Heat dissipation assembly of speed reducer

Abstract

The utility model relates to the field of speed reducer heat dissipation, and discloses a speed reducer heat dissipation assembly which comprises a speed reducer body and a heat dissipation cover, the speed reducer body is fixedly sleeved with the heat dissipation cover, a first arc-shaped heat conduction plate is fixedly installed on the inner wall of the bottom of the heat dissipation cover, and a second arc-shaped heat conduction plate is fixedly installed on the inner wall of the left side of the heat dissipation cover; a third arc-shaped heat conduction plate is fixedly installed on the inner wall of the top of the heat dissipation cover, a fourth arc-shaped heat conduction plate is fixedly installed on the inner wall of the right side of the heat dissipation cover, and the first arc-shaped heat conduction plate, the second arc-shaped heat conduction plate, the third arc-shaped heat conduction plate and the fourth arc-shaped heat conduction plate are all of hollow structures. The first arc-shaped heat conduction plate, the second arc-shaped heat conduction plate, the third arc-shaped heat conduction plate and the fourth arc-shaped heat conduction plate make contact with the outer wall of the speed reducer body. The speed reducer has the following advantages and effects that effective heat dissipation of the speed reducer body can be achieved under the joint cooperation effect of the two modes of heat transfer heat dissipation and water cooling heat dissipation.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of reducers, and in particular to a heat dissipation component of a reducer. Background Art

[0002] The reducer is an independent component consisting of a gear transmission, a worm transmission, or a gear-worm transmission enclosed in a rigid housing. It is often used as a reduction transmission device between the prime mover and the working machine. The reducer plays the role of matching the speed and transmitting the torque between the prime mover and the working machine or the actuator, and is widely used in modern machinery. During the operation of the reducer, a large amount of heat will be generated due to the friction of the gears and other transmission parts inside it. If the heat is not dissipated in time, it will cause damage to the gears and other transmission parts. Therefore, a heat dissipation device needs to be installed on the reducer to dissipate the heat of the reducer. After searching, the patent document with authorization announcement number CN211737977U announced a heat dissipation device of a reducer, including a heat dissipation box, a reducer is fixedly installed in the middle of the inner cavity of the heat dissipation box, an output shaft is fixedly installed on the side of the heat dissipation box, a rubber sealing ring is fixedly connected to the side of the inner cavity of the heat dissipation box, a bracket is fixedly installed on the bottom of the reducer, and a base is fixedly installed on the bottom of the bracket. The heat dissipation device of the reducer has an air cooler fixedly installed on the top of the heat dissipation box, and a dust cover is installed on the surface of the air cooler. At the same time, a reducer base is fixedly installed on the bottom of the reducer by screws, and the heat dissipator is fixedly installed on the bottom of the inner cavity of the heat dissipation box by the bracket, and air outlets are opened on both sides of the heat dissipation box, and a dustproof net is fixedly installed on the surface of the air outlet. The heat is brought out from the air outlet through the operation of the air cooler, thereby improving the service life of the reducer and increasing the working efficiency of the reducer.

[0003] In actual use, it was found that the above-mentioned related schemes still have at least the following shortcomings: Although the air cooling method meets the basic needs of heat dissipation and cooling of the reducer, when the dustproof net is used for a long time to intercept and filter external dust, the dust will adhere to the dustproof net more and more and cause its mesh to be blocked, resulting in poor air permeability of the dustproof net, and then causing poor air circulation inside the heat dissipation box, reducing the heat dissipation effect of the reducer. Therefore, we propose a heat dissipation component for the reducer to solve the above problems. Utility Model Content

[0004] The purpose of the present application is to provide a heat dissipation component for a reducer, which can achieve the effect of effectively dissipating the heat of the reducer body through the combined effect of heat transfer heat dissipation and water cooling heat dissipation.

[0005] The above-mentioned technical purpose of the present application is achieved through the following technical solutions: a heat dissipation component of a reducer, comprising a reducer body and a heat dissipation cover, the heat dissipation cover is fixedly mounted on the reducer body, a first arc-shaped heat-conducting plate is fixedly mounted on the bottom inner wall of the heat dissipation cover, a second arc-shaped heat-conducting plate is fixedly mounted on the left inner wall of the heat dissipation cover, a third arc-shaped heat-conducting plate is fixedly mounted on the top inner wall of the heat dissipation cover, and a fourth arc-shaped heat-conducting plate is fixedly mounted on the right inner wall of the heat dissipation cover, the first arc-shaped heat-conducting plate, the second arc-shaped heat-conducting plate, the third arc-shaped heat-conducting plate and the fourth arc-shaped heat-conducting plate are all hollow structures, the first arc-shaped heat-conducting plate, the second arc-shaped heat-conducting plate, the third arc-shaped heat-conducting plate and the fourth arc-shaped heat-conducting plate are all in contact with the outer wall of the reducer body, the first arc-shaped heat-conducting plate is filled with coolant, and a coolant conveying assembly is arranged on the outer wall of the heat dissipation cover, and the coolant conveying assembly is used to pump coolant.

