Thermal management device, network card device and server

Abstract

The utility model relates to the technical field of servers, in particular to a heat management device, a network card device and a server. In the embodiment of the invention, the flow channel and the pump body are arranged on the thermal management part, and the flow channel and the pump body form the liquid cooling circulation loop, so that thermal management can be carried out on the optical module, the temperature uniformity of the thermal management part is improved, and heat dissipation of the optical module is further realized. The pump body is arranged on the heat management part, so that the network card can be directly plugged and unplugged. Therefore, by using the thermal management device provided by the embodiment of the invention, not only can the heat dissipation of the optical module be carried out, but also the network card is convenient to plug and unplug, and the optical module is convenient to maintain.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a thermal management device, a network card device and a server. Background Art

[0002] An optical module is usually installed on the network card of the server, which can be used to complete photoelectric conversion and electro-optical conversion. In the related art, a cold plate is installed on the optical module, and the cold plate is connected to the corresponding external cold water device through a pipeline to form a cooling cycle, thereby achieving heat dissipation of the optical module. However, in the process of plugging and unplugging the network card, the cold plate and the cold water device need to be disassembled, which makes the plugging and unplugging process cumbersome. Utility Model Content

[0003] Based on this, a thermal management device, a network card device and a server are provided to facilitate plugging and unplugging of the network card while dissipating the heat of the optical module.

[0004] According to one aspect of the present application, an embodiment of the present application provides a thermal management device, including: a thermal management component for contacting an optical module; the thermal management component is provided with a flow channel for accommodating a heat exchange medium, the flow channel having a liquid inlet and a liquid outlet; and a pump body, provided on the thermal management component; the pump body has an input port and an output port that are connected to each other, the input port is connected to the liquid outlet, and the output port is connected to the liquid inlet.

[0005] In the thermal management device provided in the embodiment of the present application, by providing a flow channel and a pump body on the thermal management component, and making the flow channel and the pump body form a liquid cooling circulation loop, it is possible to perform thermal management on the optical module, improve the temperature uniformity of the thermal management device, and thus achieve heat dissipation optimization for the optical module. Since the pump body is provided on the thermal management component, the network card can be directly plugged in and out. Therefore, by using the thermal management device provided in the embodiment of the present application, not only can the optical module be cooled, but it is also convenient to plug in and out the network card, and it is convenient to maintain the optical module.

[0006] In one embodiment, the optical module has a first surface and a second surface arranged opposite to each other, and a third surface connecting the first surface and the second surface; the second surface is the mounting surface of the optical module; the thermal management component includes a first plate body and a second plate body; the second plate body is located on one side of the first plate body and connected to the first plate body; the flow channel is arranged in the first plate body and the second plate body, and the pump body is arranged in the first plate body or the second plate body; the first plate body is used to be arranged on one side of the first surface, and the second plate body is used to be arranged on one side of the third surface; wherein the first plate body is used to contact with the first surface; and / or, the second plate body is used to contact with the third surface.

[0007] By setting the heat management component as a structure in which the first plate body and the second plate body are connected, and by using the space on one side of the second surface (i.e., the side surface) of the optical module, the second plate body is set on one side of the side surface of the optical module, which can improve the problem of limited setting of the first plate body due to limited space on the first surface of the optical module, and is conducive to improving the heat dissipation efficiency of the optical module. In addition, when the heat management component is in contact with one of the first surface and the third surface, it is not only convenient to install the heat management component and the optical module, but also convenient to hot-swap the optical module.

[0008] In one embodiment, the area of ​​the first surface is greater than the area of ​​the third surface; the first plate body is used to contact the first surface, and the second plate body is used to fit with the third surface in a clearance; and / or, a bayonet is provided on the first plate body, and the first plate body is snap-fitted with the pump body by means of the bayonet; and / or, the pump body is arranged on the first plate body, and the liquid inlet and the liquid outlet are arranged on the same side of the second plate body.

[0009] By making the heat management component contact with the large-area first surface of the optical module and matching the gap with the third surface, it is not only beneficial to improve the heat dissipation efficiency of the optical module, but also convenient for hot plugging of the optical module. By setting a bayonet on the first plate body, it is convenient to install the pump body on the first plate body. By setting the pump body on the first plate body and setting the liquid inlet and the liquid outlet on the same side of the second plate body, it is convenient to connect the input port and the liquid outlet of the pump body, and the output port and the liquid inlet of the pump body.

