Heat dissipation module and electronic device

Abstract

The utility model discloses a heat dissipation module and an electronic device, the heat dissipation module comprises a heat dissipation assembly, a chip assembly and a fixing assembly, and the heat dissipation assembly is provided with a first through hole and a second through hole; the chip assembly comprises a circuit board assembly, a first chip and a first heat conduction layer, the first chip is arranged on the circuit board assembly, the first heat conduction layer is arranged on the side, away from the circuit board assembly, of the first chip, positioning columns are arranged on the circuit board assembly, the positioning columns correspond to the first through holes, the positioning columns penetrate through the corresponding first through holes, and the first heat conduction layer is arranged on the side, away from the first through holes, of the first chip. The circuit board assembly is provided with a first limiting hole, and the first limiting hole and the second through hole are arranged correspondingly. The fixing assemblies sequentially penetrate through the second through holes and the corresponding first limiting holes to fix the heat dissipation assembly and the chip assembly, and the fixing assemblies are used for applying acting force to the heat dissipation assembly so that the heat dissipation assembly can abut against the first heat conduction layer. According to the invention, the heat dissipation assembly abuts against the first heat conduction layer, so that the thermal resistance of the corresponding first chip can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, in particular to a heat dissipation module and an electronic device. Background Art

[0002] With the advancement of integrated circuit technology, computer chips are showing a trend of high integration, miniaturization and high frequency, and the heat generated per unit area of ​​electronic components has increased significantly. Based on this, advanced electronic chip heat dissipation technology has become the core of solving the heat dissipation problem.

[0003] When the chip is set on the circuit board, due to the influence of product specifications and other factors, there are height differences between different chips on the circuit board. In the related technology, a heat dissipation unit with a heat dissipation function is used to dissipate heat from the chip. Due to the non-standard installation of the heat sink and other reasons, an inclination angle is very likely to appear between the heat sink and the chip, resulting in excessive pressure from the heat sink on some chips, which is prone to device collisions, damage to interface materials, damage to components and other production defects. Utility Model Content

[0004] The present application provides a heat dissipation module and an electronic device, which can use positioning columns to limit the position of a heat dissipation component to prevent the heat dissipation component from moving arbitrarily and colliding with other components, and can press down the heat dissipation component so that the heat dissipation component abuts against a first thermal conductive layer. By reducing the distance between the heat dissipation component and the first chip, the thermal resistance can be reduced.

[0005] In order to solve the above technical problems, the present application provides a heat dissipation module on one hand, including a heat dissipation component, a chip component and at least one fixed component. Among them, the heat dissipation component is provided with a plurality of first through holes and a plurality of second through holes; the chip component includes a circuit board component, at least one first chip and a first heat-conducting layer, the first chip is arranged on the circuit board component, the first heat-conducting layer is arranged on the side of the corresponding first chip away from the circuit board component, a plurality of positioning posts are arranged on the circuit board component, the plurality of positioning posts are arranged correspondingly to the plurality of first through holes, the positioning posts pass through the corresponding first through holes to limit the position of the heat dissipation component, the circuit board component is provided with a plurality of first limiting holes, the plurality of first limiting holes are arranged correspondingly to the plurality of second through holes; the fixed component passes through the second through holes and the corresponding first limiting holes in sequence to fix the heat dissipation component and the chip component, and the fixed component is used to apply a force to the heat dissipation component so that the heat dissipation component abuts against the first heat-conducting layer.

[0006] In some embodiments, the circuit board assembly includes a stacked circuit board and a bottom support plate, the first chip is arranged on a side of the circuit board away from the bottom support plate, the circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, the bottom support plate is provided with a plurality of first limiting holes and a plurality of positioning columns, the plurality of third through holes are arranged corresponding to the plurality of first through holes, and the plurality of fourth through holes are arranged corresponding to the plurality of second through holes; the positioning columns pass through the corresponding third through holes and the first through holes in sequence, and the fixing components pass through the corresponding second through holes, the fourth through holes and the first limiting holes in sequence.

[0007] In some embodiments, the circuit board assembly includes a stacked circuit board, a bottom support plate and a plurality of limit columns, the first chip is arranged on the side of the circuit board away from the bottom support plate, the circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, the bottom support plate is provided with a plurality of positioning columns and a plurality of limit columns, each limit column is provided with a first limit hole, the limit column and the fourth through hole are arranged correspondingly, and the limit column is passed through the corresponding fourth through hole; the positioning column passes through the corresponding third through hole and the first through hole in sequence, and the fixing assembly passes through the corresponding second through hole and the first limit hole in sequence.

[0008] In some embodiments, the radial dimension of the positioning column decreases in a direction away from the bottom support plate.

[0009] In some embodiments, the chip assembly also includes several second chips and a second thermal conductive layer. The several second chips are arranged on the side of the circuit board away from the bottom support plate and are spaced apart from the first chip. The second thermal conductive layer is arranged on the side of the corresponding second chip away from the bottom support plate.

