Rapid cutting equipment for circuit board substrate

Abstract

The utility model relates to the technical field of circuit board cutting processing, and discloses rapid cutting equipment for a circuit board substrate, a plurality of groups of negative pressure row holes are formed in the board surface of a cutting platform in an array mode, a plurality of groups of airtight sealing assemblies corresponding to the negative pressure row holes are arranged in a box body of a negative pressure box frame in an array mode, and the negative pressure box frame is provided with a plurality of negative pressure row holes. And a negative-pressure air pump is mounted at the bottom of the box body of the negative-pressure box frame in a communicating manner. The negative pressure fixing mechanism is used for fixing the circuit board substrate in a negative pressure adsorption mode, the substrate can be cut and positioned in a negative pressure adsorption positioning mode, a fixing mode of a traditional clamping mode is replaced, positioning is simple, convenient and efficient, meanwhile, the comprehensive cutting procedure of cutting equipment on the substrate cannot be affected, and the production efficiency is improved. And then under the three-direction guide rail displacement of the Z-axis rail frame, the X-axis rail frame and the Y-axis rail frame, the laser cutting head is driven to perform three-direction displacement, and rapid and efficient laser cutting work is performed on the adsorbed and positioned circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board cutting and processing, in particular to a fast cutting device for a circuit board substrate. Background Art

[0002] Substrates are the basic materials for manufacturing PCBs, and are mainly divided into rigid substrate materials and flexible substrate materials. Among them, rigid substrate materials are the most widely used circuit board substrates at this stage. When they are used in production and processing, cutting equipment is usually used to perform modular pre-cutting and differentiation work on them, as shown in the existing patent technology: After searching, the China Patent Network disclosed a substrate cutting device for printed circuit board processing (public announcement number CN220074830U). When such a device is used, it clamps and fixes the circuit board substrate based on the combination of a movable fixed block and a threaded rod, and then uses two sets of motors to drive the horizontal and vertical displacement of two sets of threaded rods, and under the cutting of the corresponding two sets of cutting mechanisms, the circuit board is vertically cut and horizontally cut and differentiated.

[0003] However, there are still some shortcomings in the above-mentioned patents and the circuit board substrate cutting equipment adopted in the existing market: the existing method of clamping and fixing the substrate and pushing the substrate to the cutting mechanism for cutting is cumbersome during the cutting process, and the clamping part cannot be cut, resulting in the existence of scraps on the substrate after cutting, which reduces the cutting efficiency of the substrate. To this end, those skilled in the art provide a fast cutting device for circuit board substrates to solve the problems raised in the above-mentioned background technology. Utility Model Content

[0004] The main purpose of the utility model is to provide a fast cutting device for circuit board substrates, which can effectively solve the problem that the existing circuit board substrate cutting devices in the background technology have incomplete cutting and are prone to have scraps.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a rapid cutting device for a circuit board substrate, comprising a Z-axis track frame, an X-axis track frame installed on the upper end of the Z-axis track frame guide rail, a Y-axis track frame installed on the front end of the X-axis track frame guide rail, and a laser cutting head installed on the front end of the Y-axis track frame guide rail;

[0006] A negative pressure fixing mechanism is installed between the guide rails of the Z-axis track frame, and the negative pressure fixing mechanism includes a negative pressure box frame installed between the guide rails of the Z-axis track frame, a cutting platform is installed at the upper end of the box body of the negative pressure box frame, and the plate surface of the cutting platform is arranged in an array with multiple groups of negative pressure holes, the inside of the box body of the negative pressure box frame is arranged in an array with multiple groups of airtight sealing components corresponding to the negative pressure holes, and a negative pressure air pump is installed at the bottom of the box body of the negative pressure box frame.

[0007] As a further solution of the utility model: the airtight sealing assembly includes a center plate installed inside the negative pressure box frame and directly below the negative pressure discharge hole, the plate frame arrangement of the center plate is through-connected with multiple groups of compression guide rods, the outer side of the arm of the compression guide rod is sleeved with a compression spring that presses against the center plate, and the top end of the arm of the compression guide rod is provided with an airtight sealing plate that presses against the negative pressure discharge hole.