[0010] In one embodiment, the second plate has a first surface and a second surface that are arranged opposite to each other, and the first surface is arranged to face the third surface of the optical module; the thermal management device also includes a heat sink, and the heat sink is arranged on the second surface.

[0011] By arranging a heat sink on the second surface of the second plate away from the side of the optical module, not only can the space on the third surface of the optical module be further utilized, but the heat sink can also further improve the heat dissipation efficiency of the optical module.

[0012] In one embodiment, the heat sink includes a base disposed on the second surface, and a plurality of heat sinks disposed at intervals on a side of the base away from the second surface.

[0013] By configuring the heat sink to be a structure combining a base and a heat sink, the base is used to increase the contact area with the second surface, and a heat sink is provided, and multiple heat sinks are used to further increase the heat dissipation area, the heat dissipation efficiency of the optical module is further improved.

[0014] In one of the embodiments, the optical module is disposed on the network card, and the heat sink is used to contact the network card.

[0015] By making the heat sink contact with the network card, the network card can be used to increase the heat dissipation area, thereby facilitating further improving the heat dissipation efficiency of the optical module.

[0016] In one of the embodiments, the thermal management device further includes a heat conducting member; the heat sink is in contact with the network card via the heat conducting member.

[0017] By arranging a heat conducting member between the heat sink and the network card, a part of the heat of the heat sink can be transferred to the network card through the heat conducting member.

[0018] In one embodiment, the pump body is configured as a micro liquid pump; and / or the thermal management component has a contact surface for contacting the optical module; the thermal management device also includes a thermoelectric cooler arranged on the contact surface, the hot end of the thermoelectric cooler is in contact with the contact surface, and the cold end of the thermoelectric cooler is used to contact the optical module.

[0019] By configuring the pump body as a micro liquid pump, the size of the micro liquid pump is small, thereby reducing the volume occupied by the thermal management device, and facilitating the formation of a modular thermal management device. By providing a thermoelectric cooler, the temperature of the surface of the optical module can be reduced.

[0020] According to another aspect of the present application, an embodiment of the present application provides a network card device, including a network card, an optical module arranged on the network card, and a thermal management device in any of the above embodiments, wherein the thermal management component is in contact with the optical module.

[0021] Since the network card device includes the thermal management device in any of the above embodiments, the network card device also has the same advantages as the above thermal management device.

[0022] According to another aspect of the present application, an embodiment of the present application provides a server, comprising the network card device in any of the above embodiments.

[0023] Since the server includes the network card device in any of the above embodiments, the server also has the same advantages as the above network card device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of a thermal management device in one embodiment of the present application at one viewing angle.

[0025] Figure 2 It is a schematic diagram of the three-dimensional structure of the thermal management device in one embodiment of the present application from another perspective.

[0026] Figure 3 It is a schematic diagram of the three-dimensional structure of the thermal management device and the optical module in one embodiment of the present application.

[0027] Figure 4 It is a schematic diagram of the three-dimensional structure of a network card device in one embodiment of the present application.

[0028] Description of reference numerals:

[0029] Network card device 10;

[0030] Thermal management device 100, thermal management element 110, first plate 111, bayonet k, mounting hole a, second plate 112, first surface b1, second surface b2, liquid inlet j, liquid outlet c, pump body 120, heat sink 130, base 131, heat sink 132, heat conducting element 140, thermoelectric cooler 150;

[0031] Optical module 200, first surface m1, second surface m2, third surface m3;

[0032] Network card 300;

[0033] Radiator 400. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0035] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0040] Figure 1 A schematic diagram of the three-dimensional structure of a thermal management device 100 in one embodiment of the present application at a viewing angle is shown; Figure 2 A schematic diagram of the three-dimensional structure of the thermal management device 100 in one embodiment of the present application at another viewing angle is shown; for ease of explanation, only the content related to the embodiment of the present application is shown.

[0041] Please refer to Figure 1 and Figure 2 An embodiment of the present application provides a thermal management device 100 , including a thermal management component 110 and a pump body 120 .