[0010] In some embodiments, the second heat-conducting layer is spaced apart from the heat dissipation component.

[0011] In some embodiments, the positioning column and the bottom support plate are integrally formed; or the positioning column and the bottom support plate are detachably connected.

[0012] In some embodiments, when the positioning column is detachably connected to the bottom support plate, a plurality of second limiting holes are also provided on the bottom support plate, and the second limiting holes are provided corresponding to the third through holes; the positioning column passes through the second limiting hole, the corresponding third through hole and the first through hole in sequence.

[0013] In some embodiments, each fixing component includes a fastener and an elastic member; the fastener passes through the elastic member, the second through hole, the fourth through hole and the corresponding first limiting hole in sequence; or, the fastener passes through the elastic member, the second through hole and the corresponding first limiting hole in sequence.

[0014] In order to solve the above technical problem, the present application provides an electronic device on the other hand, which includes a housing and the above-mentioned heat dissipation module, wherein the housing is provided with a cavity, and the heat dissipation module is arranged in the cavity.

[0015] The heat dissipation module and electronic device provided by the present application, the heat dissipation module includes a heat dissipation component, a chip component and a fixing component, the heat dissipation component is provided with a first through hole and a second through hole; the chip component includes a circuit board component, a first chip and a first heat-conducting layer, the first chip is provided on the circuit board component, the first heat-conducting layer is provided on the side of the first chip away from the circuit board component, a positioning column is provided on the circuit board component, the positioning column is provided corresponding to the first through hole, the positioning column passes through the corresponding first through hole to limit the position of the heat dissipation component, the circuit board component is provided with a first limiting hole, the first limiting hole is provided corresponding to the second through hole; the fixing component passes through the second through hole and the corresponding first limiting hole in sequence to fix the heat dissipation component and the chip component, and the fixing component is used to apply a force to the heat dissipation component so that the heat dissipation component abuts against the first heat-conducting layer. By limiting the position of the heat dissipation component by using the positioning column, the heat dissipation component can be prevented from arbitrarily moving and colliding with other components, and the heat dissipation component is also pressed down by the fixing component so that the heat dissipation component abuts against the first heat-conducting layer, which can reduce the distance between the heat dissipation component and the first chip, thereby reducing the thermal resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0017] Figure 1 is a schematic diagram of the structure of the heat dissipation module in some embodiments of the present application;

[0018] Figure 2 yes Figure 1 The assembly effect diagram of the heat dissipation module shown;

[0019] Figure 3 is a schematic diagram of the first heat-conducting layer after being extruded in some embodiments of the present application;

[0020] Figure 4 is a schematic diagram of the structure of the heat dissipation module in some embodiments of the present application;

[0021] Figure 5 is a schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0022] Figure 6 is a schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0023] Figure 7 is a schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0024] Figure 8 is a schematic diagram of the structure of a fixing assembly in some embodiments of the present application;

[0025] Fig. 9 is an assembly effect diagram of a heat dissipation module in some embodiments of the present application;

[0026] Fig.10 It is a schematic diagram of the structure of the electronic device in some embodiments of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some but not all structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0028] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of the heat dissipation module in some embodiments of the present application, Figure 2 yes Figure 1 The heat dissipation module 10 comprises a heat dissipation component 101 , a chip component 102 and at least one fixing component 103 .

[0029] The heat dissipation component 101 is provided with a plurality of first through holes 1011 and a plurality of second through holes 1012; the chip component 102 includes a circuit board component 1021, at least one first chip 1022 and a first heat conducting layer 1023, the first chip 1022 is provided on the circuit board component 1021, the first heat conducting layer 1023 is provided on a side of the corresponding first chip 1022 away from the circuit board component 1021, and a plurality of positioning posts 1024 are provided on the circuit board component 1021, and the plurality of positioning posts 1024 correspond to the plurality of first through holes 1011. The positioning column 1024 is arranged to pass through the corresponding first through hole 1011 to limit the position of the heat dissipation component 101, and a plurality of first limiting holes 1025 are arranged on the circuit board component 1021, and the plurality of first limiting holes 1025 are arranged corresponding to the plurality of second through holes 1012; the fixing component 103 passes through the second through hole 1012 and the corresponding first limiting hole 1025 in sequence to fix the heat dissipation component 101 and the chip component 102, and the fixing component 103 is used to apply a force to the heat dissipation component 101 so that the heat dissipation component 101 abuts against the first thermal conductive layer 1023.

[0030] It can be understood that the heat dissipation component 101 can perform heat dissipation treatment on the chip arranged on the circuit board component 1021. The heat dissipation component 101 can include components such as a main board and heat dissipation fins, which are not limited here. The first through hole 1011 and the second through hole 1012 on the heat dissipation component 101 can be arranged on the main board.