[0008] As a further solution of the utility model: the upper end of the plate frame of the central plate is symmetrically provided with an electromagnet, and the lower end of the plate frame of the airtight sealing plate is symmetrically provided with a magnetic magnet opposite to the electromagnet.

[0009] As a further solution of the utility model: a Z-axis screw rod is rotatably connected to one side of the guide rail of the Z-axis track frame, a Z-axis motor fixed to the Z-axis track frame is installed at one end of the shaft of the Z-axis screw rod, and a Z-axis slide table is sleeved on the outer side of the shaft of the Z-axis screw rod, which guides the Z-axis track frame and supports the X-axis track frame.

[0010] As a further solution of the utility model: the front side of the guide rail of the X-axis track frame is rotatably connected with an X-axis screw rod, one end of the shaft of the X-axis screw rod is equipped with an X-axis motor fixed on the X-axis track frame, and the outer side of the shaft of the X-axis screw rod is sleeved with an X-axis slide that guides the X-axis track frame and supports the Y-axis track frame.

[0011] As a further solution of the utility model: the front side of the guide rail of the Y-axis track frame is rotatably connected to a Y-axis screw rod, one end of the shaft of the Y-axis screw rod is equipped with a Y-axis motor fixed on the Y-axis track frame, and the outer side of the shaft of the Y-axis screw rod is sleeved with a Y-axis slide that guides the Y-axis track frame and supports the laser cutting head, and the Y-axis slide is fixedly connected to the laser cutting head via a mounting seat installed on the front side of its frame.

[0012] As a further solution of the utility model: the front end of the box body of the negative pressure box frame is connected to recoil air valves at both sides.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] When the utility model cuts the circuit board substrate, the negative pressure fixing mechanism is used to fix the circuit board substrate by negative pressure adsorption, and the substrate can be cut and positioned by negative pressure adsorption positioning, which replaces the traditional clamping fixing method. The positioning is simple, convenient and efficient, and will not affect the comprehensive cutting process of the cutting equipment on the substrate. Then, under the displacement of the three-dimensional guide rails of the Z-axis track frame, the X-axis track frame and the Y-axis track frame, the laser cutting head is driven to move in three directions, and the adsorbed and positioned circuit board is quickly and efficiently laser cut, which improves the cutting efficiency and ensures the comprehensiveness of the cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a rapid cutting device for a circuit board substrate according to the utility model;

[0016] Figure 2 This is a schematic structural diagram of a negative pressure fixing mechanism in a rapid cutting device for a circuit board substrate according to the utility model;

[0017] Figure 3 This is a schematic structural diagram of an airtight sealing component in a rapid cutting device for a circuit board substrate according to the utility model;

[0018] Figure 4 The utility model is a transmission schematic diagram of a laser cutting head in a rapid cutting device for a circuit board substrate.