[0006] The present application is further configured as follows: the coolant delivery assembly includes a circulation pump, a suction pipe, a discharge pipe, a first infusion pipe, a second infusion pipe and a third infusion pipe, the circulation pump is fixedly mounted on the outer wall of the heat dissipation cover, one end of the suction pipe is fixedly connected to the suction end of the circulation pump, the end of the suction pipe away from the circulation pump extends to the interior of the first arc-shaped heat-conducting plate, one end of the discharge pipe is fixedly connected to the discharge end of the circulation pump, the end of the discharge pipe away from the circulation pump extends to the interior of the second arc-shaped heat-conducting plate, the first infusion pipe is located between the second arc-shaped heat-conducting plate and the third arc-shaped heat-conducting plate, the two ends of the first infusion pipe extend to the interior of the second arc-shaped heat-conducting plate and the interior of the third arc-shaped heat-conducting plate respectively, the second infusion pipe is located between the third arc-shaped heat-conducting plate and the fourth arc-shaped heat-conducting plate, the two ends of the second infusion pipe extend to the interior of the third arc-shaped heat-conducting plate and the interior of the fourth arc-shaped heat-conducting plate respectively, the third infusion pipe is located between the fourth arc-shaped heat-conducting plate and the first arc-shaped heat-conducting plate, and the third infusion pipe extends to the interior of the fourth arc-shaped heat-conducting plate and the interior of the first arc-shaped heat-conducting plate respectively.

[0007] The present application is further configured as follows: the number of the first infusion tubes is set to be multiple, and the multiple first infusion tubes are distributed at equal intervals.

[0008] The present application is further configured as follows: the number of the second infusion tubes is set to be multiple, and the multiple second infusion tubes are distributed at equal intervals.

[0009] The present application is further configured as follows: the number of the third infusion tubes is set to be multiple, and the multiple third infusion tubes are distributed at equal intervals.

[0010] The present application is further configured as follows: a semiconductor refrigerator is fixedly mounted on the top of the heat dissipation cover, and a cooling end of the semiconductor refrigerator extends to the inside of the third arc-shaped heat conducting plate.

[0011] The present application is further configured as follows: a plurality of inclined water retaining plates are fixedly mounted on the bottom inner wall and the top inner wall of the third arc-shaped heat conducting plate, and the plurality of water retaining plates are evenly distributed.

[0012] The present application includes at least one of the following beneficial technical effects:

[0013] The present application can achieve heat transfer and heat dissipation of the reducer by utilizing the cooperation of the first arc-shaped heat-conducting plate, the second arc-shaped heat-conducting plate, the third arc-shaped heat-conducting plate, the fourth arc-shaped heat-conducting plate and the heat dissipation cover.

[0014] The present application utilizes a coolant delivery assembly consisting of a circulating pump, a suction tube, a liquid outlet tube, a first infusion tube, a second infusion tube and a third infusion tube to control the coolant to circulate inside the first curved heat conduction plate, the second curved heat conduction plate, the third curved heat conduction plate and the fourth curved heat conduction plate. The coolant entering the third curved heat conduction plate can be cooled by utilizing a semiconductor refrigerator, so that the coolant can continue to maintain a relatively low temperature during the continuous flow process. The coolant can then be used to absorb part of the heat on the reducer body, thereby achieving an effective water-cooling heat dissipation effect.

[0015] The present application utilizes multiple water baffles to block the flow direction of the coolant, thereby increasing the flow time of the coolant inside the third arc-shaped heat conduction plate, and then utilizes a semiconductor refrigerator to cool the coolant more comprehensively and fully, thereby improving the water-cooling effect of the reducer body.

[0016] The present application realizes effective heat dissipation of the reducer body by cooperating with the heat transfer heat dissipation and water cooling heat dissipation of the reducer body, which can effectively replace the existing air cooling heat dissipation method. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of this embodiment.

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the heat dissipation cover.

[0019] Figure 3 It is a schematic diagram of the main cross-sectional three-dimensional structure of the heat dissipation cover.

[0020] Figure 4 yes Figure 3 Schematic diagram of the enlarged structure of part A.

