Case rear plate heat dissipation device

Abstract

The utility model discloses a case back plate heat dissipation device, which comprises a supporting assembly, a heat dissipation assembly and a power supply assembly, the heat dissipation assembly is vertically arranged on the supporting assembly, the heat dissipation assembly is connected with the supporting assembly and is used for heat dissipation of a case, the power supply assembly is vertically arranged on the supporting assembly and is connected with the supporting assembly, and the power supply assembly is used for heat dissipation of the case. The heat dissipation assembly comprises a heat dissipation fan, the heat dissipation fan is vertically installed on the supporting assembly, the heat dissipation fan is connected with the supporting assembly and used for cooling the interior of the case, the heat dissipation area is effectively increased through vertical installation of the heat dissipation fan and arrangement of a heat dissipation grid, heat in the case can be rapidly dissipated to the external environment, and the heat dissipation efficiency is improved. According to the computer case, the temperature inside the computer case is reduced, the stability and the reliability of equipment are improved, the video card heat dissipation grooves and the ventilation grids provide independent heat dissipation channels for the video card, the problem that the video card is overheated is effectively avoided, it is ensured that the performance of the video card is stable during high-load work, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the field of chassis technology development, in particular to a chassis rear plate heat dissipation device. Background Art

[0002] With the rapid development of computer technology, the performance of computer hardware has been significantly improved, but high-performance hardware is often accompanied by high power consumption and high heat generation. Especially in applications such as servers, high-performance computing (HPC) systems, data centers, and gaming computers, heat dissipation has become a key factor in ensuring stable operation of hardware and extending its service life;

[0003] Traditional chassis heat dissipation methods mostly rely on fans for air cooling, but this method has limitations in terms of heat dissipation efficiency and noise control. Although fan heat dissipation can reduce the internal temperature of the chassis to a certain extent, as the power consumption of hardware continues to increase, the heat dissipation demand also increases accordingly. It is difficult to meet the heat dissipation demand of high heat generation by relying solely on fans. At the same time, the fan will generate a lot of noise when running at high speed, affecting the user experience. In addition, for certain specific applications, such as high-density server clusters or data centers, the internal space of the chassis is limited and the requirements for heat dissipation efficiency are extremely high. In this case, traditional air-cooled heat dissipation methods are often difficult to meet the heat dissipation requirements, resulting in excessive hardware temperature, which in turn affects the stability and reliability of the system. To this end, in order to solve this problem, the inventors have proposed a chassis back plate heat dissipation device. Utility Model Content

[0004] In view of the deficiencies existing in the above-mentioned technology, the utility model provides a chassis rear plate heat dissipation device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a chassis rear plate heat dissipation device, comprising a support assembly, a heat dissipation assembly and a power supply assembly, the heat dissipation assembly is vertically installed on the support assembly, the heat dissipation assembly is connected to the support assembly, and is used to dissipate heat for the chassis, the power supply assembly is vertically installed on the support assembly, the power supply assembly is connected to the support assembly, the heat dissipation assembly comprises a cooling fan, the cooling fan is vertically installed on the support assembly, the cooling fan is connected to the support assembly, and is used to cool the inside of the chassis.

[0006] As a further explanation, a heat dissipation grid is extended outward from the heat dissipation fan, and the heat dissipation grid is vertically installed on the support component. One end of the heat dissipation grid is provided with a graphics card heat dissipation slot connected thereto, and the graphics card heat dissipation slot is vertically installed on the support component.

[0007] As a further explanation, the graphics card heat sink extends outwardly to be provided with a ventilation grid, the ventilation grid is vertically installed on the support component, the ventilation grid is connected to the support component, the heat sink component extends outwardly to be provided with a ventilation slot, and the ventilation slot is vertically provided on the support component.

[0008] As a further explanation, the power supply assembly includes a data transmission board, a mainboard interface and a power supply placement slot, the data transmission board is vertically installed on the support assembly, the mainboard interface is vertically installed on the support assembly, and the power supply placement slot is vertically installed on the support assembly.

[0009] As a further explanation, the support assembly includes a rear cover plate, a side panel and an upper cover plate, the upper cover plate is vertically mounted on the side panel, the upper cover plate is connected to the side panel, the rear cover plate is vertically mounted on the side panel, the rear cover plate is connected to the side panel, the cooling fan is located inside the rear cover plate, the graphics card heat dissipation groove is located in the middle of the rear cover plate, the ventilation grid is located inside the rear cover plate, the ventilation groove is located inside the upper cover plate, the data transmission board is located on the top of the upper cover plate, the mainboard interface is located inside the rear cover plate, and the power supply placement groove is located at the tail of the rear cover plate.

