Double-cavity plasma etching device with simple automatic door

Abstract

The utility model relates to the technical field of plasma etching, in particular to a double-cavity plasma etching device with a simple and convenient automatic door, which comprises two identical cavity mechanisms, each cavity mechanism comprises a cavity and a cavity door, first fixing seats are arranged on two sides outside the cavity, and a sliding rail is arranged on the cavity door; the power mechanism comprises a hydraulic rod, a transmission block and a cantilever, the hydraulic rod is connected with the first fixing seat, one end of the cantilever is connected with the first fixing seat, the other end of the cantilever is connected with the cavity door, and the transmission block is connected with the hydraulic rod and the cantilever; the moving mechanism comprises a second fixing base and a sliding block, the second fixing base is installed on the cavity and connected with the sliding block, and the sliding block is movably connected with the sliding rail; the console is connected with the cavity, and the hydraulic rod drives the cantilever to enable the sliding rail to move on the sliding block. The cavity door is automatically controlled through the console, manual operation danger is reduced, the cavity door is opened and closed through cooperation of the sliding block and the sliding rail, and the space utilization rate is guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of plasma etching, in particular to a double-cavity plasma etching device with a simple automatic door. Background Art

[0002] With the development of industry, the requirements for refined production are gradually increasing, and the requirements for multi-layer boards and high density are also put forward for printed circuit boards. In the process of printed circuit board manufacturing, the hole metallization process of printed circuit boards has always been a key link in production, which directly affects the electrical connection performance of electronic products. The effect of drilling decontamination directly affects the quality of the plating in the hole, which in turn determines the qualified rate of the product. For the glue residue that is difficult to remove in the hole of the printed circuit board, the current process uses plasma etching to decontaminate the printed circuit board.

[0003] Plasma cleaning technology is a high-precision cleaning technology. Its cleaning principle is to first generate a vacuum. Under the vacuum state, the intermolecular force gradually decreases, and then the high-voltage alternating electric field generated by the radio frequency source is used to oscillate the process gas to make it ions with certain reactivity or high energy. These ions react or collide with organic pollutants or micro-particle pollutants on the surface of the workpiece to form volatile substances, which are then removed by the working gas and vacuum pump, thereby achieving the purpose of surface cleaning and activation.

[0004] In the prior art, the chamber door of the plasma etching device is generally opened and closed manually. Since there are volatile pollutants in the chamber of the plasma etching machine, they are usually corrosive and harmful to the human body. At the same time, in the prior art, the chamber door of the plasma etching device is generally opened to the left, right, up or down. Opening the door to the left or right makes the equipment difficult to integrate, and opening the door up and down requires additional height occupation, which may conflict with the pipeline layout above the factory. Such methods all require additional height or width, and the factory space is limited, which will limit the use of plasma etching equipment.

[0005] The utility model provides a double-chamber plasma etching device with a simple automatic door. The device can control the plasma etching device through an operating table to realize automatic operation, and the automatic door of the device is opened and closed by a slide rail in combination with a slider. After opening, it is stored in a stacked manner on the top of the cavity. On the basis of realizing automation, the integration is improved, the requirement for the use space is reduced, and the use restrictions are greatly reduced. Utility Model Content

[0006] 1. Technical issues to be resolved

[0007] The problem to be solved by the utility model is to provide a double-chamber plasma etching device with a simple automatic door, so as to overcome the defect of the prior art that the chamber doors are opened and closed in an up-down, left-right manner and occupy a large space, thereby making the equipment more integrated and reducing usage restrictions.

[0008] (II) Technical solution

[0009] In order to solve the technical problem, the utility model provides a double-chamber plasma etching device with a simple automatic door, comprising:

[0010] Two identical cavity mechanisms, the cavity mechanism comprising a cavity and a cavity door, first fixing seats are arranged on both sides of the outer surface of the cavity, and a slide rail is arranged on the cavity door;

[0011] A power mechanism, the power mechanism comprising a hydraulic rod, a transmission block and a cantilever, the hydraulic rod is hinged to the first fixing seat, one end of the cantilever is hinged to the first fixing seat, the other end of the cantilever is connected to the cavity door, one end of the transmission block is hinged to the hydraulic rod, and the other end of the transmission block is connected to the cantilever;

[0012] A moving mechanism, the moving mechanism comprising a second fixing seat and a slider, the second fixing seat is mounted on the cavity, the second fixing seat is connected to the slider, and the slider is movably hinged to the slide rail;

[0013] A control console is connected to a hydraulic rod in the cavity, and the hydraulic rod drives the cantilever through a transmission block to move the slide rail on the slide block.

[0014] As described above in the dual-chamber plasma etching device, optionally, the slide rails are arranged on both sides of the chamber door.

[0015] As described above, the dual-chamber plasma etching device can optionally include a third fixing seat, and the cantilever is connected to the chamber door via the third fixing seat.

[0016] As described above, for the dual-chamber plasma etching device, optionally, the console controls the two chamber mechanisms in a unified manner or separately.

