the electroplating tank and the inner wall of the electroplating tank form the electroplating tank, and the inner wall of the electroplating tank forms a hollow area inwardly; wherein the electroplating tank body is arranged on the equipment rack; the outer wall of the electroplating tank and the inner wall of the electroplating tank form a connected electroplating tank, and the connected electroplating tank is in the shape of an annular structure; of course, the hollow area surrounded by the inner wall of the electroplating tank is circular, and the outside of the electroplating tank is formed into a rectangle or other shapes. At this time, the shape of the electroplating tank surrounded by the inner wall of the electroplating tank and the outer wall of the electroplating tank is not a strict annular structure, but also belongs to the connected electroplating tank structure, so that the device to be electroplated can be more easily rotated in the electroplating tank; the outer wall of the electroplating tank or the inner wall of the electroplating tank can be provided with electrodes according to the electroplating requirements; in one embodiment, the width of the hollow area is not less than 330 mm.

[0027] A hanging rod, wherein the hanging rod is arranged in the hollow area, and one end of the hanging rod is arranged in the equipment frame, wherein the hanging rod is rotated by a driving component, and generally the driving component is arranged in the equipment frame; the main purpose of the hanging component is to support the device to be electroplated, and the hanging rod can drive the device to be electroplated to rotate together, which is more conducive to the electroplating of the device to be electroplated; the rotation of the hanging rod can be driven by a universal driving structure, and the driving structure only needs to meet its rotation speed and rotation stability; in one embodiment, the rotation speed of the hanging rod is not less than 1.5R / min.

[0028] A hanger, the hanger is fixed by the other end of the hanging rod, and the hanger is provided with a fixing part, the fixing part is used to set the device to be electroplated, and the fixing part is located in the electroplating tank. The purpose of the fixing part on the hanger is to set the device to be electroplated, and electrodes are provided to make the device to be electroplated conductive, and the device to be electroplated set on the hanger can rotate in the electroplating tank. Compared with traditional electroplating, the present application uses a hanger to fix the device to be electroplated, and after the electroplating is completed, the hanger can be directly lifted from the electroplating tank, which is very convenient for disassembly. In one embodiment, the hanger is fixedly connected to the hanging rod by means of a snap; the main purpose is to connect the two in a detachable manner, which is convenient for the installation and disassembly of the hanger.

[0029] Of course, the fixing parts used to set the devices to be electroplated can be directly set on the hanging rod, or connected to the hanging rod through a hanger. It only needs to fix the devices to be electroplated, and there is no special requirement for the connection or fixing method with the hanging rod.

[0030] In one embodiment, the electroplating tank is provided with an electroplating solution circulation filter component for filtering the electroplating solution. The electroplating solution in the electroplating tank will have some impurities when it is used for a long time, and some impurities will be introduced because the electroplating solution needs to be continuously replenished with materials during use, so the electroplating solution needs to be circulated and filtered to ensure the purity of the electroplating solution.

[0031] In one embodiment, it also includes a lifting device, which is connected to the sling through a winding rope, so that the sling is lifted away from the electroplating tank. The sling can be moved by the lifting device, and such lifting is more stable and more convenient. In one embodiment, the lifting device is arranged in a sliding track, so that the lifting device moves along the sliding track. After the sling is lifted to a certain height, the sling and the device to be electroplated fixed on the sling can be moved by the sliding track, so that the electroplating staff can operate better.

[0032] In one embodiment, an anode electrode is provided on the outer wall of the electroplating tank, a cathode electrode is provided on the fixing member, and a device to be plated is provided on the fixing member, the cathode electrode is electrically connected to the device to be plated, and the side to be plated of the device to be plated faces the anode electrode. This arrangement belongs to external plating, that is, metal ions are deposited on the outer surface of the device to be plated, because an electric field is formed between the anode electrode and the cathode electrode (device to be plated), and the direction of the electric field points to the cathode electrode (device to be plated). At this time, the metal ions will move toward the cathode and deposit, so they are finally deposited on the conductive part of the device to be plated.