[0042] The thermal management component 110 is a component for thermal management of the optical module 200. The thermal management component 110 is used to contact the optical module 200, that is, the thermal management component 110 and the optical module 200 perform heat exchange by contact. The thermal management component is provided with a flow channel for accommodating a heat exchange medium, and the flow channel has a liquid inlet j and a liquid outlet c. The heat exchange medium can be water, or other liquids capable of heat exchange. It can be understood that the liquid inlet j and the liquid outlet c of the flow channel are connected to each other. The thermal management component 110 can be made of a metal with good thermal conductivity (such as copper or aluminum), and the heat of the optical module 200 is transferred to the heat exchange medium in the flow channel of the thermal management component 110 by means of the thermal management component 110, and then heat exchange is performed through the heat exchange medium.

[0043] The pump body 120 is a component for providing power for the flow of heat exchange medium. The pump body 120 is arranged on the thermal management component 110. The pump body 120 has an input port (not shown in the figure) and an output port (not shown in the figure) that are connected to each other, the input port is connected to the liquid outlet c, and the output port is connected to the liquid inlet j. It can be understood that the input port and the liquid outlet c can be connected through related pipe fittings (not shown in the figure), and the output port and the liquid inlet j can also be connected through related pipe fittings (not shown in the figure). The interior and flow channel of the pump body 120 constitute a circulating flow channel for the heat exchange medium. The heat exchange medium in the flow channel circulates under the action of the power provided by the pump body 120.

[0044] By providing a flow channel and a pump body 120 on the thermal management component 110, and making the flow channel and the pump body 120 form a liquid cooling circulation loop, the optical module 200 can be thermally managed, the temperature uniformity of the thermal management device can be improved, and the heat dissipation optimization of the optical module 200 can be achieved. Since the pump body 120 is provided on the thermal management component 110, the network card 300 can be directly plugged in and out. Therefore, by using the thermal management device 100 provided in the embodiment of the present application, not only can the optical module 200 be cooled, but it is also convenient to plug and unplug the network card 300, and it is convenient to maintain the optical module 200.

[0045] Figure 3 A schematic diagram of a three-dimensional structure of a thermal management device 100 and an optical module 200 in cooperation with each other in an embodiment of the present application is shown; for ease of explanation, only contents related to the embodiment of the present application are shown.

[0046] In some embodiments, please refer to Figure 1 and Figure 2 , and combined with reference Figure 3 The heat management member 110 includes a first plate body 111 and a second plate body 112. The first plate body 111 and the second plate body 112 are plate-shaped components. For example, the first plate body 111 and the second plate body 112 can be arranged in a substantially flat plate shape. Figures 1 to 3 For example, the first plate 111 and the second plate 112 are substantially perpendicular to each other.

[0047] The second plate body 112 is located on one side of the first plate body 111 and is connected to the first plate body 111. The first plate body 111 and the second plate body 112 can be an integrated structure or a split structure. An integrated structure refers to a structure that can be manufactured by an integrated molding process. A split structure refers to a structure that can be connected by a welding process or other connecting parts.

[0048] The flow channel is disposed in the first plate body 111 and the second plate body 112. The pump body 120 is disposed in the first plate body 111 or the second plate body 112. That is, a portion of the flow channel is located in the first plate body 111, and another portion of the flow channel is located in the second plate body 112. Moreover, a portion of the flow channel located in the first plate body 111 is connected to another portion of the flow channel located in the second plate body 112, and can form the aforementioned heat exchange circulation loop with the pump body 120.

[0049] Combined with reference Figure 3 The optical module 200 has a first surface m1 and a second surface m2 that are arranged opposite to each other, and a third surface m3 that connects the first surface m1 and the second surface m2. The second surface m2 is the installation surface of the optical module 200. The figure schematically shows the position of the second surface m2.