[0031] The number, shape, positional relationship and size of the first through hole 1011 and the second through hole 1012 on the heat dissipation component 101 can be determined according to actual conditions, and the number, shape and size of the positioning columns 1024 on the circuit board component 1021 can be determined according to actual conditions. There is no restriction here, but it needs to be satisfied that the positioning columns 1024 are set corresponding to the first through hole 1011, and the first limiting hole 1025 is set corresponding to the second through hole 1012.

[0032] In some embodiments, the positioning column 1024 is integrally formed with the circuit board assembly 1021 or is detachably connected thereto.

[0033] In some application scenarios, under the premise of limiting the position of the heat dissipation component 101 by using the positioning column 1024 and fixing the heat dissipation component 101 and the circuit board component 1021 by using the fixing component 103, in order to save costs, the number of positioning columns 1024 and fixing components 103 can be reduced as much as possible. For example, the heat dissipation component 101 includes two first through holes 1011 and one second through hole 1012, the circuit board component 1021 is provided with two positioning columns 1024, and a fixing component 103 is used to apply force to the heat dissipation component 101; for another example, the heat dissipation component 101 includes two first through holes 1011 and two second through holes 1012, the circuit board component 1021 is provided with two positioning columns 1024, and one or two fixing components 103 are used to apply force to the heat dissipation component 101.

[0034] It can be understood that in order to ensure that the heat dissipation component 101 can be fixed and force applied, at least two positioning columns 1024 and at least one fixing component 103 are required.

[0035] In some other application scenarios, under the premise of limiting the position of the heat dissipation component 101 by using the positioning column 1024 and fixing the heat dissipation component 101 with the circuit board component 1021 by using the fixing component 103, the positioning column 1024 may not be arranged corresponding to the first through hole 1011, and / or the first limiting hole 1025 may not be arranged corresponding to the second through hole 1012. For example, the number of the positioning column 1024 is less than the number of the first through hole 1011; and / or, when the number of the fixing component 103 and the first limiting hole 1025 is the same, the number of the first limiting hole 1025 is less than the number of the second through hole 1012, or, when the number of the fixing component 103 and the second through hole 1012 is the same, the number of the first limiting hole 1025 is greater than the number of the second through hole 1012.

[0036] In some embodiments, the positional relationship between the positioning posts 1024 and the first chip 1022 on the circuit board assembly 1021 can be determined according to actual conditions. For example, in the extension direction of the circuit board assembly 1021, the first chip 1022 is disposed between at least two positioning posts 1024; or in another example, in the extension direction of the circuit board assembly 1021, all the positioning posts 1024 are disposed on one side of the first chip 1022.

[0037] In some embodiments of the present application, after the heat dissipation component 101 is fixed by the positioning column 1024, the fixing component 103 is used to apply a force to the heat dissipation component 101. The magnitude of the force applied to the fixing component 103 can be controlled to achieve control over the magnitude of the force applied to the heat dissipation component 101. Furthermore, within the pressure range that the first chip 1022 can withstand, the heat dissipation component 101 is driven to abut against the first thermal conductive layer 1023, or even continuously squeeze the first thermal conductive layer 1023, so that the thickness of the first thermal conductive layer 1023 between the heat dissipation component 101 and the first chip 1022 changes, so as to reduce the distance between the heat dissipation component 101 and at least part of the first chip 1022.

[0038] On the one hand, since the relationship between the contact thermal resistance and the contact pressure applied to the first chip 1022 is: the greater the contact pressure, the smaller the contact thermal resistance. Therefore, after applying a force to the heat dissipation component 101 through the fixing component 103, the pressure of the heat dissipation component 101 on the first chip 1022 can be increased, thereby reducing the contact thermal resistance.

[0039] On the other hand, since the surface of the side of the heat dissipation component 101 close to the first heat-conducting layer 1023 and the side of the first chip 1022 away from the circuit board component 1021 have a certain degree of roughness, they are not smooth and flat, and the relationship between the surface roughness of the heat dissipation component 101 or the first chip 1022 and the interface thermal resistance is: the greater the roughness, the greater the interface thermal resistance. Based on this, under the extrusion of the fixing component 103, the thickness of the first heat-conducting layer 1023 changes irregularly, and the air between the heat dissipation component 101 and the first chip 1022 (air has a certain degree of heat preservation function) can be squeezed out, such as Figure 3 As shown, the gap between the heat dissipation component 101 and the first chip 1022 is almost “zero”, which can reduce the interface thermal resistance.

[0040] Furthermore, in the embodiment of the present application, when the heat dissipation module 10 dissipates heat for a plurality of chips, in addition to dissipating heat for the first chip 1022 , it can also dissipate heat for other types of chips at the same time.

