Integrated inductor packaging structure

Abstract

An integrated inductor packaging structure comprises a first lead frame, a second lead frame located above the first lead frame, and a plastic packaging layer for plastic packaging of the first lead frame and the second lead frame. The first lead frame is provided with a plurality of first pins and a plurality of second pins; the second lead frame is provided with a plurality of third pins, a plurality of fourth pins and a plurality of fifth pins, each third pin is provided with a first bending part which is bent downwards, the lower end of each first bending part is located in a gap between the corresponding first pin and the corresponding second pin, each fourth pin is provided with a second bending part which is bent downwards, and the lower end of each fifth pin is located in a gap between the corresponding first pin and the corresponding second pin. The lower ends of the second bending parts are stacked on part of the upper surfaces of the corresponding second pins and are electrically connected with the second pins; the inductance coil is located in the plastic packaging layer, and the inductance coil is electrically connected with the corresponding fifth pin; the first semiconductor chip is electrically connected with the first pin and the second pin; and the second semiconductor chip is electrically connected with the third pin, the fourth pin and the fifth pin. According to the integrated inductor packaging structure, the integration level of the packaging structure is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging, and in particular to an integrated inductor packaging structure. Background Art

[0002] In order to achieve better performance, maintain smaller size and lower power consumption, the existing packaging technology has developed from the early 2D packaging towards 2.5D packaging and 3D packaging.

[0003] Among them, 2.5D packaging, as an advanced heterogeneous chip packaging method, can achieve high-density circuit connection of multiple chips and integrate them into a package.

[0004] However, the existing 2.5D packaging is mainly based on substrates (such as silicon interposers), and the lead frame is less used in 2.5D packaging due to its low interconnection density. Therefore, how to improve the integration of lead frame-based packaging to meet more packaging unit integration requirements and the expansion of application scenarios is a technical problem that needs to be solved urgently. In addition, it is also difficult to integrate an inductor in a lead frame package, and the inductor can only be mounted outside the package. Utility Model Content

[0005] The technical problem to be solved by the present application is to provide an integrated inductor packaging structure, improve the packaging integration based on the lead frame, and integrate the inductor packaging.

[0006] To this end, the present application provides an integrated inductor packaging structure, including:

[0007] A first lead frame, a second lead frame located above the first lead frame, and a plastic sealing layer for sealing the first lead frame and the second lead frame;

[0008] The first lead frame has a plurality of first pins and a plurality of second pins; the second lead frame has a plurality of third pins, a plurality of fourth pins and a plurality of fifth pins, and the third pin has a first bent portion bent downward, the lower end of the first bent portion of the third pin is located in the gap between the adjacent first pin and the second pin or in the gap between two adjacent first pins, the fourth pin has a second bent portion bent downward, the lower end of the second bent portion of the fourth pin is stacked on a portion of the upper surface of the corresponding second pin, and the second bent portion is electrically connected to the second pin;

[0009] An inductor coil is located in the plastic packaging layer, and a head end and a tail end of the inductor coil are electrically connected to the corresponding fifth pin respectively;

[0010] The first semiconductor chip and the second semiconductor chip are located in the plastic packaging layer between the first lead frame and the second lead frame. The first semiconductor chip is electrically connected to the first pin and the second pin. The second semiconductor chip is electrically connected to the third pin, the fourth pin and the fifth pin.

[0011] In an optional embodiment, the third pin also has a first horizontal extension portion, the front end of the first horizontal extension portion is connected to the upper end of the first bending portion, and the first bending portion is bent downward relative to the first horizontal extension portion; the first bending portion includes a first connecting portion inclined downward relative to the first horizontal extension portion and a second horizontal extension portion connected to the lower end of the first connecting portion, the upper end of the first connecting portion is connected to the front end of the first horizontal extension portion as the upper end of the first bending portion, and the second horizontal extension portion is located in the gap between adjacent first pins and the second pin or in the gap between two adjacent first pins as the lower end of the first bending portion.

