Wafer bearing device and semiconductor process equipment

Abstract

The utility model provides a wafer bearing device and semiconductor process equipment, relates to the technical field of semiconductor process, and aims to solve the problem that the rotating speed of a second tray is not easy to detect. The wafer bearing device comprises a first tray; the second trays are rotationally arranged on the first tray, the edge of each second tray is provided with a first color area and a second color area which are different in color, and the first color areas and the second color areas are evenly and alternately distributed on the edge of the second tray in the circumferential direction. The wafer bearing device provided by the utility model can conveniently detect the rotating speed of the second tray.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor process, in particular to a wafer carrying device and semiconductor process equipment. Background Art

[0002] Metal organic chemical vapor deposition is a new type of vapor phase epitaxial growth technology developed on the basis of vapor phase epitaxial growth. It uses hydrides of group III and group V elements as raw materials for crystal growth, and performs vapor phase epitaxy on substrates in a thermal decomposition reaction mode to grow various group III-V compound semiconductors and thin-layer single crystal materials with their multi-component solid solutions.

[0003] Multi-wafer compound epitaxial equipment uses a graphite base to carry silicon wafers. Currently, 6-inch or 8-inch silicon wafers are mainly used. The base can accommodate 9 6-inch silicon wafers or 5 8-inch silicon wafers. During the epitaxial growth process, the first tray is driven to rotate by a hard connection through a drive motor, and the second tray is driven to rotate by pneumatic drive. Due to processing errors and air intake control and other factors, it is difficult to ensure the consistency of the second tray's air intake and speed control, which leads to inconsistent thickness and resistivity yields of each wafer in the same furnace during epitaxial growth, affecting product quality and causing waste of time, cost and efficiency. Utility Model Content

[0004] The first purpose of the utility model is to provide a wafer carrying device to solve the technical problem that the rotation speed of the existing second tray is difficult to detect.

[0005] The wafer carrying device provided by the utility model is used for chemical vapor deposition processing, comprising:

[0006] a first pallet; and,

[0007] A second tray, a plurality of the second trays are rotatably arranged on the first tray respectively, the edge of the second tray has a first color area and a second color area of ​​different colors, the first color area and the second color area are evenly and alternately arranged in the circumferential direction at the edge of the second tray, and when the second tray rotates, the switching between the second color area and the first color area is configured to be detectable by a color sensor.

[0008] In a preferred technical solution, the first color area is formed by a first coating located at an edge of the second tray.

[0009] In a preferred technical solution, the first pallet is provided with a detection area, the color of the detection area is different from the first color area; the distance between the detection area and the rotation center of the first pallet is equal to a first distance, and the first distance is the distance between the first coating and the rotation center of the first pallet when the first coating is detected.

[0010] In a preferred technical solution, the area that the color sensor is facing is the area of ​​the second tray that is closest to the rotation center of the first tray.

[0011] In a preferred technical solution, the second tray comprises a second tray body and an O-ring, the O-ring is arranged on the edge of the second tray body, and the first coating is arranged on the upper surface of the O-ring at intervals along the circumference of the O-ring.

[0012] In a preferred technical solution, the number of the first color zones is n, where n is an even number greater than zero, the central angle corresponding to each of the first color zones on the O-ring is 180° / n, and the first coating is provided in n evenly spaced areas on the upper surface of the O-ring.

[0013] In a preferred technical solution, the second tray body is provided with a boss, and at least a portion of the inner circumference of the O-ring cooperates with the outer circumference of the boss.

[0014] In a preferred technical solution, the first coating is made of zirconium oxide.

[0015] In a preferred technical solution, the detection area is provided with a second coating.

[0016] In a preferred technical solution, the color of the detection area in the first tray is gold.

[0017] The second purpose of the utility model is to provide a semiconductor process equipment to solve the technical problem that the rotation speed of the second tray is difficult to detect.

[0018] The semiconductor process equipment provided by the utility model comprises a process chamber; the above-mentioned wafer carrying device is arranged in the process chamber; and a color sensor, wherein the color sensor is used to detect the switching between the second color area and the first color area when the second tray rotates.