[0041] See also Figure 4 , Figure 41 is a schematic diagram of the structure of the heat dissipation module 10 in some embodiments of the present application, and the heat dissipation module 10 includes a heat dissipation component 101, a chip component 102 and at least one fixing component 103. Among them, the chip component 102 includes a circuit board component 1021, at least one first chip 1022, a first heat-conducting layer 1023, at least one second chip 1026 and a second heat-conducting layer 1027. The first chip 1022 and the second chip 1026 are arranged on the circuit board component 1021, the first heat-conducting layer 1023 is arranged on the side of the corresponding first chip 1022 away from the circuit board component 1021, the second heat-conducting layer 1027 is arranged on the side of the corresponding second chip 1026 away from the circuit board component 1021, and the second chip 1026 is arranged at a distance from the first chip 1022.

[0042] It is understandable that the spacing between the first chip 1022 and the second chip 1026 can be determined according to actual conditions. Furthermore, when there is at least one first chip 1022 and at least one second chip 1026, the position layout of the first chip 1022 and the second chip 1026 on the circuit board assembly 1021 can be determined according to actual conditions, and there is no limitation here.

[0043] In some embodiments, the first chip 1022 and the second chip 1026 are different in type, property, etc. For example, the first chip 1022 is a CPU (Central Processing Unit), and the second chip 1026 is a FPGA (Field-Programmable Gate Array) chip.

[0044] In some embodiments, due to the difference in specifications of the first chip 1022 and the second chip 1026, when the first chip 1022 and the second chip 1026 are both disposed on the circuit board assembly 1021, there may be a difference in height between the two. In this case, the thickness of the first heat-conducting layer 1023 and the second heat-conducting layer 1027 can be set to achieve that the two are in the same horizontal plane when in contact with the heat dissipation assembly 101, so that the heat dissipation assembly 101 can simultaneously abut against the first heat-conducting layer 1023 and the second heat-conducting layer 1027. Furthermore, when the fixing assembly 103 continuously applies force to the heat dissipation assembly 101, the first heat-conducting layer 1023 and the second heat-conducting layer 1027 can be squeezed simultaneously, so as to reduce the distance between the heat dissipation assembly 101 and the first chip 1022, and reduce the distance between the heat dissipation assembly 101 and the second chip 1026 within the force range of the first chip 1022 and the second chip 1026, thereby reducing the contact thermal resistance and interface thermal resistance of the first chip 1022 and the second chip 1026.

[0045] In some embodiments, due to reasons such as manufacturing process, even if a first thermal conductive layer 1023 is set on the first chip 1022 and a second thermal conductive layer 1027 is set on the second chip 1026, it cannot be guaranteed that they are in the same horizontal plane. At this time, the heat dissipation component 101 first abuts against the nearest thermal conductive layer under the action of the fixing component 103.

[0046] It is worth noting that whether the heat dissipation component 101 can abut against the farthest heat-conducting layer depends to a certain extent on the force range of the chip corresponding to the heat-conducting layer closest to the heat dissipation component 101. For example, when the heat dissipation component 101 descends close to the heat-conducting layer, it first abuts against the first heat-conducting layer 1023 on the first chip 1022. During the continuous descent of the heat dissipation component 101, it is necessary to consider the force range of the first chip 1022, so as to stop pressing down when the maximum force value of the first chip 1022 is reached. Whether it abuts against the second heat-conducting layer 1027 at this time depends on the specification parameters of the second chip 1026 and the thickness of the second heat-conducting layer 1027. For example, the heat dissipation component 101 first abuts against the first heat-conducting layer 1023, and when the fixing component 103 stops applying pressure to the heat dissipation component 101, the heat dissipation component 101 and the second heat-conducting layer 1027 are spaced apart / abutted.

[0047] Based on this, the height of the second chip 1026 on the circuit board assembly 1021 and / or the thickness of the second heat conducting layer 1027 can be adjusted by determining the magnitude of the force applied during the downward pressing of the heat dissipation assembly 101 .

[0048] In addition, in actual applications, different chips in the heat dissipation module 10 perform different functions. During the operation of the heat dissipation module 10, if the thermal resistance is too high, some chips will have performance degradation problems such as derating due to excessive temperature, and severe chips may even burn out. Considering the performance and sustainable use of the equipment, different chips will be prioritized. At this time, the height of the chip and the corresponding thermal conductive layer on the circuit board assembly 1021 can be set independently according to the importance of the chip, so that the thermal conductive layer on the most important and most protected chip is first in contact with the heat dissipation assembly 101, increasing its heat dissipation area to ensure the best heat dissipation for the most important chip and improve product reliability and market competitiveness.

[0049] In other embodiments, in addition to the first chip 1022, the first heat-conducting layer 1023, the second chip 1026 and the second heat-conducting layer 1027, the chip assembly 102 may also include other chips and corresponding heat-conducting layers, such as a third chip and a third heat-conducting layer, which is not limited here.

