Semiconductor refrigeration water-cooling heat dissipation module
By designing multiple throughput channels and flow ports in the heat dissipation module of the semiconductor refrigerator, and sealing both ends of the water channel through the blocking plate to form an S-type one-way channel, the problem of cold liquid leakage is solved and the sealing performance and production efficiency are improved.
Patent Information
- Application Number
- CN202421315411.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-07
AI Technical Summary
The heat dissipation module of existing semiconductor refrigerators is prone to cold liquid leakage in the gap between the upper and lower parts, resulting in poor sealing.
A semiconductor refrigerated water cooling module is designed to form an S-shaped one-way channel to improve sealing performance by setting multiple throughput channels and flow ports on the substrate and sealing both ends of the channel through the blocking sheet.
This technical solution not only reduces processing difficulty and improves mass production efficiency, but also significantly improves the sealing performance in the one-way channel, reduces the leakage of cold liquid, and ensures the long-term normal use of the heat dissipation module.
Smart Images
Figure CN222598081U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor heat dissipation, in particular to a semiconductor refrigeration water-cooling heat dissipation module. Background Art
[0002] In recent years, semiconductor refrigerators have been widely used in medical, military, laboratory, car refrigerators, water dispensers, etc. due to their advantages of small size, small thermal inertia, fast cooling and heating speed, and convenient reverse switching. In order to achieve greater cooling efficiency and lower cooling temperature of semiconductor refrigerators, the hot surface needs a lower temperature to achieve a lower cooling temperature of the cold surface, and at the same time, the volume of the refrigeration module cannot be made too large. Therefore, it is the best way to dissipate heat by setting up a heat dissipation module and circulating water cooling at the far end. In order to facilitate the processing of the S-shaped flow channel, the heat dissipation module is generally divided into two parts, an upper and lower part, and an S-shaped notch is opened between the two parts. By sealing the two parts, an S-shaped flow channel is formed inside, but the flow channel is easy to flow out of the gap between the upper and lower parts, and the sealing is poor. Utility Model Content
[0003] The utility model aims to provide a semiconductor refrigeration water-cooling heat dissipation module to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.
[0004] The technical solution adopted to solve the above technical problems is as follows: a semiconductor refrigeration water-cooling heat dissipation module includes a base body, through which a plurality of water channels are arranged in parallel, and flow openings are staggered at both ends of the base body so that two adjacent water channels are connected at the ends, and the water channel in the middle position is connected with the two adjacent water channels at both ends respectively, and the ends of the base body corresponding to the flow openings are sealed with plugging pieces, and the plurality of water channels are connected to each other to form a one-way channel.
[0005] This technical solution has at least the following beneficial effects: by arranging a plurality of penetrating waterways and flow ports on the base and sealing both ends of the waterway with plugging plates, an S-shaped one-way channel is formed in the base. This technical solution can not only reduce the processing difficulty, improve the processing efficiency, facilitate mass production, and improve the product economy, but also improve the sealing performance in the one-way channel, reduce the leakage of cold liquid, and ensure the long-term normal use of the heat dissipation module.
[0006] As a further improvement of the above technical solution, only one piece of the blocking sheet is provided at each end of the substrate, and one piece of the blocking sheet covers all the flow openings at the same end. By blocking all the flow openings at the same end with one blocking sheet, the gap length between the blocking sheet and the substrate can be reduced, thereby improving the sealing performance.
[0007] As a further improvement of the above technical solution, the base body and the plurality of water channels are made by extrusion molding. The extrusion molded water channels have high reliability, so that the product has high air tightness, high consistency and low defect rate.
[0008] As a further improvement of the above technical solution, grooves are respectively provided at both ends of the base for the plugging piece to be embedded in. The plugging piece is embedded in the groove, which can facilitate the preliminary positioning and definition of the plugging piece, so as to facilitate the processing and connection of the plugging piece and the base, and also improve the connection stability between the plugging piece and the base.
