Semiconductor chip clamping table
By designing a semiconductor chip clamping table with a rotating motor, a front motor and a slip shaft, the problem of poor applicability of semiconductor device fixing fixtures in the prior art is solved, and stable clamping and efficient detection of semiconductor devices of different sizes are achieved.
Patent Information
- Application Number
- CN202421784307.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-07-26
AI Technical Summary
The existing semiconductor device fixing fixtures have poor applicability and cannot be applied to semiconductor devices of different sizes, resulting in the need to frequently replace different fixtures.
A semiconductor chip clamping table is designed, adopting structures such as the table body, clamping outer frame, side clamping plate, front moving frame and clamping spring. Through the cooperation of the rotating motor, front motor and sliding shaft, the clamping outer frame and side clamping plate are realized, adapting to semiconductor devices of different sizes, and providing stable clamping force through clamping springs and buffer springs.
The stable clamping of semiconductor devices of different sizes is achieved, which avoids damage caused by excessive clamping force and improves the efficiency of semiconductor detection.
Smart Images
Figure CN222619741U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor chip clamping table. Background Art
[0002] A semiconductor device is made of silicon, germanium or gallium arsenide. During the production and processing of semiconductor devices, the semiconductor devices need to be tested. When testing the semiconductor devices, they need to be fixed on a test bench. The applicability of existing fixing fixtures is poor and cannot be used for semiconductor devices of different sizes, resulting in the need to frequently replace different fixtures. Utility Model Content
[0003] The purpose of the utility model is to provide a semiconductor chip clamping platform to overcome the above-mentioned defects in the prior art.
[0004] According to the utility model, a semiconductor chip clamping platform comprises a platform body, a rear rotation axis is rotatably arranged at the rear side of the upper end surface of the platform body, two clamping outer frames that can move left and right are symmetrically arranged at the upper end surface of the platform body, and a side clamping plate that can move left and right is arranged at the end surface of one side of the clamping outer frame close to the symmetry center;
[0005] A front movable frame that can move forward and backward is provided on the front side of the upper end face of the platform body, a front clamping plate that can move forward and backward is provided on the rear end face of the front movable frame, a clamping inner cavity is provided in the clamping outer frame, and the side clamping plate extends from the end face on one side away from the symmetry center into the clamping inner cavity.
[0006] As a preferred embodiment of the utility model, the outer circumferential surface of the rear rotating shaft is symmetrical on the left and right and is fixed with two threaded sleeves, the outer circumferential surface of the threaded sleeve is threadedly connected to the rear end surface of the clamping outer frame, the right end surface of the platform is fixed with a rotating motor, and the right end surface of the rear rotating shaft is dynamically connected to the rotating motor.
[0007] As a preferred embodiment of the utility model, a clamping spring is fixedly connected between a side wall of the clamping inner cavity away from the center and an end face of the side clamping plate on the same side away from the center, a front clamping cavity is provided in the front movable frame, the front end face of the front clamping plate extends into the front clamping cavity and a buffer spring is fixedly connected between the front clamping cavity, and both the buffer spring and the clamping spring can provide clamping force.
[0008] As a preferred embodiment of the utility model, a sliding shaft is rotatably provided on the front side of the upper end face of the platform, the lower end face of the front movable frame is threadedly connected to the sliding shaft, the front end face of the platform is fixedly provided with a front motor, and the front end face of the sliding shaft is dynamically connected to the front motor.
[0009] As a preferred embodiment of the present invention, a lighting lamp is fixedly provided on the rear side of the upper end surface of the platform, and the lighting lamp can illuminate the upper end surface of the platform to assist in the detection of semiconductor chips.
[0010] As a preferred embodiment of the present invention, a control panel is fixedly provided on the right side of the front end surface of the platform body, and the control panel can control the start and stop of all motors of the present invention.
[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:
[0012] 1. In the utility model, the rear rotating shaft is driven to rotate, thereby driving the threaded sleeve to rotate, and then driving the clamping outer frame to move toward the center side, and then driving the side clamping plates on both sides to move toward the center side. At the same time, the front motor is started to drive the sliding shaft to rotate, thereby driving the front moving frame to move toward the rear side to complete the clamping work. The sliding connection between the side clamping plates and the front clamping plates also enables the utility model to be applicable to semiconductor devices of different sizes.
[0013] 2. In the present invention, the side clamping plates and the front clamping plates can clamp the chip through the rebound force of the clamping spring and the front clamping cavity, and the clamping spring and the buffer spring can prevent the semiconductor chip from being damaged due to excessive clamping force.
[0014] 3. In the present invention, when performing semiconductor testing, the lighting lamp can illuminate the semiconductor chip, effectively assisting the testing work and improving the testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is the front view of the utility model;
[0016] Figure 2 It is a rear view of the utility model;
[0017] Figure 3 It is a left view of the utility model;
[0018] Figure 4 It is a top view of the utility model;
[0019] Figure 5 This is a schematic diagram of the overall structure of a semiconductor chip clamping platform of the utility model;
[0020] Figure 6 This utility model Figure 4 A schematic diagram of the structure of the center front clamping plate 21 component.
