Zero-backplane CLOS orthogonal architecture switch

Abstract

The utility model discloses a zero-backplane CLOS orthogonal architecture switch which comprises a case, a mainboard bin, a service bin and a power bin are sequentially arranged in the front structure of the case from the top end to the bottom end, the power bin is connected with upward extension bins in the back structure of the case, the extension bins are arranged on the two sides of the service bin, and the extension bins communicate with the power bin; the control panel is arranged in the mainboard bin; the business board is arranged in the business bin; the power supply is arranged in the power supply bin; and the plurality of fan discs are arranged on the back surface of the interaction machine in parallel and are connected with the business bin, the power supply bin and the extension bin. Double independent air duct design of a power supply cabin and an exchange service cabin is adopted. And the fan of the power supply bin directly extracts cold air to directly blow a power supply device, so that the heat dissipation capability is improved, and power supply with higher power and higher efficiency can be realized in a more compact space.

Description

Technical Field

[0001] The present application relates to the switch architecture field, and in particular to a zero-backplane CLOS orthogonal architecture switch. Background Art

[0002] The CLOS architecture (a hierarchical network structure design, mainly composed of three main components: input ports, intermediate switches and output ports) switching architecture has the characteristics of large capacity, high density, low loss, green energy saving, etc. While providing high performance and stable services, it can perfectly match the needs of cloud data center business complexity and diversity and the core switching needs of campus networks. It is the most common hardware architecture for current high-end rack switches.

[0003] According to the signal transmission form of line cards and switching network cards, CLOS architecture switches can be further divided into three categories: non-orthogonal backplane, orthogonal backplane and orthogonal zero backplane. The zero-backplane orthogonal CLOS architecture switch has no backplane and no wiring, which has the natural advantage of breaking through the backplane bandwidth limitation. By replacing the corresponding switching network card, the bandwidth can be smoothly upgraded, and the upgrade compatibility for future business scenarios can be achieved, protecting customers' initial investment and being highly favored by the market.

[0004] In addition, the backplane-less design enables direct heat dissipation of the switch, reducing the difficulty of strict front-to-back air duct design while improving heat dissipation efficiency.

[0005] Here is a CLOS orthogonal zero backplane switch with good market response. The product size is 440*520*442, which can meet the installation of 19-inch cabinets and realize 6 line cards, 4 switches and dual main control design at a height of 10U. However, it has the disadvantages of insufficient total switching bandwidth and overall heat dissipation capacity, and the frame performance cannot meet the application scenarios of high-density deployment of 400G / 800G high-speed optical modules in the future. Utility Model Content

[0006] In order to solve the above problems, the present application proposes a zero-backplane CLOS orthogonal architecture switch, comprising:

[0007] A chassis, wherein a mainboard compartment, a business compartment, and a power compartment are sequentially arranged from the top to the bottom in the front structure of the chassis, and the power compartment is connected to an upward extension compartment in the back structure of the chassis, and the extension compartment is arranged on both sides of the business compartment, and the extension compartment is interconnected with the power compartment;

[0008] Control panels, the number of which is at least two, and including at least one main control panel and one standby control panel; the control panels are arranged in the main board compartment; the front of the control panels is provided with a plurality of interfaces;

[0009] A plurality of service boards are arranged in the service compartment; a plurality of interfaces are arranged on the front of the service board; the service board is interconnected with other network devices through the interfaces;

[0010] A power supply, which is multiple in number and includes at least one backup power supply; the power supply is arranged in the power supply compartment; the power supply is of pluggable design;

[0011] There are multiple fan trays, which are arranged in parallel on the back of the interactive machine and connected to the business compartment, the power compartment and the extension compartment; each fan tray is provided with multiple fans.

[0012] In one example, the number of the control boards is 2, and they are arranged in parallel horizontally;

[0013] The number of the business boards is 6 and they are arranged in vertical parallel;

[0014] The number of the power supplies is 4, which are arranged in parallel horizontally and include a 3+1 redundant arrangement of 1 backup power supply;

[0015] The number of the fan trays is 4, and each fan tray includes 4 fans arranged vertically.

