Light emitting device and light emitting apparatus

Abstract

The utility model provides a light-emitting device and light-emitting equipment, the light-emitting device comprises a base material and a light-emitting element, the base material is provided with a first type of groove, the first type of groove is internally provided with a solid crystal bonding pad, and the light-emitting element is electrically connected with the solid crystal bonding pad. According to the arrangement, the solid crystal bonding pad can be accommodated in the concave area of the first type of groove, so that the lamination thickness of the light-emitting element and the base material is effectively reduced, the size of the light-emitting device is reduced, and the requirements of people on miniaturization, lightness and thinness of the light-emitting device are further met.

Description

Technical Field

[0001] The present application relates to the field of diode technology, and in particular to a light-emitting device and a light-emitting equipment. Background Art

[0002] Semiconductor light emitting diode (LED), as a commonly used light emitting device, is widely used in the fields of display and lighting.

[0003] However, with the continuous advancement of technology, users' requirements for product refinement are constantly increasing, and the lightweight design of light-emitting devices has become more and more the focus of people's attention. Utility Model Content

[0004] Based on the above requirements, the present application proposes a light-emitting device and a light-emitting equipment, which can effectively reduce the volume of the light-emitting device and further meet people's requirements for miniaturization and thinness of light-emitting devices.

[0005] To achieve the above objectives, this application proposes the following technical solutions:

[0006] In a first aspect, the present application provides a light-emitting device, comprising: a substrate and a light-emitting element;

[0007] The substrate is provided with a first type of groove; a die-bonding pad is provided in the first type of groove;

[0008] The light emitting element is electrically connected to the die bonding pad.

[0009] Optionally, the thickness of the substrate ranges from 40 to 70 μm.

[0010] Optionally, the thickness of the light emitting element ranges from 60 to 80 μm.

[0011] Optionally, the thickness of the light emitting device ranges from 150 to 180 μm.

[0012] Optionally, the substrate is further provided with a conductive hole penetrating the substrate;

[0013] The orthographic projection of the conductive hole on the substrate is located in the orthographic projection of the die-bonding pad on the substrate.

[0014] Optionally, it further includes a first conductive pad and a second conductive pad;

[0015] The first conductive pad and the second conductive pad are both located on a side of the substrate away from the light-emitting element, and the first conductive pad and the second conductive pad are spaced apart;

[0016] The conductive hole includes at least one first conductive hole and at least one second conductive hole; the die-bonding pad includes a first pad and a second pad; the first type of groove includes a first groove and a second groove; the first pad is located in the first groove; the second pad is located in the second groove;

[0017] The conductive wire of the first conductive pad is electrically connected to the first pad through the first conductive hole; the conductive wire of the second conductive pad is electrically connected to the second pad through the second conductive hole.

[0018] Optionally, at least one thermally conductive pad is further included;

[0019] The thermally conductive pad is attached to the substrate and contacts the non-metallic region of the light emitting element.

[0020] Optionally, the thermally conductive pad includes a first portion; the first portion does not contact the first conductive pad and the second conductive pad; the first portion includes a portion of the thermally conductive pad located on a side of the substrate away from the light-emitting element.

[0021] Optionally, a second type of groove is also provided on the substrate;

[0022] The thermally conductive pad also includes a second portion; the second portion is located in the second type of groove; the second portion includes a portion of the thermally conductive pad located on a side of the substrate close to the light emitting element.

[0023] Optionally, a conductive adhesive is provided between the light emitting element and the die-bonding pad; the conductive adhesive includes flux or conductive solder paste.

[0024] Optionally, a fluorescent film is also included;

[0025] The fluorescent film is attached to the light emitting area on the surface of the light emitting element.

[0026] Optionally, an epoxy adhesive layer is also included;

[0027] The epoxy adhesive layer covers the fluorescent film.

[0028] Optionally, the substrate comprises a transparent substrate.

[0029] Optionally, the number of the light emitting elements is multiple;

[0030] The number of the first type of grooves is consistent with the number of the light emitting elements.

[0031] In a second aspect, the present application provides a light-emitting device, comprising the light-emitting apparatus as described in the first aspect of the present application.