[0012] In an optional embodiment, the fourth pin also has a third horizontal extension portion, the front end of the third horizontal extension portion is connected to the upper end of the second bending portion, and the second bending portion is bent downward relative to the third horizontal extension portion; the second bending portion includes a second connecting portion inclined downward relative to the third horizontal extension portion and a fourth horizontal extension portion connected to the lower end of the second connecting portion, the upper end of the second connecting portion serves as the upper end of the first bending portion and is connected to the front end of the third horizontal extension portion, and the fourth horizontal extension portion serves as the lower end of the second bending portion and is stacked on a corresponding partial upper surface of the second pin and is electrically connected to the second pin.

[0013] In an optional embodiment, a limiting groove is provided on the upper surface of the second pin, and a protrusion is provided on the fourth horizontal extension portion of the fourth pin; or, a protrusion is provided on the second pin, and a limiting groove is provided on the lower surface of the fourth horizontal extension portion of the fourth pin, and the protrusion cooperates with the limiting groove.

[0014] In an optional embodiment, the front side of the plastic layer exposes the upper surfaces of the third pin, the fourth pin and the fifth pin, and the back side of the plastic layer exposes the lower surfaces of the first pin, the second pin and the lower end of the first bent portion of the third pin; the fifth pin includes a fifth horizontal extension portion and a third bent portion connected to the front end of the fifth horizontal extension portion and bent downward relative to the fifth horizontal extension portion, the third bent portion includes a third connecting portion inclined downward relative to the fifth horizontal extension portion and a sixth horizontal extension portion connected to the third connecting portion, and the third connecting portion and the sixth horizontal extension portion are located in the plastic layer above the first pin or the second pin.

[0015] In an optional embodiment, the upper surface of the third pin exposed on the front side of the plastic layer is the upper surface of the first horizontal extension portion, the upper surface of the fourth pin exposed on the front side of the plastic layer is the upper surface of the third horizontal extension portion, and the upper surface of the fifth pin exposed on the front side of the plastic layer is the upper surface of the fifth horizontal extension portion.

[0016] In an optional embodiment, the third connecting portion is an inclined straight line, or the third connecting portion includes an upper part and a lower part that are connected, the upper part is an inclined straight line, and the lower part is a "V"-shaped bend.

[0017] In an optional embodiment, the inductor coil is spiral-shaped, and a portion of the lower surface of the coil where the head and tail ends of the inductor coil are located is bonded to a portion of the upper surface of the sixth horizontal extension portion of the fifth pin by conductive glue or solder, and a portion of the lower surface of other coils of the inductor coil is bonded to other portions of the upper surface of the sixth horizontal extension portion by insulating glue.

[0018] In an optional embodiment, the front side of the plastic layer covers or does not expose the upper surfaces of the third pin, the fourth pin and the fifth pin, and the back side of the plastic layer exposes the lower surface of the first pin, the second pin and the lower end of the first bend portion of the third pin; the fifth pin is a horizontally extending pin.

[0019] In an optional embodiment, part of the lower surface of the coil where the head end and the tail end of the inductor coil are located is bonded to part of the upper surface of the horizontally extending fifth pin by conductive glue or solder, and part of the lower surface of other coils of the inductor coil is bonded to other parts of the upper surface of the horizontally extending fifth pin by insulating glue.

[0020] In an optional embodiment, parts of the lower surfaces of other coils of the inductor are bonded to the upper surface of the first horizontal extension portion of the third pin and the upper surface of the third horizontal extension portion of the fourth pin via isolation glue.

[0021] In an optional embodiment, the first semiconductor chip is electrically connected to the upper surfaces of the corresponding first pin and the second pin through a first metal lead, or the first semiconductor chip is electrically connected to the upper surfaces of the corresponding first pin and the second pin through a flip-chip connection.

[0022] In an optional embodiment, the second semiconductor chip is electrically connected to the lower surfaces of the corresponding third pin, the fourth pin and the fifth pin through a second metal lead, or the second semiconductor chip is electrically connected to the lower surfaces of the corresponding third pin, the fourth pin and the fifth pin through a flip-chip connection.