[0010] As a further explanation, the rear cover plate is extended outwardly to provide a rear window cover body, the rear window cover body is vertically installed inside the rear cover plate, the rear window cover body is connected to the rear cover plate, the rear window cover body is extended outwardly to provide a rear window cover fastening screw, the rear window cover fastening screw is vertically installed on the rear window cover body, the rear window cover fastening screw is connected to the rear window cover body, and is used to limit the rear window cover body to the inside of the rear cover plate, and the heat dissipation grid is located on the outer surface of the rear window cover body.

[0011] As a further explanation, a fan fastening screw is provided extending outward from the rear window cover fastening screw, the fan fastening screw is vertically installed on the rear window cover body, and the fan fastening screw is connected to the cooling fan for fixing the cooling fan.

[0012] As a further explanation, the rear cover plate is extended outwardly to have a base plate, the base plate is vertically mounted on the rear cover plate, the base plate is connected to the rear cover plate and is used to support the rear cover plate, and the base plate is extended outwardly to have a baffle, the baffle is vertically mounted on the base plate, and the baffle is connected to the base plate.

[0013] As a further explanation, a pad is provided extending outward from the bottom plate, the pad is vertically installed on the bottom plate, and the pad is connected to the bottom plate for supporting the bottom plate.

[0014] To sum up, the utility model has the following beneficial effects: the utility model provides a chassis rear plate heat dissipation device, the vertical installation of the cooling fan and the setting of the heat dissipation grid effectively increase the heat dissipation area, so that the heat inside the chassis can be quickly dissipated to the external environment, thereby reducing the temperature inside the chassis and improving the stability and reliability of the equipment. The graphics card heat dissipation slot and ventilation grid provide an independent heat dissipation channel for the graphics card, effectively avoiding the problem of graphics card overheating, ensuring the stable performance of the graphics card under high load operation, and improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional structural schematic diagram of a chassis rear plate heat dissipation device of the utility model;

[0016] Figure 2 This is a rear view of a chassis rear plate heat dissipation device of the utility model;

[0017] Figure 3 The utility model is a top view of a chassis rear plate heat dissipation device.

[0018] Numbers in the figure: 10-power supply assembly, 101-data transmission board, 102-mainboard interface, 103-power supply placement slot, 20-support assembly, 201-rear cover, 202-side panel, 203-upper cover, 204-bottom plate, 205-pad, 206-rear window cover fastening screws, 207-fan fastening screws, 208-block, 209-rear window cover body, 30-heat dissipation assembly, 301-graphics card heat dissipation slot, 302-heat dissipation grid, 303-ventilation slot, 304-cooling fan, 305-ventilation grid. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-3 As shown, a chassis rear plate heat dissipation device includes a support assembly, a heat dissipation assembly and a power supply assembly. The heat dissipation assembly is vertically mounted on the support assembly, and the heat dissipation assembly is connected to the support assembly for dissipating heat from the chassis. The power supply assembly is vertically mounted on the support assembly, and the power supply assembly is connected to the support assembly. The heat dissipation assembly includes a cooling fan 304, and the cooling fan 304 is vertically mounted on the support assembly, and the cooling fan 304 is connected to the support assembly for cooling the inside of the chassis.

[0021] Specifically, the cooling fan 304 serves as a main cooling element. When the device is running, the cooling fan 304 starts to work, generates a strong wind flow through rotation, and discharges the hot air inside the chassis through the cooling grid 302.

[0022] A heat dissipation grid 302 is provided extending outward from the heat dissipation fan 304. The heat dissipation grid 302 is vertically mounted on the support component. One end of the heat dissipation grid 302 is provided with a graphics card heat dissipation slot 301 connected thereto. The graphics card heat dissipation slot 301 is vertically mounted on the support component.

[0023] Specifically, in order to enhance the heat dissipation effect of the graphics card, a graphics card heat dissipation slot 301 and a ventilation grid 305 are provided. The graphics card heat dissipation slot 301 is located in the middle of the rear cover plate 201, and forms a synergistic heat dissipation effect with the heat dissipation fan 304. When the heat dissipation fan 304 is working, hot air is quickly discharged through the graphics card heat dissipation slot 301 and the ventilation grid 305, ensuring that the graphics card can maintain a low temperature when working under high load, thereby improving practicality.