[0032] The light-emitting device proposed in the present application includes: a substrate and a light-emitting element, wherein a first type of groove is provided on the substrate, a die-bonding pad is provided in the first type of groove, and the light-emitting element is electrically connected to the die-bonding pad. In this way, the concave area of ​​the first type of groove can be used to accommodate the die-bonding pad, thereby effectively reducing the stacking thickness of the light-emitting element and the substrate, reducing the volume of the light-emitting device, and further meeting people's requirements for miniaturization and thinness of light-emitting devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0034] Figure 1 A schematic diagram of the structure of a light emitting device provided in one embodiment of the present application;

[0035] Figure 2 An exploded view of a light emitting device provided in another embodiment of the present application;

[0036] Figure 3 A schematic structural diagram of a light emitting device provided in another embodiment of the present application;

[0037] Figure 4 A schematic structural diagram of a light emitting device provided in another embodiment of the present application;

[0038] Figure 5 A schematic structural diagram of a light emitting device provided in another embodiment of the present application;

[0039] Figure 6 A schematic structural diagram of a light emitting device provided in another embodiment of the present application;

[0040] Figure 7 A schematic structural diagram of a light-emitting device provided in another embodiment of the present application. DETAILED DESCRIPTION

[0041] The technical solution of the embodiment of the present application is applicable to the application scenario of semiconductor equipment. The technical solution of the embodiment of the present application can realize the ultra-thin design of the light-emitting device, so that the light-emitting device can be applied to the field of more sophisticated semiconductor equipment to realize the light emission of semiconductor equipment.

[0042] LED is a diode with semiconductor properties that can convert electrical energy into light energy. Due to its high efficiency, low consumption and long life, LED has become the dominant light source in the field of modern lighting.

[0043] Surface Mount Devices (SMD) is a packaging method for electronic components, in which the electronic components are designed to be directly mounted and soldered on the surface of a circuit board. As a type of electronic component, LED chips can also be packaged using SMD technology to obtain SMD LEDs. Compared with traditional LED packaging structures, SMD LEDs are more miniaturized and thinner, easier to produce, and have a wider range of applications. However, with the development of technology, people's requirements for the miniaturization and thinness of various application products are gradually increasing, and for some special ultra-fine application fields, such as more delicate wearable and medical fields, the requirements for the thinness and miniaturization of light-emitting devices are higher. Therefore, further improving the miniaturization and thinness of light-emitting devices is an urgent problem that needs to be solved.

[0044] Based on this, the present application proposes a light-emitting device, which has a more miniaturized and lightweight structural characteristic, can further meet people's requirements for miniaturization and lightweight of light-emitting devices, and can be applied to more sophisticated semiconductor equipment fields, thereby solving the problem in the prior art that the light-emitting device is large and cannot meet the application needs of more fields.

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] See also Figure 1 As shown, an embodiment of the present application provides a light-emitting device, which may include: a substrate 11 and a light-emitting element 12.

[0047] The substrate 11 is provided with a first type groove K1 ; a die-bonding pad 11 s is provided in the first type groove K1 ; and the light-emitting element 12 is electrically connected to the die-bonding pad 11 s.

[0048] The light emitting element 12 may include an LED chip, which may be a flip chip. The flip chip may be soldered on the die bonding pad 11s, occupying less space, thus providing a structural basis for the miniaturization and lightweight design of the light emitting device.

[0049] The inventors have found that the die-bonding pad 11s has a certain thickness. For a conventional light-emitting device, the thickness of the die-bonding pad is doped in the stacking thickness of the light-emitting element and the substrate. To this end, the die-bonding pad 11s can be disposed in the first type of groove K1. Compared with the conventional light-emitting device, the thickness of the die-bonding pad 11s in the stacking thickness of the light-emitting element 12 and the substrate 11 can be eliminated, which reduces the thickness and volume of the light-emitting device to a certain extent, and can further meet people's requirements for miniaturization and thinness of the light-emitting device.

[0050] It should be noted that the light emitting element 12 is electrically connected to the die bonding pad 11s, and the pad of the light emitting element 12 can be welded to the die bonding pad 11s, so that the die bonding pad 11s is used to achieve a bridge between the internal circuit of the light emitting element 12 and the external circuit, providing a structural basis for realizing the transmission of electrical signals.