[0019] In a preferred technical solution, the process chamber comprises a chamber cover, the chamber cover is provided with a detection port, and the color sensor is installed outside the detection port and can perform detection through the detection port.

[0020] The beneficial effects brought by the wafer carrying device and semiconductor process equipment of the utility model are:

[0021] By making the second tray have a first color zone and a second color zone, the rotation of the second tray is converted into the switching of the first color zone and the second color zone detected by the color sensor. When the second color zone and the first color zone switch on the second tray, the color sensor can obtain the rotation speed of the second tray according to the number of color switches detected in the corresponding time. Moreover, by using different colors to be recognized by the color sensor to obtain the rotation speed of the second tray, there is no need to form an obviously uneven structure on the second tray, and when the second tray rotates, it will not have a significant impact on the airflow above the second tray, so ensuring that the airflow on the surface of the second tray is basically stable will cause turbulence in the flow field inside the chamber, thereby ensuring the yield rate during the epitaxial growth process of the wafer.

[0022] In addition, since the second pallet cannot be guaranteed to be in only one axial position relative to the ejector pin during rotation, different colors are used for identification to determine the rotation speed. This also avoids being affected by the second pallet's unstable axial direction and the fluctuating end surface as when a concave or convex structure is set on the surface of the second pallet for detection, thereby improving the reliability of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments or background technologies of the present invention, the drawings required for use in the embodiments or background technology descriptions are briefly introduced below. Obviously, the drawings described below are merely embodiments of the present invention, and ordinary technicians in this field can obtain other drawings based on the provided drawings without paying any creative work.

[0024] Figure 1 It is a structural schematic diagram in the related art;

[0025] Figure 2 It is a schematic diagram of the simulation of the airflow field in the semiconductor process chamber when the second tray rotates at 5 rpm in the related art;

[0026] Figure 3 It is a schematic diagram of the simulation of the airflow field in the semiconductor process chamber when the second tray rotates at 50 rpm in the related art;

[0027] Figure 4 A schematic structural diagram of a wafer carrier provided in Embodiment 1 of the present utility model applied to a semiconductor process chamber;

[0028] Figure 5 A three-dimensional exploded view of a wafer carrying device provided in Embodiment 1 of the present utility model;

[0029] Figure 6 A three-dimensional sectional disassembly diagram of a partial structure of a second tray in a wafer carrying device provided in Embodiment 1 of the utility model;

[0030] Figure 7 A schematic diagram of the structure of setting a first color area and a second color area for a second tray in a wafer carrying device provided in Embodiment 1 of the utility model;

[0031] Figure 8 A top view of a first tray and a second tray in a wafer carrying device provided in Embodiment 1 of the utility model;

[0032] Fig. 9 This is a flow chart of the operating principle of the semiconductor process equipment provided in the second embodiment of the present utility model.

[0033] Description of reference numerals:

[0034] 10-first tray; 11-tray cover; 12-rotating airway; 13-thimble; 14-detection area;

[0035] 20 - second tray; 21 - O-ring; 22 - first color area; 23 - second color area;

[0036] 31-driving motor; 32-driving shaft;

[0037] 40-pyrometer;

[0038] 50-color sensor;

[0039] 60-chamber body;

[0040] 70-Mass flow controller;

[0041] 80-upper cover air intake module;

[0042] 90-Chamber air intake module. DETAILED DESCRIPTION

[0043] Figure 1 It is a structural schematic diagram in the related art; Figure 1 As shown, in the related art, multiple second trays 20 are evenly arranged circumferentially on the first tray 10, the first tray 10 can be rotated under the drive of the driving motor 31, and each second tray 20 is also rotatably connected to the first tray 10, and the second tray 20 can be pneumatically driven to achieve self-rotation relative to the first tray 10.

[0044] The temperatures of the first tray 10 and the second tray 20 during the rotation process are detected by a pyrometer 40 installed on the upper cover of the chamber. The average temperature of the first tray 10 and the average temperature of each second tray 20 are calculated through real-time feedback from the pyrometer 40 in combination with the encoder of the drive motor 31. The temperature controller compares the set temperature with the detected temperature. When the current temperature is equal to the set target temperature, the control temperature is kept unchanged. When the current temperature is less than or greater than the set target temperature, the temperature controller adjusts the output analog quantity to control the inductive power supply. The inductive power supply adjusts the output according to the received analog signal to achieve temperature control of the first tray 10.