[0019] In the figure: 1. Z-axis track frame; 2. X-axis track frame; 3. Y-axis track frame; 4. Laser cutting head; 5. Negative pressure box frame; 6. Cutting platform; 7. Negative pressure air pump; 8. Z-axis screw; 9. Z-axis slide; 10. Z-axis motor; 11. X-axis screw; 12. X-axis slide; 13. X-axis motor; 14. Y-axis screw; 15. Y-axis slide; 16. Y-axis motor; 17. Mounting seat; 18. Negative pressure discharge hole; 19. Recoil air valve; 20. Airtight sealing assembly; 201. Center plate; 202. Airtight sealing plate; 203. Compression guide rod; 204. Compression spring; 205. Magnetic iron; 206. Electromagnet. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Please refer to Figure 1-4 As shown, a rapid cutting device for circuit board substrates comprises a Z-axis track frame 1, an X-axis track frame 2 installed on the upper end of the guide rail of the Z-axis track frame 1, a Y-axis track frame 3 installed on the front end of the guide rail of the X-axis track frame 2, and a laser cutting head 4 installed on the front end of the guide rail of the Y-axis track frame 3. One side of the guide rail of the Z-axis track frame 1 is rotatably connected with a Z-axis screw rod 8, one end of the shaft rod of the Z-axis screw rod 8 is installed with a Z-axis motor 10 fixed to the Z-axis track frame 1, and the outer side of the shaft rod of the Z-axis screw rod 8 is sleeved with a Z-axis slide 9 which guides the Z-axis track frame 1 and supports the X-axis track frame 2. After the circuit board substrate is adsorbed and fixed, the Z-axis motor 10 can be controlled to work, drive the Z-axis screw rod 8 to rotate, push the Z-axis slide 9 to slide forward and backward along the direction of the guide rail of the Z-axis track frame 1, and synchronously push the laser cutting head 4 to slide forward and backward, so as to perform front and rear cutting work on the circuit board substrate.

[0024] The front side of the guide rail of the X-axis track frame 2 is rotatably connected with an X-axis screw rod 11, one end of the shaft of the X-axis screw rod 11 is installed with an X-axis motor 13 fixed on the X-axis track frame 2, and the outer side of the shaft of the X-axis screw rod 11 is sleeved with an X-axis slide 12 that guides the X-axis track frame 2 and supports the Y-axis track frame 3. After the circuit board substrate is adsorbed and fixed, the X-axis motor 13 can be controlled to work, drive the X-axis screw rod 11 to rotate, and push the X-axis slide 12 to slide left and right along the guide rail direction of the X-axis track frame 2, and synchronously push the laser cutting head 4 to slide left and right, so as to cut the circuit board substrate in the left and right directions.

[0025] The front side of the guide rail of the Y-axis track frame 3 is rotatably connected with a Y-axis lead screw 14, one end of the shaft of the Y-axis lead screw 14 is installed with a Y-axis motor 16 fixed on the Y-axis track frame 3, and the outer side of the shaft of the Y-axis lead screw 14 is sleeved with a Y-axis slide 15 which guides the Y-axis track frame 3 and supports the laser cutting head 4. The Y-axis slide 15 is fixedly connected to the laser cutting head 4 through a mounting seat 17 installed on the front side of its frame. After the circuit board substrate is adsorbed and fixed, the Y-axis motor 16 can be controlled to work, drive the Y-axis lead screw 14 to rotate, push the Y-axis slide 15 to slide up and down along the guide rail of the Y-axis track frame 3, and synchronously push the laser cutting head 4 to slide up and down, and move the laser cutting head 4 up and down to a suitable position of the circuit board substrate to facilitate accurate cutting process.

[0026] A negative pressure fixing mechanism is installed between the guide rails of the Z-axis track frame 1, and the negative pressure fixing mechanism includes a negative pressure box frame 5 installed between the guide rails of the Z-axis track frame 1, a cutting platform 6 is installed on the upper end of the box body of the negative pressure box frame 5, and the plate surface of the cutting platform 6 is arranged in an array and has multiple groups of negative pressure holes 18, and the inside of the box body of the negative pressure box frame 5 is arranged in an array form with multiple groups of airtight sealing components 20 corresponding to the negative pressure holes 18, the airtight sealing component 20 includes a center plate 201 installed inside the box body of the negative pressure box frame 5 and directly below the holes of the negative pressure holes 18, the plate frame arrangement of the center plate 201 is through-connected with multiple groups of compression guide rods 203, the outer side of the arm rod of the compression guide rod 203 is provided with a compression spring 204 that presses against the center plate 201, and the top end of the arm rod of the compression guide rod 203 is provided with an airtight sealing plate 202 that presses against the negative pressure holes 18, The upper end of the plate frame of the center plate 201 is symmetrically provided with an electromagnet 206, and the lower end of the plate frame of the airtight sealing plate 202 is symmetrically provided with a magnetic attractor 205 opposite to the electromagnet 206. Before the circuit board is negatively pressure-adsorbed and positioned, the number of through holes of the negative pressure discharge holes 18 can be adjusted in advance according to the size of the circuit board substrate to match the size of the circuit board substrate. Then, during the adjustment process, an appropriate number of airtight sealing components 20 are controlled to airtightly seal the negative pressure discharge holes 18. While adjusting, the electromagnet 206 and the magnetic attractor 205 are powered off to release the magnetic attraction therebetween. At the same time, under the elastic reset of the compression guide rod 203 and the compression spring 204, the airtight sealing plate 202 is pushed upward to block the corresponding negative pressure discharge holes 18 to keep them in a closed state, so that the remaining negative pressure discharge holes 18 can match the circuit board substrate for negative pressure adsorption.