[0050] The first plate 111 is used to be arranged on one side of the first surface m1 of the optical module 200, and the second plate 112 is used to be arranged on one side of the third surface m3 of the optical module 200; wherein the first plate 111 is used to contact the first surface m1; and / or, the second plate 112 is used to contact the third surface m3. That is, the thermal management component 110 is in contact with at least one of the two surfaces of the optical module 200. Specifically, the first plate 111 may be in contact with the first surface m1, and the second plate 112 may not be in contact with the third surface m3; or the first plate 111 may be in contact with the first surface m1, and the second plate 112 may be in contact with the third surface m3; or the first plate 111 may be in contact with the first surface m1, and the second plate 112 may be in contact with the third surface m3. It can be set according to the specific usage, and no specific limitation is made here.

[0051] It should be noted that in Figure 3 In the illustrated situation, the first surface m1 of the optical module 200 can be regarded as the top surface, the second surface m2 is the surface arranged opposite to the network card 300 illustrated later, the second surface m2 can be regarded as the bottom surface, and the third surface m3 can be regarded as the side surface. Among them, the top surface, the bottom surface and the side surface are relative, and can be determined according to the specific situation of the arrangement of the optical module 200. The optical module 200 has two third surfaces m3 arranged opposite to each other. The direction in which the first surface m1 of the optical module 200 points to the second surface m2 of the optical module 200, the direction in which one third surface m3 of the optical module 200 points to the other third surface m3 are perpendicular to each other to the longitudinal extension direction of the optical module 200. Continuing with Figure 3 For example, the second plate body 112 may be provided with one, and the second plate body 112 is used to contact a third surface m3 of the optical module 200. Of course, the second plate body 112 may also be provided with two, and the two second plate bodies 112 and the two third surfaces m3 of the optical module 200 are provided in a one-to-one correspondence. It can be set according to the specific usage, and no specific limitation is made here. In the embodiment of the present application, the second plate body 112 may be provided with one.

[0052] In this way, by setting the heat management component 110 as a structure in which the first plate 111 and the second plate 112 are connected, the first plate 111 is set in a space on one side of the first surface m1 of the optical module 200, and the second plate 112 is set in a space on one side of the third surface m3. In this way, the space on one side of the first surface m1 and the space on one side of the third surface m3 of the optical module 200 can be more effectively used. In addition, when the heat management component 110 is in contact with one surface of the optical module 200, it is not only convenient to install the heat management component 110 and the optical module 200, but also convenient to hot-swap the optical module 200.

[0053] In some embodiments, please refer to Figure 3 The area of ​​the first surface m1 of the optical module 200 is greater than the area of ​​the third surface m3. The first plate 111 is used to contact the first surface m1, and the second plate 112 is used to fit with the third surface m3 in a clearance.

[0054] In this way, it is not only beneficial to the hot plugging of the optical module 200 , but also can increase the contact area between the thermal management component 110 and the optical module 200 , thereby further increasing the heat dissipation efficiency of the optical module 200 .

[0055] In some embodiments, please refer to Figures 1 to 3 The first plate 111 is provided with a bayonet k, and the first plate 111 is engaged with the pump body 120 by means of the bayonet k. For example, the pump body 120 can be embedded in the bayonet k.

[0056] In this way, by providing the bayonet k on the first plate body 111, it is convenient to install the pump body 120 on the first plate body 111. When the pump body 120 is engaged with the bayonet k, it is beneficial to realize the miniaturization of the thermal management device 100.

[0057] In some embodiments, please refer to Figures 1 to 3 , a mounting hole a is provided on the first plate 111. Thus, the relevant mounting structure can fix the optical module 200 and the thermal management component 110 by means of the mounting hole a. Exemplarily, the relevant mounting structure can be a mounting structure such as a clamp or a connector.

[0058] In some embodiments, please refer to Figures 1 to 3The pump body 120 is disposed on the first plate body 111, and the liquid inlet j and the liquid outlet c are disposed on the same side of the second plate body 112. Further, the pump body 120, the liquid inlet j and the liquid outlet c are all disposed near one end of the optical module 200 along the longitudinal direction of the optical module 200.

[0059] In this way, by arranging the pump body 120 on the first plate body 111 and arranging the liquid inlet j and the liquid outlet c on the same side of the second plate body 112, the connection between the input port and the liquid outlet c of the pump body 120 and the connection between the output port and the liquid inlet j of the pump body 120 are facilitated.

