Edge photoresist removing device

Abstract

The utility model provides an edge photoresist removing device, which comprises an acquisition unit for acquiring the actual position of a wafer on a bearing table and obtaining the offset between the actual position of the wafer and the standard position of the wafer on the bearing table; the wafer transmission manipulator is used for correcting the position of the next wafer on the bearing table according to the offset; the detection unit is arranged on the EBR manipulator and is used for detecting the edge position of the wafer on the bearing table; and the EBR spraying unit is arranged on the EBR mechanical arm, and the EBR mechanical arm drives the EBR spraying unit to move by a set distance in the radial direction of the wafer so as to carry out EBR starting from the edge position of the wafer detected by the detection unit. According to the utility model, the deviation of the wafer transmission manipulator and the EBR manipulator can be corrected in real time, so that the EBR trimming width of each wafer can be accurately adjusted in real time, the EBR precision is improved, the manpower is saved, and the production efficiency of a machine is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to an edge photoresist removal device. Background Art

[0002] Photoresist is applied to the wafer by spraying the photoresist onto the rotating wafer. The process of removing the photoresist at the edge of the wafer is called EBR (Edge bead removal), which is used to remove the photoresist at the edge of the wafer. Edge bead removal can effectively reduce the contamination caused by the wafer during the transmission and transfer process, effectively protect the wafer process layer and reduce the contamination to the subsequent process equipment.

[0003] However, after the TRACK (coating and developing equipment) EBR OOC (Out of control, out of control or exceeding specifications), the equipment engineer needed to shut down the machine for a long time to adjust the EBR, which affected production capacity and product quality.

[0004] The method of adjusting EBR in the prior art generally includes: aligning the wafer notch at a certain angle; stopping the production of related equipment, performing EBR in the TRACK, and checking the EBR width with a measuring device; adjusting the parameters of the wafer transfer robot and the EBR robot according to the measured EBR width; then checking the EBR width again with a measuring device to determine whether it meets the specification requirements; repeating the above steps until the EBR width meets the specification requirements.

[0005] The above method takes a long time to restore the machine, and the measurement equipment is not accurate, which affects the measurement results. In addition, manual input of parameters may result in errors, and problems cannot be discovered and adjusted in real time. Utility Model Content

[0006] The purpose of the utility model is to provide an edge photoresist removal device, which can adjust the EBR cutting width of each wafer in real time and accurately, improve the accuracy of EBR, save manpower, and improve the production efficiency of the machine.

[0007] In order to solve the above technical problems, the utility model provides an edge photoresist removal device, comprising:

[0008] A collection unit collects the actual position of the wafer on the carrier and obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier;

[0009] The wafer transfer robot corrects the position of the next wafer placed on the carrier according to the offset;

[0010] A detection unit, disposed on the EBR robot, detects an edge position of the wafer on the carrier; and

[0011] The EBR spray unit is arranged on the EBR robot. Starting from when the detection unit detects the edge position of the wafer, the EBR robot drives the EBR spray unit to move a set distance along the radial direction of the wafer to perform EBR.

[0012] Optionally, the collection unit is arranged at an edge of a standard position of the wafer on the carrier.

[0013] Optionally, the edge photoresist removal device includes four collection units, and the four collection units are evenly arranged at the edge of the standard position.

[0014] Optionally, a line connecting two of the collection units is parallel to a transmission direction of the wafer when it is placed on the carrier, and a line connecting another two of the collection units is perpendicular to the transmission direction of the wafer when it is placed on the carrier.

[0015] Optionally, the acquisition unit includes a corresponding light source and a camera, the light emitted by the light source is transmitted to the camera, part of the light is blocked by the wafer, and the position of the edge of the wafer is obtained based on the blocked shadow.

[0016] Optionally, the wafer has a wafer notch, and the collection unit deviates from the wafer notch.

[0017] Optionally, the light source is an LED light source, the camera is a CCD camera, and the supporting platform is a supporting platform in a coating unit.

[0018] Optionally, the detection unit is a sensor.

[0019] Optionally, there is a fixed interval between the detection unit and the EBR spraying unit, and compared with the EBR spraying unit, the detection unit is closer to the wafer.

[0020] Optionally, the EBR spraying unit is an EBR nozzle.