[0016] In one example, the outer dimensions of the chassis are 440 mm*520 mm*442 mm.

[0017] In one example, the fan disk is configured with a grid opening on the entire surface, and the fan disks are configured to be laterally connected in parallel.

[0018] In one example, the service boards are connected via a switch board; the service boards are connected to the switch board via an orthogonal connector.

[0019] In one example, the business compartment and the power compartment adopt a double air duct design;

[0020] In the air duct corresponding to the business compartment, cooling air enters from the front panel of the business board, cools the optical module, the switching chip, and the switching network card in turn, and then the hot air is drawn out of the switch by the fan tray;

[0021] In the air duct corresponding to the power supply compartment, cooling air enters from the front panel of the power supply, cools the power supply board components, and then the hot air is drawn out of the switch by the fan tray.

[0022] In one example, the switch boards are sparsely arranged, and bypass air ducts are provided between the switch cards.

[0023] In one example, a built-in handle is also provided on the side of the chassis.

[0024] The zero-backplane CLOS orthogonal architecture switch proposed in this application can bring the following beneficial effects:

[0025] 1. The power supply compartment and the exchange service compartment are designed with dual independent air ducts. The fan in the power supply compartment directly draws cold air to blow directly to the power supply components, improving the heat dissipation capacity and achieving higher power and more efficient power supply in a more compact space.

[0026] 2. The switch board and business board are directly plugged in without backplane to form a direct air duct. At the same time, the front panel layout is optimized, the proportion of air inlets is increased, the fan layout is improved, a high-density layout of multiple fans is achieved, and the heat dissipation air volume of the whole machine is increased.

[0027] 3. In a compact 440*520*442 space, it realizes ultra-high performance configuration of 6 line cards, 6 switch cards and dual control boards, improves the capacity of the switch chip, and supports high-speed port high-density layout board applications through strong heat dissipation capabilities.

[0028] 4. The business board and the switch board are connected through an orthogonal connector. The zero-backplane CLOS orthogonal architecture design is adopted. The backplane is removed inside the chassis. The business board and the switch board are directly connected using an orthogonal connector, which effectively shortens the PCB trace length and improves signal integrity. In addition, the backplane-free design has no backplane blocking the air duct, and the front-to-back straight-through air duct effectively reduces wind resistance, which is beneficial to fan noise reduction and energy saving, and practices green design.

[0029] 5. In the air duct corresponding to the business compartment, cooling air enters from the front panel of the business board, cools the optical module, switch chip, and switch network card in turn, and then the fan tray draws the hot air out of the switch. The exhaust air duct provides a more uniform wind field for the entire chassis, meeting the heat dissipation requirements of the dispersed devices on the business board and switch board. And due to the existence of the bypass channel, the exhaust heat dissipation efficiency is further increased.

[0030] In the air duct corresponding to the power supply compartment, cooling air enters from the front panel of the power supply, cools the power board components, and then the hot air is drawn out of the switch by the fan tray. At this time, due to the setting of the extended compartment, the air outlet area of ​​the power supply compartment is higher, and more cold air is concentrated in the power module air duct, providing higher heat dissipation efficiency and improving the thermal stability of the power supply components. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0032] Figure 1 It is a three-dimensional schematic diagram of a zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0033] Figure 2 This is a front schematic diagram of a zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0034] Figure 3 This is a schematic diagram of the back side of a zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0035] Figure 4 An exploded view of a zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0036] Figure 5 It is a front cross-sectional view of a zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the wind direction of the first air duct of the zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0038] Figure 7 A schematic diagram of the wind direction of the second air duct of the zero-backplane CLOS orthogonal architecture switch in an embodiment of the present application;

[0039] Among them, 1. chassis, 2. control board, 3. business board, 4. power supply, 5. fan tray, 51. fan, 52. grid, 6. switch board, 7. bypass air duct, 8. first air duct, 9. second air duct. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] It should be noted that the directional terms such as left, right, up, down, front and back in the embodiments of the present invention are merely relative concepts or are based on the normal use state of the product, that is, the direction of movement of the product, and should not be considered as limiting.