[0060] In some embodiments, please refer to Figures 1 to 3 The second plate body 112 has a first surface b1 and a second surface b2 that are arranged opposite to each other. It can be understood that the first surface b1 and the second surface b2 are arranged opposite to each other along the thickness direction of the second plate body 112. The first surface b1 is used to be arranged toward the third surface m3 of the optical module 200. The thermal management device 100 also includes a heat sink 130. The heat sink 130 is a structure that can be used for heat dissipation. The heat sink 130 is arranged on the second surface b2.

[0061] Thus, by disposing the heat sink 130 on the second surface b2 of the second plate 112 away from the third surface m3 of the optical module 200 , not only can the space on the side of the third surface m3 of the optical module 200 be further utilized, but the heat sink 130 can also further improve the heat dissipation efficiency of the optical module 200 .

[0062] It should be noted that, in combination with the contents illustrated in some of the above embodiments, the first surface b1 and the third surface m3 may be in contact with each other or spaced apart from each other. In the embodiment of the present application, the first surface b1 and the third surface m3 are in contact with each other.

[0063] Of course, in some other embodiments, if the space is available, the heat sink 130 may be disposed on the first surface m1 of the first board 111 away from the optical module 200. The heat sink 130 may be disposed according to specific usage conditions and is not specifically limited here.

[0064] In some embodiments, please refer to Figures 1 to 3 The heat sink 130 includes a base 131 and a plurality of heat sinks 132. The base 131 is a component for carrying all the heat sinks 132, and the heat sink 132 is a component that is constructed in a sheet shape and can dissipate heat. The base 131 is arranged on the second surface b2. All the heat sinks 132 are arranged on the side of the base 131 away from the second surface b2, and all the heat sinks 132 are arranged at intervals. The base 131 and the heat sink 132 can be an integrated structure or a split structure.

[0065] For example, Figures 1 to 3For example, all heat sinks 132 are arranged along the longitudinal direction of the optical module 200, and all heat sinks 132 are arranged in sequence and spaced from the second surface m2 of the optical module 200 to the first surface m1 of the optical module 200. That is, the heat sink 130 can be regarded as a fin-type heat sink component.

[0066] In this way, by setting the heat sink 130 as a structural form combining a base 131 and a heat sink 132, the base 131 is used to increase the contact area with the second surface b2 of the second plate body 112 and the heat sink 132 is set, and multiple heat sinks 132 are used to further increase the heat dissipation area, thereby further improving the heat dissipation efficiency of the optical module 200.

[0067] In some embodiments, please refer to Figures 1 to 3 , the optical module 200 is disposed on the network card 300, and the heat sink 130 is used to contact the network card 300. Figures 1 to 3 For example, the heat sink 132 located at the bottom among all the heat sinks 132 may contact the network card 300 .

[0068] In this way, by making the bottom surface of the heat sink 130 contact with the network card 300 , the network card 300 can be used to increase the heat dissipation area, thereby facilitating further improving the heat dissipation efficiency of the optical module 200 .

[0069] In some embodiments, please refer to Figures 1 to 3 The thermal management device 100 further includes a heat conducting member 140; the heat sink 130 contacts the network card 300 via the heat conducting member 140. The heat conducting member 140 may be configured as a sheet structure. For example, the heat conducting member 140 may be a thermal pad. Figures 1 to 3 For example, the thermal pad may be disposed on a surface of the heat sink 132 at the bottom facing the network card 300 .

[0070] Thus, by disposing the heat conducting member 140 between the heat sink 130 and the network card 300 , a portion of the heat of the heat sink 130 can be transferred to the network card 300 through the heat conducting member 140 because the heat conducting member 140 can conduct heat.

[0071] In some embodiments, please refer to Figures 1 to 3 The pump body 120 is configured as a micro liquid pump. The size of the micro liquid pump can reach the millimeter level, which can realize the small modular design of the thermal management device 100 as a whole.

[0072] In this way, by configuring the pump body 120 as a micro liquid pump, the size of the micro liquid pump is small, thereby being able to reduce the volume occupied by the thermal management device 100 , thereby facilitating the formation of a modular thermal management device 100 .