[0023] The advantages of the technical solution of this application are:

[0024] The integrated inductor packaging structure in the aforementioned embodiment of the present application comprises: a first lead frame, a second lead frame located above the first lead frame, and a plastic layer that plastic-seales the first lead frame and the second lead frame; wherein the first lead frame has a plurality of first pins and a plurality of second pins; the second lead frame has a plurality of third pins, a plurality of fourth pins and a plurality of fifth pins, and the third pin has a first bending portion that is bent downward, and the lower end of the first bending portion of the third pin is located in the gap between the adjacent first pin and the second pin or in the gap between two adjacent first pins, and the fourth pin has a second bending portion that is bent downward, and the lower end of the second bending portion of the fourth pin is stacked on a portion of the upper surface of the corresponding second pin, and the second bending portion is electrically connected to the second pin; an inductor coil is located in the plastic layer, and the head end and the tail end of the inductor coil are electrically connected to the corresponding fifth pin respectively; a first semiconductor chip and a second semiconductor chip are located in the plastic layer between the first lead frame and the second lead frame, the first semiconductor chip is electrically connected to the first pin and the second pin, and the second semiconductor chip is electrically connected to the third pin, the fourth pin and the fifth pin. The integrated inductor packaging structure of the present application realizes the integrated packaging of the first lead frame and the second lead frame, and simultaneously realizes the integrated packaging of the semiconductor chip and the inductor coil, thereby improving the integration of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of a top view of an integrated inductor packaging structure in an embodiment of the present application;

[0026] Figure 2 for Figure 1 A schematic diagram of a top view of a first lead frame and a first semiconductor chip;

[0027] Figure 3 for Figure 1 A schematic structural diagram of a second lead frame and a second semiconductor chip viewed from below;

[0028] Figure 4 The first, second and third figures are respectively Figure 1 Schematic diagram of the cross-sectional structure along the cutting lines AA1, BB1 and CC1;

[0029] Figure 5 A schematic cross-sectional view of an integrated inductor packaging structure in another embodiment of the present application;

[0030] Figure 6 A schematic cross-sectional view of an integrated inductor packaging structure in another embodiment of the present application;

[0031] Figure 7 A schematic cross-sectional view of an integrated inductor packaging structure in another embodiment of the present application;

[0032] Figure 8 A schematic cross-sectional view of an integrated inductor packaging structure in another embodiment of the present application;

[0033] Fig. 9 FIG. 1 is a schematic cross-sectional structure diagram of an integrated inductor packaging structure in another embodiment of the present application. DETAILED DESCRIPTION

[0034] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present application in detail, for the sake of convenience, the schematic diagrams will not be partially enlarged according to the general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0035] An embodiment of the present application provides an integrated inductor packaging structure. Figure 1-Figure 4 ,in Figure 1 It is a top view structural diagram of the integrated inductor packaging structure. Figure 2 for Figure 1 Schematic diagram of the structure of the first lead frame 101 and the first semiconductor chip 201 from above, Figure 3 for Figure 1 A schematic diagram of the structure of the second lead frame 102 and the second semiconductor chip 202 viewed from bottom, Figure 4 The first, second and third figures are respectively Figure 1 Schematic diagram of the cross-sectional structure along the cutting lines AA1, BB1 and CC1, including:

[0036] A first lead frame 101, a second lead frame 102 located above the first lead frame 101, and a plastic sealing layer 103 for sealing the first lead frame 101 and the second lead frame 102;

[0037] The first lead frame 101 has a plurality of first pins 11 and a plurality of second pins 12 (see Figure 2 ); The second lead frame 102 has a plurality of third pins 13, a plurality of fourth pins 14 and a plurality of fifth pins 15 (reference Figure 1 or Figure 3), and the third pin 13 has a first bent portion (13b, 13c) bent downward (reference Figure 4 ), the lower end of the first bent portion (13b, 13c) of the third pin is located in the gap between the adjacent first pin 11 and the second pin 12 or in the gap between two adjacent first pins 11, and the fourth pin 14 has a second bent portion (14b, 14c) bent downward (reference Figure 4 ), the lower end of the second bent portion (14b, 14c) of the fourth pin 14 is stacked on a portion of the upper surface of the corresponding second pin 12, and the second bent portion (14b, 14c) is electrically connected to the second pin 12;

[0038] Inductor 301 (reference Figure 1 or Figure 4 ), located in the plastic packaging layer 103, the head end and the tail end of the inductor 301 are electrically connected to the corresponding fifth pin 15 respectively;

[0039] The first semiconductor chip 201 (refer to Figure 2 and Figure 4 ) and the second semiconductor chip 202 (reference Figure 3 and Figure 5 ), located in the plastic layer 103 between the first lead frame 101 and the second lead frame 102, the first semiconductor chip 201 is electrically connected to the first pin 11 and the second pin 12, and the second semiconductor chip 202 is electrically connected to the third pin 13, the fourth pin 14 and the fifth pin 15.