[0009] As a further improvement of the above technical solution, the plugging piece is connected to the side wall of the groove by brazing, so as to ensure the sealing between the plugging piece and the substrate.
[0010] As a further improvement of the above technical solution, the groove is a stepped groove, the upper layer of the stepped groove with the largest size is on the surface of the substrate, the plugging piece is embedded in the lower layer of the stepped groove with a smaller size, and the thickness of the plugging piece is greater than the depth of the lower layer of the stepped groove, and less than the depth of the stepped groove. While facilitating the installation of the plugging piece, the solder can also be fully filled between the side wall of the upper layer of the stepped groove and the side wall of the plugging piece to improve the connection stability between the plugging piece and the substrate, and at the same time, it can also better ensure the sealing performance between the plugging piece and the substrate.
[0011] As a further improvement of the above technical solution, the opening of the groove is provided with a chamfer to facilitate the embedding and installation of the plug.
[0012] As a further improvement of the above technical solution, the base is provided with convex edges on both sides, the convex edges are flush with the base on one side, and the thickness of the convex edges is less than the thickness of the base, so that the base can be easily fixed by the convex edges.
[0013] As a further improvement of the above technical solution, the base body is provided with a liquid inlet and a liquid outlet connected to the one-way channel at both ends of the one-way channel, so that the water pipe can be connected through the liquid inlet and the liquid outlet to allow the cold liquid to flow in the one-way channel.
[0014] As a further improvement of the above technical solution, the outer circumference of the liquid inlet nozzle and the liquid outlet nozzle away from the base is provided with a conical ring, and the diameter of the outer circumference of the conical ring gradually decreases in the direction away from the base. The conical ring can not only guide and assist the water pipe to be inserted into the liquid inlet nozzle and the liquid outlet nozzle to facilitate the installation of the water pipe, but also open the water pipe, and use the elasticity of the water pipe itself to fit tightly with the conical ring, so as to ensure the sealing of the connection between the water pipe and the liquid inlet nozzle and the liquid outlet nozzle. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0016] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the utility model;
[0017] Figure 2 It is a three-dimensional schematic diagram of the cross-sectional structure of the first embodiment of the utility model;
[0018] Figure 3 This is a schematic diagram of the cross-sectional structure of the first embodiment of the utility model;
[0019] Figure 4 It is a schematic diagram of the cross-sectional structure in the second embodiment of the present utility model.
[0020] The base 100 , the one-way channel 110 , the water channel 111 , the flow port 112 , the groove 120 , the upper layer 121 , the lower layer 122 , the chamfer 123 , the plug 200 , the convex edge 300 , the liquid inlet nozzle 400 , the liquid outlet nozzle 410 , and the cone ring 420 . DETAILED DESCRIPTION
[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0022] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0023] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0025] Embodiment 1:
[0026] Reference Figure 1-3 A semiconductor refrigeration water-cooling heat dissipation module includes a base 100, and the base 100 is made of aluminum. Both sides of the base 100 are provided with convex edges 300, the thickness of the convex edges 300 is less than the thickness of the base 100, one side of the convex edge 300 is arranged flush with one side of the base 100, and the side of the convex edge 300 flush with the base 100 can form a mounting surface. The base 100 is provided with four water channels 111 arranged side by side, the four water channels 111 are arranged parallel to each other, and the water channels 111 run through the base 100. A liquid inlet nozzle 400 and a liquid outlet nozzle 410 are arranged at the same end position of the base 100, wherein the liquid inlet nozzle 400 and the liquid outlet nozzle 410 are respectively arranged coaxially connected with the two water channels 111 at the most side.
[0027] The base 100 has a flow opening 112 at both end surfaces thereof, and the flow opening 112 is located between two adjacent water channels 111, and the flow openings 112 at both ends of the base 100 are arranged in a staggered manner. That is, the base 100 has a flow opening 112 between the two middle water channels 111 at one end near the liquid inlet nozzle 400, so that the two water channels 111 at the middle are connected; among the four water channels 111 at one end far from the liquid inlet nozzle 400, the base 100 has a flow opening 112 between the two adjacent water channels 111 on the left, and a flow opening 112 between the two adjacent water channels 111 on the right. Thus, the two water channels 111 on the left are connected, and the two water channels 111 on the right are connected.
