Printed circuit board high-order HDI interlayer alignment auxiliary device

Abstract

The utility model relates to the technical field of printed circuit board manufacturing, in particular to a printed circuit board high-order HD I interlayer alignment auxiliary device which comprises an auxiliary board, positioning mechanisms are arranged on two sides of the auxiliary board, and each positioning mechanism comprises a supporting shaft and a torsion spring; the beneficial effects are that the printed circuit board high-order HD I interlayer alignment auxiliary device provided by the utility model is provided with the positioning mechanism, and the supporting arm is elastically connected with the vertical frame through the torsional spring and is rotatably connected with the vertical frame through the supporting shaft, so that after interlayer alignment of the high-order HD I circuit board, the limiting of the moving frame is released, and the positioning of the high-order HD I circuit board is realized. The supporting arm and the positioning plate can be reset under the action of the torsion spring, so that positioning of the multilayer circuit board can be realized, contact surfaces of the multilayer circuit board can be in complete contact, false riveting of the contact surfaces of the multilayer circuit board can be prevented, and the reject ratio of products can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a high-order HDI interlayer alignment auxiliary device for a printed circuit board. Background Art

[0002] With the rapid development of electronic technology, the performance and manufacturing precision requirements of printed circuit boards, as the core components of electronic equipment, are increasing day by day. High-end HDI multilayer circuit boards are widely used in high-end electronic products such as smart phones, tablet computers, and medical equipment due to their excellent performance in signal transmission and electrical performance. However, in the manufacturing process of HDI multilayer circuit boards, the inter-layer alignment accuracy is one of the key factors affecting product quality and yield.

[0003] According to a printed circuit board interlayer alignment auxiliary fixture with publication number CN208159010U, its main body is a hard plate in a rectangular shape, and at least two grooves are symmetrically arranged on the side surfaces of its two long sides, and the grooves correspond to the riveting positions of the multi-layer printed circuit boards; the thickness of the main body is 3 to 5 mm; circuit board positioning holes are symmetrically arranged at the four corners and the middle area of ​​the main body, and the circuit board positioning holes are countersunk holes, and positioning pins are arranged on the circuit board positioning holes for alignment between different layers of the printed circuit boards; a positioning through hole is symmetrically arranged at the middle positions of the four sides of the main body.

[0004] Regarding the above-mentioned related schemes, the alignment between the layers of the printed circuit board is achieved through the main body, positioning holes, positioning pins, etc. However, in the process of alignment and fixation between the multi-layer circuit boards, the contact surfaces between the multi-layer circuit boards are prone to not being connected tightly enough or having slight deviations, which can easily lead to virtual riveting on the contact surfaces between the multi-layer circuit boards, thereby resulting in a high product defect rate. Utility Model Content

[0005] The utility model aims to provide a high-order HDI layer alignment auxiliary device for a printed circuit board to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a printed circuit board high-order HDI interlayer alignment auxiliary device, the printed circuit board high-order HDI interlayer alignment auxiliary device comprising: an auxiliary plate, both sides of the auxiliary plate are provided with positioning mechanisms, the positioning mechanisms include a support shaft and a torsion spring, both sides of the auxiliary plate are provided with stand frames, the stand frames are rotatably connected with a support arm, and a positioning plate is provided at one end of the support arm.

[0007] Preferably, a support shaft connected to the stand via a bearing is provided at one end of the support arm close to the stand, and a torsion spring is provided between the support arm and the stand.

[0008] Preferably, the support arm and the stand form an elastic structure through a torsion spring, and two groups of the support arm and the torsion spring are symmetrically arranged about the central axis of the auxiliary plate.

[0009] Preferably, the positioning plates are symmetrically arranged in two groups about the central axis of the auxiliary plate, and an elastic pad is arranged at one end of the positioning plate close to the auxiliary plate.

[0010] Preferably, a limiting mechanism is provided on one side of the stand, and the limiting mechanism consists of a supporting frame, a limiting plate, a supporting spring and a moving frame.