[0040] Specifically, the first lead frame 101 has a plurality of first pins 11 and a plurality of second pins 12, and the first pins 11 are distributed between two adjacent second pins 12 or on one side of the second pin. The first pins 11 are used to electrically connect the first semiconductor chip 201, and serve as a connection terminal between the back side of the integrated inductor package structure and the outside (other package structures or devices). The second pins 12 are used to electrically connect the first semiconductor chip 201, and are used to support and electrically connect the lower end of the second bent portion (14b, 14c) of the fourth pin 14 in the second lead frame 102, and are also used as a connection terminal between the back side of the integrated inductor package structure and the outside (other package structures or devices). In one embodiment, the number of the first pins 11 is greater than the number of the second pins 12, and a gap is provided between some of the two adjacent first pins 11, or between some of the adjacent first pins 11 and the second pin 12, and the gap is used to place the lower end of the first bent portion (13b, 13c) of the third pin 13 in the second lead frame 102. On the one hand, the lower end of the third pin 13 can also be used as a connection terminal between the back side of the integrated inductor packaging structure and the outside (PCB board, other packaging structure or device). On the other hand, when forming the integrated inductor packaging structure, before forming the plastic packaging layer 103, when the first lead frame 101 and the second lead frame 102 are bonded, the lower end of the first bent portion (13b, 13c) of the third pin 13 in the second lead frame 102 is placed in the gap. , the lower end of the second bent portion (14b, 14c) of the fourth pin 14 in the second lead frame 102 is mounted on the upper surface of the second pin 12 in the first lead frame 101, so that the second lead frame 102 can be simply and stably installed above the first lead frame 101, thereby improving the integration of the formed integrated inductor packaging structure, and then a plastic encapsulation process is performed to form a plastic encapsulation layer (it should be noted that before installing the second lead frame 102, the first semiconductor chip 201 is first mounted on the first lead frame 101, so that the first semiconductor chip 201 is electrically connected to the corresponding first pin 11 and the second pin 12, and the second semiconductor chip 202 is mounted on the second lead frame 102, so that the second semiconductor chip 202 is electrically connected to the corresponding third pin 13, the fourth pin 15 and the fifth pin 15).

[0041] In one embodiment, reference Figure 2 or Figure 4 , or refer to Figure 5 , Figure 7-Figure 9In any of the figures, the first lead frame 101 may also include a first base island 10, the first lead 11 and the second lead 12 are located around the first base island 10, and the first lead 11 and the second lead 12 are isolated from the first base island 10 by a plastic packaging layer 103. The upper surface of the first base island 10 is used to attach the first semiconductor chip 201. In a specific embodiment, the first semiconductor chip 201 includes a relative back side and an active side, and the active side has a pad electrically connected to the integrated circuit in the first semiconductor chip 201. The back side of the first semiconductor chip 201 is attached to the upper surface of the first base island 10 by an adhesive, and the pad on the active surface of the first semiconductor chip 201 is electrically connected to the corresponding first pin 11 and second pin 12 through a first metal lead 204. In another embodiment, refer to Figure 6 , the first lead frame 101 does not have a base island, and the first semiconductor chip 201 is electrically connected to the upper surface of the corresponding first pin 11 and the second pin 12 by flip-chip connection to reduce the thickness of the integrated inductor packaging structure. In a specific embodiment, the first semiconductor chip 201 includes a back surface and an active surface relative to each other, and the active surface has a first welding protrusion 206 electrically connected to the integrated circuit in the first semiconductor chip 201. When the active surface of the first semiconductor chip 201 is flipped downward on the upper surface of the corresponding first pin 11 and the second pin 12, the first welding protrusion 206 on the active surface of the first semiconductor chip 201 is welded together with the upper surface of the corresponding first pin 11 and the second pin 12.

[0042] The first semiconductor chip 201 and the second semiconductor chip 202 are chips with the same or different functions. In one embodiment, the first semiconductor chip 201 or the second semiconductor chip 202 includes but is not limited to a signal processing chip, a logic control chip, a memory chip, a sensor chip, a power chip or a radio frequency chip.

