Glass-based circuit board sintering device

Abstract

The utility model discloses a glass-based circuit board sintering device. The glass-based circuit board sintering device comprises a sliding table module, a sintering module and a first air inlet unit, a shell is arranged on the sliding table module, a cavity is formed between the shell and the sliding table module, a supporting table is arranged on the sliding table module, the supporting table is in a plate shape, the upper surface of the supporting table is a plane, the supporting table is used for containing a base plate, openings are formed in the two ends of the shell and are the feeding port and the discharging port respectively, and the feeding port and the discharging port are communicated with each other. The sliding table module is used for driving the supporting table to do linear reciprocating motion in the direction of the feeding port and the discharging port, the sintering module is arranged in the shell and used for heating a substrate, and the first air inlet unit is arranged on the shell and used for providing nitrogen into the cavity. And the first air inlet unit is positioned at one end of the feeding hole. The nitrogen-saving device has the advantages that nitrogen is saved, the production cost is reduced, and the rate of finished products is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of glass-based circuit board manufacturing, and in particular relates to a glass-based circuit board sintering device. Background Art

[0002] In the process of glass-based sintering of metal, it is necessary to carry out in a specific oxygen-free environment. At present, a circulating transmission conveyor belt is mostly used to transport the substrate into the sintering device, and then nitrogen is filled into the sintering device to form an air curtain to prevent air from entering the sintering device from both ends of the sintering device. However, due to the low flatness of the conveyor belt, in order to avoid collision caused by the ups and downs of the conveyor belt, the distance between the sintering device and the conveyor belt is large, resulting in a large amount of nitrogen required to achieve an oxygen-free environment in the sintering device. In order to save nitrogen, a glass-based circuit board sintering device is proposed. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] To this end, the utility model proposes a glass-based circuit board sintering device, which has the advantages of saving nitrogen, reducing production costs and improving the yield rate.

[0005] According to the glass-based circuit board sintering device of the embodiment of the utility model, it includes: a slide module, a sintering module, and a first air inlet unit; the slide module is provided with a shell, a chamber is formed between the shell and the slide module, the slide module is provided with a support, the support is plate-shaped, the upper surface of the support is flat, the support is used to place the substrate, both ends of the shell have openings, which are a feed port and a discharge port respectively, the slide module is used to drive the support to move back and forth in a straight line along the feed port and the discharge port, the sintering module is arranged inside the shell, the sintering module is used to heat the substrate, the first air inlet unit is arranged on the shell, the first air inlet unit is used to provide nitrogen to the chamber, and the first air inlet unit is located at one end of the feed port.

[0006] According to an embodiment of the utility model, a second air inlet unit is further provided on the shell, the second air inlet unit is located at one end of the discharge port, and the sintering module is located between the first air inlet unit and the second air inlet unit.

[0007] According to an embodiment of the utility model, an air extraction unit is further provided on the shell, and the air extraction unit is provided between the sintering module and the second air inlet unit.

[0008] According to an embodiment of the present invention, there are multiple second air inlet units, and the multiple second air inlet units are arranged at intervals along the moving direction of the support platform.

[0009] According to an embodiment of the present invention, the air extraction unit and a plurality of second air inlet units are arranged side by side, and the air extraction unit is arranged between the plurality of second air inlet units.

[0010] According to an embodiment of the utility model, the first air inlet unit includes a heating component, and the heating component is used to heat the nitrogen supplied by the first air inlet unit.

[0011] According to an embodiment of the utility model, the sintering module and the slide module are arranged opposite to each other, and the lower surface of the sintering module and the inner surface of the upper part of the shell are located on the same plane.

[0012] According to an embodiment of the utility model, a carrier is provided on the support platform, and the carrier is used to carry the substrate.

[0013] According to an embodiment of the present invention, a groove for placing the substrate is formed on the carrier.

[0014] According to an embodiment of the utility model, the distance between the inner surface of the upper part of the shell and the upper surface of the substrate is 0.2-0.3mm.

[0015] The beneficial effect of the utility model is that the utility model adopts a slide module to drive the support table to transport the substrate, thereby ensuring that the substrate is always at the same distance from the inner surface of the upper part of the shell during the movement. Therefore, while avoiding the collision between the substrate and the shell, the requirement for the distance between the substrate and the inner surface of the upper part of the shell is reduced, thereby reducing the amount of nitrogen used. Only a small amount of nitrogen is used to form an air curtain at the feed port and the discharge port, isolating oxygen and preventing oxygen from entering the chamber.