[0021] Compared with the prior art, the edge photoresist removal device provided by the utility model includes: a collection unit, which collects the actual position of the wafer on the carrier table and obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier table; a wafer transfer robot, which corrects the position of the next wafer placed on the carrier table according to the offset; a detection unit, which is arranged on the EBR robot, and detects the edge position of the wafer located on the carrier table; an EBR spraying unit, which is arranged on the EBR robot, and starts from the time when the detection unit detects the edge position of the wafer, the EBR robot drives the EBR spraying unit to move a set distance along the radial direction of the wafer to perform EBR. The utility model can collect the position of the wafer on the carrier table in real time through the collection unit, so as to correct the offset of the wafer transfer robot, so that the wafer is located at the standard position on the carrier table. After the wafer is coated with photoresist on the carrier table, the edge of the wafer is detected by the detection unit to accurately move the EBR robot, so as to correct the offset of the EBR robot in real time, so that the EBR cutting edge width of each wafer can be adjusted in real time and accurately, thereby improving the accuracy of the EBR, saving manpower, and improving the production efficiency of the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0023] Figure 1 It is a top view of the position relationship between the acquisition unit and the wafer provided by an embodiment of the utility model.

[0024] Figure 2 It is a cross-sectional view showing the position relationship between a collection unit and a wafer provided in one embodiment of the utility model.

[0025] Figure 3 It is a schematic diagram of the relationship between the actual position and the standard position of a wafer provided by an embodiment of the present utility model.

[0026] Figure 4 This is a schematic diagram of the positional relationship between an EBR robot and a wafer provided in one embodiment of the utility model.

[0027] Figure 5 This is a schematic diagram of the positional relationship between an EBR robot and a wafer provided in one embodiment of the utility model.

[0028] Description of reference numerals:

[0029] 10-wafer; 20a-first acquisition unit; 20b-second acquisition unit; 20c-third acquisition unit; 20d-fourth acquisition unit; 21-light source; 22-camera; 31-EBR spray unit; 32-detection unit; 40-photoresist layer; A-actual position of wafer; A0-actual center position of wafer; B-standard position of wafer; B0-standard center position of wafer. DETAILED DESCRIPTION

[0030] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0031] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense that includes "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense that includes "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features.

[0032] In response to the problems mentioned in the above background technology, the inventors have found through research that EBR OCC is mainly caused by the offset of the EBR robot and the wafer transfer robot. For this problem, a position sensing device can be added to the EBR robot and the coating unit to track and correct the offset of the EBR robot and the wafer transfer robot in real time, so that the EBR cutting edge width of each wafer can be adjusted in real time and accurately, thereby improving the accuracy of EBR, saving manpower, and improving the production efficiency of the machine.

[0033] A detection unit is set on the EBR robot to detect the edge position of the wafer, correct the offset of the EBR robot in real time, and collect the actual position of the wafer on the carrier through the collection unit to obtain the offset between the actual position and the standard position. The wafer transfer robot corrects the position of the next wafer placed on the carrier according to the offset. By correcting the offset between the wafer transfer robot and the EBR robot, the accuracy of the EBR is improved.

[0034] After further research, the utility model provides an edge photoresist removal device, comprising:

[0035] A collection unit collects the actual position of the wafer on the carrier and obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier;

[0036] The wafer transfer robot corrects the position of the next wafer placed on the carrier according to the offset;

[0037] A detection unit, disposed on the EBR robot, detects an edge position of the wafer on the carrier; and

[0038] The EBR spray unit is arranged on the EBR robot. Starting from the position where the detection unit detects the wafer, the EBR robot drives the EBR spray unit to move a set distance along the radial direction of the wafer to perform EBR.

[0039] In an embodiment of the present invention, the acquisition unit is disposed at the edge of the standard position of the wafer on the carrier, and the actual position of the wafer is obtained by acquiring the position of the edge of the wafer.

[0040] In one embodiment of the utility model, the edge photoresist removal device includes four collection units, and the four collection units are evenly arranged at the edge of the standard position, but not limited to this. Exemplarily, the connection line of two of the collection units is parallel to the transmission direction of the wafer when it is placed on the carrier, and the connection line of the other two collection units is perpendicular to the transmission direction of the wafer when it is placed on the carrier.

[0041] Figure 1 This is a top view of the position relationship between the acquisition unit and the wafer provided by an embodiment of the utility model. Please refer to Figure 1As shown, the edge photoresist removal device includes four sets of collection units, a first collection unit 20a, a second collection unit 20b, a third collection unit 20c and a fourth collection unit 20d. The wafer 10 has a wafer notch 11. The wafer 10 is transported along the Y direction and placed on the carrier, that is, the Y direction is the transport direction when the wafer 10 is placed on the carrier. The wafer transport robot carries the wafer and transports it along the Y direction to the top of the carrier and places the wafer on the carrier. At this time, the position of the wafer 10 is the standard position. The line connecting the second collection unit 20b and the fourth collection unit 20d is perpendicular to the Y direction (that is, parallel to the X direction). In theory, the line connecting the first collection unit 20a and the third collection unit 20c is parallel to the Y direction. However, since the wafer notch 11 is located at Figure 1 As shown, the line connecting the wafer notch 11 and the third acquisition unit 20c is parallel to the Y direction, so the first acquisition unit 20a is offset to the left, away from the wafer notch 11, to avoid failure to collect the edge of the wafer 10. In this embodiment, the angle of the wafer notch 11 is 0 degrees, then the first acquisition unit 20a is located at the position of 10 degrees, the second acquisition unit 20b is located at the position of 90 degrees, the third acquisition unit 20c is located at the position of 180 degrees, and the fourth acquisition unit 20d is located at the position of 270 degrees, but not limited to this. According to the position information collected by the first acquisition unit 20a and the third acquisition unit 20c, it is judged whether the wafer 10 is offset in the Y direction, and according to the position information collected by the second acquisition unit 20b and the fourth acquisition unit 20d, it is judged whether the wafer 10 is offset in the X direction.