[0043] The first pin 11 and the second pin 12 are made of conductive metal.

[0044] In one embodiment, continue to refer to Figure 4, the third pin 13 also has a first horizontal extension portion 13a, the front end of the first horizontal extension portion 13a is connected to the upper end of the first bending portion (13b, 13c), and the first bending portion (13b, 13c) is bent downward relative to the first horizontal extension portion 13a; the first bending portion (13b, 13c) includes a first connecting portion 13b tilted downward relative to the first horizontal extension portion 13a and a second horizontal extension portion 13c connected to the lower end of the first connecting portion 13b, the upper end of the first connecting portion 13b is connected to the front end of the first horizontal extension portion 13a as the upper end of the first bending portion, and the second horizontal extension portion 13c is located in the gap between the adjacent first pin 11 and the second pin 12 or in the gap between two adjacent first pins 11 as the lower end of the first bending portion. (It should be noted that in this embodiment and subsequent embodiments, the front end of any component refers to the end of the component away from the center of the integrated inductor packaging structure, and the rear end of any component refers to the end of the component close to the center of the integrated inductor packaging structure, such as Figure 4 The front end of the first horizontal extension portion 13a shown in FIG. 1 is the first horizontal extension portion 13a located at Figure 4 The rear end of the first horizontal extension portion 13a shown is the first horizontal extension portion 13a located at Figure 4 The front end of the third horizontal extension portion 14a is located at the left end of the third horizontal extension portion 14a. Figure 4 The rear end of the third horizontal extension portion 14a is located at the left end of the third horizontal extension portion 14a. Figure 4 the right end of the center).

[0045] In one embodiment, the first connecting portion 13b is an inclined straight line.

[0046] In one embodiment, continue to refer to Figure 4 The fourth pin 14 also has a third horizontal extension portion 14a, the front end of the third horizontal extension portion 14a is connected to the upper end of the second bending portion (14b, 14c), and the second bending portion (14b, 14c) is bent downward relative to the third horizontal extension portion 14a; the second bending portion (14b, 14c) includes a second connecting portion 14b inclined downward relative to the third horizontal extension portion 14a and a fourth horizontal extension portion 14c connected to the lower end of the second connecting portion 14b, the upper end of the second connecting portion 14b is connected to the front end of the third horizontal extension portion 14a as the upper end of the first bending portion, and the fourth horizontal extension portion 14c is overlapped on the corresponding partial upper surface of the second pin 12 as the lower end of the second bending portion, and is electrically connected to the second pin 12.

[0047] In one embodiment, the lower surface of the fourth horizontal extension portion 14 c of the fourth pin 14 is overlapped on a portion of the upper surface of the corresponding second pin 12 through a conductive adhesive or solder 104 .

[0048] In one embodiment, a limiting groove is provided on the upper surface of the second pin 12, and a protrusion is provided on the fourth horizontal extension portion 14c of the fourth pin 14, and when the first lead frame 101 and the second lead frame 102 are attached, the protrusion is embedded in the limiting groove. The limiting groove and the protrusion cooperate with each other to achieve more reliable positioning of the first lead frame and the second lead frame.

[0049] In one embodiment, a protrusion is provided on the second pin 12, and a limiting groove is provided on the lower surface of the fourth horizontal extension portion 14c of the fourth pin 14. When the first lead frame 101 and the second lead frame 102 are attached to each other, the protrusion is embedded in the limiting groove.

[0050] In one embodiment, the second connecting portion 14b is an inclined straight line.

[0051] In one embodiment, continue to refer to Figure 4 The front side of the plastic encapsulation layer 103 exposes the upper surfaces of the third pin 13, the fourth pin 14 and the fifth pin 15, and the back side of the plastic encapsulation layer 103 exposes the lower surface of the first pin 11, the second pin 12 and the lower end of the first bent portion of the third pin 13 (the second horizontal extension portion 13c), so that the front and back sides of the integrated inductor packaging structure of the present application both have connection terminals with the outside (other packaging structures or devices), so that the integrated inductor packaging structure of the present application can be applied to 2.5D packaging or 3D packaging; the fifth pin 15 is wrapped The present invention comprises a fifth horizontal extension portion 15a and a third bent portion (15b, 15c) connected to the front end of the fifth horizontal extension portion 15a and bent downward relative to the fifth horizontal extension portion 15a, the third bent portion (15b, 15c) comprises a third connecting portion 15b inclined downward relative to the fifth horizontal extension portion 15a and a sixth horizontal extension portion 15c connected to the third connecting portion 15b, the third connecting portion 15b and the sixth horizontal extension portion 15c are located in the plastic packaging layer 103 above the first pin 11 or the second pin 12.