[0050] In some embodiments of the present application, the first heat-conducting layer 1023, the second heat-conducting layer 1027 and other heat-conducting layers may be heat-conducting gel, heat-conducting silicone grease, heat-conducting silicon wafer or others, which are not limited here.

[0051] In some embodiments of the present application, different heat-conducting layers disposed on the circuit board assembly 1021 may be abutted against each other, or even different heat-conducting layers may be squeezed to the same or different degrees, so as to achieve the same or different degrees of heat dissipation for different chips.

[0052] See also Figure 5 and Figure 6 , Figure 5 and Figure 6 All of them are structural schematic diagrams of the circuit board assembly 1021 in some embodiments of the present application, wherein the circuit board assembly 1021 includes a stacked circuit board 201 and a bottom support plate 202. The circuit board 201 may be a single board in a BBU (Building Base band Unite, indoor baseband processing unit), and the bottom support plate 202 may be a PCB (Printed Circuit Board) bottom plate, which may be used to support the circuit board 201, and there is no limitation here.

[0053] exist Figure 5 In the embodiment, the chip assembly 102 includes a circuit board assembly 1021, at least one first chip 1022 and a first heat conducting layer 1023, the first chip 1022 is arranged on a side of the circuit board 201 away from the bottom support plate 202, the first heat conducting layer 1023 is arranged on a side of the corresponding first chip 1022 away from the bottom support plate 202, the circuit board 201 is provided with a plurality of third through holes 2011 and a plurality of fourth through holes 2012, the bottom support plate 202 is provided with a plurality of first limiting holes 1025 and A plurality of positioning posts 1024, a plurality of third through holes 2011 are arranged corresponding to the plurality of first through holes 1011, a plurality of fourth through holes 2012 are arranged corresponding to the plurality of second through holes 1012, and a plurality of first limiting holes 1025 are arranged corresponding to the plurality of fourth through holes 2012; the positioning posts 1024 pass through the corresponding third through holes 2011 and the first through holes 1011 in sequence, and the fixing components 103 pass through the corresponding second through holes 1012, the fourth through holes 2012 and the first limiting holes 1025 in sequence.

[0054] exist Figure 6In the embodiment, the chip assembly 102 includes a circuit board assembly 1021, at least one first chip 1022, a first heat-conducting layer 1023, at least one second chip 1026 and a second heat-conducting layer 1027. The first chip 1022 and the second chip 1026 are arranged on a side of the circuit board 201 away from the bottom support plate 202, and the first chip 1022 and the second chip 1026 are arranged at intervals. The first heat-conducting layer 1023 is arranged on a side of the corresponding first chip 1022 away from the bottom support plate 202, and the second heat-conducting layer 1027 is arranged on a side of the corresponding second chip 1026 away from the bottom support plate 202. The circuit board 201 is provided with a plurality of The bottom support plate 202 is provided with a plurality of third through holes 2011 and a plurality of fourth through holes 2012, and a plurality of first limiting holes 1025 and a plurality of positioning columns 1024. The plurality of third through holes 2011 are arranged correspondingly to the plurality of first through holes 1011, the plurality of fourth through holes 2012 are arranged correspondingly to the plurality of second through holes 1012, and the plurality of first limiting holes 1025 are arranged correspondingly to the plurality of fourth through holes 2012; the positioning columns 1024 pass through the corresponding third through holes 2011 and the first through holes 1011 in sequence, and the fixing components 103 pass through the corresponding second through holes 1012, the fourth through holes 2012 and the first limiting holes 1025 in sequence.

[0055] It can be understood that in order to ensure that the positioning column 1024 can pass through the third through hole 2011 and the first through hole 1011 , the size, shape and other parameters of the first through hole 1011 and the third through hole 2011 can be set corresponding to the size, shape and other parameters of the positioning column 1024 .

[0056] Similarly, in order to ensure that the fixing component 103 can pass through the second through hole 1012, the fourth through hole 2012 and the first limiting hole 1025, the size, shape and other parameters of the second through hole 1012, the fourth through hole 2012 and the first limiting hole 1025 can be set corresponding to the size, shape and other parameters of the fixing component 103.

[0057] It is worth noting that in some embodiments of the present application, the first limiting hole 1025 is a non-through hole, and the fixing component 103 can be disposed in the non-through hole to fix the heat dissipation component 101 to the bottom support plate 202 .

[0058] In some embodiments, the inner wall of the first limiting hole 1025 (and the fourth through hole 2012) is provided with an internal thread, and the fixing component 103 is provided with an external thread, and the external thread cooperates with the internal thread to threadably connect the heat dissipation component 101 to the bottom support plate 202.

[0059] In some embodiments, since the force ranges of different chips are inconsistent, the depth of the first limiting hole 1025 and / or the fourth through hole 2012 can be determined by referring to the force range of the reference chip, the combined height of the chip and the corresponding thermal conductive layer, etc., so as to determine that the downward pressure stops when the fixing component 103 abuts against the bottom of the first limiting hole 1025.

