Cooling case for cloud computing

Abstract

The utility model discloses a heat dissipation case for cloud computing, which comprises a case body and a heat dissipation module arranged on the side wall of the case body, the heat dissipation module comprises a mounting shell, a fan arranged in the mounting shell and an air water cooling assembly arranged in the mounting shell, an air inlet duct and an air outlet duct which are through are arranged in the mounting shell, the fan is mounted on the air outlet duct, and the air outlet duct is communicated with the interior of the case body; the air water-cooling assembly is arranged in the air inlet duct, a water pan used for receiving condensate water is arranged at the bottom of the air water-cooling assembly, and a water outlet is formed in the bottom of the water pan; and the mounting shell is fixedly mounted on the case body. According to the heat dissipation case for cloud computing, heat generated by electronic components in all the modules is taken away through cold air generated by the heat dissipation modules, the heat dissipation efficiency of the electronic components is improved, the service life of the electronic components is prolonged, and it is guaranteed that equipment works stably and reliably.

Description

Technical Field

[0001] The utility model relates to the technical field of cloud computing equipment, and in particular to a heat dissipation chassis for cloud computing. Background Art

[0002] Cloud computing is a type of distributed computing, which means breaking down huge data computing programs into countless small programs through the network "cloud", and then processing and analyzing these small programs through a system composed of multiple servers to obtain results and return them to users. At this stage, cloud services are not just a type of distributed computing, but the result of the hybrid evolution and leap of computer technologies such as distributed computing, utility computing, load balancing, parallel computing, network storage, hot backup redundancy and virtualization.

[0003] At present, cloud computing devices are developing rapidly towards "short, small, light and thin". This is the result of the high integration of IC technology, which has brought about high-density assembly of cloud computing devices. The power has increased rapidly, and the heat generated by cloud computing devices is also concentrated. Excessive temperature will have a serious impact on the stability and reliability of cloud computing equipment.

[0004] Therefore, when designing the structure of cloud computing equipment, it is necessary to analyze the thermal characteristics of the equipment and implement effective thermal control measures. At present, the common cooling methods for equipment chassis are mainly air cooling and liquid cooling. The air-cooled chassis has a simple structural design, low manufacturing cost, and high reliability, but its heat dissipation capacity is poor. It is difficult to meet the use requirements of cloud computing equipment with higher temperature rise and larger heat flux density, and it is greatly affected by the external ambient temperature. The liquid-cooled chassis has strong heat dissipation capacity, especially for electronic equipment with high heat flux density, and has better heat dissipation effect, but its processing technology is complex, the research and development is difficult, the manufacturing cost is high, and it is prone to leakage. There are major hidden dangers in the safety and reliability of the product. Utility Model Content

[0005] In view of the defects in the prior art, the utility model provides a heat dissipation chassis for cloud computing to solve the technical problems raised in the background technology.

[0006] A heat dissipation chassis for cloud computing, comprising a chassis body and a heat dissipation module arranged on the side wall of the chassis body, the heat dissipation module comprising a mounting shell, a fan arranged in the mounting shell, and an air-water cooling component arranged in the mounting shell, the mounting shell is provided with a penetrating air inlet duct and an air outlet duct, the fan is installed on the air outlet duct, and the air outlet duct is connected to the interior of the chassis body; the air-water cooling component is arranged in the air inlet duct, a water receiving pan for receiving condensed water is arranged at the bottom of the air-water cooling component, and a drain outlet is arranged at the bottom of the water receiving pan; the mounting shell is fixedly mounted on the chassis body.

[0007] Furthermore, the installation shell is a T-shaped cavity structure, the air inlet ducts are arranged opposite to each other on both sides of the installation shell, and the air inlet of the air inlet duct is larger than the air outlet;

[0008] The air-water cooling assembly includes a heat exchange coil, a heat dissipation module, and a circulation pipeline connected between the heat exchange coil and the heat dissipation module. The heat exchange coil is arranged in the air inlet duct, and the water receiving pan is arranged at the bottom of the heat exchange coil.

[0009] Furthermore, the heat dissipation module includes a water storage tank and a semiconductor refrigeration sheet arranged on the outer wall of the water storage tank, the cold surface of the semiconductor refrigeration sheet is arranged in contact with the outer wall of the water storage tank, and a heat dissipation fan is arranged on the hot surface of the semiconductor refrigeration sheet;

[0010] The heat exchange coil is communicated with the water storage tank through the circulation pipeline, and a water pump is arranged in the water storage tank.

[0011] Furthermore, the inner wall of the water tank is provided with a plurality of guide plates which are staggered in sequence, and the guide plates cooperate with the inner wall of the water tank to form a circuitous extending waterway, and the guide plates are integrally provided with the inner wall of the water tank.

[0012] Furthermore, the cold surface of the semiconductor refrigeration plate is tightly fitted to the outer wall of the water storage tank through thermal conductive silicone grease.

