PCB of Buck circuit
By using GaN power switches and optimized layout in the PCB board of the Buck circuit, the problem of low efficiency of the PCB board of the traditional Buck circuit is solved, and a more efficient circuit design is achieved.
Patent Information
- Application Number
- CN202420873007.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The PCB boards of existing Buck circuits are relatively low in efficiency, mainly due to the large size of silicon-based Mosfet devices, which makes it difficult to separate the driving loop and the power loop, resulting in large parasitic parameters.
GaN power switch is used to replace traditional Mosfet devices, and the impact of the drive loop is reduced by putting the drive module as close as possible to the GaN power switch, and the power loop and the drive loop are separated.
By using GaN power switches and optimized layout, the volume of the power loop and the drive loop is reduced, the loops are affected by each other, the parasitic parameters are reduced, and the efficiency of the PCB board is improved.
Smart Images
Figure CN222621283U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB board of a Buck circuit. Background Art
[0002] Most of the current DC-DC power supply Buck circuit applications use silicon-based Mosfet discrete devices. The circuit application is mainly divided into two ways: one is to use Mosfet for both the upper tube and the lower tube; the other is to use Mosfet for the upper tube and Diode for the lower tube. Since the silicon-based Mosfet device itself is large in size, it is difficult to take into account both the drive loop and the power loop during PCB layout. When applied to the DC-DC power supply BUCK circuit, the loop caused by physical factors will be larger. If the drive loop and the power loop cannot be separated well, they will affect each other, resulting in large parasitic parameters and reducing the efficiency of the PCB board. Utility Model Content
[0003] The utility model provides a PCB board of a Buck circuit, which is used to solve the defect of low efficiency of the PCB board of the Buck circuit in the prior art.
[0004] The utility model provides a PCB board of a Buck circuit, comprising: a first power switch, a second power switch and a driving module, wherein the first power switch is electrically connected to the second power switch, and the driving module is electrically connected to the first power switch and the second power switch; the first power switch and the second power switch are arranged opposite to and adjacent to each other, and the driving module is arranged on one side of the first power switch or the second power switch, and adjacent to the first power switch and the second power switch; the source of the first power switch is opposite to the drain of the second power switch, and the first power switch and the second power switch are GaN power switches.
[0005] According to the utility model, a PCB board of a Buck circuit also includes: a first board layer, an intermediate layer group and a second board layer, the first board layer, the intermediate layer group and the second board layer are stacked in sequence, the intermediate layer group includes a plurality of third board layers, the plurality of third board layers are stacked in sequence, and each of the third board layers is provided with a plurality of first through holes.
[0006] According to a PCB board of a Buck circuit provided by the utility model, the first power switch, the second power switch and the driving module are arranged on the second board layer.
[0007] According to a PCB board of a Buck circuit provided by the utility model, one of the first power switch and the second power switch is arranged on the second board layer, the other is arranged on the first board layer, and the driving module is arranged on the second board layer or the first board layer.
[0008] According to a PCB board of a Buck circuit provided by the utility model, the first power switch is provided with a plurality of second through holes, the second power switch is provided with a plurality of third through holes, the second through holes penetrate the board layer where the first power switch is located, and the third through holes penetrate the board layer where the second power switch is located.
[0009] According to a PCB board of a Buck circuit provided by the utility model, the second board layer is provided with a plurality of fourth through holes, and the plurality of fourth through holes are located between the first power switch and the second power switch; the first board layer is provided with a plurality of fifth through holes.
[0010] A PCB board of a Buck circuit provided by the utility model further includes a ground layer, and the ground layer is arranged between the plurality of third board layers.
[0011] According to a PCB board of a Buck circuit provided by the utility model, the distance between the first power switch and the second power switch is less than or equal to 1 mm.
[0012] According to a PCB board of a Buck circuit provided by the utility model, the distance between the driving module and the first power switch and the second power switch is less than or equal to 1.5 mm.
[0013] According to a PCB board of a Buck circuit provided by the utility model, it also includes an inductor, an input capacitor and an output capacitor. The input capacitor is electrically connected to the first power switch and is arranged adjacent to it; the second power switch is electrically connected to the inductor, the inductor is electrically connected to the output capacitor, and the output capacitor is arranged adjacent to the second power switch.