[0028] Grooves 120 are provided at both ends of the base 100, and the grooves 120 cover the range of all the flow openings 112 at the same end of the base 100. It can be understood that the groove 120 at the end of the base 100 close to the liquid inlet nozzle 400 can cover the ports of the two middle waterways 111 and is slightly larger than the ports of the two waterways 111. In the groove 120, a slightly smaller plugging piece 200 is embedded and installed to block the ends of the two middle waterways 111; the groove 120 at the end of the base 100 away from the liquid inlet nozzle 400 can cover the ports of the four waterways 111 and is slightly larger than the ports of the four waterways 111. In the groove 120, a slightly larger plugging piece 200 is embedded and installed to block the end positions of the four waterways 111. Finally, the four waterways 111 and the three flow openings 112 form an S-shaped one-way channel 110. In this embodiment, a plurality of penetrating water channels 111 and flow ports 112 are arranged on the base 100, and both ends of the water channel 111 are blocked by a plug 200, so as to form an S-shaped one-way channel 110 in the base 100. This can not only reduce the difficulty of production and processing, improve mass production efficiency and product economy, but also improve the sealing performance in the one-way channel 110, reduce the leakage of cold liquid, and ensure the long-term normal use of the heat dissipation module.
[0029] Among them, the plugging piece 200 can be connected to the side wall of the corresponding groove 120 by brazing. The brazing connection method can ensure the sealing of the connection between the outer wall of the plugging piece 200 and the inner wall of the corresponding groove 120, thereby ensuring the sealing inside the one-way channel 110, which is conducive to batch processing and production.
[0030] In other embodiments, if there are five water channels 111, the liquid inlet nozzle 400 and the liquid outlet nozzle 410 are located at different ends of the substrate 100, and two flow ports 112 are respectively provided at both ends of the substrate 100. The flow ports 112 connect two adjacent water channels 111, and the water channel 111 at the middle position is connected with the two adjacent water channels 111 at both ends. The plugs 200 at the two end positions are respectively used to block the four water channels 111 corresponding to the two flow ports 112 at the corresponding end positions. Finally, the multiple water channels 111 are also connected to form a one-way channel 110 after being blocked by the plugs 200. It should be noted that the number of water channels 111 on the same substrate 100 can be set to three, six, seven, eight, etc. according to actual conditions and needs.
[0031] The base 100 with the convex edge 300 and four water channels 111 can be directly obtained by the extrusion molding process. Compared with the water channels 111 formed by CNC processing, the extruded water channels 111 have high reliability, making the product more airtight, more consistent, simpler in processing technology and lower in defect rate. Then the required contour is milled out on the outside of the inlet nozzle 400 and the outlet nozzle 410. A cone ring 420 is milled out of the periphery of the inlet nozzle 400, and the cone ring 420 protrudes from the periphery of the inlet nozzle 400 and is located at the end of the inlet nozzle 400 away from the base 100. The diameter of the cone ring 420 gradually decreases along the axial direction, and the end with a larger diameter is located at one end position close to the base 100. The outlet nozzle 410 is milled out of the same shape as the inlet nozzle 400 by the same process, so that the water pipe can be easily sealed and connected with the inlet nozzle 400 and the outlet nozzle 410. The flow port 112 can be directly milled out on the two end faces of the base 100, which is convenient for processing.