[0051] Of course, the present application is not limited to this. In some other implementations, such as Figure 2 As shown, the orthographic projection of the first type of groove K1 on the substrate 11 can cover the orthographic projection of the light emitting element 12 on the substrate 11. In this way, the die-bonding pad 11s can be located in the first type of groove K1 while the light emitting element is also located in the first type of groove K1, so that the concave area of ​​the first type of groove K1 can be used to accommodate the thickness of the die-bonding pad 11s while accommodating part of the thickness of the light emitting element 12, thereby further reducing the thickness and volume of the light emitting device, and further improving the miniaturization and thinness of the light emitting device.

[0052] As an optional implementation, another embodiment of the present application discloses that the thickness of the substrate may range from 40 to 70 μm.

[0053] For example, the thickness of the substrate may be 40 μm, which can ensure that the substrate has sufficient physical support capabilities while improving the lightness and thinness of the light-emitting device; for another example, the thickness of the substrate may be 50 μm, which can reduce the thickness of the light-emitting device while enhancing the physical support capabilities of the substrate, thereby improving the impact resistance of the light-emitting device; for another example, the thickness of the substrate may be 70 μm, which can ensure the lightness and thinness of the light-emitting device while further improving the impact resistance of the substrate and enhancing the protection of the light-emitting element, and so on.

[0054] Limiting the thickness of the substrate to within the range of 40 to 70 μm can ensure that the substrate can provide physical support so that the light-emitting element can be firmly placed during the packaging process, ensuring the mechanical stability of the light-emitting element during handling and use, and can further reduce the thickness and volume of the substrate, thereby avoiding the situation where the light-emitting device is too large due to the substrate being too thick and unable to adapt to more sophisticated application requirements.

[0055] As an optional implementation, another embodiment of the present application discloses that the thickness of the light emitting element may range from 60 to 80 μm.

[0056] Specifically, the thickness of the light-emitting element can be set at 60μm, which can reduce the thickness of the light-emitting device as much as possible while meeting the light-emitting requirements, laying a structural foundation for the miniaturized design of the light-emitting device; the thickness of the light-emitting element can also be set at 70μm, which can improve the light-emitting performance while achieving a lightweight design of the light-emitting device; the thickness of the light-emitting element can also be set at 80μm. By appropriately increasing the thickness of the light-emitting element, the light-emitting performance of the light-emitting element can be further improved while achieving a lightweight design of the light-emitting device, ensuring that the light-emitting device meets the user's requirements for light effects, and so on.

[0057] Limiting the thickness range of the light-emitting element to 60 to 80 μm can reduce the thickness of the light-emitting element while ensuring the performance of the light-emitting element, thereby further reducing the thickness and volume of the light-emitting device, improving the miniaturization and thinness of the light-emitting device, and providing a guarantee for the light-emitting device to be suitable for more and more sophisticated equipment.

[0058] As an optional implementation, another embodiment of the present application discloses that the thickness of the light-emitting device may range from 150 to 180 μm.

[0059] Specifically, the thickness of the light-emitting device can be set at 150μm, realizing the miniaturization and lightweight design of the light-emitting device. Alternatively, the thickness of the light-emitting device can be set at 165μm. On the one hand, the appropriate increase in thickness can be reflected in the increase in the thickness of the substrate to achieve the effect of improving the impact resistance of the light-emitting device. On the other hand, the appropriate increase in thickness can be reflected in the increase in the thickness of the light-emitting element to achieve the purpose of improving the luminous effect. Alternatively, the thickness of the light-emitting device can be set at 180μm, which can ensure the lightweight and miniaturization design of the light-emitting device while taking into account its impact resistance and luminous effect to meet the user's higher usage requirements.

[0060] As an optional implementation, Figure 3 As shown, in another embodiment of the present application, a conductive hole d penetrating the substrate 11 is further provided on the substrate 11 ; the orthographic projection of the conductive hole d on the substrate 11 is located within the orthographic projection of the die-bonding pad 11s on the substrate 11 .

[0061] The conductive hole d can provide a channel for connecting the light emitting element 12 with an external circuit, ensuring that the light emitting element 12 can be stably fixed on the substrate 11 through the die-bonding pad 11s while being electrically connected to the external circuit.

[0062] Further, as an optional implementation, if Figure 4 As shown, in another embodiment of the present application, it is disclosed that the light emitting device may further include a first conductive pad 13 and a second conductive pad 14 .

[0063] The first conductive pad 13 and the second conductive pad 14 are both located on the side of the substrate 11 away from the light emitting element 12, and the first conductive pad 13 and the second conductive pad 14 are arranged at intervals. This arrangement can facilitate the connection of the light emitting device with an external circuit, thereby facilitating the light emitting device to emit light.