[0021] In the figure:
[0022] 11. Platform; 12. Front motor; 13. Front moving frame; 14. Side clamping plate; 15. Clamping outer frame; 16. Rotating motor; 17. Threaded sleeve; 18. Lighting lamp; 19. Control panel; 20. Rear rotating shaft; 21. Front clamping plate; 22. Clamping inner cavity; 23. Clamping spring; 24. Front clamping cavity; 25. Buffer spring; 26. Sliding shaft. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] Embodiment 1
[0025] See also Figure 1-Figure 6 , which is the first embodiment of the utility model, and provides an embodiment of a semiconductor chip clamping platform, including a platform body 11, a rear rotation axis 20 is rotatably provided on the rear side of the upper end surface of the platform body 11, two clamping outer frames 15 that can move left and right are symmetrically provided on the upper end surface of the platform body 11, and a side clamping plate 14 that can move left and right is provided on the end surface of the clamping outer frame 15 close to the symmetry center;
[0026] A front movable frame 13 capable of moving forward and backward is provided on the front front side of the upper end face of the platform body 11, a front clamping plate 21 capable of moving forward and backward is provided on the rear end face of the front movable frame 13, a clamping inner cavity 22 is provided in the clamping outer frame 15, and the side clamping plate 14 extends from the end face on one side away from the symmetry center into the clamping inner cavity 22.
[0027] The outer circumferential surface of the rear rotating shaft 20 is symmetrical and fixed with two threaded sleeves 17. The outer circumferential surface of the threaded sleeve 17 is threadedly connected to the rear end surface of the clamping outer frame 15. A rotating motor 16 is fixedly provided on the right end surface of the platform body 11. The right end surface of the rear rotating shaft 20 is dynamically connected to the rotating motor 16.
[0028] A clamping spring 23 is fixedly connected between a side wall of the clamping inner cavity 22 away from the center and an end face of the side clamping plate 14 on the same side away from the center. A front clamping cavity 24 is provided in the front movable frame 13. The front end face of the front clamping plate 21 extends into the front clamping cavity 24 and a buffer spring 25 is fixedly connected between the front clamping cavity 24. Both the buffer spring 25 and the clamping spring 23 can provide clamping force.
[0029] A sliding shaft 26 is rotatably provided on the front side of the upper end face of the platform body 11, the lower end face of the front moving frame 13 is threadedly connected to the sliding shaft 26, a front motor 12 is fixedly provided on the front end face of the platform body 11, and the front end face of the sliding shaft 26 is dynamically connected to the front motor 12.
[0030] An illumination lamp 18 is fixedly provided on the rear side of the upper end surface of the platform 11 , and the illumination lamp 18 can illuminate the upper end surface of the platform 11 to assist in the detection of semiconductor chips.
[0031] A control panel 19 is fixedly disposed on the right side of the front end surface of the platform body 11 , and the control panel 19 can control the start and stop of all motors of the utility model.
[0032] Specific workflow:
[0033] When performing semiconductor testing, the semiconductor can be placed on the upper end surface of the table 11. At this time, the rotating motor 16 is started to drive the rear rotating shaft 20 to rotate, thereby driving the threaded sleeve 17 to rotate, and then driving the clamping outer frame 15 to move toward the center side, and then driving the side clamping plates 14 on both sides to move toward the center side. At the same time, the front motor 12 is started to drive the sliding shaft 26 to rotate, thereby driving the front moving frame 13 to move toward the rear side. The side clamping plates 14 and the front clamping plates 21 can clamp the chip through the rebound force of the clamping springs 23 and the front clamping chamber 24. At the same time, the clamping springs 23 and the buffer springs 25 can also prevent the semiconductor chip from being damaged due to excessive clamping force. The sliding connection between the side clamping plates 14 and the front clamping plates 21 can also make the utility model suitable for semiconductor devices of different sizes.
[0034] When performing semiconductor testing, the lighting lamp 18 can illuminate the semiconductor chip, effectively assisting the testing work and improving the testing efficiency.
[0035] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.
Claims
1. A semiconductor chip holding platform, comprising a platform body (11), characterized in that: A rear rotating shaft (20) is rotatably provided on the rear side of the upper end surface of the platform (11); two clamping external frames (15) that can move leftward and rightward are symmetrically provided on the upper end surface of the platform (11); and a side clamping plate (14) that can move leftward and rightward is provided on the end surface of one side of the clamping external frame (15) close to the symmetry center; A front movable frame (13) capable of moving forward and backward is provided on the front side of the upper end face of the platform (11), a front clamping plate (21) capable of moving forward and backward is provided on the rear end face of the front movable frame (13), a clamping inner cavity (22) is provided in the clamping outer frame (15), and the end face of the side clamping plate (14) away from the symmetry center extends into the clamping inner cavity (22).
2. A semiconductor chip clamping platform according to claim 1, characterized in that: The outer circumferential surface of the rear rotating shaft (20) is bilaterally symmetrical and fixedly provided with two threaded sleeves (17). The outer circumferential surface of the threaded sleeve (17) is threadedly connected to the rear end surface of the clamping outer frame (15). A rotating motor (16) is fixedly provided on the right end surface of the platform (11). The right end surface of the rear rotating shaft (20) is dynamically connected to the rotating motor (16).
3. The semiconductor chip clamping platform according to claim 1, characterized in that: A clamping spring (23) is fixedly connected between a side wall of the clamping inner cavity (22) away from the center and an end face of the side clamping plate (14) on the same side away from the center. A front clamping cavity (24) is provided in the front movable frame (13). The front end face of the front clamping plate (21) extends into the front clamping cavity (24) and a buffer spring (25) is fixedly connected between the front clamping cavity (24).
4. The semiconductor chip clamping platform according to claim 1, characterized in that: A sliding shaft (26) is rotatably provided on the front side of the upper end face of the platform (11); the lower end face of the front moving frame (13) is threadedly connected to the sliding shaft (26); a front motor (12) is fixedly provided on the front end face of the platform (11); and the front end face of the sliding shaft (26) is dynamically connected to the front motor (12).
5. The semiconductor chip holding platform according to claim 1, characterized in that: A lighting lamp (18) is fixedly provided on the rear side of the upper end surface of the platform (11).
6. The semiconductor chip holding platform according to claim 1, characterized in that: A control panel (19) is fixedly provided on the right side of the front end surface of the platform (11).