[0045] The controller compares the average temperature of each second tray 20, calculates the temperature difference between the second trays 20, and calculates the flow rate of the air mass flow controller 70 required to adjust the air suspension second tray 20 according to the temperature difference, so as to achieve the rotation speed consistency control of the air suspension second tray 20.

[0046] However, the temperature detection of the pyrometer 40 can only provide feedback when the temperature deviation between the small plates is relatively large, and it is difficult to detect when the temperature deviation is small. Figure 2 and Figure 3 As shown, the rotation speed of the second tray 20 has a relatively small effect on the temperature, but a relatively large effect on the airflow field of the chamber. The instability of the airflow field has a greater impact on the epitaxial process of each wafer in the multi-wafer chamber. Therefore, the rotation speeds of the second trays 20 are inconsistent, resulting in a significantly complex and uneven airflow field in the chamber, which leads to uneven quality of the produced wafers.

[0047] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific embodiments of the utility model are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0048] Embodiment 1:

[0049] Figure 4 A schematic structural diagram of a wafer carrier provided in Embodiment 1 of the present invention applied to a process chamber; Figure 5 A three-dimensional exploded view of a wafer carrying device provided in Embodiment 1 of the present utility model; Figure 7 A schematic diagram of a structure in which a first color area and a second color area are arranged on a second tray in a wafer carrying device provided in Embodiment 1 of the present utility model. Figure 4 , Figure 5 and Figure 7As shown, the wafer carrying device provided in the first embodiment of the utility model is used for chemical vapor deposition processing, including: a first tray 10 and a second tray 20; the first tray 10 and the chamber body 60 are arranged to rotate relative to each other; a plurality of second trays 20 are rotatably arranged on the first tray 10, and the edge of the second tray 20 has a first color area 22 and a second color area 23 of different colors, and the first color area 22 and the second color area 23 are evenly and alternately arranged in the circumferential direction at the edge of the second tray 20, and the switching configuration of the second color area 23 and the first color area 22 when the second tray 20 rotates is configured to be detectable by the color sensor 50.

[0050] Figure 6 A three-dimensional sectional disassembly diagram of a partial structure of a second tray in a wafer carrying device provided in the first embodiment of the present invention; Figure 4-Figure 6 As shown, in this embodiment, five second trays 20 are evenly distributed circumferentially on the first tray 10, and a rotating airway 12 is processed in a local area of ​​the first tray 10 below each second tray 20. The second tray 20 can be driven to rotate by the flow of gas in the rotating airway 12. A ejector pin 13 is also provided on the first tray 10 to achieve radial positioning of the second tray 20. Specifically, the ejector pin 13 is located at the rotation center of each second tray 20. Since the ejector pin 13 only radially positions the second tray 20, and the rotation of the second tray 20 is driven by the airflow, the second tray 20 cannot be guaranteed to be in only one axial position relative to the ejector pin 13 during rotation.

[0051] The first tray 10 is driven to rotate by a driving motor 31 disposed below the chamber body 60 through a driving shaft 32. A tray cover 11 is disposed above the first tray 10 to cover the second tray 20.

[0052] like Figure 7 As shown, it should be noted that in the present application, the first color area 22 and the second color area 23 are uniformly and alternately arranged in the circumferential direction at the edge of the second tray 20, which means that the first color area 22 is uniformly arranged in the circumferential direction at the edge of the second tray 20, and the central angles of each first color area 22 relative to the rotation center of the second tray 20 are the same, and the central angles of the interval area sandwiched by any two adjacent first color areas 22 are also the same; correspondingly, the second color area 23 is uniformly arranged in the circumferential direction at the edge of the second tray 20, and the central angles of each second color area 23 relative to the rotation center of the second tray 20 are the same, and the central angles of the interval area sandwiched by any two adjacent second color areas 23 are also the same. The first color area 22 and the second color area 23 are uniformly and alternately arranged in the circumferential direction at the edge of the second tray 20, which does not mean that the central angles corresponding to the first color area 22 and the second color area 23 must be the same. Of course, in this embodiment, the central angles corresponding to the first color area 22 and the second color area 23 are the same.