[0027] A negative pressure air pump 7 is installed at the bottom of the negative pressure box rack 5. The circuit board substrate to be cut is placed on the cutting platform 6 and is pressed against the negative pressure discharge hole 18. The negative pressure air pump 7 is controlled to work, so that the negative pressure box rack 5 forms a negative pressure state. The circuit board substrate is limited by negative pressure adsorption through the negative pressure discharge hole 18, which replaces the traditional clamping fixing method. The positioning is simple, convenient and efficient, and will not affect the comprehensive cutting process of the cutting equipment on the substrate.

[0028] The front end of the negative pressure box frame 5 is connected to recoil air valves 19 at both sides. When the cutting equipment is used to cut the circuit board substrate, the high-pressure air pipe can be regularly connected to one of the two groups of recoil air valves 19, and then the high-pressure impact of the high-pressure air pipe can be used to flush out the dust generated by the cutting and accidentally falling into the negative pressure box frame 5 through the other group of recoil air valves 19, and a dust cover can be installed at the negative pressure port of the negative pressure air pump 7 in advance to prevent dust from entering the negative pressure air pump 7.

[0029] The working principle of the utility model is as follows: when the circuit board substrate is cut, the number of the negative pressure holes 18 that are turned on can be adjusted in advance according to the size of the circuit board substrate to match it with the size of the circuit board substrate, and then during the adjustment process, an appropriate number of airtight sealing components 20 are controlled to airtightly seal the negative pressure holes 18. During the adjustment, the electromagnet 206 and the magnetic magnet 205 are powered off to release the magnetic attraction between the two, and at the same time, the airtight sealing plate 202 is pushed upward under the elastic reset of the compression guide rod 203 and the compression spring 204 to block the corresponding negative pressure holes 18 to keep them in a closed state, so that the remaining negative pressure holes 18 can match the circuit board substrate with negative pressure adsorption, and then the circuit board substrate to be cut is placed on the cutting platform 6, and is pressed against the turned-on negative pressure holes 18, and at the same time, the negative pressure air pump 7 is controlled to work to form a negative pressure state of the negative pressure box frame 5, and the circuit board substrate is negatively charged through the negative pressure holes 18. The pressure adsorption limit is applied, and then, after the circuit board substrate is adsorbed and fixed, the Y-axis screw rod 14 is controlled to work, driving the Y-axis screw rod 14 to rotate, pushing the Y-axis slide 15 to slide up and down along the guide direction of the Y-axis track frame 3, and synchronously pushing the laser cutting head 4 to slide up and down, and moving the laser cutting head 4 up and down to the appropriate position of the circuit board substrate, and synchronously controlling the X-axis motor 13 to work, driving the X-axis screw rod 11 to rotate, pushing the X-axis slide 12 to slide left and right along the guide direction of the X-axis track frame 2, and synchronously pushing the laser cutting head 4 to slide left and right, and cutting the circuit board substrate in the left and right directions, and the Z-axis motor 10 can be controlled to work, driving the Z-axis screw rod 8 to rotate, pushing the Z-axis slide 9 to slide back and forth along the guide direction of the Z-axis track frame 1, and synchronously pushing the laser cutting head 4 to slide back and forth, and cutting the circuit board substrate in the front and back directions, and then performing horizontal and vertical cutting on the circuit board substrate, with higher cutting efficiency and more comprehensive cutting.