[0033] In one embodiment, an anode electrode is provided on the inner wall of the electroplating tank, a cathode electrode is provided on the fixing member, and a device to be plated is provided on the fixing member, the cathode electrode is electrically connected to the device to be plated, and the side to be plated of the device to be plated faces the anode electrode. This arrangement belongs to internal plating, that is, metal ions are deposited on the inner surface of the device to be plated, because an electric field is formed between the anode electrode and the cathode electrode (device to be plated), and the direction of the electric field points to the cathode electrode (device to be plated). At this time, the metal ions will move toward the cathode and deposit, so they are finally deposited on the conductive part of the device to be plated.

[0034] In one embodiment, a temperature sensor is provided in the electroplating tank for detecting the temperature of the electroplating solution. Of course, a cooling component and a heating component may also be provided in the electroplating tank to adjust the temperature according to different temperature requirements. Furthermore, a drainage pipe is provided in the electroplating tank for discharging the electroplating solution when it is replaced.

[0035] Example

[0036] like Figure 1 As shown, an electroplating device for internal and external plating, the electroplating device includes an equipment frame 10, an electroplating tank 20, an outer wall 21 of the electroplating tank, an inner wall 22 of the electroplating tank, a hanger 30 and a hanging rod 40; the electroplating tank 20 is arranged on the equipment frame 10, and the outer wall 21 of the electroplating tank and the inner wall 22 of the electroplating tank form the electroplating tank; one end of the hanging rod 40 is arranged in the equipment frame 10, and the hanger 30 is arranged on the other end of the hanging rod 40, and the hanger 30 and the hanging rod 40 are fixedly connected in a detachable manner, for example The hanger is connected to the hanging rod 40 by a snap-fit ​​connection; the hanger 30 also includes a fixing part 31, on which the device to be electroplated can be arranged; a driving component is provided at one end of the hanging rod 40, and the driving component can drive the hanging rod 40 to rotate, so that the hanger 30 will rotate with the hanging rod 40, and the rotation speed of the hanging rod is not less than 1.5R / min; the shape of the electroplating tank 20 surrounded by the outer wall 21 of the electroplating tank and the inner wall 22 of the electroplating tank is annular, or other connected shapes.

[0037] like Figure 2a as well as Figure 2b As shown, a top view of the electroplating equipment is given. It can be seen from the figure that the shape of the outer wall 21 of the electroplating tank is circular, and the inner wall 22 of the electroplating tank is also circular. Of course, the circle formed by the outer wall 21 of the electroplating tank and the circle formed by the inner wall 22 of the electroplating tank can be concentric circles. The hanging rod 40 can be seen in the center of the hollow area (inner circle) formed by the inner wall 22 of the electroplating tank; Figure 2a It can be seen that the electroplating tank is a connected annular structure; the diameter of the hollow area (inner circle) (or the width if it is non-circular) is not less than 330 mm; Figure 2b What is shown in the figure is that the shape formed by the outer wall 21 of the electroplating tank is a square, and the shape formed by the inner wall 22 of the electroplating tank is a circle, thus forming a connected electroplating tank formed by two different shapes.

[0038] like Figure 3 As shown, the electroplating equipment includes an equipment frame 10, an electroplating tank 20, an outer wall of the electroplating tank 21, an inner wall of the electroplating tank 22, a sling 30 and a hanging rod 40; it also includes a lifting device 50, and the lifting device 50 is connected to the sling 30 through a winding rope 51, so that the sling 30 and the fixing part 31 can be lifted by the lifting device 50, which is convenient for the staff to operate.