[0053] In this embodiment, the color sensor 50 can be a white LED color sensor, which can achieve stable detection under different light intensities or colors of the same color system as long as there is a slight color difference. In this embodiment, the first color area 22 is white, and the second color area 23 is black. Although during the process, during dynamic adjustment, due to the increase in temperature in the semiconductor process chamber, the colors of the first color area 22 and the second color area 23 on the second tray 20 also change, but at the highest process temperature of 800°C, there can still be obvious color deviations between the first color area 22 and the second color area 23, and the difference between the two can be detected by the color sensor 50.

[0054] By making the second tray 20 have the first color area 22 and the second color area 23, the rotation of the second tray 20 is converted into the detection of the switching of the first color area 22 and the second color area 23 by the color sensor 50. When the second color area 23 switches with the first color area 22 on the second tray 20, the color sensor 50 can obtain the rotation speed of the second tray 20 according to the number of color switching detected in the corresponding time. Moreover, by using the method of different colors being recognized by the color sensor 50 to obtain the rotation speed of the second tray 20, there is no need to form an obvious uneven structure on the second tray 20, and when the second tray 20 rotates, it will not have a significant impact on the airflow above the second tray 20, so ensuring that the airflow on the surface of the second tray 20 is basically stable will cause the flow field inside the chamber to be turbulent, thereby ensuring the yield rate during the epitaxial growth process of the wafer.

[0055] In addition, since the second tray 20 cannot be guaranteed to be in only one axial position relative to the ejector pin 13 during rotation, different colors are used for identification to determine the rotation speed. This also avoids being affected by the axial instability of the second tray 20 and the uneven height of the end surface when a concave or convex structure is set on the surface of the second tray 20 for detection, thereby improving the reliability of detection.

[0056] like Figure 7 As shown, preferably, the first color area 22 is formed by a first coating layer located at the edge of the second tray 20 .

[0057] In this embodiment, the second color area 23 is the original color of the graphite material of the second tray 20 , that is, the second tray 20 is not provided with a coating in the second color area 23 , and the second tray 20 is provided with a first coating in the first color area 22 .

[0058] By using the first color area 22 formed by the first coating located at the edge of the second tray 20, the thickness of the object generating the identification signal can be greatly reduced, even to the micron level, and the influence on the airflow during the rotation of the second tray 20 can be ignored. Thus, the processing quality of the wafers supported by the second tray 20 is guaranteed.

[0059] Figure 8 A top view of a first tray and a second tray in a wafer carrying device provided in Embodiment 1 of the present utility model; Figure 4 and Figure 8 As shown, preferably, the first pallet 10 is provided with a detection area 14, the color of the detection area 14 is different from the first color area 22 and the second color area 23; the distance between the detection area 14 and the rotation center of the first pallet 10 is equal to the first distance, and the first distance is the distance between the first coating and the rotation center of the first pallet 10 when the first coating is detected.

[0060] Specifically, the distance between the detection area 14 and the rotation center of the first pallet 10 is equal to the distance between the first coating and the rotation center of the first pallet 10 when the first coating is detected. Therefore, when the first pallet 10 rotates and the second pallet 20 also rotates, the color sensor 50 can detect the color of the detection area 14 of the first pallet 10 in addition to detecting the colors of the first color area 22 and the second color area 23. That is, the color sensor 50 can detect the mutual color changes among the first color area 22, the second color area 23 and the detection area 14. The interval time between the detection of the color of the detection area 14 can be used as a time reference for detecting the number of changes in the first color area 22 and the second color area 23, which is conducive to determining the rotation speed of the second pallet 20.

[0061] In another implementation, a detection area 14 may also be set in the first tray 10. The angle of the area where the second tray 20 sweeps the color sensor 50 relative to the rotation center of the first tray 10 during the rotation of the first tray 10 is divided by the actual rotation speed of the first tray 10 to obtain a time reference for detecting the number of changes in the first color area 22 and the second color area 23.