[0060] See also Figure 7 , Figure 7 1 is a schematic diagram of the structure of the circuit board assembly 1021 in some embodiments of the present application. The circuit board assembly 1021 includes a stacked circuit board 201, a bottom support plate 202 and a limiting column 203. Among them, the bottom support plate 202 is provided with a plurality of positioning columns 1024 and a plurality of limiting columns 203, each limiting column 203 is provided with a first limiting hole 1025, the limiting column 203 is arranged corresponding to the fourth through hole 2012, and the limiting column 203 is penetrated in the corresponding fourth through hole 2012. At this time, the fixing assembly 103 can pass through the corresponding second through hole 1012 and the first limiting hole 1025 in sequence.

[0061] It can be understood that the radial dimension of the first limiting hole 1025 is smaller than the radial dimension of the fourth through hole 2012, so that the first limiting hole 1025 is penetrated into the fourth through hole 2012; the radial dimension of the positioning column 1024 is smaller than the radial dimension of the third through hole 2011, and the positioning column 1024 passes through the third through hole 2011.

[0062] In some embodiments, the positioning column 1024 and the bottom support plate 202 are integrally formed; or, the positioning column 1024 and the bottom support plate 202 are detachably connected.

[0063] In some embodiments, when the positioning column 1024 is detachably connected to the bottom support plate 202, a plurality of first limiting holes 1025, a plurality of positioning columns 1024, and a plurality of second limiting holes are provided on the bottom support plate 202. The second limiting holes are provided corresponding to the positioning columns 1024; the positioning columns 1024 pass through the second limiting holes, the corresponding third through holes 2011, and the first through holes 1011 in sequence.

[0064] In some embodiments, the second limiting hole is a non-through hole, and the positioning column 1024 can be disposed in the non-through hole to fix the positioning column 1024 to the bottom support plate 202 .

[0065] In some embodiments, an internal thread is provided on the inner wall of the second limiting hole, and an external thread is provided on the end of the positioning column 1024 close to the bottom support plate 202, and the external thread cooperates with the internal thread to threadably connect the positioning column 1024 to the bottom support plate 202.

[0066] In some embodiments, a mounting groove is provided on one end of the positioning column 1024 away from the bottom support plate 202, and the mounting groove can be used to accommodate an installation tool, so that the positioning column 1024 is connected to the bottom support plate 202 under the action of the installation tool. The installation tool can be a wrench, a screwdriver or other.

[0067] In some embodiments, the radial dimension of the positioning column 1024 decreases in the direction away from the bottom support plate 202. At this time, in the process of the positioning column 1024 passing through the heat dissipation component 101 and using the fixing component 103 to press down the heat dissipation component 101, due to the continuous increase in the radial dimension of the positioning column 1024, the heat dissipation component 101 will not be able to continue to descend after it has dropped to a certain height due to the restriction of the first through hole 1011. At this time, if the fixing component 103 continues to apply force to the heat dissipation component 101, the force-bearing part of the heat dissipation component 101 will be concave. For example, the positioning column 1024 is set on both sides of the chip and the fixing component 103. Under the continuous pressure of the fixing component 103, the cross-section of the heat dissipation component 101 will present a "suspension bridge" structure with "high sides and low middle".

[0068] See also Figure 8 , Figure 8 It is a structural schematic diagram of the fixing component 103 in some embodiments of the present application, the fixing component 103 includes a fastener 1031 and an elastic member 1032, the fastener 1031 passes through the elastic member 1032, the second through hole 1012, the fourth through hole 2012 and the corresponding first limiting hole 1025 in sequence; or, the fastener 1031 passes through the elastic member 1032, the second through hole 1012 and the corresponding first limiting hole 1025 in sequence.

[0069] In a specific embodiment, the fastener 1031 includes a connecting rod that can be inserted into the second through hole 1012 and the fourth through hole 1032, and a limiting arm that is perpendicular to the connecting rod and is disposed on the connecting rod. When the fastener 1031 is connected to the heat dissipation component 101, the connecting rod is inserted into the second through hole 1012, and the limiting arm on the connecting rod is located on a side of the heat dissipation component 101 close to the chip component 102. The fastener 1031 is prevented from coming out of the second through hole 1012 of the heat dissipation component 101 by the limiting arm.

[0070] The fastener 1031 may be a screw, a stud, a nut, a bolt or others, which is not limited here.

[0071] The elastic member 1032 may be a spring as shown in the figure, or an elastic diaphragm, a bellows or others, which is not limited here.