[0014] According to a PCB board of a Buck circuit provided by the utility model, it also includes an inductor, an input capacitor and an output capacitor. The input capacitor is electrically connected to the first power switch and is arranged adjacent to it; the second power switch is electrically connected to the inductor, the inductor is electrically connected to the output capacitor, and the output capacitor is arranged adjacent to the second power switch.
[0015] The PCB board of the Buck circuit provided by the utility model reduces the volume of the first power switch and the second power switch and reduces the power loop by setting the first power switch and the second power switch as GaN power switches. At the same time, the power loop and the drive loop are separated by utilizing the characteristics of the GaN power switch itself, and the drive module is set as close to the first power switch and the second power switch as possible, thereby reducing the drive loop, thereby avoiding mutual influence between the drive loop and the power loop, reducing the influence of parasitic parameters, and improving the efficiency of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 It is a structural schematic diagram of a PCB board of a Buck circuit in the prior art;
[0018] Figure 2 This is one of the structural schematic diagrams of the PCB board of the Buck circuit provided by the utility model;
[0019] Figure 3 This is the second structural schematic diagram of the PCB board of the Buck circuit provided by the utility model;
[0020] Reference numerals:
[0021] 11: first power switch; 12: second power switch; 13: fourth through hole; 20: driving module; 30: inductor; 40: input capacitor; 50: output capacitor; 100: driving loop; 111: second through hole; 121: third through hole; 200: power loop. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] The features of the terms "first" and "second" in the specification and claims of the utility model may explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, the meaning of "plurality" is two or more.
[0024] Combine the following Figure 1-Figure 3 The utility model is described as a PCB board of a Buck circuit.
[0025] like Figure 1 As shown, in the prior art, the power switches are all silicon-based Mosfet power switches. Since the silicon-based Mosfet power switches are relatively large in size, they will generate a relatively large power loop 200. When the components on the PBC board are laid out, they are relatively dispersed, which will cause the driver module to generate a relatively large drive loop 100. The power loop 200 and the drive loop 100 affect each other, generating relatively large parasitic parameters, thereby reducing the efficiency of the PCB board.
[0026] like Figure 2 and Figure 3 As shown, in an embodiment of the present utility model, the PCB board of the Buck circuit includes: a first power switch 11, a second power switch 12 and a driving module 20. The first power switch 11 is electrically connected to the second power switch 12, and the driving module 20 is electrically connected to the first power switch 11 and the second power switch 12. The first power switch 11 and the second power switch 12 are arranged opposite to and adjacent to each other, and the driving module 20 is arranged on one side of the first power switch 11 and the second power switch 12, and adjacent to the first power switch 11 and the second power switch 12. Among them, the source of the first power switch 11 is opposite to the drain of the second power switch 12, and the first power switch 11 and the second power switch 12 are GaN power switches.
[0027] Specifically, in this embodiment, the first power switch 11 and the second power switch 12 are set as GaN power switches. The smaller size of the GaN power switch can be used to reduce the power loop. During layout, the package and pins of the GaN device can completely divide the drive loop and the power loop into two parts. When arranging the drive module 20, as long as the drive module 20 is close enough to the first power switch 11 and the second power switch 12, the drive loop can become very small and will not affect the power loop. At the same time, when GaN devices are used as the first power switch 11 and the second power switch 12, due to the smaller size of the first power switch 11 and the second power switch 12, the layout area can be greatly reduced on the physical level. Specifically, if Figure 2 and Figure 3As shown, the first power switch 11 and the second power switch 12 are arranged in sequence according to the direction of the pins and the loop, and are close to each other. The current flows from the drain of the first power switch 11 to the source of the first power switch 11, then flows to the drain of the second power switch 12, flows from the drain of the second power switch 12 to the source of the second power switch 12, and then flows out. The path of the current flowing between the two power switches is shorter, thereby generating a smaller power loop, avoiding the mutual influence between the power loop and the drive loop, reducing the influence of parasitic parameters, and thus improving the efficiency of the PCB board. At the same time, the first power switch 11 and the second power switch 12 can have a higher switching frequency and a higher power density.
[0028] In this embodiment, the switching frequency of the first power switch 11 and the second power switch 12 can reach 4 MHz, which is significantly higher than the switching frequency of 1 MHz of a conventional power switch.
[0029] Furthermore, in the embodiment of the present invention, the driving module 20 is a driving IC.
