Multilayer circuit board with in-plate holes
By using pre-installed components on the multi-layer circuit board, including inner conductors, connection rings and pins, the connection is solved and the connection is stable and reliable.
Patent Information
- Application Number
- CN202420662183.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-02
AI Technical Summary
During the hot pressing process of existing multi-layer circuit boards, due to the lack of pre-installed structure at the intra-disk holes and circuit connections, the connection ring and circuit are offset, which may cause short circuit or open circuit, affecting the stability of the equipment.
A multi-layer circuit board with intradisk holes is designed, using pre-installed components, including inner conductors, connection rings and pins. By inserting the pins into the slots of the circuit, pre-installation of the connecting rings on the inner conductors of the intradisk holes is achieved to avoid offset during hot pressing.
By setting the pre-installed components, ensure that the connection ring and the circuit remain stable during the hot pressing process without slight deviation, avoid open circuit phenomenon, and improve the stability and reliability of the connection.
Smart Images
Figure CN222621261U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit boards, and more specifically, to a multilayer circuit board with vias in disks. Background Art
[0002] A multilayer circuit board is a multilayer wiring layer with a dielectric layer between every two layers. The dielectric layer can be made very thin. A multilayer circuit board has at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board. The via in the disk is an important part of the multilayer circuit board. It not only bears the main functional performance of the multilayer circuit board, but the cost of drilling holes usually accounts for 30% to 40% of the cost of multilayer circuit board manufacturing. In short, every hole on a multilayer circuit board can be called a via in the disk.
[0003] When the existing circuit boards are hot-pressed, there is no pre-installed structure between the via in the pad and the circuit connection. As a result, the circuit and the via in the pad are offset during hot-pressing, causing a short circuit between the via in the pad and the adjacent circuit, or an open circuit in the via in the pad, which affects the stability of the equipment. Utility Model Content
[0004] In order to solve the above problems, the present application provides a multilayer circuit board with a via in a disk.
[0005] The present application provides a multilayer circuit board with a via in a disk, which adopts the following technical solution:
[0006] A multilayer circuit board with a plate-in-hole comprises a circuit board, the number of the circuit boards is set to be multiple, two circuits are arranged on the top of the circuit board, the plate-in-hole is opened inside the circuit board, and a pre-installed component is arranged on one side of the plate-in-hole;
[0007] The pre-installed component includes an inner conductor, which is located inside the hole in the disk. The top and bottom of the inner conductor are provided with connecting rings, and both ends of the connecting rings are fixedly connected with multiple pins. Both ends of the two circuits are provided with slots, and the multiple pins are respectively plugged into the slots.
[0008] Through the above technical solution, the pre-installed components can pre-install the connecting rings and circuits of the vias in the disk, avoiding the displacement of the connecting rings and circuits of the vias in the disk during hot pressing of the multi-layer circuit board, and maintaining the stability and reliability of the connection.
[0009] Furthermore, the connection ring is located between the two circuits, and the plurality of pins are distributed at equal distances along the horizontal direction of the circuits.
[0010] Through the above technical solution, the pins are plugged into the slots inside the connecting ring to achieve a fixed connection.
[0011] Furthermore, a protective shell is provided on the outside of the circuit board, and a plurality of heat dissipation fins are provided at both ends of the protective shell.
[0012] Through the above technical solution, the protective shell provides protection for the multi-layer circuit board.
[0013] Furthermore, the plurality of heat dissipation fins are distributed at equal distances along the horizontal direction of the protective housing.
[0014] Through the above technical solution, the heat dissipation fins transfer the heat on the multi-layer circuit board to the surrounding environment.
[0015] Furthermore, heat dissipation holes are provided at both ends of the protective shell away from the heat dissipation fins, and the number of holes in the plate is set to be multiple.
[0016] Through the above technical solution, the heat dissipation holes can also play a role in heat dissipation.
[0017] Furthermore, two through holes are provided inside the protective shell, and rotating rods are provided inside the two through holes.
[0018] Through the above technical solution, the rotating rod can drive the placement plate to rotate.
[0019] Furthermore, friction grooves are provided inside the two through holes, and friction pads are provided on the outer walls of the two rotating rods.
[0020] Through the above technical solution, the friction pad and the friction groove increase the friction between the rotating rod and the through hole, and rotation will not occur when there is no rotation force.
[0021] Furthermore, the tops of the two rotating rods are fixedly connected with rotating handles, and the two ends of the two rotating rods are fixedly connected with placement plates.
[0022] Through the above technical solution, the placement plate limits the circuit board to prevent the circuit board from being separated from the protective shell.