[0072] The fixing assembly 103 provided in some embodiments of the present application includes a fastener 1031 and an elastic member 1032. By arranging the elastic member 1032 on the side of the heat dissipation assembly 101 away from the thermal conductive layer, the fastener 1031 can be used to press the elastic member 1032 to shrink the elastic member 1032. The elastic member 1032 can provide a force to the heat dissipation assembly 101 close to the thermal conductive layer. When the heat dissipation assembly 101 is fixed by the positioning column 1024, the heat dissipation assembly 101 abuts against the thermal conductive layer under the action of the elastic force, and the cross-section of the heat dissipation assembly 101 is recessed at the position where the elastic member 1032 acts.

[0073] See also Fig. 9 , Fig. 9 1 is an assembly effect diagram of a heat dissipation module 10 in some embodiments of the present application, wherein the heat dissipation module 10 comprises a heat dissipation component 101, a chip component 102 and at least one fixing component 103. The chip component 102 comprises a circuit board component 1021, at least one first chip 1022, a first heat conducting layer 1023, at least one second chip 1026 and a second heat conducting layer 1027; the circuit board component 1021 comprises a stacked circuit board 201, a bottom support plate 202 and a plurality of limit posts 203; and the fixing component 103 comprises a fastener 1031 and an elastic member 1032.

[0074] In summary Fig. 9 Taking the final structure shown as an example, the installation process of the heat dissipation module 10 provided in some embodiments of the present application may include the following process (not shown):

[0075] S1: Assemble the bottom support plate and the circuit board, and the positioning posts on the bottom support plate pass through the third through holes on the circuit board to form a circuit board assembly; wherein at least one chip is arranged on the side of the circuit board away from the bottom support plate, a heat conducting layer is arranged on the side of the chip away from the circuit board, and a plurality of positioning posts are arranged on the bottom support plate.

[0076] S2: The positioning post passes through the first through hole on the heat dissipation component to limit the position of the heat dissipation component by using the positioning post.

[0077] S3: The fastener passes through the elastic member, the second through hole on the heat dissipation assembly, and the fourth through hole on the circuit board in sequence, and is set in the first limiting hole on the bottom support plate.

[0078] It is understandable that the above installation scheme is only one of the embodiments provided by the present application based on the structure of the heat dissipation module 10, and does not limit other installation schemes brought by the technical solution of the present application. For example, before executing step S1, execute "fastener 1031 passes through elastic member 1032 and second through hole 1012 in sequence" in step S3.

[0079] Based on the above installation process, the disassembly process of the heat dissipation module 10 provided in some embodiments of the present application may include the following process (not shown):

[0080] S1: Adjust the position of the fastener so that the fastener can move in the second through hole of the heat dissipation component to loosen the elastic member so that the elastic member returns to its original shape.

[0081] S2: Remove the connection between the heat sink assembly and the positioning posts on the chip assembly.

[0082] S3: Adjust the positional relationship between the bottom support plate and the circuit board so that the bottom support plate is away from the circuit board, and remove the bottom support plate from the circuit board.

[0083] It can be understood that the above disassembly solution is only one of the embodiments provided by the present application based on the structure of the heat dissipation module 10, and does not limit other disassembly solutions brought about by the technical solution of the present application.

[0084] See also Fig.10 , Fig.10 It is a schematic diagram of the structure of an electronic device in some embodiments of the present application, the electronic device 100 includes a housing 1001 and a heat dissipation module 10 as described in any one of the above items, wherein the housing 1001 is provided with a cavity, and the heat dissipation module 10 is arranged in the cavity.

[0085] In some embodiments, the heat dissipation module 10 may be a radiator or other device having a heat dissipation function, which is not limited here.

[0086] In some embodiments, the electronic device 100 may be a household appliance, a medical device or others, which is not limited here.

[0087] It can be understood that when the heat dissipation module 10 is disposed in the housing 1001 , the overall volume of the heat dissipation module 10 needs to be smaller than or equal to the size of the accommodating space of the cavity.

[0088] In an application scenario, under the same ambient temperature and power consumption, the heat dissipation of the target chip by the "stud type heat sink" in the related art and the electronic device 100 of the present application is compared through simulation experiments. Compared with the stud type solution, the temperature of the target chip is significantly reduced by the technical solution of the present application. In addition, in addition to the target chip, other devices / chips in the electronic device 100 are also reduced to varying degrees.

[0089] The electronic device 100 provided in some embodiments of the present application includes a heat dissipation module 10, which can realize the functions of the heat dissipation module 10 described in any of the above embodiments, and will not be described in detail here.

[0090] In summary, some embodiments of the present application provide a heat dissipation module 10 with a positioning column 1024. On the one hand, when the heat dissipation component 101 is installed, the positioning column 1024 can play a guiding role, so as to avoid blind insertion of the heat dissipation component 101 and causing chips and other components to be hit; on the other hand, after the heat dissipation component 101 is installed, the positioning column 1024 can play an anti-tilting role. Through the hard contact between the positioning column 1024 and the first through hole 1011 on the heat dissipation component 101, the heat dissipation component 101 can be prevented from tilting, thereby avoiding secondary impact on chips and other components; on the other hand, when the fixing component 103 applies force to the heat dissipation component 101, the setting of the positioning column 1024 can ensure that the position of the heat dissipation component 101 is controllable.