[0073] In some embodiments, please refer to Figures 1 to 3The thermal management element 110 has a contact surface (not shown) for contacting the optical module 200. The thermal management device 100 also includes a thermoelectric cooler (TEC) 150 disposed on the contact surface, the hot end of the thermoelectric cooler 150 is in contact with the contact surface, and the cold end of the thermoelectric cooler 150 is used to contact the optical module 200.

[0074] Thermoelectric cooler 150 is a semiconductor device, which essentially uses the Peltier effect (ie, thermoelectric effect) of semiconductor materials to cool. The Peltier effect refers to the phenomenon that when direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat.

[0075] Specifically, the contact surface may be a surface where the first plate 111 contacts the first surface m1 of the optical module 200, or a surface where the second plate 112 contacts the third surface m3 of the optical module 200, or a surface where the first plate 111 contacts the first surface m1 of the optical module 200, or a surface where the second plate 112 contacts the third surface m3 of the optical module 200. Figures 1 to 3 For example, the contact surface is the surface of the first plate 111 that contacts the first surface m1 of the optical module 200. The cold end of the thermoelectric cooler 150 has a cold surface, and the hot end of the thermoelectric cooler has a hot surface.

[0076] The thermoelectric cooler 150 has its hot surface connected to the surface of the first plate 111 that contacts the first surface m1 of the optical module 200, and its cold surface connected to the optical module 200. By applying a voltage to the thermoelectric cooler 150, a temperature difference can be generated between the cold surface and the hot surface of the thermoelectric cooler 150, and the cold surface of the thermoelectric cooler 150 can be used to cool the optical module 200. In this way, by providing the thermoelectric cooler 150, the surface temperature of the optical module 200 can be reduced, and the tolerance of the optical module 200 to the ambient air temperature can be improved.

[0077] Figure 4 A three-dimensional structural diagram of a network card device 10 in an embodiment of the present application is shown; for ease of explanation, only the contents related to the embodiment of the present application are shown.

[0078] Based on the same invention concept, please refer to Figure 4 , and combined with reference Figures 1 to 3 The embodiment of the present application provides a network card device 10, including a network card 300, an optical module 200 arranged on the network card 300, and a thermal management device 100 in any of the above embodiments, wherein the thermal management component 110 is in contact with the optical module 200.

[0079] Specifically, the number of optical modules 200 can be set according to specific usage requirements. Figure 4For example, the case where there are two optical modules 200 is illustrated. The thermal management components 110 and the optical modules 200 are arranged in a one-to-one correspondence, that is, the positions of the thermal management components 110 and the positions of the optical modules 200 are in a one-to-one correspondence, and the number of the thermal management components 110 and the number of the optical modules 200 are in a one-to-one correspondence.

[0080] Since the network card device 10 includes the thermal management device 100 in any of the above embodiments, the network card device 10 also has the same advantages as the thermal management device 100 , which will not be described in detail herein.

[0081] It should be noted that the network card is generally used for connection between a server and network devices such as a switch, and the network card may be an OCP (Open Compute Project) network card.

[0082] In some embodiments, please refer to Figure 4 The network card device 10 further includes a heat sink 400 disposed on the network card 300. The heat sink 400 is located at the tail end side of the optical module 200. Along the longitudinal direction of the optical module 200, the tail end and the head end of the optical module 200 are arranged opposite to each other. The heat sink 400 has a plurality of heat dissipation fins.

[0083] In this way, by disposing the heat sink 400 at the rear end side of the optical module 200 , not only the space of the network card device 10 can be utilized, but also the heat of the chip on the network card 300 can be dissipated.

[0084] Based on the same invention concept, please refer to Figures 1 to 4 An embodiment of the present application provides a server, comprising the network card device 10 in any of the above embodiments.

[0085] Since the server includes the network card device 10 in any of the above embodiments, the server also has the same advantages as the above network card device 10.

[0086] In some embodiments, the server further includes a cooling fan, which is located on a side of the heat sink 400 away from the optical module 200. In this way, the cooling fan can not only cool other components of the server.