[0064] The conductive hole d may include at least one first conductive hole d1 and at least one second conductive hole d2; the die-bonding pad 11s includes a first pad s1 and a second pad s2; the first type groove K1 may include a first groove K1a and a second groove K1b; the first pad s1 is located in the first groove K1a; the second pad s2 is located in the second groove K1b.

[0065] The conductive wire of the first conductive pad 13 is electrically connected to the first pad s1 through the first conductive via d1 ; the conductive wire of the second conductive pad 14 is electrically connected to the second pad s2 through the second conductive via d2 .

[0066] In a specific implementation, the first pad s1 and the second pad s2 can be respectively welded to the two electrode pads of the light emitting element 12. For example, the first pad s1 is welded to the first electrode pad of the light emitting element 12, and the second pad s2 is welded to the second electrode pad of the light emitting element 12. Taking the light emitting element 12 as an LED chip as an example, the first electrode pad refers to the pad on the light emitting element 12 connected to the first electrode of the LED, and the second electrode pad refers to the pad on the light emitting element 12 connected to the second electrode of the LED.

[0067] It should be understood that the first electrode and the second electrode can be a cathode and an anode, respectively, or the first electrode and the second electrode can be an anode and a cathode, respectively. Specifically, the polarity of the first electrode and the second electrode can be set according to actual needs, and is not specifically limited here.

[0068] Accordingly, in order to avoid the positive and negative electrodes being connected in series, the first pad s1 and the second pad s2 can be located in the first groove K1a and the second groove K1b, respectively, and the wire of the first conductive pad 13 is electrically connected to the first pad s1 through the first conductive hole d1, and the wire of the second conductive pad 14 is electrically connected to the second pad s2 through the second conductive hole d2. In this way, the first conductive pad 13 can be used as the first electrode of the light-emitting device, and the second conductive pad 14 can be used as the second electrode of the light-emitting device, providing an interface for realizing the light-emitting device to emit light.

[0069] In addition, the number of the first conductive holes d1 and the number of the second conductive holes d2 can be set according to actual needs, and are not specifically limited here. It only needs to ensure that the wires of the conductive pads can be connected to the corresponding pads through the corresponding conductive holes.

[0070] As an optional implementation, Figure 5 As shown, in another embodiment of the present application, it is disclosed that the light emitting device may further include at least one thermally conductive pad 15 ; the thermally conductive pad 15 is attached to the substrate 11 and contacts the non-metallic area of ​​the light emitting element 12 .

[0071] Specifically, the thermal pad 15 may include a first portion 15A, which is not in contact with the first conductive pad 13 and the second conductive pad 14 ; the first portion 15A includes a portion of the thermal pad 15 located on a side of the substrate 11 away from the light emitting element 12 .

[0072] That is, one end of the thermal pad 15 can contact the non-metallic area of ​​the light emitting element 12, and the other end can extend to the side of the substrate 11 away from the light emitting element 12. The material of the thermal pad 15 can refer to the existing related technology, which will not be described here.

[0073] During implementation, one end of the thermal pad 15 contacts the non-metallic area of ​​the light-emitting element 12, which can lead out the heat on the light-emitting element 12 and help the heat of the light-emitting element 12 to dissipate as quickly as possible. The other end of the thermal pad 15 extends to the side of the substrate 11 away from the light-emitting element 12, which can provide a larger heat dissipation area for the heat dissipation of the light-emitting element 12, so as to further accelerate the heat dissipation of the light-emitting element 12 and improve the heat dissipation effect. In addition, the first portion 15A is located on the side of the substrate 11 away from the light-emitting element 12, which also facilitates the connection of the thermal pad 15 with an external heat dissipation device, providing convenience for further heat dissipation.

[0074] Among them, when the other end of the thermal pad 15 extends to the side of the substrate 11 away from the light-emitting element 12, the other end of the thermal pad 15 can be extended along the side of the substrate 11 to the side of the substrate 11 away from the light-emitting element 12, or a thermal via is provided on the substrate 11, and the other end of the thermal pad 15 extends to the side of the substrate 11 away from the light-emitting element 12 through the thermal via.

[0075] Furthermore, the first portion 15A does not contact the first conductive pad 13 or the second conductive pad 14 , which can improve the heat dissipation effect of the light-emitting device while preventing the heat-conductive pad 15 from affecting the light emission of the light-emitting device.