[0062] like Figure 4 and Figure 8 As shown, preferably, the distance between the detection area 14 and the rotation center of the first tray 10 is the shortest distance between the rotation centers of the second tray 20 and the first tray 10 .

[0063] Specifically, in this embodiment, the rotation center of the first tray 10, the detection area 14, and the rotation center of the second tray 20 are sequentially distributed from the inside to the outside along the radial direction of the first tray 10. When a second tray 20 is being detected, there is a moment when the three are collinear. Of course, at this time, the detection area 14 is blocked by the first color area 22 or the second color area 23 of the second tray 20.

[0064] The area that the color sensor 50 is facing is actually a part of the detection area 14 in the circumferential direction. When the area that the color sensor 50 is facing is the area where the second tray 20 is closest to the rotation center of the first tray 10, the edge of the second tray 20 is actually tangent to or close to the detection area 14. Therefore, the color sensor 50 can detect that the overlapping area of ​​the two has a larger length in the circumferential direction of the detection area 14, which is conducive to obtaining more changes in the first color area 22 and the second color area 23 at the edge of the second tray 20, and is conducive to improving the detection accuracy.

[0065] Of course, in another implementation, the area to which the color sensor 50 is directed may also be the area of ​​the second tray 20 that is farthest from the rotation center of the first tray 10, that is, the rotation center of the first tray 10, the rotation center of the second tray 20, and the area to which the color sensor 50 is directed are sequentially distributed from the inside to the outside along the radial direction of the first tray 10. By setting the area to which the color sensor 50 is directed at the area of ​​the second tray 20 that is farthest from the rotation center of the first tray 10, the edge of the second tray 20 and the detection area 14 are also in a tangent or nearly tangent state, and more changes of the first color area 22 and the second color area 23 at the edge of the second tray 20 can be obtained.

[0066] like Figure 6 As shown, preferably, the second tray 20 includes a second tray body and an O-ring 21 , the O-ring 21 is arranged at the edge of the second tray body, and the first coating is arranged on the upper surface of the O-ring 21 at intervals along the circumference of the O-ring 21 .

[0067] The first coating is disposed on the O-ring 21, and different O-rings 21 with different distribution amounts of the first coating on these O-rings 21 can be selected according to different rotational speeds of the second tray 20. For example, when the rotational speed of the second tray 20 is low, O-rings 21 with a high distribution amount of the first coating on each can be selected, and when the rotational speed of the second tray 20 is high, O-rings 21 with a low distribution amount of the first coating on each can be selected, thereby improving the detection accuracy of the second tray 20 at a low rotational speed.

[0068] In another implementation, the O-ring may not be provided separately, and the first coating may be directly provided on the edge of the second tray to form the first color area 22 .

[0069] like Figure 7 As shown, preferably, the number of first color areas 22 is n, n is an even number greater than zero, the central angle of each first color area 22 on the O-ring 21 is 180° / n, and n evenly spaced areas on the upper surface of the O-ring 21 are provided with a first coating.

[0070] Specifically, in this embodiment, n is 6. The corresponding central angle of each first coating on the O-ring 21 is 25° to 35°, and further, the central angle of each first coating on the O-ring 21 is 30°. That is, on each second tray 20, the number of the first color area 22 and the second color area 23 at the edge position is six, the central angle is also 30°, and they are evenly spaced.

[0071] The amount of the first coating on each O-ring 21 is set to the above value, which can cover the existing normal rotation speed range of the second tray 20 , thereby meeting the need for detecting the rotation speed of the second tray 20 .

[0072] like Figure 6 As shown, preferably, the second tray body is provided with a boss, and at least a portion of the inner circumference of the O-ring 21 cooperates with the outer circumference of the boss.

[0073] Specifically, the cross section of the O-ring 21 is roughly in an inverted L-shape, and the top of the O-ring 21 protrudes upward from the upper surface of the second tray body. The portion of the O-ring 21 protruding upward from the second tray body can radially position the wafer placed on the second tray 20. Moreover, by adopting an inverted L-shaped cross section, the width of the upper surface of the O-ring 21, that is, the radial dimension of the second tray 20, can be increased, thereby increasing the width of the first color area 22 and the second color area 23 to improve the reliability of being recognized by the color sensor 50. In this embodiment, the lower part of the inner circumference of the O-ring 21 cooperates with the outer circumference of the boss. If only considering the technical problem to be solved by the present application, the O-ring 21 can also cooperate with the outer circumference of the boss at all heights.

