Double-row semiconductor rib cutting die

Abstract

The utility model provides a double-row semiconductor rib cutting die which comprises an upper die and a lower die, a limiting structure is arranged on the top face of the lower die and used for containing a lead frame, material grooves are formed in the two sides of the lower die and are parallel to the length direction of the lead frame, and inclined faces are formed between the material grooves and the top face of the lower die. A pin of the semiconductor device is located in the middle of the lower die, and the packaging body is located above the inclined plane. Connecting pieces are arranged at the opposite ends of the two material grooves and used for installing material storage pipes, and after the material storage pipes are installed on the connecting pieces, openings of the material storage pipes face the corresponding material grooves and are aligned with the corresponding material grooves; push rods are arranged at the other ends of the material grooves and are arranged in the corresponding material grooves in parallel; the lower die is provided with a driving part used for driving the push rod to move in the trough in the length direction. According to the scheme, the semiconductor devices subjected to rib cutting can be orderly pushed into the material storage pipe, the links of manual material taking and vibration disc arrangement are reduced, and the production efficiency can be effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor device rib cutting dies, in particular to a double-row semiconductor rib cutting die. Background Art

[0002] like Figure 1 The packaging form of the semiconductor device shown on the lead frame usually includes two rows of semiconductor devices, the semiconductor devices are arranged along the length direction of the lead frame, the package body of the semiconductor device is located on both sides of the lead frame, and the pins of the semiconductor device are arranged relatively, and the pins are staggered. Semiconductor devices in this packaging form usually use a mold to cut ribs, so that the semiconductor device forms an independent individual. A single semiconductor device punched by an existing cutting die usually requires manual discharge or the top surface of the mold is set to a structure inclined toward the length direction of the lead frame, so that the single semiconductor device after cutting ribs can automatically slide down and discharge. However, the above two forms of discharge methods cannot obtain a neat output state, resulting in the inability to directly feed a single semiconductor device into a storage tube. It is necessary to arrange it through a vibration plate later, and then the arranged semiconductor device is sent into the storage tube, which increases the discharge process. Utility Model Content

[0003] In order to solve the deficiencies of the prior art, the utility model provides a double-row semiconductor cutting die, which can neatly push the semiconductor devices after cutting into a material storage tube, reducing the steps of manual material taking and vibration plate arrangement, and can effectively improve production efficiency.

[0004] In order to achieve the purpose of this utility model, the following scheme is proposed:

[0005] A double-row semiconductor rib cutting die comprises: an upper die and a lower die. The top surface of the lower die is provided with a limiting structure for placing a lead frame. Both sides of the lower die are provided with material grooves which are parallel to the length direction of the lead frame. An inclined surface is provided between the material groove and the top surface of the lower die. When the lead frame is placed, the pins of the semiconductor device are located in the middle of the lower die, and the package body is located above the inclined surface.

[0006] The two material troughs are each provided with a connecting piece at the opposite end for installing a material storage tube. After the material storage tube is installed on the connecting piece, the opening of the material storage tube faces the corresponding material trough and is aligned with the corresponding material trough; the other end of the material trough is provided with a push rod, which is arranged parallel to the corresponding material trough; the lower mold is provided with a driving component for driving the push rod to move along the length direction in the material trough.

[0007] The beneficial effect of the utility model is that the single semiconductor device after cutting can be automatically sent into the storage tube 3, reducing the manual operation links and vibration plate discharge welding, which can effectively improve the production efficiency and make the semiconductor devices in each storage tube 3 have the same direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0009] Figure 1 A schematic diagram showing the packaging state of a semiconductor device on a lead frame is shown.

[0010] Figure 2 The overall structural schematic diagram of the preferred embodiment of the lower mold of the present application is shown.

[0011] Figure 3 Shows Figure 2 A partial enlarged view of point A in the middle.

[0012] Figure 4 A partial cross-sectional view of the lower mold of the present application is shown.

[0013] Figure 5 A cross-sectional view along the length direction of the lower mold of the present application is shown.

[0014] Markings in the figure: material trough -11, inclined surface -12, positioning pin -13, countersunk hole -14, connecting piece -2, material storage tube -3, push rod -4, rack -41, cross bar -42, gear -51, motor -52. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.