[0030] The PCB board of the Buck circuit provided by the embodiment of the utility model reduces the volume of the first power switch and the second power switch and reduces the power loop by setting the first power switch and the second power switch as GaN power switches. At the same time, the power loop and the drive loop are separated by utilizing the characteristics of the GaN power switch itself, and the drive module is set as close to the first power switch and the second power switch as possible, thereby reducing the drive loop, thereby avoiding mutual influence between the drive loop and the power loop, reducing the influence of parasitic parameters, and improving the efficiency of the PCB board.
[0031] In an embodiment of the utility model, the PCB board of the Buck circuit further includes: a first board layer, an intermediate layer group and a second board layer. The first board layer, the intermediate layer group and the second board layer are stacked in sequence, the intermediate layer group includes a plurality of third board layers, the plurality of third board layers are stacked in sequence, and each third board layer is provided with a plurality of first through holes. In this embodiment, the first board layer is the bottom layer and the second board layer is the top layer.
[0032] Further, in the embodiment of the utility model, there are two arrangements of the first power switch 11 and the second power switch 12. One is that the first power switch 11 and the second power switch 12 are arranged in the same plane, that is, the first power switch 11 and the second power switch 12 are both arranged in the second board layer, and accordingly, the driving module 20 is also arranged in the second board layer. The other is that one of the first power switch 11 and the second power switch 12 is arranged in the first board layer, and the other is arranged in the second board layer, and the driving module 20 can be arranged in the first board layer or in the second board layer.
[0033] In the above-mentioned embodiment, no matter whether the first power switch 11 and the second power switch 12 are located in the same plane or in different planes, the source of the first power switch 11 is always opposite to the drain of the second power switch 12, so that the current flow path can be shortened and a smaller power loop can be generated.
[0034] like Figure 2 and Figure 3 As shown, in the embodiment of the present utility model, the first power switch 11 is provided with a plurality of second through holes 111, and the second power switch 12 is provided with a plurality of third through holes 121. The second through holes 111 penetrate the board layer where the first power switch 11 is located, and the third through holes 121 penetrate the board layer where the second power switch 12 is located.
[0035] Specifically, when the first power switch 11 and the second power switch 12 are both located in the second board layer, the second through hole 111 and the third through hole 121 penetrate the second board layer. Each third board layer is provided with a plurality of first through holes, and the first board layer is provided with a plurality of fifth through holes, so that each board layer has a plurality of through holes to increase the flow capacity of the PCB board, thereby improving the efficiency of the PCB board.
[0036] When the first power switch 11 and the second power switch 12 are located in different board layers, the second through hole 111 passes through one of the first board layer and the second board layer, and the third through hole 121 passes through the other of the first board layer and the second board layer. Each third board layer is provided with a plurality of first through holes, so that each board layer has a plurality of through holes, so as to increase the flow capacity of the PCB board, thereby improving the efficiency of the PCB board.
[0037] It should be noted that: in the above-described embodiments, the through holes of two adjacent layers may be connected or not connected.
[0038] Furthermore, if Figure 2 and Figure 3 As shown, when the first power switch 11 and the second power switch 12 are located in the same plane, the second board layer is provided with a plurality of fourth through holes 13, and the plurality of fourth through holes 13 are located between the first power switch 11 and the second power switch 12, and the fourth through holes 13 penetrate the first board layer and the second board layer to increase the flow capacity of the PCB board, thereby improving the efficiency of the PCB board.
[0039] In an embodiment of the present invention, the PCB board of the Buck circuit further includes a ground layer, which is sandwiched between a plurality of third board layers to improve the current carrying capacity of the PCB board, thereby improving the efficiency of the PCB board.
[0040] Furthermore, in the embodiment of the present invention, the distance between the first power switch 11 and the second power switch 12 is less than or equal to 1 mm.
[0041] Specifically, in theory, the smaller the distance between the first power switch 11 and the second power switch 12, the smaller the generated power loop, the smaller the impact of parasitic parameters on the PCB, the higher the switching frequency and power density of the first power switch 11 and the second power switch 12, and the higher the efficiency of the PCB. At the same time, the smaller the space occupied on the PCB, the more other devices can be arranged on the PCB, thereby improving the function of the PCB.
[0042] Further, in the embodiment of the present utility model, the distance between the driving module 20 and the first power switch 11 and the second power switch 12 is less than or equal to 1.5 mm.
[0043] Specifically, in theory, as long as the driving module 20 is close enough to the first power switch 11 and the second power switch 12, the driving loop can become very small and will not affect the power loop. Therefore, when setting the driving module 20, the distance between the driving module 20 and the first power switch 11 and the second power switch 12 can be as small as possible.