[0013] Furthermore, a plurality of fins are evenly distributed on both side surfaces of the guide plate.

[0014] Furthermore, a temperature sensor is provided in the air outlet duct, the temperature sensor is connected to a controller, and the semiconductor refrigeration sheet is connected to the controller.

[0015] Furthermore, the controller is a single chip microcomputer.

[0016] The beneficial effects of the utility model are embodied in:

[0017] The heat dissipation chassis for cloud computing provided by the utility model takes away the heat generated by the electronic components in each module through the cold air generated by the heat dissipation module, thereby improving the heat dissipation efficiency and service life of the electronic components and ensuring stable and reliable operation of the equipment.

[0018] Based on the existing air-cooled chassis architecture, the heat dissipation module first cools the incoming air with water, so as to continuously provide air with a suitable temperature for the electronic equipment inside the chassis, ensuring that the electronic equipment inside the chassis is always in a relatively stable and suitable temperature environment. It also takes into account its economy, reliability and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the description of the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0020] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. For ordinary technicians in this field, other accompanying drawings can also be obtained based on these accompanying drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a heat dissipation chassis for cloud computing provided by an embodiment of the utility model;

[0022] Figure 2 A schematic diagram of the structure of the installation shell provided by an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of the internal structure of the installation shell provided by an embodiment of the utility model;

[0024] Figure 4 A schematic diagram of the structure of a heat dissipation module provided in an embodiment of the utility model;

[0025] Figure 5 A schematic diagram of the installation structure of the semiconductor cooling sheet provided in the embodiment of the utility model;

[0026] Figure 6 A schematic diagram of the internal structure of a water storage tank provided in an embodiment of the utility model;

[0027] Figure 7 A schematic structural diagram of a guide plate provided in an embodiment of the utility model.

[0028] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention.

[0030] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the invention belongs.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] like Figure 1-Figure 7As shown, the utility model provides a heat dissipation chassis for cloud computing, including a chassis body 1 and a heat dissipation module 2 arranged on the side wall of the chassis body 1. The heat dissipation module 2 includes a mounting shell 3, a fan 4 arranged in the mounting shell 3, and an air-water cooling component arranged in the mounting shell 3. The mounting shell 3 is provided with a through air inlet duct 5 and an air outlet duct 6. The fan 4 is installed on the air outlet duct 6, and the air outlet duct 6 is connected to the inside of the chassis body 1. The air-water cooling component is arranged in the air inlet duct 5, and a water receiving pan 7 for receiving condensed water is arranged at the bottom of the air-water cooling component, and a drain port 8 is arranged at the bottom of the water receiving pan 7 for draining condensed water. The mounting shell 3 is fixedly mounted on the chassis body 1 by screws.

[0036] Specifically, the mounting shell 3 is a T-shaped cavity structure, and the air inlet duct 5 is located on both sides of the mounting shell 3 and is arranged opposite to each other. The air-water cooling assembly includes a heat exchange coil 9, a heat dissipation module, and a circulation pipeline connected between the heat exchange coil 9 and the heat dissipation module. The heat dissipation module can be placed outside the chassis body 1. The heat exchange coil 9 is arranged at the air inlet of the air inlet duct 5, and is used to cool the airflow entering the chassis body 1. The water receiving pan 7 is arranged at the bottom of the heat exchange coil 9, and the water receiving pan 7 is used to receive the condensed water that may appear on the heat exchange coil 9. In addition, in order to prevent the condensed water from entering the chassis body 1 with the air flow, the air inlet of the air inlet duct 5 is larger than the air outlet, that is, it is horizontally arranged in a square funnel shape. In the process of the airflow flowing inward, it will be blocked by the inner wall of the air inlet duct 5, and will flow back to the water receiving pan 7, and then be discharged from the drain pipe externally connected to the drain outlet 8.

[0037] The heat dissipation module includes a water tank 10 and a semiconductor refrigeration sheet 11 arranged on the outer wall of the water tank 10. The cold surface of the semiconductor refrigeration sheet 11 is arranged in contact with the outer wall of the water tank 10. A heat dissipation fan 12 is arranged on the hot surface of the semiconductor refrigeration sheet 11. The heat dissipation of the hot surface of the semiconductor refrigeration sheet 11 is dissipated by the heat dissipation fan 12. A radiator is also arranged on the heat dissipation fan 12 and the hot surface of the semiconductor refrigeration sheet 11. The heat dissipation fan 12 and the hot surface of the semiconductor refrigeration sheet 11 are fixed to the water tank 10 by bolts.

[0038] The heat exchange coil 9 is connected to the water tank 10 through a circulation pipeline. A water pump 13 is provided in the water tank 10 . The water pump 13 allows the coolant to circulate between the water tank 10 and the heat exchange coil 9 .