[0021] In the figure, 1, reducer body; 2, heat dissipation cover; 3, first arc-shaped heat conduction plate; 4, second arc-shaped heat conduction plate; 5, third arc-shaped heat conduction plate; 6, fourth arc-shaped heat conduction plate; 7, coolant; 8, circulation pump; 9, suction pipe; 10, outlet pipe; 11, first infusion pipe; 12, second infusion pipe; 13, third infusion pipe; 14, semiconductor refrigerator; 15, water retaining plate. DETAILED DESCRIPTION

[0022] The technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0023] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The present application provides a heat dissipation assembly for a reducer, comprising a reducer body 1 and a heat dissipation cover 2, wherein:

[0024] The heat dissipation cover 2 is fixedly mounted on the reducer body 1, and a first arc-shaped heat conducting plate 3 is fixedly installed on the bottom inner wall of the heat dissipation cover 2, a second arc-shaped heat conducting plate 4 is fixedly installed on the left inner wall of the heat dissipation cover 2, a third arc-shaped heat conducting plate 5 is fixedly installed on the top inner wall of the heat dissipation cover 2, and a fourth arc-shaped heat conducting plate 6 is fixedly installed on the right inner wall of the heat dissipation cover 2. The first arc-shaped heat conducting plate 3, the second arc-shaped heat conducting plate 4, the third arc-shaped heat conducting plate 5 and the fourth arc-shaped heat conducting plate 6 are all hollow structures. The first arc-shaped heat conducting plate 3, the second arc-shaped heat conducting plate 4, the third arc-shaped heat conducting plate 5 and the fourth arc-shaped heat conducting plate 6 are all in contact with the outer wall of the reducer body 1. The heat dissipation cover 2, the first arc-shaped heat conducting plate 3, the second arc-shaped heat conducting plate 4, the third arc-shaped heat conducting plate 5 and the fourth arc-shaped heat conducting plate The joint connection and cooperation of the heat plates 6 can transfer part of the heat generated by the reducer body 1 to the air, thereby achieving the effect of heat transfer and heat dissipation. The first arc-shaped heat-conducting plate 3 is filled with coolant 7, and a coolant delivery component is arranged on the outer wall of the heat dissipation cover 2. The coolant delivery component is used to pump the coolant 7. The first arc-shaped heat-conducting plate 3, the second arc-shaped heat-conducting plate 4, the third arc-shaped heat-conducting plate 5 and the fourth arc-shaped heat-conducting plate 6 are arranged as a hollow structure to facilitate the flow of the coolant 7. It should be noted that the heat dissipation cover 2, the first arc-shaped heat-conducting plate 3, the second arc-shaped heat-conducting plate 4, the third arc-shaped heat-conducting plate 5 and the fourth arc-shaped heat-conducting plate 6 are all made of aluminum alloy, copper alloy or stainless steel with good thermal conductivity. The above-mentioned coolant delivery component includes a circulating pump 8, A liquid suction pipe 9, a liquid outlet pipe 10, a first liquid infusion pipe 11, a second liquid infusion pipe 12 and a third liquid infusion pipe 13, a circulation pump 8 is fixedly installed on the outer wall of the heat dissipation cover 2, one end of the liquid suction pipe 9 is fixedly connected to the suction end of the circulation pump 8, an end of the liquid suction pipe 9 away from the circulation pump 8 extends to the inside of the first arc-shaped heat-conducting plate 3, one end of the liquid outlet pipe 10 is fixedly connected to the discharge end of the circulation pump 8, an end of the liquid outlet pipe 10 away from the circulation pump 8 extends to the inside of the second arc-shaped heat-conducting plate 4, the first liquid infusion pipe 11 is located between the second arc-shaped heat-conducting plate 4 and the third arc-shaped heat-conducting plate 5, two ends of the first liquid infusion pipe 11 extend to the inside of the second arc-shaped heat-conducting plate 4 and the inside of the third arc-shaped heat-conducting plate 5 respectively, the second liquid infusion pipe 12 is located between the third arc-shaped heat-conducting plate 5 and the fourth arc-shaped heat-conducting plate 5. The two ends of the second infusion pipe 12 extend to the inside of the third arc-shaped heat conducting plate 5 and the inside of the fourth arc-shaped heat conducting plate 6 respectively. The third infusion pipe 13 is located between the fourth arc-shaped heat conducting plate 6 and the first arc-shaped heat conducting plate 3. The third infusion pipe 13 extends to the inside of the fourth arc-shaped heat conducting plate 6 and the inside of the first arc-shaped heat conducting plate 3 respectively. By utilizing the coordinated action of the circulating pump 8, the suction pipe 9, the outlet pipe 10, the first infusion pipe 11, the second infusion pipe 12 and the third infusion pipe 13, the cooling liquid 7 can be controlled to circulate in the first arc-shaped heat conducting plate 3, the second arc-shaped heat conducting plate 4, the third arc-shaped heat conducting plate 5 and the fourth arc-shaped heat conducting plate 6. The cooling liquid 7 can absorb part of the heat on the reducer body 1 to achieve the effect of water cooling and heat dissipation.