[0074] The O-ring 21 is arranged so that its inner circumference cooperates with the outer circumference of the boss, so that the radial position of the O-ring 21 can be precisely positioned, thereby reducing the jitter of the first color area 22 and the second color area 23 when the second tray 20 rotates, thereby ensuring the smooth operation of color detection.

[0075] Preferably, the first coating is made of zirconium oxide.

[0076] Zirconia material is used as the first coating, which has good high temperature resistance and can remain stable even at the highest process temperature of 800°C in wafer processing.

[0077] like Figure 7As shown, preferably, the detection area 14 is provided with a second coating.

[0078] By providing the second coating, the color of the detection area 14 can be different from the color of the second tray 20 , so that the second color area 23 of the second tray 20 is distinguished from the detection area 14 of the first tray 10 , so as to facilitate obtaining the number of changes in the first color area 22 and the second color area 23 of the second tray 20 .

[0079] Preferably, the color of the detection area 14 in the first tray 10 is gold.

[0080] The detection area 14 of the first tray 10 is golden in color, which is different from the colors of the first color area 22 and the second color area 23 , so as to facilitate determining the start and end time of the second tray 20 passing through the area toward which the color sensor 50 is directed.

[0081] Embodiment 2:

[0082] Embodiment 2 also provides a semiconductor process equipment, including: a process chamber; the above-mentioned wafer carrier, the wafer carrier is arranged in the process chamber; and a color sensor 50, the color sensor 50 is used to detect the switching of the second color area 23 and the first color area 22 when the second tray 20 rotates.

[0083] By setting the above-mentioned semiconductor process chamber in the semiconductor process equipment, accordingly, the semiconductor process equipment has all the advantages of the above-mentioned semiconductor process chamber, which will not be described one by one here.

[0084] like Figure 4 As shown, preferably, the process chamber includes a chamber cover, the chamber cover is provided with a detection port, and the color sensor 50 is installed outside the detection port and can perform detection through the detection port.

[0085] By providing a detection port on the chamber cover, the color sensor 50 can be disposed outside the chamber cover, thereby preventing the color sensor 50 from being in a high temperature state, and improving the service life of the color sensor 50.

[0086] Fig. 9 The flowchart of the operation principle of the semiconductor process equipment provided by the second embodiment of the utility model is as follows: Fig. 9 As shown, the action principle of this embodiment is:

[0087] First, the wafer is transferred into the process chamber.

[0088] Then, the temperature and pressure in the process chamber are controlled to meet the process requirements; wherein, air can be introduced into the semiconductor process chamber in sequence through the upper cover recent module and the chamber air intake module 90, wherein the upper cover air intake module 80 is located approximately at the center of the upper side of the chamber cover body, and the chamber air intake module 90 is located approximately at the center of the inner side of the chamber cover body.

[0089] Then, the rotary air intake for driving the second trays 20 to rotate is controlled, wherein the flow rate of the airflow for driving each second tray 20 is controlled by a mass flow controller 70 respectively.

[0090] Detect the rotation speed of the second tray 20. Specifically, at room temperature, the color of the second color area 23 is the color of the graphite O-ring 21 itself, the color of the first color area 22 is the white of the first coating, and the color of the detection area 14 is the gold of the second coating. Although the colors of the O-ring 21, the first coating, and the second coating change due to the increase in the temperature in the chamber during the process, the color sensor 50 can achieve stable detection under different light intensities or colors of the same color system as long as there is a slight color difference. When the color sensor 50 detects that the color changes to white and gold, the corresponding channel will output a corresponding signal. Within the departure time T (s) of the two detections of the color changing to gold, according to the number of rising edges X corresponding to the white channel, the corresponding rotation speed V (rpm / min) of the second tray 20 can be calculated: V = 60 / {T / [(X-1)*n]}, where n is the number of the first color area 22 on each second tray 20, and this formula is applicable to the case where the rotation direction of the first tray 10 is opposite to the rotation direction of the second tray 20.