[0052] In a specific embodiment, the upper surface of the third pin 13 exposed on the front side of the plastic layer 103 is the upper surface of the first horizontal extension portion 13a, the upper surface of the fourth pin 14 exposed on the front side of the plastic layer 103 is the upper surface of the third horizontal extension portion 14a, and the upper surface of the fifth pin 15 exposed on the front side of the plastic layer 103 is the upper surface of the fifth horizontal extension portion 15a.

[0053] In one embodiment, continue to refer to Figure 4 , the third connecting portion 14b is an inclined straight line. In another embodiment, referring to Figure 7 The third connecting portion 15b includes an upper portion and a lower portion that are connected, the upper portion is an inclined straight line, and the lower portion is a "V"-shaped bend.

[0054] The material of the third pin 13, the fourth pin 14 and the fifth pin 15 is a conductive metal. It should be noted that before being monomerized, the third pin 13, the fourth pin 14 and the fifth pin 15 in the present application are all an integrated structure. In order to facilitate distinction in the figure, the components of the third pin 13, the fourth pin 14 and the fifth pin 15 are separated by straight lines.

[0055] In one embodiment, reference Figure 3 or Figure 4 , or refer to Figure 7 or Figure 8 The second lead frame 102 further has a second base island 20, the third pin 13, the fourth pin 14 and the fifth pin 15 are located around the second base island 20, and the third pin 13, the fourth pin 14 and the fifth pin 15 are isolated from the second base island 20 by the plastic packaging layer 103. The lower surface of the second base island 20 is used for attaching the second semiconductor chip 202. In a specific embodiment, the second semiconductor chip 202 includes a back surface and an active surface relative to each other, the active surface having pads electrically connected to the integrated circuit in the second semiconductor chip 202, the back surface of the second semiconductor chip 202 is attached to the lower surface of the second base island 20 by adhesive, the pads on the active surface of the second semiconductor chip 202 are electrically connected to the lower surfaces of the corresponding third pin 13, the fourth pin 14 and the fifth pin 15 through the second metal lead 203, specifically, the pads on the active surface of the second semiconductor chip 202 are electrically connected to the lower surface of the first horizontal extension portion 13a of the corresponding third pin 13, the lower surface of the third horizontal extension portion 14a of the fourth pin 14 and the lower surface of the fifth horizontal extension portion 15a of the fifth pin 15 through the second metal lead 203. In another embodiment, referring to Figure 5 , Figure 6 or Fig. 9, the second lead frame 102 does not have a base island, and the second semiconductor chip 202 is electrically connected to the corresponding third pin 13, the fourth pin 14 and the fifth pin 15 by a flip-chip connection method to reduce the thickness of the integrated inductor packaging structure. In a specific embodiment, the second semiconductor chip 202 includes a relative back surface and an active surface, and the active surface has a second welding protrusion 205 electrically connected to the integrated circuit in the second semiconductor chip 202. When the active surface of the second semiconductor chip 202 is flipped upward on the lower surface of the corresponding third pin 13, the fourth pin 14 and the fifth pin 15, the second welding protrusion 205 on the active surface of the second semiconductor chip 202 is welded together with the lower surface of the corresponding third pin 13, the fourth pin 14 and the fifth pin 15. Specifically, the second welding protrusion 205 on the active surface of the second semiconductor chip 202 is welded together with the lower surface of the first horizontal extension portion 13a of the corresponding third pin 13, the lower surface of the third horizontal extension portion 14a of the fourth pin 14 and the lower surface of the fifth horizontal extension portion 15a of the fifth pin 15.

