Positioning jig for semiconductor test

Abstract

A positioning jig for semiconductor testing comprises a bottom plate, a plurality of top plates are arranged on the bottom plate, and the top plates play a role in supporting and positioning the lower end of a semiconductor. The two ends of the bottom plate are each provided with a pair of guide rods, limiting nuts are arranged at the upper ends of the guide rods, the upper ends of the guide rods are sleeved with movable plates, springs are arranged between the movable plates and the bottom plate, the guide rods are sleeved with the springs, a plurality of inserting sleeves are arranged on the lower walls of the movable plates, and the inserting sleeves and the top plates are in one-to-one correspondence. The semiconductor is further limited through the arranged plug bushes so as to ensure the accuracy during the test, and the semiconductor can be ejected out through the top plate by moving the movable plate after the test is completed, so that the semiconductor can be conveniently taken out. A side plate is arranged on the movable plate, a first air cylinder is installed on the bottom plate, the movable end of the first air cylinder is arranged on the movable plate, and the movable plate can be driven to ascend and descend through the provided first air cylinder.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a positioning fixture for semiconductor testing. Background Art

[0002] like Figure 3 The figure shows a three-dimensional structure diagram of a semiconductor. The package of the semiconductor is a rectangular structure, and one of the corners of the lower end of the package is chamfered. At the same time, a central hole is opened on the package, and four pins are arranged on the package. After the semiconductor is packaged, it needs to be tested by a test device. The test device currently used includes a base, and a test head is movably arranged on the upper end of the base. When testing, the operator presses the test head to insert the pin into the test head, and then performs the test operation. However, this test device has a low positioning accuracy for the semiconductor, so it is easy to cause the pin to bend during the test process, or fail to form an electrical connection, which brings great problems to the test of semiconductor devices. Utility Model Content

[0003] The utility model provides a positioning fixture for semiconductor testing, which solves the deficiencies of the prior art and can accurately position the semiconductor, thereby facilitating the testing operation of the semiconductor and having strong practicability.

[0004] In order to achieve the purpose of this utility model, the following technologies are proposed:

[0005] A positioning fixture for semiconductor testing includes a bottom plate, on which a plurality of top plates are arranged, and the top plates play a role in supporting and positioning the lower end of the semiconductor. A pair of guide rods are respectively arranged at both ends of the bottom plate, and a limit nut is arranged at the upper end of the guide rod, and a movable plate is sleeved on the upper end of the guide rod. A spring is arranged between the movable plate and the bottom plate, and the spring is sleeved on the guide rod. A plurality of insert sleeves are arranged on the lower wall of the movable plate, and the insert sleeves and the top plates are in a one-to-one correspondence. The semiconductor is further limited by the set insert sleeves to ensure the accuracy during the test, and the movable plate can be moved after the test is completed, so as to eject the semiconductor through the top plate, thereby facilitating the removal of the semiconductor. A side plate is arranged on the movable plate, and a first cylinder is installed on the bottom plate. The movable end of the first cylinder is arranged on the movable plate, and the movable plate can be driven to move up and down by the provided first cylinder.

[0006] Furthermore, one of the corners of the upper end of the top plate is a wedge-shaped block, and the inclined surface provided on the wedge-shaped block can act on the inclined surface of the semiconductor, thereby achieving the purpose of positioning the semiconductor.