[0042] In addition, it should be noted that the dynamic terms such as "relative motion" mentioned in the embodiments of the present invention are not only changes in position, but also include movements such as rotation and rolling where there is no relative change in position but a change in state.

[0043] Finally, it should be noted that when a component is referred to as being "located" or "set on" another component, it can be on the other component or there can be an intermediate component at the same time. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be an intermediate component at the same time.

[0044] like Figure 1 As shown, the present application provides a zero-backplane CLOS orthogonal architecture switch, which mainly includes a chassis 1, a control board 2, a service board 3, a power supply 4, and a fan tray 5.

[0045] like Figure 1 and Figure 2 As shown, in the front structure of the chassis 1, a mainboard compartment, a business compartment, and a power compartment are arranged in sequence from the top to the bottom. In addition, the power compartment is connected to an upward extension compartment in the back structure of the chassis. The extension compartments are arranged on both sides of the business compartment, and the extension compartments are interconnected with the power compartment. The extension compartment can wrap all or part of the height of both sides of the business compartment. In this case, the height of the extension compartment is the same or close to that of the business compartment, and the width and length are set based on actual needs. Each compartment is separated by a corresponding rod structure, plate structure or side support structure.

[0046] The control board 2 (also called control card, control board card, etc.) is arranged in the main board compartment. Several interfaces are arranged on the front of the control board 2. The control board 2 communicates with corresponding devices and external management systems through the interfaces, thereby realizing the control, management, configuration and other functions of the switch.

[0047] The number of control boards 2 is at least two, and includes at least one main control board and one standby control board. Figure 1 and Figure 2 As shown, two control boards 2 are provided, one of which is a main control board and the other is a standby control board, and the two are arranged in parallel horizontally, that is, the two are at the same level. The main control board performs daily work, and when the main control board fails, the device control function of the switch can automatically switch to the standby control board to work, thereby improving the control stability of the system.

[0048] The business board 3 (also called business card, business card, etc.) is provided with several interfaces on the front. The business board 3 is interconnected with other network devices (such as external servers, switches, etc.) through the interfaces to provide signal transmission services, forward and process data packets, etc.

[0049] There are multiple business boards 3, which are arranged in the business warehouse. Figure 1 and Figure 2 As shown, the number of business boards is 6, and they are arranged in vertical parallel, that is, the 6 business boards are in the same vertical position.

[0050] The power supply 4 is arranged in the power supply compartment and is designed to be pluggable. There are multiple power supplies 4 and at least one backup power supply is included. Figure 1 and Figure 2 As shown, the number of power supplies is 4, which are arranged in parallel horizontally, that is, they are at the same horizontal height. Power supply 4 includes a 3+1 redundant setting of 1 backup power supply.

[0051] The fan trays 5 are multiple in number and are arranged in parallel on the back of the interactive machine, connected to the business compartment, the power compartment, and the extension compartment. The specific connection position can be connected to the back of the business compartment, the back of the bottom power compartment, and the back of the extension compartment. Figure 3 As shown, when the horizontal direction of the fan disk 5 is the short side and the vertical direction is the long side, it can be arranged in parallel in the horizontal direction. Of course, when the horizontal direction of the fan disk is the long side and the vertical direction is the short side, it can be arranged in parallel in the vertical direction.

[0052] Each fan tray 5 is provided with a plurality of fans 51. For example, the number of fan trays 5 may be 4, and each fan tray 5 includes 4 vertically arranged fans 51. The fans 51 are cooling fans, and their size may be 80 mm*80 mm. Thus, a total of 16 fans 51 are formed to form 4 fan trays 5, providing high-performance cooling for the switch.