[0024] The graphics card heat sink 301 is extended outwardly to be provided with a ventilation grid 305, the ventilation grid 305 is vertically installed on the support component, the ventilation grid 305 is connected to the support component, the heat sink component is extended outwardly to be provided with a ventilation slot 303, and the ventilation slot 303 is vertically provided on the support component.

[0025] Specifically, the ventilation slots 303 are vertically opened inside the upper cover plate 203, allowing external cold air to enter the chassis and form convection with the internal hot air, thereby accelerating the dissipation of heat. Through the setting of the ventilation grid 305, the components inside the chassis can be effectively cooled, thereby improving practicality.

[0026] The power supply assembly includes a data transmission board 101, a mainboard interface 102 and a power supply placement slot 103. The data transmission board 101 is vertically mounted on the support assembly, the mainboard interface 102 is vertically mounted on the support assembly, and the power supply placement slot 103 is vertically mounted on the support assembly.

[0027] Specifically, the power supply assembly provides functions such as data transmission, motherboard interface 102 and power supply placement slot 103, ensuring stable power supply and data transmission of hardware inside the chassis. At the same time, the power supply assembly also avoids thermal interference with other heat dissipation components through reasonable design and layout, ensuring stable operation of the entire system and improving practicality. Through the setting of data transmission board 101, it is mainly used to transmit data from the outside to the inside of the chassis.

[0028] The supporting assembly includes a rear cover 201, a side panel 202 and an upper cover 203. The upper cover 203 is vertically mounted on the side panel 202, and the upper cover 203 is connected to the side panel 202. The rear cover 201 is vertically mounted on the side panel 202, and the rear cover 201 is connected to the side panel 202. The cooling fan 304 is located inside the rear cover 201, the graphics card heat dissipation slot 301 is located in the middle of the rear cover 201, the ventilation grid 305 is located inside the rear cover 201, the ventilation slot 303 is located inside the upper cover 203, the data transmission board 101 is located on the top of the upper cover 203, the motherboard interface 102 is located inside the rear cover 201, and the power placement slot 103 is located at the tail of the rear cover 201.

[0029] Specifically, in terms of supporting components, the rear cover plate 201, the side panel 202, the upper cover plate 203 and other components are tightly connected by vertical installation, forming a stable chassis structure, thereby improving the stability of the overall equipment.

[0030] A rear window cover body 209 is extended outward from the rear cover plate 201, and the rear window cover body 209 is vertically installed inside the rear cover plate 201, and the rear window cover body 209 is connected to the rear cover plate 201. A rear window cover fastening screw 206 is extended outward from the rear window cover body 209, and the rear window cover fastening screw 206 is vertically installed on the rear window cover body 209, and the rear window cover fastening screw 206 is connected to the rear window cover body 209, and is used to limit the rear window cover body 209 inside the rear cover plate 201. The heat dissipation grid 302 is located on the outer surface of the rear window cover body 209.

[0031] Specifically, components such as the rear window cover body 209 and the fan fastening screws 207 ensure stable installation and fixation of the cooling fan 304, prevent malfunctions due to vibration or movement, and improve practicality.

[0032] A fan fastening screw 207 is provided extending outward from the rear window cover fastening screw 206 . The fan fastening screw 207 is vertically mounted on the rear window cover body 209 . The fan fastening screw 207 is connected to the cooling fan 304 for fixing the cooling fan 304 .

[0033] Specifically, the design of the rear window cover body 209 and the fan fastening screws 207 makes the replacement and maintenance of the cooling fan 304 simple and quick, thereby improving the maintainability of the equipment.

[0034] A bottom plate 204 is extended outward from the rear cover plate 201, and the bottom plate 204 is vertically mounted on the rear cover plate 201. The bottom plate 204 is connected to the rear cover plate 201 for supporting the rear cover plate 201. A baffle 208 is extended outward from the bottom plate 204, and the baffle 208 is vertically mounted on the bottom plate 204. The baffle 208 is connected to the bottom plate 204.

[0035] Specifically, the arrangement of the bottom plate 204, the baffle 208 and the pad 205 not only enhances the stability of the rear plate of the chassis, but also provides additional support and protection for the chassis, preventing damage caused by external factors and improving practicality.