[0007] Further, a vertical plate is installed on the movable plate, an L-shaped plate is provided at the lower end of the vertical plate, a spline shaft is penetrated at the upper end of the L-shaped plate, an inner plate is provided at the inner end of the spline shaft, a clamping rod is provided on the inner plate, an outer push plate is installed at the outer end of the spline shaft, a second spring is provided between the inner plate and the L-shaped plate, the second spring is sleeved on the spline shaft, an inclined hole is opened on the outer push plate, an angle is formed between the length direction of the inclined hole and the vertical direction, an action rod is provided in the inclined hole, an L-shaped arm is provided on the action rod, a pressure block is provided at the inner end of the L-shaped arm, a vertical guide rod is sleeved on the pressure block, a third spring is sleeved on the vertical guide rod, a mounting end plate is provided at the lower end of the vertical guide rod, the mounting end plate is installed on the side plate, a cylinder is installed on the side plate, a push-down plate is installed at the movable end of the cylinder, the push-down plate is installed on the pressure block, and the clamping rod can be penetrated in the middle hole of the semiconductor, thereby positioning the semiconductor. The setting of the action rod and the inclined hole enables the clamping rod to be extended and pulled out, thereby performing positioning control. Through the components provided above, when conducting semiconductor testing, the jig can be set on a rotating device such as a rotating cylinder or a motor, and the jig can be rotated to a certain position by the rotating device, and then the semiconductor can be placed and positioned. Thereafter, the semiconductor can be driven to rotate again so that the pins of the semiconductor are facing the test head, so as to perform the testing operation, and then the jig can be rotated again and the semiconductor can be unloaded.

[0008] The advantages of the above technical solution are:

[0009] The utility model facilitates the testing of semiconductors and can accurately position the semiconductors during the testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings.

[0011] Figure 1 The three-dimensional structure of one embodiment is shown Figure 1 .

[0012] Figure 2 The three-dimensional structure of one embodiment is shown Figure 2 .

[0013] Figure 3 A three-dimensional structure diagram of a semiconductor is shown. DETAILED DESCRIPTION

[0014] like Figure 1~Figure 3As shown, a positioning fixture for semiconductor testing includes a bottom plate 1, on which a plurality of top plates 10 are arranged, and a wedge-shaped block is formed at one corner of the upper end of the top plate 10. A pair of guide rods 2 are respectively arranged at both ends of the bottom plate 1, and a limit nut 21 is arranged at the upper end of the guide rod 2. A movable plate 3 is sleeved on the upper end of the guide rod 2, and a spring 20 is arranged between the movable plate 3 and the bottom plate 1. The spring 20 is sleeved on the guide rod 2, and a plurality of insert sleeves 31 are arranged on the lower wall of the movable plate 3, and the insert sleeves 31 are in a one-to-one correspondence with the top plate 10. A side plate 30 is arranged on the movable plate 3, and a first cylinder 6 is installed on the bottom plate 1, and the movable end of the first cylinder 6 is arranged on the movable plate 3.

[0015] When conducting a test, the operator inserts the semiconductor into the socket 31, and places the lower end of the semiconductor on the top plate 10, and then presses down the test head set just above the movable plate 3. When the test head moves downward, the pins of the semiconductor are inserted into the test head. After the insertion is completed, the test operation is performed. After the test is completed, the test head moves upward, and then the movable plate 3 moves downward under the drive of the first cylinder 6. Thereafter, the top plate 10 pushes the semiconductor out.

[0016] In addition, in another embodiment, the bottom plate 1 can be rotatably arranged on the indexing rotation mechanism, the indexing rotation mechanism is connected to a motor, a vertical plate is installed on the movable plate 3, an L-shaped plate 4 is provided at the lower end of the vertical plate, a spline shaft 40 is penetrated at the upper end of the L-shaped plate 4, an inner plate 49 is provided at the inner side end of the spline shaft 40, a clamping rod 50 is provided on the inner plate 49, an outer push plate 41 is installed at the outer side end of the spline shaft 40, a second spring 51 is provided between the inner plate 49 and the L-shaped plate 4, the second spring 51 is sleeved on the spline shaft 40, and an inclined hole is opened on the outer push plate 41 42, there is an angle between the length direction of the inclined hole 42 and the vertical direction, an action rod 43 is arranged in the inclined hole 42, an L-shaped arm 44 is arranged on the action rod 43, a pressure block 45 is arranged on the inner end of the L-shaped arm 44, a vertical guide rod 46 is sleeved on the pressure block 45, a third spring 47 is sleeved on the vertical guide rod 46, a mounting end plate 48 is arranged at the lower end of the vertical guide rod 46, the mounting end plate 48 is mounted on the side plate 30, a cylinder 7 is mounted on the side plate 30, a push-down plate 70 is mounted on the movable end of the cylinder 7, and the push-down plate 70 is mounted on the pressure block 45.