[0030] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A rapid cutting device for a circuit board substrate, characterized in that: It comprises a Z-axis track frame (1), an X-axis track frame (2) installed on the upper end of the guide rail of the Z-axis track frame (1), a Y-axis track frame (3) installed on the front end of the guide rail of the X-axis track frame (2), and a laser cutting head (4) installed on the front end of the guide rail of the Y-axis track frame (3); A negative pressure fixing mechanism is installed between the guide rails of the Z-axis track frame (1), and the negative pressure fixing mechanism includes a negative pressure box frame (5) installed between the guide rails of the Z-axis track frame (1), a cutting platform (6) is installed at the upper end of the box body of the negative pressure box frame (5), and the plate surface of the cutting platform (6) is arranged in an array and has multiple groups of negative pressure holes (18), the inside of the box body of the negative pressure box frame (5) is arranged in an array and has multiple groups of airtight sealing components (20) corresponding to the negative pressure holes (18), and a negative pressure air pump (7) is installed at the bottom of the box body of the negative pressure box frame (5).

2. A rapid cutting device for circuit board substrates according to claim 1, characterized in that: The airtight sealing assembly (20) comprises a center plate (201) installed inside the negative pressure box frame (5) and directly below the negative pressure discharge hole (18); the center plate (201) is arranged on a plate frame and is connected to a plurality of groups of compression guide rods (203); a compression spring (204) is sleeved on the outer side of the arm of the compression guide rod (203) and is pressed against the center plate (201); and an airtight sealing plate (202) is provided at the top end of the arm of the compression guide rod (203) and is pressed against the negative pressure discharge hole (18).

3. A rapid cutting device for a circuit board substrate according to claim 2, characterized in that: The upper end of the plate frame of the central plate (201) is symmetrically provided with an electromagnet (206), and the lower end of the plate frame of the airtight sealing plate (202) is symmetrically provided with a magnetic magnet (205) opposite to the electromagnet (206).

4. The rapid cutting device for circuit board substrate according to claim 1, characterized in that: A Z-axis screw rod (8) is rotatably connected to one side of the guide rail of the Z-axis track frame (1); a Z-axis motor (10) fixed to the Z-axis track frame (1) is installed at one end of the shaft of the Z-axis screw rod (8); and a Z-axis slide table (9) which guides the Z-axis track frame (1) and supports the X-axis track frame (2) is sleeved on the outer side of the shaft of the Z-axis screw rod (8).

5. The rapid cutting device for circuit board substrate according to claim 1, characterized in that: The front side of the guide rail of the X-axis track frame (2) is rotatably connected to an X-axis screw rod (11), one end of the shaft of the X-axis screw rod (11) is equipped with an X-axis motor (13) fixed on the X-axis track frame (2), and the outer side of the shaft of the X-axis screw rod (11) is sleeved with an X-axis slide table (12) which guides the X-axis track frame (2) and supports the Y-axis track frame (3).

6. The rapid cutting device for circuit board substrate according to claim 1, characterized in that: The front side of the guide rail of the Y-axis track frame (3) is rotatably connected to a Y-axis lead screw (14); one end of the shaft of the Y-axis lead screw (14) is mounted with a Y-axis motor (16) fixed to the Y-axis track frame (3); and the outer side of the shaft of the Y-axis lead screw (14) is sleeved with a Y-axis slide table (15) which guides the Y-axis track frame (3) and supports the laser cutting head (4); the Y-axis slide table (15) is fixedly connected to the laser cutting head (4) via a mounting seat (17) mounted on the front side of the table.

7. The rapid cutting device for circuit board substrate according to claim 1, characterized in that: The front end of the box body of the negative pressure box frame (5) is connected to a recoil air valve (19) at positions on both sides.

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