[0016] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments of the present invention, in which:

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a partial cross-sectional schematic diagram of the housing of the utility model;

[0021] Figure 3 It is a schematic diagram of the substrate and slide module of the utility model;

[0022] Figure 4 It is a top view schematic diagram of the overall structure of the utility model;

[0023] Reference numerals:

[0024] 1. Slide module; 11. Support platform; 12. Carrier; 13. Shell; 2. Sintering module; 3. First air inlet unit; 31. Heating component; 41. Second air inlet unit; 42. Exhaust unit; 5. Substrate. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The glass-based circuit board sintering device according to an embodiment of the utility model will be described in detail below with reference to the accompanying drawings.

[0029] like Figure 1-Figure 4As shown, according to the glass-based circuit board sintering device of the embodiment of the utility model, it includes: a slide module 1, a sintering module 2, and a first air inlet unit 3; the slide module 1 is provided with a shell 13, and a chamber is formed between the shell 13 and the slide module 1, and the slide module 1 is provided with a support 11, the support 11 is plate-shaped, and the upper surface of the support 11 is flat, and the support 11 is used to place the substrate 5, and both ends of the shell 13 have openings, which are a feed port and a discharge port respectively, and the slide module 1 is used to drive the support 11 to move back and forth in a straight line along the feed port and the discharge port. The sintering module 2 is arranged inside the shell 13, and the sintering module 2 is used to heat the substrate 5. The first air inlet unit 3 is arranged on the shell 13, and the first air inlet unit 3 is used to provide nitrogen to the chamber, and the first air inlet unit 3 is located at one end of the feed port.

[0030] In this embodiment, the sintering module 2 is an ultrafast infrared heater, which uses infrared rays to heat the substrate 5. The support 11 is installed on the output end of the slide module 1; the slide module 1 drives the support 11 to transport the substrate 5. After the substrate 5 enters the chamber, the sintering module 2 is used to achieve high-temperature sintering. After the sintering is completed, the slide module 1 transports the substrate 5 out of the discharge port. After the substrate 5 is removed, the slide module 1 drives the support 11 to reset for the next round of transportation; in this process, since the slide module 1 is a linear reciprocating motion, the slide module 1 is moved upward. The support table 11 can realize linear reciprocating movement in a horizontal state. Compared with the conveyor belt transportation using circular transportation in the prior art, it has higher stability and ensures that the substrate 5 is always at the same distance from the inner surface of the upper part of the shell 13 during the movement. Therefore, while avoiding the collision between the substrate 5 and the shell 13, the requirement for the distance between the substrate 5 and the upper inner surface of the shell 13 is reduced, thereby reducing the amount of nitrogen used. Only a small amount of nitrogen can form an air curtain at the feed port and the discharge port to isolate oxygen and prevent oxygen from entering the chamber.

[0031] A second air inlet unit 41 is further provided on the housing 13 . The second air inlet unit 41 is located at one end of the discharge port. The sintering module 2 is located between the first air inlet unit 3 and the second air inlet unit 41 .

[0032] In this embodiment, the first air inlet unit 3 and the second air inlet unit 41 are used to form air curtains at the feed port and the discharge port respectively to isolate oxygen, thereby improving the isolation speed and ensuring the isolation performance. The second air inlet unit 41 is used to reduce the flow rate of nitrogen supplied by the first air inlet unit 3 to the discharge port. Therefore, after the substrate 5 is away from the sintering module 2, the nitrogen supplied by the first air inlet unit 3 is reduced to bring heat to the substrate 5. At the same time, the nitrogen supplied by the second air inlet unit 41 has a preliminary cooling effect on the substrate 5.

[0033] The housing 13 is further provided with an air extraction unit 42 , which is disposed between the sintering module 2 and the second air inlet unit 41 .

[0034] There are multiple second air inlet units 41 , and the multiple second air inlet units 41 are arranged at intervals along the moving direction of the support platform 11 .

[0035] The air extraction unit 42 and the plurality of second air inlet units 41 are arranged side by side, and the air extraction unit 42 is arranged between the plurality of second air inlet units 41 .

[0036] In this embodiment, the exhaust unit 42 is used to absorb part of the nitrogen blown toward the substrate 5 by the second air inlet unit 41, so that the nitrogen can remove part of the heat on the substrate 5, further improving the cooling speed of the substrate 5 and shortening the cooling time of the substrate 5, so that the substrate 5 can be taken out of the discharge port, thereby shortening the travel of the substrate 5 after being transported out of the discharge port, thereby speeding up the production speed.

[0037] At least one second air inlet unit 41 close to the discharge port is away from the exhaust unit 42 to reduce the influence of the exhaust unit 42 on the flow direction of nitrogen supplied by the second air inlet unit 41, so that a large amount of nitrogen supplied by the second air inlet unit 41 flows toward the discharge port to ensure that an air curtain is formed at the discharge port to isolate oxygen.