[0076] As an optional implementation, Figure 5As shown, in another embodiment of the present application, a second type of groove K2 is also provided on the substrate 11; the thermal pad 15 also includes a second part 15B; the second part 15B is located in the second type of groove K2; the second part 15B includes a part of the thermal pad 15 located on the side of the substrate 11 close to the light-emitting element 12.

[0077] In this way, the second type groove K2 can be used to accommodate part of the volume of the thermal pad 15, thereby ensuring the heat dissipation effect of the light-emitting device while reducing the volume of the light-emitting device and improving the miniaturization and thinness of the light-emitting device.

[0078] As an optional implementation, Figure 6 As shown, in another embodiment of the present application, a conductive adhesive 16 is provided between the light emitting element 12 and the die-bonding pad 11s; the conductive adhesive 16 may include flux or conductive solder paste.

[0079] Specifically, the welding of the light emitting element 12 and the die bonding pad 11s can be achieved by using flux eutectic or conductive solder paste. Compared with the traditional gold wire welding of the PN pole, it can not only reduce the thermal resistance, but also prevent the occurrence of poor welding caused by human factors, thereby improving the product yield of the light emitting device.

[0080] As an optional implementation, Figure 6 As shown, in another embodiment of the present application, it is disclosed that the light-emitting device may further include a fluorescent film 17 ; the fluorescent film 17 is attached to the light-emitting area on the surface of the light-emitting element 12 .

[0081] The fluorescent film 17 can be excited by the blue light emitted by the light emitting element 12 and then mixed with the blue light to form white light, so that the light emitted by the light emitting device appears as white light.

[0082] The fluorescent film 17 is attached to the light-emitting area, which can greatly improve the uniformity of light output and reduce material costs while realizing the white light emission of the light-emitting device.

[0083] As an optional implementation, Figure 7 As shown, in another embodiment of the present application, it is disclosed that the light emitting device may further include an epoxy adhesive layer 18 ; the epoxy adhesive layer 18 covers the fluorescent film 17 .

[0084] The epoxy adhesive layer 18 is used to cover the fluorescent film 17 , which can protect the fluorescent film 17 and the light-emitting element 12 wrapped by the fluorescent film 17 while increasing the light transmission effect, thereby improving the light-emitting performance of the light-emitting device.

[0085] As an optional implementation, it is disclosed in another embodiment of the present application that the substrate 11 may include a transparent substrate.

[0086] During implementation, the transparent substrate may be made of glass or thermoplastic polyester such as polyethylene or polyethylene terephthalate.

[0087] By setting the substrate 11 to be transparent, the bottom of the light-emitting device (ie, the side of the transparent substrate facing away from the light-emitting element) can be made light-transmissive, thereby achieving a multi-faceted light-emitting effect of the light-emitting device.

[0088] As an optional implementation, another embodiment of the present application discloses that the number of the light-emitting elements is multiple; and the number of the first type of grooves is consistent with the number of the light-emitting elements.

[0089] Based on this, a plurality of light-emitting elements may be arranged on the substrate, and the light-emitting colors of the plurality of light-emitting elements may be the same or different. Each light-emitting element has its corresponding first type of groove, and accordingly, each light-emitting element has its corresponding first conductive pad and second conductive pad. The external circuit may realize the light-emitting control of the light-emitting element through the conductive pad corresponding to the light-emitting element, that is, realize the independent control of each light-emitting element in the light-emitting device, so as to realize multi-color synchronous light-emitting or multi-color asynchronous light-emitting.

[0090] During implementation, the number of the plurality of light emitting elements may be 2 or more. Specifically, the number of light emitting elements on the substrate may be set according to actual needs, and is not specifically limited here.

[0091] Correspondingly, an embodiment of the present application further provides a light-emitting device, which may include: a light-emitting device as described in any of the above embodiments.

[0092] Specifically, the light emitting device may include a lighting device.

[0093] The light-emitting device provided in this embodiment belongs to the same application concept as the light-emitting device provided in the above embodiment of this application. The light-emitting device in the light-emitting device has the same functional modules and beneficial effects as the light-emitting device provided in any of the above embodiments of this application. For technical details not fully described in this embodiment, please refer to the specific contents of the light-emitting device provided in the above embodiment of this application, and will not be repeated here.