[0044] The PCB board of the Buck circuit provided by the embodiment of the utility model, in the horizontal layout, by setting the first power switch and the second power switch as GaN power switches, and making the first power switch, the second power switch and the driving module as close as possible, realizes the small-area stacking of power devices and driving devices, reduces the influence of parasitic parameters on the PCB board, improves the switching frequency and power density of the first power switch and the second power switch, and the efficiency of the PCB board; in the vertical layout, by setting a plurality of through holes, the current carrying capacity of the PCB board is increased; by setting a ground layer in the middle layer group, the current carrying capacity of the PCB board is enhanced, and the efficiency of the PCB board is further improved.
[0045] like Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the PCB board of the Buck circuit further includes an inductor 30, an input capacitor 40 and an output capacitor 50. The input capacitor 40 is electrically connected to the first power switch 11 and is disposed adjacent thereto. The second power switch 12 is electrically connected to the inductor 30, the inductor 30 is electrically connected to the output capacitor 50, and the output capacitor 50 is disposed adjacent to the second power switch 12.
[0046] Specifically, Figure 2 and Figure 3 Provides two layout methods for PCB boards. Figure 2 and Figure 3In the embodiment, the input capacitor 40 is arranged adjacent to the first power switch 11, and the output capacitor 50 is arranged adjacent to the second power switch 12, so that the peripheral circuit has a larger adjustment space, and the input capacitor 40 and the output capacitor 50 can be placed according to the principle of proximity according to different device packages. The devices in the peripheral circuit are also easier to change without causing greater interference to the internal circuit, so that the PCB board can have more functions.
[0047] It should be noted that: Figure 2 and Figure 3 In the illustrated embodiment, the circuit within the dotted line frame is an internal circuit, and the circuit outside the dotted line frame is a peripheral circuit.
[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.
Claims
1. A PCB board of a Buck circuit, characterized in that: include: A first power switch, a second power switch and a driving module, wherein the first power switch is electrically connected to the second power switch, and the driving module is electrically connected to the first power switch and the second power switch; The first power switch and the second power switch are arranged opposite to and adjacent to each other, and the driving module is arranged on one side of the first power switch or the second power switch and adjacent to the first power switch and the second power switch; A source of the first power switch is opposite to a drain of the second power switch, and the first power switch and the second power switch are GaN power switches.
2. The PCB board of the Buck circuit according to claim 1, characterized in that: Also includes: A first board layer, an intermediate layer group and a second board layer, wherein the first board layer, the intermediate layer group and the second board layer are stacked in sequence, the intermediate layer group includes a plurality of third board layers, and the plurality of third board layers are stacked in sequence, and each of the third board layers is provided with a plurality of first through holes.
3. The PCB board of the Buck circuit according to claim 2, characterized in that: The first power switch, the second power switch and the driving module are arranged on the second board layer.
4. The PCB board of the Buck circuit according to claim 2, characterized in that: One of the first power switch and the second power switch is disposed on the second board layer, and the other is disposed on the first board layer. The driving module is disposed on the second board layer or the first board layer.
5. The PCB board of the Buck circuit according to claim 2, characterized in that: The first power switch is provided with a plurality of second through holes, the second power switch is provided with a plurality of third through holes, the second through holes penetrate the board layer where the first power switch is located, and the third through holes penetrate the board layer where the second power switch is located.
6. The PCB board of the Buck circuit according to claim 3, characterized in that: The second board layer is provided with a plurality of fourth through holes, and the plurality of fourth through holes are located between the first power switch and the second power switch; The first board layer is provided with a plurality of fifth through holes.
7. The PCB board of the Buck circuit according to claim 2, characterized in that: Also included is a ground layer, which is disposed between the plurality of third plate layers.
8. The PCB board of the Buck circuit according to claim 3, characterized in that: A distance between the first power switch and the second power switch is less than or equal to 1 mm.
9. The PCB board of the Buck circuit according to claim 3, characterized in that: The distance between the driving module and the first power switch and the second power switch is less than or equal to 1.5 mm.
10. The PCB board of the Buck circuit according to claim 1, characterized in that: Also includes an inductor, an input capacitor and an output capacitor, wherein the input capacitor is electrically connected to the first power switch and is disposed adjacent to the first power switch; The second power switch is electrically connected to the inductor, the inductor is electrically connected to the output capacitor, and the output capacitor is disposed adjacent to the second power switch.