[0017] In this embodiment, the bottom plate 1 is first rotated by the indexing rotation mechanism so that the upper wall of the bottom plate 1 faces one side, and then the operator inserts the semiconductor devices into the socket 31 in sequence. After the socket 31 is completed, the cylinder 7 is started to drive the lower push plate 70 to move. When the lower push plate 70 moves, it will drive the pressure block 45 to move. During the movement, the third spring 47 will be compressed. At the same time, when the pressure block 45 moves, it will drive the action rod 43 to move, and the movement of the action rod 43 will cause it to act on the inclined hole 42. , thereby moving the push plate 41. The movement of the push plate 41 will cause the clamping rod 50 to be inserted into the socket 31 and the middle hole of the semiconductor, and complete the positioning operation of the semiconductor. The semiconductor is then driven to rotate by the motor. After that, the test head is moved to complete the test operation of the semiconductor. After the test is completed, the semiconductor is rotated to the other side by the motor again, and then the clamping rod 50 is removed from the middle hole by the cylinder 7. Then the movable plate 3 is driven to move by the first cylinder 6, and the semiconductor is ejected by the top plate 10.

[0018] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is also intended to include these modifications and variations.

Claims

1. A semiconductor testing positioning fixture, characterized in that: It comprises a bottom plate (1), wherein a plurality of top plates (10) are arranged on the bottom plate (1); A pair of guide rods (2) are respectively provided at both ends of the bottom plate (1), a limit nut (21) is provided at the upper end of the guide rod (2), a movable plate (3) is sleeved on the upper end of the guide rod (2), a spring (20) is provided between the movable plate (3) and the bottom plate (1), the spring (20) is sleeved on the guide rod (2), a plurality of insert sleeves (31) are provided on the lower wall of the movable plate (3), and the insert sleeves (31) and the top plate (10) are in a one-to-one correspondence relationship; A side plate (30) is provided on the movable plate (3), a first cylinder (6) is installed on the bottom plate (1), and a movable end of the first cylinder (6) is provided on the movable plate (3).

2. The semiconductor testing positioning fixture according to claim 1, characterized in that: A wedge-shaped block is formed at one of the corners of the upper end of the top plate (10).

3. The semiconductor testing positioning fixture according to claim 1, characterized in that: A vertical plate is mounted on the movable plate (3), an L-shaped plate (4) is mounted at the lower end of the vertical plate, a spline shaft (40) is passed through the upper end of the L-shaped plate (4), an inner plate (49) is mounted at the inner end of the spline shaft (40), a clamping rod (50) is mounted on the inner plate (49), an outer push plate (41) is mounted at the outer end of the spline shaft (40), a second spring (51) is mounted between the inner plate (49) and the L-shaped plate (4), the second spring (51) is sleeved on the spline shaft (40), an inclined hole (42) is opened on the outer push plate (41), and an angle is formed between the length direction of the inclined hole (42) and the vertical direction. An action rod (43) is provided in the inclined hole (42), an L-shaped arm (44) is provided on the action rod (43), a pressure block (45) is provided at the inner end of the L-shaped arm (44), a vertical guide rod (46) is sleeved on the pressure block (45), a third spring (47) is sleeved on the vertical guide rod (46), a mounting end plate (48) is provided at the lower end of the vertical guide rod (46), the mounting end plate (48) is mounted on the side plate (30), a cylinder (7) is mounted on the side plate (30), a push-down plate (70) is mounted on the movable end of the cylinder (7), and the push-down plate (70) is mounted on the pressure block (45).

Images