[0053] Furthermore, Figure 3 As shown, the fan disk 5 is a setting in which the entire surface of the grid 52 is opened. Four fans 51 are arranged in one fan disk 5, and the four fans are combined through the grid 52. The combined four fan disks 5 are arranged in parallel horizontally.

[0054] The overall chassis 1 is designed for high-performance broadband access scenarios in data centers, following a strict front-to-back air duct design. The front of the service board 3 provides high-density optical port access while using reasonable design optimization to increase the panel opening rate and reduce the inlet wind resistance of air cooling. The fan tray 5 panel adopts a full-surface grid opening method, which provides a large opening rate while meeting the fan structure protection and reducing the outlet wind resistance.

[0055] The dual independent air duct design of the power supply compartment and the exchange service compartment is adopted. The fan of the power supply compartment directly draws cold air to blow directly to the power supply components, improving the heat dissipation capacity, and can achieve higher power and higher efficiency power supply in a more compact space. The exchange board and the service board are directly plugged in without backplane to form a direct air duct. At the same time, the front panel layout is optimized, the proportion of air inlets is increased, the fan layout is improved, and a high-density layout of multiple fans is achieved to increase the heat dissipation air volume of the whole machine. In a compact 440*520*442 space, an ultra-high performance configuration of 6 line cards, 6 exchange cards and dual control boards is achieved, the capacity of the exchange chip is improved, and the high-speed port high-density layout board application is supported through strong heat dissipation capabilities.

[0056] The chassis 1 of the switch has a more compact structure, significantly improved port density, and a smaller depth, which can meet the installation requirements of a general 19-inch network cabinet. It adopts an orthogonal CLOS architecture and a strict front-to-back air duct design to meet the application scenarios of cold and hot air duct isolation in data centers.

[0057] In one or more embodiments of the present application, Figure 4 and Figure 5 As shown, a switching board 6 (also called a switching card, switching board card, etc.) is also provided in the switch. Each business board 3 is connected through the switching board 6. The switching board 6 is a component used to transfer data between different business boards 3. It usually includes a switching chip, a switching network card and other structures.

[0058] The business board 3 and the switch board 6 are connected via an orthogonal connector. The zero-backplane CLOS orthogonal architecture design is adopted. The backplane is removed inside the chassis. The business board 3 and the switch board 6 are directly connected using an orthogonal connector, which effectively shortens the PCB trace length and improves signal integrity. In addition, the backplane-free design does not have a backplane blocking the air duct. The front-to-back straight-through air duct effectively reduces wind resistance, which is beneficial to fan noise reduction and energy saving, and practices green design.

[0059] In one or more embodiments of the present application, unlike the closely arranged switch boards 6 in the market, all incoming air is discharged from the chassis through the service board 3, the switch board 6, and the fan tray 5 in sequence. Figure 4 and Figure 5 As shown, the switch boards 6 are sparsely arranged, that is, there is a preset distance of space between every two adjacent switch boards 6, so that a bypass air duct 7 is formed between the switch boards 6, so that part of the cooling air directly enters the fan 51 after cooling the service board 3 and is discharged from the chassis 1. The design of the bypass air duct 7 reduces the overall wind resistance, can effectively increase the air volume of the service board 3, and is convenient for supporting the heat dissipation of high-density and high-speed optical modules.

[0060] In one or more embodiments of the present application, when the fan is actually working, it is connected to the business compartment and the power compartment respectively, so a dual air duct design of the business compartment and the power compartment is realized. Figure 6 and Figure 7 In the diagram, the cube represents a simplified schematic diagram of the switch. The upper part is the service compartment, the lower part is the power compartment, and the extension compartment is connected to the power compartment and arranged on both sides of the service compartment. In addition, the arrows are only exemplary arrows for indicating the wind direction in the air duct, and do not mean that the actual wind direction will definitely follow the arrow's indication. Figure 6 The arrow on the rightmost vertical row at the bottom still points to the inside.