[0025] In this embodiment, the number of first infusion tubes 11 is set to be multiple, and the multiple first infusion tubes 11 are distributed at equal intervals, so that the coolant 7 can be fully and evenly diffused when flowing from the inside of the second curved heat conductive plate 4 into the inside of the third curved heat conductive plate 5. The number of second infusion tubes 12 is set to be multiple, and the multiple second infusion tubes 12 are distributed at equal intervals, so that the coolant 7 can be fully and evenly diffused when flowing from the inside of the third curved heat conductive plate 5 into the inside of the fourth curved heat conductive plate 6. The number of third infusion tubes 13 is set to be multiple, and the multiple third infusion tubes 13 are distributed at equal intervals, so that the coolant 7 can be fully and evenly diffused when flowing from the inside of the fourth curved heat conductive plate 6 into the inside of the first curved heat conductive plate 3.

[0026] In this embodiment, a semiconductor refrigerator 14 is fixedly installed on the top of the heat dissipation cover 2, and the cooling end of the semiconductor refrigerator 14 extends to the inside of the third arc-shaped heat conducting plate 5. The semiconductor refrigerator 14 can be used to cool the coolant 7 entering the inside of the third arc-shaped heat conducting plate 5, so that the coolant 7 can continue to maintain a relatively low temperature during the continuous flow process, which can better perform water cooling and heat dissipation on the reducer body 1.

[0027] In this embodiment, a plurality of inclined water baffles 15 are fixedly installed on the bottom inner wall and the top inner wall of the third arc-shaped heat conducting plate 5. The plurality of water baffles 15 are evenly distributed. The plurality of water baffles 15 can be used to block the flow direction of the coolant 7, thereby increasing the flow time of the coolant 7 inside the third arc-shaped heat conducting plate 5, and then the semiconductor refrigerator 14 can be used to cool the coolant 7 more comprehensively and fully.

[0028] In this embodiment, it should be noted that the circulating pump 8 and the semiconductor refrigerator 14 can be purchased from the market. The circulating pump 8 and the semiconductor refrigerator 14 are equipped with a power supply, and their line connection method and control method are mature technologies in this field, so they will not be described in detail in this specification.

[0029] Through the above structure, the heat dissipation component of the reducer provided in the present application can achieve the effect of effectively dissipating the heat of the reducer body 1 through the joint cooperation of heat transfer heat dissipation and water cooling heat dissipation when in use. In specific operation, when the reducer body 1 is in operation, part of the heat generated by it can be transferred to the air through the first arc-shaped heat conductive plate 3, the second arc-shaped heat conductive plate 4, the third arc-shaped heat conductive plate 5, the fourth arc-shaped heat conductive plate 6 and the heat dissipation cover 2 to achieve the effect of heat transfer heat dissipation. By controlling the operation of the circulating pump 8 and the semiconductor refrigerator 14, the cooling liquid 7 inside the first arc-shaped heat conductive plate 3 can be pumped into the second arc-shaped heat conductive plate 4 by utilizing the function of the circulating pump 8, so that the cooling liquid 7 entering the second arc-shaped heat conductive plate 4 can then enter the third arc-shaped heat conductive plate 5 through multiple first infusion pipes 11, so that the cooling liquid entering the third arc-shaped heat conductive plate 5 7 then passes through multiple second infusion pipes 12 into the fourth arc-shaped heat conducting plate 6, and then the cooling liquid 7 entering the fourth arc-shaped heat conducting plate 6 is refluxed to the first arc-shaped heat conducting plate 3 through the third infusion pipe 13, so that the circulation of the cooling liquid 7 can be controlled, and the cooling liquid 7 can be used to absorb part of the heat on the reducer body 1 to achieve the effect of water cooling and heat dissipation. The cooling liquid 7 entering the third arc-shaped heat conducting plate 5 can be cooled by using the semiconductor refrigerator 14, and the flow direction of the cooling liquid 7 can be blocked by multiple water retaining plates 15, which can increase the flow time of the cooling liquid 7 in the third arc-shaped heat conducting plate 5, and the semiconductor refrigerator 14 can be used to cool the cooling liquid 7 more comprehensively and fully, so that the cooling liquid 7 can continue to maintain a relatively low temperature during the continuous flow process, and the reducer body 1 can be better cooled by water.