[0016] like Figure 2 As shown, a double-row semiconductor cutting die includes an upper die and a lower die. A limit structure is provided on the top surface of the lower die for placing a lead frame. A material groove 11 is provided on both sides of the lower die, which is parallel to the length direction of the lead frame. An inclined surface 12 is provided between the material groove 11 and the top surface of the lower die. When the lead frame is placed, the pins of the semiconductor device are located in the middle of the lower die, and the package body is located above the inclined surface 12.

[0017] The two opposite ends of the two troughs 11 are provided with a connector 2 for installing a storage tube 3. After the storage tube 3 is installed on the connector 2, the opening of the storage tube 3 faces the corresponding trough 11 and is aligned with the corresponding trough 11. The other end of the trough 11 is provided with a push rod 4, which is arranged parallel to the corresponding trough 11. The lower mold is provided with a driving component for driving the push rod 4 to move along the length direction in the trough 11.

[0018] Working principle: When the semiconductor device on the lead frame passes through the cutting ribs of the upper and lower dies and forms a single semiconductor device, because one end of the semiconductor device package is heavier, the other end of the semiconductor device package will automatically fall on the inclined plane 12 and fall into the material trough 11 along the inclined plane 12. Finally, the push rod 4 is driven by the driving component to push the semiconductor device in the material trough 11 into the storage tube 3 opposite the corresponding material trough 11. Then, driven by the driving component, the push rod 4 returns to the other end of the material trough 11. This structure can automatically deliver the single semiconductor device after rib cutting into the storage tube 3, reducing manual operation links and vibration plate discharge welding, which can effectively improve production efficiency; and the storage tube 3 is respectively set at the opposite ends of the two material troughs 11, the purpose of which is to keep the direction of the two rows of semiconductor devices loaded into the storage tube 3 consistent, such as Figure 1 As shown, in order to visually observe the orientation of the semiconductor device for easy assembly, one corner of the semiconductor device package is usually set as a chamfered structure. The device allows two rows of semiconductor devices on the lead frame to be aligned along the Figure 1 By discharging in the direction of the arrow shown, the chamfered side of the semiconductor device package can be directed toward the bottom of the storage tube 3, so that the semiconductor devices in each storage tube 3 are oriented in the same direction; this not only facilitates subsequent use, but also helps to unify the conveying direction during inspection in the inspection process.

[0019] Preferably, Figure 2 As shown, the connecting member 2 is a rectangular frame structure. When the storage tube 3 is installed, its front end is inserted into the rectangular frame to facilitate the quick loading and unloading of the storage tube 3.

[0020] Preferably, Figure 2 As shown, the limiting structure is a pair of positioning pins 13 vertically arranged on the top surface of the lower mold, which are connected with the gaps between the pins to limit the position of the lead frame on the lower mold.

[0021] Preferably, when the lead frame is placed at the cutting rib position on the top surface of the lower mold, the lower edge of the semiconductor device package body facing the middle side of the lower mold contacts the inclined surface 12, thereby forming a limit between the packages of the two rows of semiconductor devices and the two inclined surfaces, further preventing the lead frame from moving in the width direction, and the two inclined surfaces 12 can be used to form a tapered surface to guide the lead frame, so that the lead frame can be placed more quickly and accurately.

[0022] As an installation method of the push rod 4, the driving component includes two independently arranged telescopic devices, both of which are arranged at the other end of the material trough 11 relative to the connecting member 2. The movable rod of the telescopic device is parallel to the material trough 11. The push rod 4 is connected to the front end of the movable rod of the corresponding telescopic device, so that the telescopic device is used to drive the push rod 4 to reciprocate along the length direction. The telescopic device is a cylinder or a linear motor.

[0023] As another preferred installation method of the push rod 4, Figures 2 to 5 As shown, the driving component includes a gear 51 arranged inside the lower mold, whose axis is perpendicular to the top surface of the lower mold, and the gear 51 is located in the middle position of the length direction of the lower mold. The gear 51 is driven by a motor 52, and the motor 52 is arranged below the lower mold. The push rods 4 are all arranged in parallel with a rack 41, and the ends of the push rods 4 and the rack 41 are connected by a cross bar 42. The racks 41 are all penetrated in the lower mold, and the racks 41 are all facing the middle of the lower mold, and the two racks 41 are respectively engaged with the two sides of the gear 51. When working, the two push rods 4 can be driven to move synchronously in opposite directions by rotating the gear 51, so as to achieve the purpose of synchronous pushing and retracting. The structure of this driving component is simpler and more compact.