[0056] In one embodiment, continue to refer to Figure 4-Figure 6 In any of the accompanying drawings, the material of the inductor 301 is metal, the inductor 301 is spiral, the lower surface of the coil where the head and tail ends of the inductor 301 are located is bonded to the upper surface of the sixth horizontal extension 15c of the fifth pin 15 through conductive glue or solder 302, and the lower surface of the other coils of the inductor 301 is bonded to the upper surface of the other parts of the sixth horizontal extension 15c through isolation glue 303. The two fifth pins 15 are used as the electrical connection with the head or tail end of the inductor 301, and the sixth horizontal extension 15c of the other fifth pins 15 can be used to support the inductor 301 when forming an integrated inductor packaging structure, so as to realize the integrated packaging of the inductor 301 with the first lead frame 101 and the second lead frame 102.

[0057] The material of the plastic encapsulation layer 103 is resin. In one embodiment, the material of the plastic encapsulation layer 103 is epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin containing fillers; or it can also be polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol containing fillers. The filler can be an inorganic filler or an organic filler.

[0058] In another embodiment, reference Figure 8 or Fig. 9The front side of the plastic encapsulation layer 103 covers or does not expose the upper surfaces of the third pin 13, the fourth pin 14 and the fifth pin 15, and the back side of the plastic encapsulation layer 103 exposes the lower surface of the first pin 11, the second pin 12 and the lower end of the first bending portion of the third pin 13 (the second horizontal extension portion 13c); and the fifth pin 15 is a horizontally extending pin and does not have a downward bending area. The lower surface of the coil where the head and tail ends of the inductor 301 are located is bonded to the upper surface of the fifth pin 15 extending horizontally through conductive glue or solder 302, and the lower surfaces of the other coils of the inductor 301 are bonded to the upper surfaces of the other parts of the fifth pin 15 extending horizontally through isolation glue 303. The fifth pin 15 extending horizontally increases the area of ​​the mounting area of ​​the inductor 301, so that the mounted inductor 301 can have more turns.

[0059] In one embodiment, part of the lower surface of other coils of the inductor 301 is bonded to the upper surface of the first horizontal extension portion 13a of the third pin 13 and the upper surface of the third horizontal extension portion 14a of the fourth pin 14 through an isolation adhesive 303 .

[0060] Although the present application has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field can use the methods and technical contents disclosed above to make possible changes and modifications to the technical solution of the present application without departing from the spirit and scope of the present application. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are within the protection scope of the technical solution of the present application.

Claims

1. An integrated inductor packaging structure, characterized in that: include: A first lead frame, a second lead frame located above the first lead frame, and a plastic sealing layer for sealing the first lead frame and the second lead frame; The first lead frame has a plurality of first pins and a plurality of second pins; the second lead frame has a plurality of third pins, a plurality of fourth pins and a plurality of fifth pins, and the third pin has a first bent portion bent downward, the lower end of the first bent portion of the third pin is located in the gap between the adjacent first pin and the second pin or in the gap between two adjacent first pins, the fourth pin has a second bent portion bent downward, the lower end of the second bent portion of the fourth pin is stacked on a portion of the upper surface of the corresponding second pin, and the second bent portion is electrically connected to the second pin; An inductor coil is located in the plastic packaging layer, and a head end and a tail end of the inductor coil are electrically connected to the corresponding fifth pin respectively; The first semiconductor chip and the second semiconductor chip are located in the plastic packaging layer between the first lead frame and the second lead frame. The first semiconductor chip is electrically connected to the first pin and the second pin. The second semiconductor chip is electrically connected to the third pin, the fourth pin and the fifth pin.

2. The integrated inductor packaging structure according to claim 1, characterized in that: The third pin also has a first horizontal extension portion, the front end of the first horizontal extension portion is connected to the upper end of the first bending portion, and the first bending portion is bent downward relative to the first horizontal extension portion; the first bending portion includes a first connecting portion inclined downward relative to the first horizontal extension portion and a second horizontal extension portion connected to the lower end of the first connecting portion, the upper end of the first connecting portion is connected to the front end of the first horizontal extension portion as the upper end of the first bending portion, and the second horizontal extension portion is located in the gap between adjacent first pins and second pins or in the gap between two adjacent first pins as the lower end of the first bending portion.