[0036] A pad 205 is provided extending outward from the bottom plate 204 . The pad 205 is vertically mounted on the bottom plate 204 . The pad 205 is connected to the bottom plate 204 to support the bottom plate 204 .

[0037] The vertical installation of the cooling fan 304 and the setting of the cooling grid 302 effectively increase the cooling area, so that the heat inside the chassis can be quickly dissipated to the external environment, reducing the temperature inside the chassis and improving the stability and reliability of the equipment. The graphics card heat dissipation slot 301 and the ventilation grid 305 provide an independent cooling channel for the graphics card, effectively avoiding the problem of overheating of the graphics card, ensuring the stable performance of the graphics card when working under high load, and improving practicality.

[0038] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0039] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chassis rear plate heat dissipation device, characterized in that: including a support assembly; A heat dissipation component, which is vertically mounted on the support component and connected to the support component for dissipating heat from the chassis; A power supply assembly, the power supply assembly is vertically mounted on the support assembly, and the power supply assembly is connected to the support assembly; The heat dissipation component includes a heat dissipation fan, which is vertically installed on the support component and connected to the support component for cooling the interior of the chassis.

2. The chassis rear plate heat dissipation device according to claim 1, characterized in that: A heat dissipation grid is provided outwardly extending from the heat dissipation fan, and the heat dissipation grid is vertically installed on the support component. One end of the heat dissipation grid is provided with a graphics card heat dissipation slot connected thereto, and the graphics card heat dissipation slot is vertically installed on the support component.

3. The chassis rear plate heat dissipation device according to claim 2, characterized in that: The graphics card heat sink extends outwardly to be provided with a ventilation grid, the ventilation grid is vertically installed on the support component, the ventilation grid is connected to the support component, the heat sink component extends outwardly to be provided with a ventilation slot, and the ventilation slot is vertically provided on the support component.

4. The chassis rear plate heat dissipation device according to claim 3, characterized in that: The power supply assembly includes a data transmission board, a mainboard interface, and a power supply placement slot. The data transmission board is vertically mounted on the support assembly, the mainboard interface is vertically mounted on the support assembly, and the power supply placement slot is vertically mounted on the support assembly.

5. The chassis rear plate heat dissipation device according to claim 4, characterized in that: The support assembly includes a rear cover plate, a side panel and an upper cover plate, the upper cover plate is vertically mounted on the side panel, the upper cover plate is connected to the side panel, the rear cover plate is vertically mounted on the side panel, the rear cover plate is connected to the side panel, the cooling fan is located inside the rear cover plate, the graphics card heat dissipation slot is located in the middle of the rear cover plate, the ventilation grid is located inside the rear cover plate, the ventilation slot is located inside the upper cover plate, the data transmission board is located on the top of the upper cover plate, the mainboard interface is located inside the rear cover plate, and the power supply placement slot is located at the tail of the rear cover plate.

6. The chassis rear plate heat dissipation device according to claim 5, characterized in that: The rear cover plate is extended outwardly to be provided with a rear window cover body, the rear window cover body is vertically installed inside the rear cover plate, the rear window cover body is connected to the rear cover plate, the rear window cover body is extended outwardly to be provided with a rear window cover fastening screw, the rear window cover fastening screw is vertically installed on the rear window cover body, the rear window cover fastening screw is connected to the rear window cover body and is used for limiting the rear window cover body inside the rear cover plate, and the heat dissipation grid is located on the outer surface of the rear window cover body.

7. The chassis rear plate heat dissipation device according to claim 6, characterized in that: A fan fastening screw is provided extending outward from the rear window cover fastening screw, and the fan fastening screw is vertically installed on the rear window cover body. The fan fastening screw is connected to the cooling fan and is used to fix the cooling fan.

8. The chassis rear plate heat dissipation device according to claim 5, characterized in that: The rear cover plate is extended outwardly to be provided with a bottom plate, the bottom plate is vertically mounted on the rear cover plate, the bottom plate is connected to the rear cover plate and is used to support the rear cover plate, and the bottom plate is extended outwardly to be provided with a baffle, the baffle is vertically mounted on the bottom plate, and the baffle is connected to the bottom plate.

9. The chassis rear plate heat dissipation device according to claim 8, characterized in that: A pad is provided extending outward from the bottom plate, the pad is vertically mounted on the bottom plate, and the pad is connected to the bottom plate for supporting the bottom plate.

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