[0087] In summary, in the embodiment of the present application, by arranging the flow channel and the pump body 120 on the thermal management component 110, and making the flow channel and the pump body 120 form a heat exchange circulation loop, the optical module 200 can be thermally managed, the temperature uniformity of the thermal management component 110 can be improved, and the heat dissipation of the optical module 200 can be achieved. Since the pump body 120 is arranged on the thermal management component 110, further, the second plate body 112 is arranged at intervals with the third surface m3 of the optical module 200, and the optical module 200 can be directly hot-swapped, and the first plate body 111 is in contact with the first surface m1 of the optical module 200, and the area of ​​the first surface m1 is greater than the area of ​​the third surface m3. In this way, not only can the optical module 200 be cooled, but also the network card 300 can be plugged in and out, and the optical module 200 can be maintained. Furthermore, by configuring the pump body 120 as a micro liquid pump and embedding it in the first plate body 111 of the thermal management component 110, it is conducive to modularization and miniaturization of the thermal management device 100. Furthermore, by arranging a heat sink 130 on the side of the second plate 112 of the thermal management component 110 away from the optical module 200, and making the heat sink 130 contact the network card 300 with the help of the heat conductive component 140, not only can the space on the network card device 10 be more effectively utilized, but also the heat dissipation effect of the optical module 200 can be further improved. In addition, a thermoelectric cooler 150 is arranged between the first plate 111 and the optical module 200, which can improve the heat dissipation effect of the optical module 200. Therefore, the various components illustrated in the embodiment of the present application cooperate with each other, and while improving the heat dissipation efficiency of the optical module 200, it is not only convenient to obtain an integrated, miniaturized and modular structure, but also convenient for the disassembly of the optical module 200 with the card, which is convenient for later maintenance.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A thermal management device, characterized in that: include: A heat management component, used to contact the optical module; the heat management component is provided with a flow channel for accommodating a heat exchange medium, the flow channel having a liquid inlet and a liquid outlet; and A pump body is arranged on the heat management component; the pump body has an input port and an output port which are connected to each other, the input port is connected to the liquid outlet, and the output port is connected to the liquid inlet.

2. The thermal management device according to claim 1, characterized in that: The optical module has a first surface and a second surface that are arranged opposite to each other, and a third surface connecting the first surface and the second surface; the second surface is a mounting surface of the optical module; The heat management component comprises a first plate and a second plate; the second plate is located on one side of the first plate and connected to the first plate; the flow channel is arranged in the first plate and the second plate, and the pump body is arranged in the first plate or the second plate; The first plate is used to be arranged on one side of the first surface, and the second plate is used to be arranged on one side of the third surface; Wherein, the first plate body is used to contact the first surface; and / or, the second plate body is used to contact the third surface.

3. The thermal management device according to claim 2, characterized in that: The area of ​​the first surface is greater than the area of ​​the third surface; the first plate is used to contact the first surface, and the second plate is used to have a clearance fit with the third surface; and / or The first plate body is provided with a bayonet, and the first plate body is engaged with the pump body by means of the bayonet; and / or The pump body is arranged on the first plate body, and the liquid inlet and the liquid outlet are arranged on the same side of the second plate body.

4. The thermal management device according to claim 2, characterized in that: The second plate has a first surface and a second surface that are arranged opposite to each other, and the first surface is used to be arranged toward the third surface of the optical module; The thermal management device further includes a heat sink, and the heat sink is disposed on the second surface.

5. The thermal management device according to claim 4, characterized in that: The heat sink comprises a base disposed on the second surface, and a plurality of heat sinks disposed at intervals on a side of the base away from the second surface.

6. The thermal management device according to claim 4, characterized in that: The optical module is arranged on the network card, and the heat sink is used for contacting the network card.

7. The thermal management device according to claim 6, characterized in that: The thermal management device also includes a heat conducting member; The heat sink is in contact with the network card via the heat conductor.

8. The thermal management device according to any one of claims 1 to 7, characterized in that: The pump body is configured as a micro liquid pump; and / or The thermal management component has a contact surface for contacting the optical module; the thermal management device also includes a thermoelectric cooler arranged on the contact surface, the hot end of the thermoelectric cooler contacts the contact surface, and the cold end of the thermoelectric cooler contacts the optical module.

9. A network card device, characterized in that: The invention comprises a network card, an optical module arranged on the network card and the thermal management device according to any one of claims 1 to 8, wherein the thermal management component is in contact with the optical module.

10. A server, characterized in that: Comprising the network card device as claimed in claim 9.

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