[0039] Furthermore, the inner wall of the water tank 10 is provided with a plurality of guide plates 14 which are staggered in sequence. The guide plates 14 cooperate with the inner wall of the water tank 10 to form a circuitous and extending waterway. The guide plates 14 are integrally provided with the inner wall of the water tank 10. The waterway extends the flow distance of the coolant in the water tank 10, so that the coolant can be better cooled and cooled by the semiconductor refrigeration plate 11. The guide plates 14 and the water tank 10 can both be made of copper or aluminum alloy. A plurality of fins 15 are evenly distributed on the two side surfaces of the guide plates 14, which are used to increase the surface area of ​​the guide plates 14, so as to better cool the coolant.

[0040] Furthermore, for better heat conduction, the cold surface of the semiconductor refrigeration sheet 11 is tightly fitted to the outer wall of the water storage tank 10 through thermal conductive silicone grease.

[0041] Furthermore, a temperature sensor 16 is provided in the air outlet duct 6, and the temperature sensor 16 is connected to the controller, and the semiconductor cooling sheet 11 is connected to the controller, and the controller is a single chip microcomputer. The temperature sensor 16 collects the air flow temperature in the air outlet duct 6, and sends the collected temperature data to the controller, and the controller controls the cooling power of the semiconductor cooling sheet 11 by adjusting the voltage of the semiconductor cooling sheet 11, thereby adjusting the air flow temperature in the air outlet duct 6.

[0042] Finally, it should be noted that the various technical features of the technical solution of the present application can be combined arbitrarily. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments may still be modified, or some or all of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and should all be included in the scope of the claims and specification of the present invention.

Claims

1. A heat dissipation chassis for cloud computing, comprising a chassis body (1) and a heat dissipation module (2) arranged on a side wall of the chassis body (1), characterized in that: The heat dissipation module (2) comprises a mounting shell (3), a fan (4) arranged in the mounting shell (3), and an air-water cooling assembly arranged in the mounting shell (3); the mounting shell (3) is provided with an air inlet duct (5) and an air outlet duct (6) penetrating therein; the fan (4) is installed on the air outlet duct (6), and the air outlet duct (6) is communicated with the interior of the chassis body (1); the air-water cooling assembly is arranged in the air inlet duct (5), a water receiving tray (7) for receiving condensed water is arranged at the bottom of the air-water cooling assembly, and a drain outlet (8) is arranged at the bottom of the water receiving tray (7); the mounting shell (3) is fixedly mounted on the chassis body (1).

2. The heat dissipation chassis for cloud computing according to claim 1, characterized in that: The mounting shell (3) is in a T-shaped cavity structure, the air inlet duct (5) is located on two sides of the mounting shell (3) and arranged opposite to each other, and the air inlet of the air inlet duct (5) is larger than the air outlet; The air-water cooling component comprises a heat exchange coil (9), a heat dissipation module, and a circulation pipeline connected between the heat exchange coil (9) and the heat dissipation module; the heat exchange coil (9) is arranged in the air inlet duct (5), and the water receiving tray (7) is arranged at the bottom of the heat exchange coil (9).

3. The heat dissipation chassis for cloud computing according to claim 2, characterized in that: The heat dissipation module comprises a water storage tank (10) and a semiconductor cooling sheet (11) arranged on the outer wall of the water storage tank (10), the cold surface of the semiconductor cooling sheet (11) being arranged in contact with the outer wall of the water storage tank (10), and a heat dissipation fan (12) being arranged on the hot surface of the semiconductor cooling sheet (11); The heat exchange coil (9) is connected to the water storage tank (10) through the circulation pipeline, and a water pump (13) is provided in the water storage tank (10).

4. The heat dissipation chassis for cloud computing according to claim 3, characterized in that: The inner wall of the water storage tank (10) is provided with a plurality of guide plates (14) which are arranged in a staggered manner in sequence; the guide plates (14) cooperate with the inner wall of the water storage tank (10) to form a circuitous and extending waterway; the guide plates (14) and the inner wall of the water storage tank (10) are arranged integrally.

5. The heat dissipation chassis for cloud computing according to claim 4, characterized in that: The cold surface of the semiconductor refrigeration sheet (11) is tightly fitted to the outer wall of the water storage tank (10) via heat-conducting silicone grease.

6. The heat dissipation chassis for cloud computing according to claim 4, characterized in that: A plurality of fins (15) are evenly distributed on both side surfaces of the guide plate (14).

7. The heat dissipation chassis for cloud computing according to claim 3, characterized in that: A temperature sensor (16) is provided in the air outlet duct (6); the temperature sensor (16) is connected to a controller; and the semiconductor refrigeration sheet (11) is connected to the controller.

8. The heat dissipation chassis for cloud computing according to claim 7, characterized in that: The controller is a single chip microcomputer.

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