[0023] Furthermore, both ends of the bottom of the connecting ring are fixedly connected with bumps, and the tops of the two circuits are fixedly connected with card slots.
[0024] Through the above technical solution, the protrusion and the slot are also used to achieve the connection between the circuit and the connecting ring.
[0025] Furthermore, the two protrusions are respectively engaged with the corresponding slots.
[0026] Through the above technical solution, the protrusion is inserted into the card slot during installation to achieve pre-installation.
[0027] In summary, the present application includes at least one of the following beneficial technical effects:
[0028] (1) The utility model can pre-install the connection ring and circuit of the via in the disk by setting the pre-installation component, so as to avoid the connection ring and circuit of the via in the disk from being offset when the multi-layer circuit board is hot pressed. Specifically, before hot pressing, the pin is inserted into the slot of the circuit to realize the pre-installation of the circuit and the connection ring on the inner conductor of the via in the disk, so that the connection ring and the circuit remain stable without slight offset when the multi-layer circuit board is hot pressed, thus avoiding the formation of an open circuit in the via in the disk and maintaining the stability and reliability of the connection;
[0029] (2) The utility model can effectively increase the heat conduction between the circuit board and the surrounding air by setting the heat dissipation fins and the heat dissipation holes, and quickly transfer the heat generated on the circuit board to the surrounding environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0031] Figure 2 It is a bottom view of the utility model;
[0032] Figure 3 This is a schematic diagram of the internal structure of the protective shell of the utility model;
[0033] Figure 4 This is a schematic diagram of the connection structure of the spring and the trapezoidal block of the utility model;
[0034] Figure 5 This is a schematic diagram of the pin and circuit connection structure of the utility model;
[0035] Figure 6 It is a schematic diagram of the connection structure of the protrusion and the slot of the utility model.
[0036] Explanation of the reference numerals: 1. Circuit board; 2. Protective shell; 3. Heat dissipation fins; 4. Turn handle; 5. Turn rod; 6. Placement plate; 7. Heat dissipation hole; 8. Inner conductor; 9. Connecting ring; 10. Circuit; 11. Pin; 12. Bump; 13. Card slot. DETAILED DESCRIPTION
[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.
[0038] Example 1, reference Figure 1-Figure 5A multilayer circuit board with a plate-in-hole comprises a circuit board 1, the number of the circuit boards 1 is set to be multiple, two circuits 10 are arranged on the top of the circuit board 1, a plate-in-hole is opened inside the circuit board 1, and a pre-installed component is arranged on one side of the plate-in-hole;
[0039] The pre-installed component includes an inner conductor 8, which is located inside the hole in the disk. Connecting rings 9 are provided on the top and bottom of the inner conductor 8. Multiple pins 11 are fixedly connected to both ends of the connecting rings 9. Slots are provided at both ends of the two circuits 10, and the multiple pins 11 are respectively plugged into the slots.
[0040] By setting up the pre-installed components, the connecting ring 9 and the circuit 10 of the hole in the disk can be pre-installed, so as to avoid the connecting ring 9 and the circuit 10 of the hole in the disk from being offset when the multi-layer circuit board 1 is hot-pressed. Specifically, before hot-pressing, the pin 11 is inserted into the slot of the circuit 10 to realize the pre-installation of the circuit 10 and the connecting ring 9 on the inner conductor 8 of the hole in the disk, so that the connecting ring 9 and the circuit 10 remain stable without slight offset when the multi-layer circuit board 1 is hot-pressed, thereby avoiding the formation of an open circuit in the hole in the disk and maintaining the stability and reliability of the connection.
[0041] Reference Figure 4-Figure 5 The connecting ring 9 is located between two circuits 10 , and a plurality of pins 11 are distributed equidistantly along the horizontal direction of the circuit 10 .
[0042] Reference Figure 1-Figure 2 A protective shell 2 is provided on the outside of the circuit board 1, and multiple heat dissipation fins 3 are provided at both ends of the protective shell 2. The multiple heat dissipation fins 3 are distributed at equal distances along the horizontal direction of the protective shell 2. Heat dissipation holes 7 are opened at both ends of the protective shell 2 away from the heat dissipation fins 3, and the number of holes in the disk is set to multiple.
[0043] The protective housing 2 is provided to protect the circuit board 1 from external physical damage.
[0044] By providing the heat dissipation fins 3 and the heat dissipation holes 7, the heat conduction between the circuit board 1 and the surrounding air can be effectively increased, and the heat generated on the circuit board 1 can be quickly transferred to the surrounding environment.