[0038] The first air inlet unit 3 includes a heating component 31 , and the heating component 31 is used to heat the nitrogen supplied by the first air inlet unit 3 .

[0039] In this embodiment, when the first air inlet unit 3 supplies nitrogen into the chamber, the heating component 31 heats the nitrogen, and the heat is less than the heat of the sintering module 2, so as to realize the preheating function of the substrate 5, avoid deformation caused by large temperature difference between the substrates 5, and improve the qualified rate of the finished product.

[0040] The sintering module 2 is arranged opposite to the slide module 1 , and the lower surface of the sintering module 2 and the inner surface of the upper portion of the housing 13 are located on the same plane.

[0041] In this embodiment, the height requirement of the chamber is reduced, nitrogen is saved, and production costs are reduced.

[0042] The first air inlet unit 3, the second air inlet unit 41 and the exhaust unit 42 all include air vents, which are connected to the chamber to supply or extract nitrogen. The width of the air vents is not less than the width of the feed port and the discharge port to ensure that the air curtain formed at the feed port and the discharge port can cover the corresponding feed port and the discharge port to prevent oxygen from entering the chamber.

[0043] A carrier 12 is provided on the support 11, and the carrier 12 is used to carry the substrate 5; a groove for placing the substrate 5 is formed on the carrier 12, which is used to limit the substrate 5. When the substrate 5 is placed in the groove, the upper surface of the substrate 5 and the upper surface of the carrier 12 are located in the same plane, so as to reduce the requirement for the chamber height.

[0044] The distance between the inner surface of the upper part of the shell 13 and the upper surface of the substrate 5 is 0.2-0.3mm.

[0045] The substrate 5 can be made of glass or other materials according to user needs. The first air inlet unit 3 and the second air inlet unit 41 are connected to a nitrogen gas source through a pipeline.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A glass-based circuit board sintering device, characterized in that: include: A slide module (1), wherein a shell (13) is provided on the slide module (1), a chamber is formed between the shell (13) and the slide module (1), a support (11) is provided on the slide module (1), the support (11) is plate-shaped, the upper surface of the support (11) is a plane, the support (11) is used to place a substrate (5), both ends of the shell (13) have openings, which are a feed port and a discharge port, respectively, and the slide module (1) is used to drive the support (11) to move back and forth in a straight line along the feed port and the discharge port; A sintering module (2), the sintering module (2) being arranged inside the housing (13), and the sintering module (2) being used to heat the substrate (5); A first air inlet unit (3), wherein the first air inlet unit (3) is arranged on the housing (13), and the first air inlet unit (3) is used to provide nitrogen into the chamber, and the first air inlet unit (3) is located at one end of the feed port.

2. The glass-based circuit board sintering device according to claim 1, characterized in that: The housing (13) is also provided with a second air inlet unit (41), the second air inlet unit (41) is located at one end of the discharge port, and the sintering module (2) is located between the first air inlet unit (3) and the second air inlet unit (41).

3. The glass-based circuit board sintering device according to claim 2, characterized in that: The housing (13) is also provided with an air extraction unit (42), and the air extraction unit (42) is arranged between the sintering module (2) and the second air inlet unit (41).

4. The glass-based circuit board sintering device according to claim 3, characterized in that: There are a plurality of the second air inlet units (41), and the plurality of the second air inlet units (41) are arranged at intervals along the moving direction of the support platform (11).

5. The glass-based circuit board sintering device according to claim 4, characterized in that: The air extraction unit (42) and the plurality of second air inlet units (41) are arranged side by side, and the air extraction unit (42) is arranged between the plurality of second air inlet units (41).

6. The glass-based circuit board sintering device according to claim 1, characterized in that: The first air inlet unit (3) comprises a heating component (31), and the heating component (31) is used to heat the nitrogen supplied by the first air inlet unit (3).

7. The glass-based circuit board sintering device according to claim 1, characterized in that: The sintering module (2) and the slide module (1) are arranged opposite to each other, and the lower surface of the sintering module (2) and the inner surface of the upper part of the shell (13) are located on the same plane.

8. The glass-based circuit board sintering device according to claim 1, characterized in that: A carrier (12) is provided on the support platform (11), and the carrier (12) is used to carry the substrate (5).

9. The glass-based circuit board sintering device according to claim 8, characterized in that: The carrier (12) is formed with a groove for placing the substrate (5).

10. The glass-based circuit board sintering device according to claim 1, characterized in that: The distance between the inner surface of the upper part of the shell (13) and the upper surface of the substrate (5) is 0.2-0.3 mm.

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