Cooling and shaping equipment for plastic products
By designing a cooling shaping equipment for plastic products including semiconductor refrigeration sheets and circulating cooling systems, the problems of unsatisfactory cooling effect and low efficiency of existing equipment are solved, and efficient cooling and water resource recycling are achieved.
Patent Information
- Application Number
- CN202323410341.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-14
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2033-12-14
AI Technical Summary
The cooling effect of existing plastic product cooling equipment is not ideal, the cooling efficiency is slow, and may lead to deformation of plastic products.
A cooling shaping device for plastic products including a cooling mechanism, a placement mechanism and an external mechanism is designed. The cooling mechanism cools the cold water through the semiconductor refrigeration sheet, and the water pump transports the cold water into the cavity of the cooling table. The mold in the cooling table is used to place plastic products to achieve circulating cooling.
It improves the cooling efficiency of plastic products, reduces the opportunity for direct contact between plastic products and cold water, avoids deformation, and realizes the recycling of water resources.
Smart Images

Figure CN222610171U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cooling and shaping equipment, in particular to cooling and shaping equipment for plastic products. Background Art
[0002] Plastic products are a general term for industrial or daily necessities made from plastic as the main raw material. In the production and processing of plastic particles, a plastic product cooling and shaping equipment is usually required to cool and shape the strip plastic extruded by the plastic extruder.
[0003] When cooling plastic products, they are usually placed in cold water. However, the temperature of the plastic products after processing is high, so the cold water temperature rises and becomes warm water. Cold water needs to be added to cool the plastic products, resulting in an unsatisfactory cooling effect on the plastic products and a slow cooling efficiency. Utility Model Content
[0004] In order to solve the above technical problems, the utility model provides a cooling and shaping device for plastic products.
[0005] The utility model is implemented by the following technical scheme: a cooling and shaping device for plastic products, comprising a cooling mechanism, a placing mechanism and an external mechanism, wherein the placing mechanism is located at the upper end of the cooling mechanism, and the external mechanism is located outside the cooling mechanism;
[0006] The cooling mechanism includes a cooling table, the inner wall of which is provided with a cavity, a cold water pool is arranged at the lower end of the cooling table, a water pump is arranged at the right end of the cold water pool, both ends of the water pump are respectively connected with a water supply pipe and a water suction pipe, semiconductor refrigeration plates are fixedly connected to the front and rear ends of the cold water pool, a through hole is arranged at the right end of the cooling table, a water outlet is arranged at the left side of the cavity, the water outlet is connected with a water outlet pipe, and the end of the water outlet pipe away from the water outlet extends to the inside of the cold water pool.
[0007] Through the above technical solution, the cold water pool is cooled by the semiconductor refrigeration sheet so that the water temperature in the cold water pool is maintained.
[0008] As a further improvement of the above scheme, the end of the water supply pipe away from the water pump extends into the cavity through a through hole, the end of the water suction pipe away from the water pump passes through the cold water pool and extends into the cold water pool, and the number of the semiconductor refrigeration plates is set to be several.
[0009] Through the above technical solution, cold water is transported into the cavity by a water pump.
[0010] As a further improvement of the above scheme, the placement mechanism includes a mold, both ends of the mold are fixedly connected with fixed blocks, the upper end of the fixed block is fixedly connected with a handle, both ends of the cooling table are provided with grooves, and the interior of the cooling table is provided with a placement groove.
[0011] Through the above technical solution, the processed plastic products can be placed in the mold.
[0012] As a further improvement of the above solution, the surface of the fixing block contacts the inner wall of the groove, the size of the groove matches the size of the fixing block, the bottom of the mold contacts the inner wall of the placement groove, and the number of the handles is set to two.
[0013] Through the above technical solution, the mold can be easily taken out through the two handles.
[0014] As a further improvement of the above solution, the external mechanism includes a controller, a button is fixedly connected to the front of the controller, a fixed bracket is fixedly connected to the bottom of the cooling table, and a non-slip base is fixedly connected to the bottom of the fixed bracket.
[0015] Through the above technical solution, the cooling platform is supported by a fixed bracket to improve stability.
[0016] As a further improvement of the above solution, the back side of the controller is fixedly connected to the front end of the cooling platform, and the number of the fixing brackets is four, and the four fixing brackets are symmetrically distributed with the cooling platform as the center.