Claims

1. A heat dissipation component of a reducer, characterized in that: The invention comprises a reducer body (1) and a heat dissipation cover (2), wherein the heat dissipation cover (2) is fixedly mounted on the reducer body (1), a first arc-shaped heat conduction plate (3) is fixedly mounted on the bottom inner wall of the heat dissipation cover (2), a second arc-shaped heat conduction plate (4) is fixedly mounted on the left inner wall of the heat dissipation cover (2), a third arc-shaped heat conduction plate (5) is fixedly mounted on the top inner wall of the heat dissipation cover (2), and a fourth arc-shaped heat conduction plate (6) is fixedly mounted on the right inner wall of the heat dissipation cover (2), wherein the first arc-shaped heat conduction plate (3) and the second arc-shaped heat conduction plate (4) are fixedly mounted on the left inner wall of the heat dissipation cover (2). The second arc-shaped heat conducting plate (4), the third arc-shaped heat conducting plate (5) and the fourth arc-shaped heat conducting plate (6) are all hollow structures; the first arc-shaped heat conducting plate (3), the second arc-shaped heat conducting plate (4), the third arc-shaped heat conducting plate (5) and the fourth arc-shaped heat conducting plate (6) are all in contact with the outer wall of the reducer body (1); the first arc-shaped heat conducting plate (3) is filled with coolant (7); a coolant conveying component is provided on the outer wall of the heat dissipation cover (2); the coolant conveying component is used to pump the coolant (7).

2. A heat dissipation assembly for a reducer according to claim 1, characterized in that: The coolant delivery assembly comprises a circulation pump (8), a liquid suction pipe (9), a liquid discharge pipe (10), a first liquid infusion pipe (11), a second liquid infusion pipe (12) and a third liquid infusion pipe (13); the circulation pump (8) is fixedly mounted on the outer wall of the heat dissipation cover (2); one end of the liquid suction pipe (9) is fixedly connected to the suction end of the circulation pump (8); one end of the liquid suction pipe (9) away from the circulation pump (8) extends to the interior of the first arc-shaped heat conducting plate (3); one end of the liquid discharge pipe (10) is fixedly connected to the discharge end of the circulation pump (8); one end of the liquid discharge pipe (10) away from the circulation pump (8) extends to the interior of the second arc-shaped heat conducting plate (4); the first liquid infusion pipe (11) is located at the second arc-shaped heat conducting plate (4); ) and the third curved heat conducting plate (5), the two ends of the first infusion tube (11) respectively extend to the interior of the second curved heat conducting plate (4) and the interior of the third curved heat conducting plate (5), the second infusion tube (12) is located between the third curved heat conducting plate (5) and the fourth curved heat conducting plate (6), the two ends of the second infusion tube (12) respectively extend to the interior of the third curved heat conducting plate (5) and the interior of the fourth curved heat conducting plate (6), the third infusion tube (13) is located between the fourth curved heat conducting plate (6) and the first curved heat conducting plate (3), the third infusion tube (13) respectively extend to the interior of the fourth curved heat conducting plate (6) and the interior of the first curved heat conducting plate (3).

3. A heat dissipation assembly for a reducer according to claim 2, characterized in that: The number of the first infusion tubes (11) is set to be multiple, and the multiple first infusion tubes (11) are distributed at equal intervals.

4. A heat dissipation assembly for a reducer according to claim 2, characterized in that: The number of the second infusion tubes (12) is set to be multiple, and the multiple second infusion tubes (12) are distributed at equal intervals.

5. The heat dissipation assembly of a reducer according to claim 2, characterized in that: The number of the third infusion tubes (13) is set to be multiple, and the multiple third infusion tubes (13) are distributed at equal intervals.

6. The heat dissipation assembly of a reducer according to claim 1, characterized in that: A semiconductor refrigerator (14) is fixedly mounted on the top of the heat dissipation cover (2), and a cooling end of the semiconductor refrigerator (14) extends to the interior of the third arc-shaped heat conduction plate (5).

7. The heat dissipation assembly of a reducer according to claim 1, characterized in that: A plurality of inclined water retaining plates (15) are fixedly mounted on the bottom inner wall and the top inner wall of the third arc-shaped heat conducting plate (5), and the plurality of water retaining plates (15) are evenly distributed.

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