[0032] The groove 120 is a stepped groove, which includes an upper layer 121 with the largest size and a lower layer 122 with the smallest size. The upper layer 121 is on the surface of the base 100, and the lower layer 122 is slightly larger than the opening range of the waterway 111 corresponding to the flow port 112. When the corresponding plugging piece 200 is just embedded in the lower layer 122, the plugging piece 200 can cover the opening range of the corresponding waterway 111 to achieve reliable blocking. At the same time, the thickness of the plugging piece 200 is slightly larger than the depth of the lower layer 122, but the thickness of the plugging piece 200 does not exceed or is less than the overall depth of the stepped groove. Thereby, an annular gap is left between the side wall of the plugging piece 200 and the inner side wall of the upper layer 121, but the plugging piece 200 does not protrude from the outer surface of the base 100. During the brazing connection, the outer wall of the plugging piece 200 can be firmly connected to the inner wall of the groove 120, ensuring the sealing between the plugging piece 200 and the side wall of the groove 120, and reducing the situation of producing defective products due to poor sealing. A chamfer 123 can also be set at the opening of the groove 120 to facilitate the embedding of the plugging piece 200.
[0033] Compared with the traditional heat dissipation module, the process cost of this embodiment is reduced by about 25%, and the defect rate is reduced by more than 60%.
[0034] Embodiment 2:
[0035] Reference Figure 4 The difference between this embodiment and the first embodiment lies in the difference between the groove 120 and the plugging piece 200. Specifically, in this embodiment, an independent groove 120 is opened on the end surface of the base 100 corresponding to a flow port 112, and each groove 120 is independently installed with a plugging piece 200. The size of each plugging piece 200 is the same, which is convenient for mass production. Compared with the first embodiment, the relative independence relationship between each water channel 111 in this embodiment is more reliable, and it can withstand a large hydraulic pressure condition for a long time, and the plugging piece 200 is not easy to deform.
[0036] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A semiconductor refrigeration water cooling module, characterized in that: include: A base body is provided with a plurality of water channels in parallel, and flow openings are staggered at both ends of the base body so that two adjacent water channels are connected at the ends, and the water channel in the middle position is connected with the two adjacent water channels at both ends respectively. The ends of the base body corresponding to the flow openings are sealed with plugging pieces, and the plurality of water channels are connected to each other to form a one-way channel.
2. According to claim 1, a semiconductor refrigeration water cooling heat dissipation module is characterized in that: Only one piece of the blocking piece is respectively arranged at both ends of the base, and one piece of the blocking piece covers all the flow openings at the same end position.
3. According to claim 1, a semiconductor refrigeration water cooling heat dissipation module is characterized in that: The base body and the plurality of water channels are made by extrusion molding.
4. A semiconductor refrigeration water cooling heat dissipation module according to claim 1, characterized in that: Both ends of the base are respectively provided with grooves for the plugging piece to be embedded.
5. A semiconductor refrigeration water cooling module according to claim 4, characterized in that: The plugging piece is connected to the side wall of the groove by brazing.
6. A semiconductor refrigeration water cooling module according to claim 5, characterized in that: The groove is a stepped groove, the upper layer of the stepped groove with the largest size is on the surface of the substrate, the plugging piece is embedded in the lower layer of the stepped groove with a smaller size, and the thickness of the plugging piece is greater than the depth of the lower layer of the stepped groove and less than the depth of the stepped groove.
7. A semiconductor refrigeration water cooling module according to claim 4, characterized in that: The groove opening is provided with a chamfer.
8. The semiconductor refrigeration water cooling module according to claim 1, characterized in that: The base is provided with convex edges on both sides, the convex edges are flush with the base on one side, and the thickness of the convex edges is less than the thickness of the base.
9. The semiconductor refrigeration water cooling heat dissipation module according to claim 1, characterized in that: The base body is respectively provided with a liquid inlet nozzle and a liquid outlet nozzle communicated with the one-way channel at two end positions corresponding to the one-way channel.
10. A semiconductor refrigeration water cooling module according to claim 9, characterized in that: The outer circumference of the liquid inlet nozzle and the liquid outlet nozzle away from the base is protruded outwardly and provided with a cone ring, and the diameter of the outer circumference of the cone ring gradually decreases in the direction away from the base.