[0017] Through the above technical solution, the start or shut down of the water pump and the semiconductor refrigeration plate is controlled by the controller.
[0018] Compared with the prior art, the beneficial effects of the present invention are:
[0019] The utility model starts the water in the cold water pool through the arranged cavity, specifically the semiconductor refrigeration sheet, and transports the cold water in the cold water pool to the cavity of the cooling table through the water pump, the water pumping pipe and the water delivery pipe, so that the cold water in the cavity cools down the plastic product in the mold; when the water in the cavity is equal to the water outlet, the water is discharged into the cold water pool through the water outlet pipe for a cycle, thereby improving the cooling efficiency of the plastic product and recycling the water resources.
[0020] The utility model places the plastic product through the provided mold, specifically through the mold, and reduces the direct contact between the plastic product and cold water, which causes deformation of the plastic product. After the plastic product is cooled, the mold is taken out through two handles, and the handles facilitate taking out the mold, thereby improving the convenience of operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0022] Figure 2 This is a schematic diagram of the cross-sectional structure of the cooling table of the utility model;
[0023] Figure 3 This is a schematic diagram of the cold water pool structure of the utility model;
[0024] Figure 4 It is a schematic diagram of the placement mechanism structure of the utility model.
[0025] Description of main symbols:
[0026] 1. Cooling mechanism; 101. Cooling table; 102. Cold water pool; 103. Water pump; 104. Water supply pipe; 105. Water extraction pipe; 106. Semiconductor refrigeration plate; 107. Through hole; 108. Cavity; 109. Water outlet; 110. Water outlet pipe; 2. Placement mechanism; 201. Mold; 202. Fixing block; 203. Handle; 204. Groove; 205. Placement slot; 3. External mechanism; 301. Controller; 302. Button; 303. Fixed bracket; 304. Anti-slip base. DETAILED DESCRIPTION
[0027] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
[0028] Example:
[0029] Please combine Figure 1-4 , a cooling and shaping device for plastic products of this embodiment comprises a cooling mechanism 1, a placing mechanism 2 and an external mechanism 3, wherein the placing mechanism 2 is located at the upper end of the cooling mechanism 1, and the external mechanism 3 is located outside the cooling mechanism 1;
[0030] The cooling mechanism 1 includes a cooling platform 101, the inner wall of the cooling platform 101 is provided with a cavity 108, the lower end of the cooling platform 101 is provided with a cold water pool 102, the right end of the cold water pool 102 is provided with a water pump 103, the two ends of the water pump 103 are respectively connected with a water supply pipe 104 and a water pumping pipe 105, the front and rear ends of the cold water pool 102 are fixedly connected with a semiconductor refrigeration sheet 106, the right end of the cooling platform 101 is provided with a through hole 107, the left side of the cavity 108 is provided with a water outlet 109, the water outlet 109 is connected with a water outlet pipe 110, and the water outlet pipe 110 is far away from the water outlet 109. The end extends into the cold water pool 102, the semiconductor refrigeration sheet 106 is started to cool the water in the cold water pool 102, and the cold water in the cold water pool 102 is transported to the cavity 108 of the cooling table 101 through the water pump 103 in cooperation with the water suction pipe 105 and the water delivery pipe 104, so that the cold water in the cavity 108 cools down the plastic product in the mold 201. When the water in the cavity 108 is equal to the water outlet 109, the water will be discharged into the cold water pool 102 through the water outlet pipe for a cycle, thereby improving the cooling efficiency of the plastic products and recycling water resources.
[0031] One end of the water supply pipe 104 away from the water pump 103 extends to the inside of the cavity 108 through the through hole 107, and one end of the water extraction pipe 105 away from the water pump 103 passes through the cold water pool 102 and extends to the inside of the cold water pool 102. A number of semiconductor cooling plates 106 are provided.
[0032] The placement mechanism 2 includes a mold 201, both ends of the mold 201 are fixedly connected with a fixing block 202, the upper end of the fixing block 202 is fixedly connected with a handle 203, both ends of the cooling table 101 are provided with grooves 204, and the interior of the cooling table 101 is provided with a placement groove 205. The mold 201 is used to facilitate placement and reduce direct contact between plastic products and cold water, which may cause deformation of the plastic products. After the plastic products are cooled, the mold 201 is taken out through the two handles 203.