[0039] like Figure 4 , Figure 5 As shown, a schematic diagram of the electroplating process is given; Figure 5 In the present invention, the electroplating equipment includes an equipment frame 10, an electroplating tank 20, an outer wall 21 of the electroplating tank, an inner wall 22 of the electroplating tank, a hanger 30 and a hanging rod 40; a cathode 60 is provided on the fixing part 31, and the cathode 60 is electrically connected to the device to be electroplated, and an anode 61 is provided on the inner wall 22 of the electroplating tank, so that an electric field is formed between the cathode 60 and the anode 61, and the device to be electroplated faces the anode 61, and a plating layer can be formed on the inner side of the device to be electroplated. This setting method is for internal plating of the device to be electroplated. The advantage of this electroplating method is that the device to be electroplated can be cylindrical, so that a plating structure can be formed on the inner surface or inner wall of the hollow cylinder, and the plating structure can be a preset graphic structure. Figure 5A cathode 60 is provided on the fixing part 31, and the cathode 60 is electrically connected to the device to be electroplated. An anode 61 is provided on the inner side of the outer wall 21 of the electroplating tank, so that an electric field is formed between the cathode 60 and the anode 61, and the device to be electroplated faces the anode 61, and a plating layer can be formed on the outer side of the device to be electroplated. This setting method is for external plating of the device to be electroplated. The advantage of this electroplating method is that the device to be electroplated can be cylindrical, so that an electroplating structure can be formed on the outer surface or outer wall of the hollow cylinder, and the electroplating structure can be a preset graphic structure; the advantage of the electroplating equipment of the present application is that when preparing a roller-shaped electroplating mold, a roller-shaped mold can be directly formed, and the inner and outer surfaces of the roller-shaped mold that can be formed can be provided with a preset structure. Furthermore, the formed roller-shaped mold is more convenient for rolling or easier to use.

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail above in conjunction with the accompanying drawings. In the above description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described above, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed above. In addition, the various technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. An electroplating device, characterized in that: It includes an equipment frame, an outer wall of an electroplating tank, an inner wall of an electroplating tank and a hanging rod; the outer wall of the electroplating tank and the inner wall of the electroplating tank are arranged on the equipment frame, a connected electroplating tank is formed between the outer wall of the electroplating tank and the inner wall of the electroplating tank, and the inner wall of the electroplating tank is surrounded by a hollow area inwardly; the hanging rod is arranged in the hollow area, and one end of the hanging rod is arranged in the equipment frame.

2. An electroplating device according to claim 1, characterized in that: A fixing piece is arranged at the other end of the hanging rod, and a device to be electroplated is arranged on the fixing piece.

3. An electroplating device according to claim 2, characterized in that: An anode is arranged on the outer wall of the electroplating tank, a cathode is arranged on the fixing part, and a device to be electroplated is arranged on the fixing part. The cathode is electrically connected to the device to be electroplated, and the side to be electroplated of the device to be electroplated faces the anode.

4. The electroplating equipment according to claim 2, characterized in that: An anode is provided on the inner wall of the electroplating tank, a cathode is provided on the fixing part, and a device to be plated is arranged on the fixing part. The cathode is electrically connected to the device to be plated, and the side to be plated of the device to be plated faces the anode.

5. The electroplating equipment according to claim 2, characterized in that: The fixing piece is fixedly connected to the other end of the suspension rod through a hanger, and the fixed connection is in a detachable manner.

6. An electroplating device according to claim 5, characterized in that: It also includes a lifting device, which is connected to the lifting fixture via a winding rope, so that the lifting fixture and the fixing member are lifted up and away from the electroplating tank.

7. An electroplating device according to claim 6, characterized in that: The lifting device is arranged in the sliding track, so that the lifting device moves along the sliding track.

8. The electroplating equipment according to claim 1, characterized in that: The hanging rod is arranged at one end of the equipment frame and is also provided with a driving component, wherein the hanging rod is driven to rotate by the driving component.

9. The electroplating equipment according to claim 1, characterized in that: The width of the hollow area is not less than 330 mm.

10. The electroplating equipment according to claim 8, characterized in that: The rotation speed of the suspension rod is not less than 1.5R / min.

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