3. The integrated inductor packaging structure according to claim 2, characterized in that: The fourth pin also has a third horizontal extension portion, the front end of the third horizontal extension portion is connected to the upper end of the second bending portion, and the second bending portion is bent downward relative to the third horizontal extension portion; the second bending portion includes a second connecting portion inclined downward relative to the third horizontal extension portion and a fourth horizontal extension portion connected to the lower end of the second connecting portion, the upper end of the second connecting portion is connected to the front end of the third horizontal extension portion as the upper end of the first bending portion, and the fourth horizontal extension portion is stacked on the corresponding partial upper surface of the second pin as the lower end of the second bending portion, and is electrically connected to the second pin.

4. The integrated inductor packaging structure according to claim 3, characterized in that: A limiting groove is provided on the upper surface of the second pin, and a protrusion is provided on the fourth horizontal extension portion of the fourth pin; or, a protrusion is provided on the second pin, and a limiting groove is provided on the lower surface of the fourth horizontal extension portion of the fourth pin, and the protrusion cooperates with the limiting groove for positioning.

5. The integrated inductor packaging structure according to claim 3, characterized in that: The front side of the plastic encapsulation layer exposes the upper surfaces of the third pin, the fourth pin and the fifth pin, and the back side of the plastic encapsulation layer exposes the lower surfaces of the first pin, the second pin and the lower end of the first bent portion of the third pin; the fifth pin includes a fifth horizontal extension portion and a third bent portion connected to the front end of the fifth horizontal extension portion and bent downward relative to the fifth horizontal extension portion, the third bent portion includes a third connecting portion inclined downward relative to the fifth horizontal extension portion and a sixth horizontal extension portion connected to the third connecting portion, and the third connecting portion and the sixth horizontal extension portion are located in the plastic encapsulation layer above the first pin or the second pin.

6. The integrated inductor packaging structure according to claim 5, characterized in that: The upper surface of the third pin exposed on the front side of the plastic layer is the upper surface of the first horizontal extension part, the upper surface of the fourth pin exposed on the front side of the plastic layer is the upper surface of the third horizontal extension part, and the upper surface of the fifth pin exposed on the front side of the plastic layer is the upper surface of the fifth horizontal extension part.

7. The integrated inductor packaging structure according to claim 5, characterized in that: The third connecting portion is an inclined straight line, or the third connecting portion includes an upper part and a lower part connected, the upper part is an inclined straight line, and the lower part is a "V" shape bend.

8. The integrated inductor packaging structure according to claim 5, characterized in that: The inductor coil is spiral-shaped, and part of the lower surface of the coil where the head end and the tail end of the inductor coil are located is bonded to part of the upper surface of the sixth horizontal extension part of the fifth pin through conductive glue or solder, and part of the lower surface of other coils of the inductor coil is bonded to other parts of the upper surface of the sixth horizontal extension part through isolation glue.

9. The integrated inductor packaging structure according to claim 3, characterized in that: The front side of the plastic layer covers or does not expose the upper surfaces of the third pin, the fourth pin and the fifth pin, and the back side of the plastic layer exposes the lower surface of the lower end of the first bend portion of the first pin, the second pin and the third pin; the fifth pin is a horizontally extending pin.

10. The integrated inductor packaging structure according to claim 9, characterized in that: Part of the lower surface of the coil where the head end and the tail end of the inductor coil are located is bonded to the part of the upper surface of the horizontally extending fifth pin through conductive glue or solder, and part of the lower surface of other coils of the inductor coil is bonded to the other part of the upper surface of the horizontally extending fifth pin through isolation glue.

11. The integrated inductor packaging structure according to claim 10, characterized in that: Part of the lower surface of the other coils of the inductor coil is bonded to the upper surface of the first horizontal extension portion of the third pin and the upper surface of the third horizontal extension portion of the fourth pin through isolation glue.

12. The integrated inductor packaging structure according to claim 5 or 9, characterized in that: The first semiconductor chip is electrically connected to the upper surfaces of the corresponding first pin and the second pin through a first metal lead, or the first semiconductor chip is electrically connected to the upper surfaces of the corresponding first pin and the second pin through a flip-chip connection.

13. The integrated inductor packaging structure according to claim 5 or 9, characterized in that: The second semiconductor chip is electrically connected to the lower surfaces of the corresponding third pin, the fourth pin and the fifth pin through a second metal lead, or the second semiconductor chip is electrically connected to the lower surfaces of the corresponding third pin, the fourth pin and the fifth pin through a flip-chip connection.

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