[0033] The surface of the fixing block 202 contacts the inner wall of the groove 204 . The size of the groove 204 matches the size of the fixing block 202 . The bottom of the mold 201 contacts the inner wall of the placement groove 205 . There are two handles 203 .
[0034] The external mechanism 3 includes a controller 301 , a button 302 is fixedly connected to the front of the controller 301 , a fixing bracket 303 is fixedly connected to the bottom of the cooling platform 101 , and an anti-skid base 304 is fixedly connected to the bottom of the fixing bracket 303 .
[0035] The back side of the controller 301 is fixedly connected to the front end of the cooling platform 101 . There are four fixing brackets 303 , which are symmetrically distributed with the cooling platform 101 as the center.
[0036] The implementation principle of a cooling and shaping device for plastic products in the embodiment of the present application is as follows: the plastic product is placed in the mold 201, the semiconductor refrigeration plate 106 is started by the controller 301 to cool the water in the cold water pool 102, and the cold water in the cold water pool 102 is transported to the cavity 108 of the cooling table 101 by the water pump 103 in cooperation with the water pumping pipe 105 and the water supply pipe 104, so that the cold water in the cavity 108 cools down the plastic product in the mold 201, and when the water level in the cavity 108 is equal to the water outlet 109, the water is discharged into the cold water pool 102 through the water outlet pipe for a cycle, thereby improving the cooling efficiency of the plastic product and recycling water resources. After the plastic product is cooled, the mold 201 is taken out through the two handles 203.
[0037] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.
Claims
1. A cooling and shaping device for plastic products, characterized in that: It comprises a cooling mechanism (1), a placement mechanism (2) and an external mechanism (3), wherein the placement mechanism (2) is located at the upper end of the cooling mechanism (1), and the external mechanism (3) is located outside the cooling mechanism (1); The cooling mechanism (1) comprises a cooling platform (101), the inner wall of the cooling platform (101) is provided with a cavity (108), a cold water pool (102) is arranged at the lower end of the cooling platform (101), a water pump (103) is arranged at the right end of the cold water pool (102), the two ends of the water pump (103) are respectively connected with a water supply pipe (104) and a water suction pipe (105), the front and rear ends of the cold water pool (102) are fixedly connected with a semiconductor refrigeration plate (106), the right end of the cooling platform (101) is provided with a through hole (107), the left side of the cavity (108) is provided with a water outlet (109), the water outlet (109) is connected with a water outlet pipe (110), and the end of the water outlet pipe (110) away from the water outlet (109) extends to the inside of the cold water pool (102).
2. A cooling and shaping device for plastic products as claimed in claim 1, characterized in that: One end of the water supply pipe (104) away from the water pump (103) extends to the inside of the cavity (108) through the through hole (107), and one end of the water extraction pipe (105) away from the water pump (103) passes through the cold water pool (102) and extends to the inside of the cold water pool (102). The number of the semiconductor cooling plates (106) is set to be several.
3. A cooling and shaping device for plastic products as claimed in claim 1, characterized in that: The placement mechanism (2) comprises a mold (201), the two ends of the mold (201) are fixedly connected with a fixing block (202), the upper end of the fixing block (202) is fixedly connected with a handle (203), the two ends of the cooling platform (101) are provided with grooves (204), and the interior of the cooling platform (101) is provided with a placement groove (205).
4. A cooling and shaping device for plastic products as claimed in claim 3, characterized in that: The surface of the fixing block (202) contacts the inner wall of the groove (204), the size of the groove (204) matches the size of the fixing block (202), the bottom of the mold (201) contacts the inner wall of the placement groove (205), and the number of the handles (203) is two.
5. A cooling and shaping device for plastic products as claimed in claim 1, characterized in that: The external mechanism (3) comprises a controller (301), a button (302) is fixedly connected to the front of the controller (301), a fixed bracket (303) is fixedly connected to the bottom of the cooling platform (101), and a non-slip base (304) is fixedly connected to the bottom of the fixed bracket (303).
6. A cooling and shaping device for plastic products as claimed in claim 5, characterized in that: The back side of the controller (301) is fixedly connected to the front end of the cooling platform (101), and the number of the fixing brackets (303) is four, and the four fixing brackets (303) are symmetrically distributed with the cooling platform (101) as the center.