[0091] Furthermore, some embodiments of the present application provide a fixing component 103 in the heat dissipation module 10, so that the fixing component 103 can be used to apply force to the chip through the heat dissipation component 101. On the one hand, the distance between the heat dissipation component 101 and the chip can be reduced, and the thickness of the thermal conductive layer on the chip close to the heat dissipation component 101 can be reduced, so that the minimum thickness between the heat dissipation component 101 and the chip approaches 0 infinitely, and the interface thermal resistance can be reduced. On the other hand, according to the maximum force that the chip can withstand, the fixing component 103 continuously increases the force applied to reduce the contact thermal resistance between the chip and the heat dissipation component 101.

[0092] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module comprises: A heat dissipation component, wherein the heat dissipation component is provided with a plurality of first through holes and a plurality of second through holes; A chip assembly, comprising a circuit board assembly, at least one first chip and a first heat-conducting layer, wherein the first chip is arranged on the circuit board assembly, the first heat-conducting layer is arranged on a side of the corresponding first chip away from the circuit board assembly, a plurality of positioning posts are arranged on the circuit board assembly, a plurality of the positioning posts are arranged correspondingly to a plurality of the first through holes, the positioning posts pass through the corresponding first through holes to limit the position of the heat dissipation assembly, a plurality of first limiting holes are arranged on the circuit board assembly, a plurality of the first limiting holes are arranged correspondingly to a plurality of the second through holes; At least one fixing component, which passes through the second through hole and the corresponding first limiting hole in sequence to fix the heat dissipation component and the chip component, and the fixing component is used to apply a force to the heat dissipation component so that the heat dissipation component abuts against the first thermal conductive layer.

2. The heat dissipation module according to claim 1, characterized in that: The circuit board assembly comprises a stacked circuit board and a bottom support plate, the first chip is arranged on a side of the circuit board away from the bottom support plate, the circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, the bottom support plate is provided with a plurality of first limiting holes and a plurality of positioning posts, a plurality of the third through holes are arranged correspondingly to a plurality of the first through holes, and a plurality of the fourth through holes are arranged correspondingly to a plurality of the second through holes; The positioning column passes through the corresponding third through hole and the first through hole in sequence, and the fixing component passes through the corresponding second through hole, the fourth through hole and the first limiting hole in sequence.

3. The heat dissipation module according to claim 1, characterized in that: The circuit board assembly comprises a stacked circuit board, a bottom support plate and a plurality of limiting posts, the first chip is arranged on a side of the circuit board away from the bottom support plate, the circuit board is provided with a plurality of third through holes and a plurality of fourth through holes, the bottom support plate is provided with a plurality of positioning posts and a plurality of limiting posts, each of the limiting posts is provided with a first limiting hole, the limiting posts are arranged corresponding to the fourth through holes, and the limiting posts are penetrated into the corresponding fourth through holes; The positioning column passes through the corresponding third through hole and the first through hole in sequence, and the fixing component passes through the corresponding second through hole and the first limiting hole in sequence.

4. The heat dissipation module according to claim 2 or 3, characterized in that: The radial dimension of the positioning column decreases along a direction away from the bottom supporting plate.

5. The heat dissipation module according to claim 2 or 3, characterized in that: The chip assembly also includes a plurality of second chips and a second heat-conducting layer. The plurality of second chips are arranged on a side of the circuit board away from the bottom support plate and are spaced apart from the first chip. The second heat-conducting layer is arranged on a side of the corresponding second chip away from the bottom support plate.

6. The heat dissipation module according to claim 5, characterized in that: The second heat-conducting layer is spaced apart from the heat-dissipating component.

7. The heat dissipation module according to claim 2 or 3, characterized in that: The positioning column is integrally formed with the bottom support plate; or The positioning column is detachably connected to the bottom supporting plate.

8. The heat dissipation module according to claim 7, characterized in that: When the positioning column is detachably connected to the bottom support plate, the bottom support plate is further provided with a plurality of second limiting holes, and the second limiting holes are provided correspondingly to the third through holes; The positioning column passes through the second limiting hole, the corresponding third through hole and the first through hole in sequence.

9. The heat dissipation module according to claim 8, characterized in that: The fixing assembly includes a fastener and an elastic member; The fastener passes through the elastic member, the second through hole, the fourth through hole and the corresponding first limiting hole in sequence; Alternatively, the fastener passes through the elastic member, the second through hole and the corresponding first limiting hole in sequence.

10. An electronic device, characterized in that: The electronic device comprises: A housing having a cavity; The heat dissipation module according to any one of claims 1 to 9 is arranged in the cavity.

Images