[0017] As described above, the dual-chamber plasma etching device can optionally include two vacuum pumps, the two vacuum pumps are connected to the two chamber mechanisms respectively, and the vacuum pumps are connected to the console.

[0018] As described above, the dual-chamber plasma etching device can optionally include a mold temperature controller, wherein the mold temperature controller is connected to the cavity, and the mold temperature controller is connected to the console.

[0019] (III) Beneficial effects

[0020] The utility model provides a dual-chamber plasma etching device with a simple automatic door. Compared with the prior art, the utility model has the following beneficial effects: the console can automatically control the closing of the chamber door of the dual-chamber plasma etching device. At the same time, the hydraulic rod can drive the cantilever to provide power for the moving mechanism, so that the slide rail set on the chamber door moves on the slider, driving the opening and closing of the chamber door, thereby improving the integration on the basis of automation, reducing the requirements for the use space, and greatly reducing the use restrictions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the mechanism of a double-chamber plasma etching device with a simple automatic door according to the utility model;

[0023] Figure 2 It is a partial schematic diagram of a double-chamber plasma etching device with a simple automatic door according to the utility model;

[0024] Figure 3 It is a partial schematic diagram of another embodiment of a dual-chamber plasma etching device with a simple automatic door according to the utility model.

[0025] Figure 4 The utility model is a schematic structural diagram of another embodiment of a dual-chamber plasma etching device with a simple automatic door.

[0026] Figure 5 The utility model is a partial cross-sectional view of a double-chamber plasma etching device with a simple automatic door.

[0027] The corresponding component names of the various figure marks in the figure are: 1. Cavity mechanism; 11. Cavity; 12. Cavity door; 13. First fixed seat; 14. Slide rail; 2. Power mechanism; 21. Hydraulic rod; 22. Transmission block; 23. Cantilever; 3. Moving mechanism; 31. Second fixed seat; 32. Slider; 4. Control console; 5. Third fixed seat; 6. Vacuum pump; 7. Mold temperature controller. DETAILED DESCRIPTION

[0028] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0030] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0031] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0032] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.

[0033] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0034] See also Figures 1 to 5 The utility model provides a double-chamber plasma etching device with a simple automatic door. The double-chamber plasma etching device comprises: a chamber mechanism 1, a power mechanism 2, a moving mechanism 3, a vacuum pump 6, a mold temperature controller 7 and a control console 4. The double-chamber plasma etching device uses plasma cleaning technology to clean and activate the surface of the object to be etched.

[0035] exist Figures 1 to 5In an optional embodiment, the cavity mechanism 1 includes a cavity 11 and a cavity door 12, the cavity 11 is used to accommodate the object to be etched, and first fixing seats 13 are provided at both ends of the outer side of the cavity 11. The first fixing seat 13 can be fixed to the outside of the cavity 11 by welding but is not limited to it.

[0036] Furthermore, the chamber door 12 is provided with a slide rail 14, and there are two slide rails 14, which are respectively located on both sides of the chamber door 12. The chamber door 12 can be used to provide a closed space for the cleaning process of the object to be etched. Figures 1 to 3 In the embodiment of the present invention, the object to be etched may be a printed circuit board, and in other optional embodiments of the present invention, the object to be etched may be other objects that need to be etched. Specifically, the dual-chamber plasma etching device includes two identical chamber mechanisms 1, thereby improving work efficiency.

[0037] See Figures 1 to 5 The power mechanism 2 has two, and the two power mechanisms 2 are respectively arranged at the two ends of the outer side of the cavity 11. The power mechanism 2 includes a hydraulic rod 21, a transmission block 22 and a cantilever 23. One end of the hydraulic rod 21 is hinged to the first fixed seat 13 through a latch, and the other end of the hydraulic rod 21 is hinged to one end of the transmission block 22 through a latch. The other end of the transmission block 22 is fixedly connected to one end of the cantilever 23, and the connection method can be but is not limited to welding. At the same time, one end of the cantilever 23 is hinged to the first fixed seat 13 through a latch.

[0038] Specifically, the hydraulic rod 21 is used to provide power, and the transmission block 22 is used to transmit the power provided by the hydraulic rod 21 to the cantilever 23 .

[0039] exist Figures 1 to 5 In an optional embodiment, there are two moving mechanisms 3, and the two moving mechanisms 3 are respectively installed at the two ends of the cavity 11. The moving mechanism 3 includes a second fixed seat 31 and a slider 32. The second fixed seat 31 is installed on the cavity 11, and the installation method can be but not limited to welding. At the same time, the second fixed seat 31 is movably connected to the slider 32 through a hinge, and the slider 32 can have a certain rotation space on the second fixed seat 31. The specific rotation angle can be adjusted by a person skilled in the art according to actual conditions. Furthermore, the inner surface of the slider 32 is convex. Since the outer surface of the slide rail 14 is concave, the inner surface of the slider 32 can better cooperate with the outer surface of the slide rail 14, and the slider 32 is movably connected to the slide rail 14.