[0042] In an embodiment of the utility model, the acquisition unit includes a corresponding light source and a camera. Figure 2 This is a cross-sectional view of the position relationship between the acquisition unit and the wafer provided in an embodiment of the utility model, please refer to Figure 2 As shown, the acquisition unit includes a corresponding light source 21 and a camera 22. The light emitted by the light source 21 is transmitted to the camera 22. Part of the light is blocked by the wafer 10. The position of the edge of the wafer 10 is obtained based on the blocked shadow.

[0043] The four cameras collect the positions of the four edges of the wafer 10 , thereby obtaining the center position of the wafer 10 . Figure 3 This is a schematic diagram of the relationship between the actual position and the standard position of the wafer provided in an embodiment of the utility model. Please refer to Figure 3As shown, A is the actual position of the wafer, A0 is the actual center position of the wafer (i.e., the center of the circle), B is the standard position of the wafer, and B0 is the standard center position of the wafer (i.e., the center of the circle). The actual center position A0 of the wafer is obtained according to the positions of the four edges of the wafer, and the actual center position A0 of the wafer is compared with the standard center position B0 to obtain the offset of the wafer, and the offset includes the offset in the X direction and the offset in the Y direction.

[0044] In one embodiment of the utility model, the light source is an LED light source, the camera is a CCD camera, and the supporting platform is a supporting platform in a coating unit.

[0045] In an embodiment of the present invention, the edge photoresist removal device may further include a main system, wherein the main system is connected to the coating unit, and the main system may be an existing system, such as a manufacturing execution system.

[0046] The acquisition unit acquires the actual position of the wafer on the carrier, obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier, and transmits it to the main system; or the acquisition unit acquires the actual position of the wafer on the carrier, and transmits it to the main system, and the main system calculates the offset between the actual position of the wafer and the standard position of the wafer on the carrier. The main system determines whether the wafer is offset according to the offset. If there is an offset, the main system corrects the parameters of the wafer transfer robot in real time according to the offset to correct the position of the wafer when it is transferred to the carrier next time.

[0047] The main system can determine whether the wafer is offset according to the offset, for example, by setting a standard offset. If the actual offset is less than or equal to the standard offset, it can be considered that the position of the wafer is not offset. If the actual offset is greater than the standard offset, it can be considered that the position of the wafer is offset. Then, the transmission parameters of the wafer transfer robot are obtained according to the offset, and the wafer transfer robot corrects the position of the next wafer placed on the carrier.

[0048] In the utility model, by setting the acquisition unit, the deviation of the wafer transfer robot can be corrected in real time, so that the next transmission of the wafer transfer robot has no deviation and the wafer is transferred to the standard position of the carrier.

[0049] Figure 4 This is a schematic diagram of the positional relationship between the EBR robot and the wafer provided in one embodiment of the utility model. Figure 5 This is a schematic diagram of the position relationship between the EBR robot and the wafer provided by an embodiment of the utility model. Please refer to Figure 4 and Figure 5 As shown, the EBR robot (not shown) is provided with an EBR spray unit 31 and a detection unit 32, and a fixed interval S1 is provided between the detection unit 32 and the EBR spray unit 31, and the detection unit 32 is closer to the wafer 10 than the EBR spray unit 31. After the photoresist layer 40 is formed on the wafer 10, the edge position of the wafer 10 is detected by the detection unit 32. After the edge position of the wafer is determined, the EBR robot drives the EBR spray unit 31 to move a set distance along the radial direction of the wafer 10 from the position (i.e., the position of the EBR nozzle 31 when the wafer edge position is determined) to perform EBR.

[0050] The set distance is the sum of the fixed spacing S1 and the trimming width S2 set by EBR. The EBR set trimming width S2 refers to the width required for trimming. After the EBR robot moves the set distance, the detection unit 32 moves from the edge position to the position of S1+S2, and the EBR spraying unit 31 also moves a distance of S1+S2. After moving the distance S1, the EBR spraying unit 31 moves to the edge of the wafer 10, at which time spraying can be started. After that, the distance S2 moved by the EBR spraying unit 31 is the trimming width required for EBR.