[0024] As a further preferred solution, the gear 51 is located in the middle of the two troughs 11, so that the distance between the gear 51 and the two push rods 4 is the same, so that the length of the cross bar 42 is also the same, thereby achieving the purpose of interchangeability of the two push rods 4.

[0025] Further preferably, Figure 3 As shown, the teeth of the rack 41 are located inside the cross section of the rack 41, so that the outer contour of the cross section of the rack 41 is a regular rectangle, thereby facilitating the sliding of the rack 41 in the lower mold to prevent the rack 41 from being stuck due to the influence of the teeth.

[0026] Preferably, Figure 2 As shown, the top surface of the lower mold is provided with a countersunk hole 14 for mounting the gear 51, so as to facilitate the installation of the gear 51 from the top of the lower mold and the maintenance of the gear 51 and the rack 41, such as applying butter.

[0027] Further preferably, the countersunk hole 14 is provided with a sealing cover to prevent dust and debris from falling in.

[0028] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.

Claims

1. A double-row semiconductor cutting die, comprising: An upper mold and a lower mold, characterized in that a limit structure is provided on the top surface of the lower mold for placing a lead frame, material grooves (11) are provided on both sides of the lower mold and are parallel to the length direction of the lead frame, and an inclined surface (12) is provided between the material groove (11) and the top surface of the lower mold, and when the lead frame is placed, the pins of the semiconductor device are located in the middle of the lower mold, and the package body is located above the inclined surface (12); The two material troughs (11) are each provided with a connecting piece (2) at the opposite end thereof for mounting a material storage pipe (3). The material storage pipe (3) is mounted behind the connecting piece (2). The opening of the material storage pipe (3) faces the corresponding material trough (11) and is aligned with the corresponding material trough (11). The other end of each material trough (11) is provided with a push rod (4), which is arranged parallel to the corresponding material trough (11); The lower die is provided with a driving component for driving the push rod (4) to move along the length direction in the material trough (11).

2. A double-row semiconductor cutting die according to claim 1, characterized in that: The connecting piece (2) is a rectangular frame structure, and when the material storage tube (3) is installed, its front end is inserted into the rectangular frame.

3. A double-row semiconductor cutting die according to claim 1, characterized in that: The limiting structure is a pair of positioning pins (13) vertically arranged on the top surface of the lower mold.

4. A double-row semiconductor cutting die according to claim 1, characterized in that: When the lead frame is placed at the cutting rib position on the top surface of the lower mold, the lower edge of the semiconductor device package body facing the middle of the lower mold contacts the inclined surface (12).

5. A double-row semiconductor cutting die according to claim 1, characterized in that: The driving component comprises two independently arranged telescopic devices, each of which is arranged at the other end of the material trough (11) relative to the connecting member (2), the movable rods of the telescopic devices are parallel to the material trough (11), and the push rod (4) is connected to the front end of the movable rod of the corresponding telescopic device.

6. A double-row semiconductor cutting die according to claim 1, characterized in that: The driving component comprises a gear (51) arranged inside the lower die, the axis of which is perpendicular to the top surface of the lower die, the gear (51) is located in the middle position in the length direction of the lower die, the gear (51) is driven by a motor (52), the motor (52) is arranged below the lower die, the push rods (4) are arranged parallel to a rack (41), the push rods (4) are connected to the ends of the rack (41) through a cross bar (42), the racks (41) are penetrated in the lower die, the racks (41) are facing the middle of the lower die, and the two racks (41) are respectively meshed with the two sides of the gear (51).

7. A double-row semiconductor cutting die according to claim 6, characterized in that: The gear (51) is located in the middle of the two troughs (11).

8. A double-row semiconductor cutting die according to claim 6, characterized in that: The teeth of the rack (41) are located inside the cross section of the rack (41).

9. A double-row semiconductor cutting die according to claim 6, characterized in that: A countersunk hole (14) for mounting a gear (51) is formed on the top surface of the lower die.

10. A double-row semiconductor cutting die according to claim 9, characterized in that: The countersunk hole (14) is provided with a sealing cover.

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