[0040] exist Figures 1 to 5 In an optional embodiment, the console 4 is connected to the chamber 11 by a cable. In order to make the control of the dual-chamber plasma etching device by the console 4 more flexible, the console 4 can control the two chamber mechanisms 1 uniformly or separately. Specifically, the console 4 regulates the opening and closing of the chamber door 12 of the chamber mechanism 1 and various parameters of the dual-chamber plasma etching device.

[0041] See Figures 1 to 5 The dual-chamber plasma etching device includes a third fixing seat 5, which is fixed to the chamber door 12 by welding. At the same time, the cantilever 23 is connected to the third fixing seat 5 by a latch. Therefore, the cantilever 23 is connected to the chamber door 12 through the third fixing seat 5.

[0042] Further, the dual-chamber plasma etching device includes two vacuum pumps 6 and a mold temperature controller 7. The two vacuum pumps 6 are connected to the two chamber mechanisms 1 respectively, and the vacuum pumps 6 can perform vacuum treatment on the chamber mechanism 1 during the etching process. The two chamber mechanisms 1 are respectively connected to the mold temperature controller 7. Specifically, the mold temperature controller 7 is connected to the chamber 11 in the chamber mechanism 1. The mold temperature controller 7 can heat / cool the chamber mechanism 1 and maintain the thermal balance of the chamber mechanism 1 according to the needs of those skilled in the art.

[0043] It should be noted that when the cavity door 12 is opened, the power mechanisms 2 located on both sides of the cavity 11 operate simultaneously and open in parallel, thereby achieving stable opening of the cavity door 12 .

[0044] Specifically, the operation process of the dual-chamber plasma etching device is as follows:

[0045] First, the object to be etched is placed into the chamber 11 , and the chamber door 12 is closed, and the chamber mechanism 1 is vacuum treated by using the vacuum pump 6 .

[0046] Secondly, the high voltage alternating electric field generated by the radio frequency source is used to oscillate the process gas, turning it into ions with certain reactivity or high energy, and these ions react or collide with organic pollutants or micro-particle pollutants on the surface of the object to be etched to form volatile substances. The parameters of the etching process can be controlled by the console 4.

[0047] Finally, the chamber door 12 is opened through the console 4. When the console 4 sends an opening command for the chamber door 12, the two power mechanisms 2 located at both ends of the chamber 11 drive the two slide rails 14 to move the slide rails 14 on the slider 32, so that the chamber door 12 is stored above the chamber mechanism 1 after opening, avoiding waste of space.

[0048] The same and similar parts between the various embodiments in this specification can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0049] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A dual-chamber plasma etching device with a simple automatic door, characterized in that: include: Two identical cavity mechanisms (1), the cavity mechanism (1) comprising a cavity (11) and a cavity door (12), first fixing seats (13) being arranged on both sides of the outer surface of the cavity (11), and a slide rail (14) being arranged on the cavity door (12); A power mechanism (2), the power mechanism (2) comprising a hydraulic rod (21), a transmission block (22) and a cantilever (23), the hydraulic rod (21) being hinged to the first fixed seat (13), one end of the cantilever (23) being hinged to the first fixed seat (13), the other end of the cantilever (23) being connected to the chamber door (12), one end of the transmission block (22) being hinged to the hydraulic rod (21), and the other end of the transmission block (22) being connected to the cantilever (23); A moving mechanism (3), the moving mechanism (3) comprising a second fixed seat (31) and a sliding block (32), the second fixed seat (31) being mounted on the cavity (11), the second fixed seat (31) being hinged to the sliding block (32), and the sliding block (32) being movably connected to the slide rail (14); A control console (4), wherein the control console (4) is connected to a hydraulic rod (21) in the cavity (11), and the hydraulic rod (21) drives the cantilever (23) through a transmission block (22), so that the slide rail (14) moves on a slide block (32).

2. The dual-chamber plasma etching device according to claim 1, characterized in that: The slide rails (14) are arranged on both sides of the chamber door (12).

3. The dual-chamber plasma etching device according to claim 1, characterized in that: The dual-chamber plasma etching device comprises a third fixing seat (5), and the cantilever (23) is connected to the chamber door (12) via the third fixing seat (5).

4. The dual-chamber plasma etching device according to claim 1, characterized in that: The control console (4) controls the two cavity mechanisms (1) in a unified manner or separately.

5. The dual-chamber plasma etching device according to claim 1, characterized in that: The dual-chamber plasma etching device comprises two vacuum pumps (6), the two vacuum pumps (6) are connected to the two chamber mechanisms (1) respectively, and the vacuum pumps (6) are connected to the console (4).

6. The dual-chamber plasma etching device according to claim 1, characterized in that: The dual-chamber plasma etching device comprises a mold temperature controller (7), wherein the mold temperature controller (7) is connected to the cavity (11), and the mold temperature controller (7) is connected to the console (4).

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