[0094] The above embodiments introduce the various structures of the light-emitting device and the light-emitting equipment proposed in the present application, as well as the assembly and connection methods of the various structures, by way of example. The implementation of the functions of the various structures can be performed with reference to the implementation of the corresponding functions in the prior art solutions, and will not be described in detail in this embodiment.

[0095] It should be noted that the various embodiments provided in this application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other. The modules and submodules in the devices and terminals in the various embodiments of this application can be merged, divided, and deleted according to actual needs.

[0096] In the several embodiments provided in the present application, it should be understood that the disclosed terminals, devices and methods can be implemented in other ways. For example, the terminal embodiments described above are only schematic, for example, the division of modules or submodules is only a logical function division, and there may be other division methods in actual implementation, for example, multiple submodules or modules can be combined or integrated into another module, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or modules, which can be electrical, mechanical or other forms.

[0097] The modules or submodules described as separate components may or may not be physically separated, and the components of the modules or submodules may or may not be physical modules or submodules, that is, they may be located in one place, or they may be distributed on multiple network modules or submodules. Some or all of the modules or submodules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0098] In addition, each functional module or submodule in each embodiment of the present application may be integrated into one processing module, or each module or submodule may exist physically separately, or two or more modules or submodules may be integrated into one module. The above-mentioned integrated modules or submodules may be implemented in the form of hardware or in the form of software functional modules or submodules.

[0099] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0100] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A light emitting device, characterized in that: include: Substrate and light emitting element; The substrate is provided with a first type of groove; a die-bonding pad is provided in the first type of groove; The light emitting element is electrically connected to the die bonding pad.

2. The light emitting device according to claim 1, characterized in that: The thickness of the substrate ranges from 40 to 70 μm.

3. The light emitting device according to claim 1, characterized in that: The thickness of the light emitting element ranges from 60 to 80 μm.

4. The light emitting device according to claim 1, characterized in that: The thickness of the light emitting device ranges from 150 to 180 μm.

5. The light emitting device according to claim 1, characterized in that: The substrate is also provided with a conductive hole penetrating the substrate; The orthographic projection of the conductive hole on the substrate is located in the orthographic projection of the die-bonding pad on the substrate.

6. The light emitting device according to claim 5, characterized in that: Also included is a first conductive pad and a second conductive pad; The first conductive pad and the second conductive pad are both located on a side of the substrate away from the light-emitting element, and the first conductive pad and the second conductive pad are spaced apart; The conductive hole includes at least one first conductive hole and at least one second conductive hole; the die-bonding pad includes a first pad and a second pad; the first type of groove includes a first groove and a second groove; the first pad is located in the first groove; the second pad is located in the second groove; The conductive wire of the first conductive pad is electrically connected to the first pad through the first conductive hole; the conductive wire of the second conductive pad is electrically connected to the second pad through the second conductive hole.

7. The light emitting device according to claim 6, characterized in that: Also comprising at least one thermally conductive pad; The thermally conductive pad is attached to the substrate and contacts the non-metallic region of the light emitting element.

8. The light emitting device according to claim 7, characterized in that: The thermally conductive pad includes a first portion; the first portion is not in contact with the first conductive pad and the second conductive pad; the first portion includes a portion of the thermally conductive pad located on a side of the substrate away from the light emitting element.

9. The light emitting device according to claim 7, characterized in that: The substrate is also provided with a second type of groove; The thermally conductive pad also includes a second portion; the second portion is located in the second type of groove; the second portion includes a portion of the thermally conductive pad located on a side of the substrate close to the light emitting element.

10. The light emitting device according to claim 1, characterized in that: A conductive adhesive is provided between the light emitting element and the die-bonding pad; the conductive adhesive includes flux or conductive solder paste.

11. The light emitting device according to claim 1, characterized in that: Also includes fluorescent film; The fluorescent film is attached to the light emitting area on the surface of the light emitting element.

12. The light emitting device according to claim 11, characterized in that: It also includes an epoxy glue layer; The epoxy adhesive layer covers the fluorescent film.

13. The light emitting device according to claim 1, characterized in that: The substrate includes a transparent substrate.

14. The light emitting device according to claim 1, characterized in that: The number of the light-emitting elements is multiple; The number of the first type of grooves is consistent with the number of the light emitting elements.

15. A light emitting device, characterized in that: Comprising a light emitting device as described in any one of claims 1-14.

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