[0061] like Figure 6As shown, in the air duct corresponding to the business compartment (herein referred to as the first air duct 8), cooling air enters from the front panel of the business board, cools the optical module, the switching chip, and the switching network card in turn, and then the hot air is drawn out of the switch by the fan tray 5. The exhaust air duct provides a more uniform wind field for the entire chassis, meeting the heat dissipation requirements of the dispersed devices on the business board and the switching board. And due to the existence of the bypass channel 7, the exhaust heat dissipation efficiency is further increased.

[0062] like Figure 7 As shown, in the air duct corresponding to the power supply compartment (herein referred to as the second air duct 9), cooling air enters from the front panel of the power supply 4, cools the power board components, and then the hot air is drawn out of the switch by the fan tray 5. At this time, due to the setting of the extended compartment, the air outlet area of ​​the power supply compartment is higher, and more cold air is concentrated in the power module air duct, providing higher heat dissipation efficiency and improving the thermal stability of the power supply components.

[0063] In one or more embodiments of the present application, a handle is also provided on the side of the chassis 1, which can be an embedded type, a welded type, etc., to facilitate carrying the switch.

[0064] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A zero-backplane CLOS orthogonal architecture switch, characterized in that: include: A chassis, wherein a mainboard compartment, a business compartment, and a power compartment are sequentially arranged from the top to the bottom in the front structure of the chassis, and the power compartment is connected to an upward extension compartment in the back structure of the chassis, and the extension compartment is arranged on both sides of the business compartment, and the extension compartment is interconnected with the power compartment; Control panels, the number of which is at least two, and including at least one main control panel and one standby control panel; the control panels are arranged in the main board compartment; the front of the control panels is provided with a plurality of interfaces; A plurality of service boards are arranged in the service compartment; a plurality of interfaces are arranged on the front of the service board; the service board is interconnected with other network devices through the interfaces; A plurality of power supplies, including at least one backup power supply; the power supply is arranged in the power supply compartment; The power supply is of pluggable design; There are multiple fan trays, which are arranged in parallel on the back of the interactive machine and connected to the business compartment, the power compartment and the extension compartment; each fan tray is provided with multiple fans.

2. The zero-backplane CLOS orthogonal architecture switch according to claim 1, characterized in that: The number of the control boards is 2 and they are arranged in parallel horizontally; The number of the business boards is 6 and they are arranged in vertical parallel; The number of the power supplies is 4, which are arranged in parallel horizontally and include a 3+1 redundant arrangement of 1 backup power supply; The number of the fan trays is 4, and each fan tray includes 4 fans arranged vertically.

3. The zero-backplane CLOS orthogonal architecture switch according to claim 2, characterized in that: The external dimensions of the chassis are 440mm*520mm*442mm.

4. The zero-backplane CLOS orthogonal architecture switch according to claim 1, characterized in that: The fan disk is arranged with grid openings on the entire surface, and the fan disks are arranged in parallel in a transverse manner.

5. The zero-backplane CLOS orthogonal architecture switch according to claim 1, characterized in that: The service boards are connected via a switching board; the service boards are connected to the switching board via an orthogonal connector.

6. The zero-backplane CLOS orthogonal architecture switch according to claim 1, characterized in that: The business compartment and the power compartment adopt a double air duct design; In the air duct corresponding to the business compartment, cooling air enters from the front panel of the business board, cools the optical module, the switching chip, and the switching network card in turn, and then the hot air is drawn out of the switch by the fan tray; In the air duct corresponding to the power supply compartment, cooling air enters from the front panel of the power supply, cools the power board components, and then the hot air is drawn out of the switch by the fan tray.

7. The zero-backplane CLOS orthogonal architecture switch according to claim 5, characterized in that: The exchange plates are sparsely arranged, and bypass air ducts are arranged between the exchange plates.

8. The zero-backplane CLOS orthogonal architecture switch according to claim 1, characterized in that: The side of the chassis is also provided with an embedded handle.

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