[0051] After the photoresist layer is coated, the EBR robot drives the EBR spray unit 31 and the detection unit 32 to move. The detection unit 32 detects the edge position of the wafer. When the detection unit 32 detects the edge position of the wafer, the EBR robot moves a set distance along the radial direction of the wafer to an end point with the position as the starting point. The end point is the end point of the EBR. The actual tangent width of the EBR is the distance from the edge of the wafer to the end point.

[0052] In an embodiment of the present invention, the EBR spray unit 31 is an EBR nozzle, and the detection unit 32 is a sensor, but not limited thereto.

[0053] In this embodiment, the detection unit 32 is set to first determine the position of the edge of the wafer, and then the EBR robot moves a set distance from the position along the radial direction of the wafer 10 to accurately move the EBR robot and correct the offset of the EBR robot.

[0054] In the utility model, a wafer transfer robot is used to transfer and place the wafer on a carrier, and then the wafer is coated to form a photoresist layer, and then an EBR robot is used to drive an EBR spray unit to spray liquid onto the photoresist layer at the edge of the wafer to remove the edge photoresist. In this process, the offset of the wafer transfer robot is corrected by the acquisition unit, and the offset of the EBR robot is corrected by the detection unit 32, so that the EBR trimming width of each wafer can be adjusted in real time and accurately, thereby improving the accuracy of the EBR, saving manpower, and improving the production efficiency of the machine.

[0055] In summary, the edge photoresist removal device provided by the utility model includes: a collection unit, which collects the actual position of the wafer on the carrier table and obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier table; a wafer transfer robot, which corrects the position of the next wafer placed on the carrier table according to the offset; a detection unit, which is arranged on the EBR robot and is used to detect the edge position of the wafer on the carrier table; an EBR spraying unit, which is arranged on the EBR robot, and starting from the position of the wafer detected by the detection unit, the EBR robot drives the EBR spraying unit to move a set distance along the radial direction of the wafer to perform EBR. The utility model can collect the position of the wafer on the carrier table in real time through the collection unit, so as to correct the offset of the wafer transfer robot, so that the wafer is located at the standard position on the carrier table. After the wafer is coated with photoresist on the carrier table, the edge of the wafer is detected by the detection unit to accurately move the EBR robot, so as to correct the offset of the EBR robot in real time, so that the EBR cutting edge width of each wafer can be adjusted in real time and accurately, thereby improving the accuracy of the EBR, saving manpower, and improving the production efficiency of the machine.

[0056] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. An edge photoresist removal device, characterized in that: include: A collection unit collects the actual position of the wafer on the carrier and obtains the offset between the actual position of the wafer and the standard position of the wafer on the carrier; The wafer transfer robot corrects the position of the next wafer placed on the carrier according to the offset; A detection unit, disposed on the EBR robot, detects an edge position of the wafer on the carrier; and The EBR spray unit is arranged on the EBR robot. Starting from when the detection unit detects the edge position of the wafer, the EBR robot drives the EBR spray unit to move a set distance along the radial direction of the wafer to perform EBR.

2. The edge photoresist removal device according to claim 1, characterized in that: The collecting unit is arranged at the edge of the standard position of the wafer on the carrying platform.

3. The edge photoresist removal device according to claim 2, characterized in that: The edge photoresist removal device comprises four collection units, and the four collection units are evenly arranged at the edge of the standard position.

4. The edge photoresist removal device according to claim 3, characterized in that: The connection line of two of the collecting units is parallel to the transmission direction of the wafer when it is placed on the supporting platform, and the connection line of the other two collecting units is perpendicular to the transmission direction of the wafer when it is placed on the supporting platform.

5. The edge photoresist removal device according to claim 4, characterized in that: The acquisition unit includes a corresponding light source and a camera. The light emitted by the light source is transmitted to the camera. Part of the light is blocked by the wafer, and the position of the edge of the wafer is obtained based on the blocked shadow.

6. The edge photoresist removal device according to claim 4, characterized in that: The wafer has a wafer notch, and the collecting unit deviates from the wafer notch.

7. The edge photoresist removal device according to claim 5, characterized in that: The light source is an LED light source, the camera is a CCD camera, and the supporting platform is a supporting platform in a coating unit.

8. The edge photoresist removal device according to claim 1, characterized in that: The detection unit is a sensor.

9. The edge photoresist removal device according to claim 8, characterized in that: There is a fixed interval between the detection unit and the EBR spraying unit, and the detection unit is closer to the wafer than the EBR spraying unit.

10. The edge photoresist removal device according to claim 1, characterized in that: The EBR spraying unit is an EBR nozzle.

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