[0091] Then, the average rotation speed is calculated based on the rotation speed of each second tray 20. Although the rotation speed of each second tray 20 is the rotation speed of the corresponding second tray 20 when it passes under the color sensor 50, strictly speaking, it is not the rotation speed of each second tray 20 at the same time, but it can be approximately considered as the rotation speed of each second tray 20, and the rotation speeds of these second trays 20 can be averaged to obtain the average rotation speed.

[0092] Then, the difference between the rotation speed of each second tray 20 and the average rotation speed is calculated.

[0093] Then, according to the corresponding relationship between the flow rate and the rotation speed, the gas flow rate for driving each second tray 20 is adjusted by the mass flow controller 70 to adjust the rotation speed of each second tray 20 .

[0094] Then, the consistency of the rotation speeds of the second trays 20 is determined. If they are consistent, the control process ends. If they are inconsistent, the rotation speeds of the second trays 20 continue to be detected.

[0095] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

[0096] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0097] In the above embodiments, the descriptions of directions such as “upper” and “lower” are all based on the drawings.

[0098] The above description of the disclosed embodiments enables professionals in the field to implement or use the utility model. Various modifications to these embodiments will be apparent to professionals in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model.

[0099] Therefore, the present invention will not be limited to the embodiments shown herein but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer carrying device, characterized in that: include: A first tray (10); A second tray (20), wherein a plurality of the second trays (20) are rotatably disposed on the first tray (10), the edge of the second tray (20) having a first color area (22) and a second color area (23) of different colors, the first color area (22) and the second color area (23) being evenly and alternately arranged in a circumferential direction at the edge of the second tray (20), and the switching between the second color area (23) and the first color area (22) when the second tray (20) is rotated is configured to be detectable by a color sensor (50).

2. The wafer carrier device according to claim 1, characterized in that: The first color zone (22) is formed by a first coating located at the edge of the second tray (20).

3. The wafer carrier device according to claim 2, characterized in that: The first tray (10) is provided with a detection area (14), the color of the detection area (14) is different from the first color area (22) and the second color area (23); the distance between the detection area (14) and the rotation center of the first tray (10) is equal to a first distance, and the first distance is the distance between the first coating and the rotation center of the first tray (10) when the first coating is detected.

4. The wafer carrier device according to claim 3, characterized in that: The distance between the detection area and the rotation center of the first tray (10) is the shortest distance between the rotation centers of the second tray (20) and the first tray (10).

5. The wafer carrier device according to claim 4, characterized in that: The second tray (20) comprises a second tray body and an O-ring (21), wherein the O-ring (21) is arranged on the edge of the second tray body, and the first coating is arranged on the upper surface of the O-ring (21) at intervals along the circumference of the O-ring (21).

6. The wafer carrier device according to claim 5, characterized in that: The number of the first color areas (22) is n, where n is an even number greater than zero, the central angle corresponding to each of the first color areas (22) on the O-ring (21) is 180° / n, and the first coating is provided in n evenly spaced areas on the upper surface of the O-ring (21).

7. The wafer carrying device according to claim 5, characterized in that: The second tray body is provided with a boss, and at least a part of the inner circumference of the O-ring (21) is matched with the outer circumference of the boss.

8. The wafer carrying device according to claim 2, characterized in that: The first coating is made of zirconium oxide.

9. The wafer carrier device according to any one of claims 3 to 7, characterized in that: The detection area (14) is provided with a second coating.

10. The wafer carrier device according to any one of claims 3 to 8, characterized in that: The color of the detection area (14) in the first tray (10) is golden.

11. A semiconductor process equipment, characterized in that: include: Process chamber; The wafer carrier device according to any one of claims 1 to 10, arranged in the process chamber; And, a color sensor (50), wherein the color sensor (50) is used to detect the switching between the second color area (23) and the first color area (22) when the second tray (20) rotates.

12. The semiconductor process equipment according to claim 11, characterized in that: The process chamber comprises a chamber cover, the chamber cover is provided with a detection port, and the color sensor (50) is installed outside the detection port and can perform detection through the detection port.

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