[0045] Reference Figure 1-Figure 2 Two through holes are provided inside the protective shell 2, and rotating rods 5 are provided inside the two through holes. Friction grooves are provided inside the two through holes, and friction pads are provided on the outer walls of the two rotating rods 5. The tops of the two rotating rods 5 are fixedly connected with rotating handles 4, and the two ends of the two rotating rods 5 are fixedly connected with placement plates 6.
[0046] When the multi-layer circuit board 1 is placed into the protective shell 2, the two ends of the placement plate 6 are located on the outside of the circuit board 1. After it is placed in, the rotating rod 5 is rotated to rotate the placement plate 6 to the inside of the protective shell 2 of the circuit board 1 to limit the circuit board 1 and prevent the circuit board 1 from separating from the protective shell 2.
[0047] Example 2, reference Figure 6 Both ends of the bottom of the connecting ring 9 are fixedly connected with protrusions 12, and the tops of the two circuits 10 are fixedly connected with slots 13, and the two protrusions 12 are respectively engaged with the corresponding slots 13.
[0048] The arrangement of the protrusion 12 and the slot 13 is also used to realize the connection between the circuit 10 and the connecting ring 9. During installation, the protrusion 12 is inserted into the slot 13 to realize pre-installation.
[0049] In addition, the connection ring 9 and the circuit 10 can also be crimped or clamped to achieve pre-installation, which can avoid the problem of deviation of the multi-layer circuit board 1 during hot pressing.
[0050] Working principle: First, before hot pressing, the pin 11 is inserted into the slot of the circuit 10 to pre-install the circuit 10 and the connecting ring 9 on the inner conductor 8 of the via in the disk, so that the connecting ring 9 and the circuit 10 remain stable without slight deviation when hot pressing the multi-layer circuit board 1, and then the multi-layer circuit board 1 is hot pressed by hot pressing technology;
[0051] When the multilayer circuit board 1 is in use, the protective shell 2 is put on the outside of the circuit board 1. The protective shell 2 can provide a certain degree of protection for the outside of the circuit board 1. The heat dissipation holes 7 are arranged by the heat dissipation fins 3, which can effectively increase the heat conduction between the circuit board 1 and the surrounding air, and quickly transfer the heat generated on the circuit board 1 to the surrounding environment.
[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A multilayer circuit board with a via in a disk, characterized in that: include: A circuit board (1), wherein the number of the circuit boards (1) is set to be multiple, two circuits (10) are arranged on the top of the circuit board (1), a plate-in-hole is opened inside the circuit board (1), and a pre-installed component is arranged on one side of the plate-in-hole; The pre-installed component comprises an inner conductor (8), wherein the inner conductor (8) is located inside a hole in a disk, a connecting ring (9) is provided at the top and the bottom of the inner conductor (8), a plurality of pins (11) are fixedly connected to both ends of the connecting ring (9), and slots are provided at both ends of the two circuits (10), and the plurality of pins (11) are respectively plugged into the slots.
2. A multilayer circuit board with vias in disks according to claim 1, characterized in that: The connecting ring (9) is located between two circuits (10), and the plurality of pins (11) are distributed at equal distances along the horizontal direction of the circuit (10).
3. A multilayer circuit board with vias in disks according to claim 2, characterized in that: A protective shell (2) is provided on the outside of the circuit board (1), and a plurality of heat dissipation fins (3) are provided at two ends of the protective shell (2).
4. A multilayer circuit board with vias in disks according to claim 3, characterized in that: The plurality of heat dissipation fins (3) are distributed at equal distances along the horizontal direction of the protective housing (2).
5. A multilayer circuit board with vias in disks according to claim 4, characterized in that: Both ends of the protective housing (2) away from the heat dissipation fins (3) are provided with heat dissipation holes (7), and the number of holes in the plate is set to be multiple.
6. A multilayer circuit board with vias in pads according to claim 4, characterized in that: Two through holes are provided inside the protective shell (2), and rotating rods (5) are provided inside the two through holes.
7. A multilayer circuit board with vias in disks according to claim 6, characterized in that: The interiors of the two through holes are both provided with friction grooves, and the outer walls of the two rotating rods (5) are both provided with friction pads.
8. A multi-layer circuit board with vias in pads according to claim 6, characterized in that: The tops of the two rotating rods (5) are fixedly connected to rotating handles (4), and the two ends of the two rotating rods (5) are fixedly connected to placement plates (6).
9. A multilayer circuit board with vias in pads according to claim 1, characterized in that: Both ends of the bottom of the connecting ring (9) are fixedly connected with bumps (12), and the tops of the two circuits (10) are fixedly connected with card slots (13).
10. A multi-layer circuit board with vias in pads according to claim 9, characterized in that: The two protrusions (12) are respectively engaged with corresponding slots (13).