[0011] Preferably, a support frame is welded to one side of the two uprights, a limit plate is slidably connected to the interior of the support frame, and a support spring is welded to the limit plate and the support frame.

[0012] Preferably, a moving frame is welded to the top ends of the two support arms, the moving frame is arranged as an inverted "U"-shaped structure, and an inclined surface is arranged at one end of the limiting plate close to the support arm.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The high-order HDI interlayer alignment auxiliary device for printed circuit boards proposed by the utility model is provided with a positioning mechanism. Since the support arm and the stand are elastically connected by a torsion spring and are rotatably connected by a support shaft, after the high-order HDI circuit boards are aligned between layers, the limit of the moving frame is released, so that the support arm and the positioning plate are reset under the action of the torsion spring, thereby realizing the positioning of the multi-layer circuit boards, so that the contact surfaces between the multi-layer circuit boards are completely in contact, thereby preventing the contact surfaces between the multi-layer circuit boards from being falsely riveted, and thus reducing the product defect rate;

[0015] 2. The high-order HDI interlayer alignment auxiliary device for a printed circuit board proposed by the utility model is provided with a limiting mechanism. Since the limiting plate and the support frame are elastically connected by a supporting spring, and an inclined surface is provided at one end of the limiting plate close to the moving frame, when the moving frame is pulled to make the support arm deflect with the supporting shaft as the axis, the moving frame can be limited by the limiting plate, so that the support arm is in a vertical state, thereby facilitating the stacking and alignment of the circuit board and preventing obstruction to the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main cutaway structure of the utility model;

[0017] Figure 2 It is a partial front view cutaway structural schematic diagram of the utility model;

[0018] Figure 3It is a schematic diagram of the partial front view cutaway structure of the utility model in a non-positioning state;

[0019] Figure 4 It is a partial top view of the structure of the utility model.

[0020] In the figure: 1, auxiliary plate; 2, positioning mechanism; 201, stand; 202, support shaft; 203, support arm;

[0021] 204, positioning plate; 205, torsion spring; 3, limiting mechanism; 301, supporting frame; 302, limiting plate; 303, supporting spring; 304, moving frame. DETAILED DESCRIPTION

[0022] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Embodiment 1

[0024] See also Figure 1-Figure 4 The utility model provides a technical solution: a high-order HDI interlayer alignment auxiliary device for a printed circuit board, the high-order HDI interlayer alignment auxiliary device for a printed circuit board comprises: an auxiliary board 1, positioning mechanisms 2 are arranged on both sides of the auxiliary board 1, the positioning mechanisms 2 comprise a support shaft 202 and a torsion spring 205, a stand 201 is arranged on both sides of the auxiliary board 1, the stand 201 is rotatably connected with a support arm 203, a positioning plate 204 is arranged at one end of the support arm 203, a support shaft 202 connected to the stand 201 through a bearing is arranged at one end of the support arm 203 close to the stand 201, a torsion spring 205 is arranged between the support arm 203 and the stand 201, the support arm 203 and the stand 201 form an elastic structure through the torsion spring 205, and two groups of the support arm 203 and the torsion spring 205 are symmetrically arranged about the central axis of the auxiliary board 1;

[0025] Since the support arm 203 is elastically connected to the stand 201 through the torsion spring 205 and is rotationally connected through the support shaft 202, after the high-order HDI circuit board layers are aligned, the limit on the movable frame 304 is released, so that the support arm 203 and the positioning plate 204 will be reset under the action of the torsion spring 205, thereby realizing the positioning of the multi-layer circuit board so that the contact surfaces between the multi-layer circuit boards are completely in contact, thereby preventing the contact surfaces between the multi-layer circuit boards from being falsely riveted, thereby reducing the product defect rate.

[0026] The positioning plates 204 are symmetrically arranged in two groups about the central axis of the auxiliary plate 1. An elastic pad is arranged at one end of the positioning plate 204 close to the auxiliary plate 1 to play a protective role and prevent hard contact between the positioning plate 204 and the circuit board, thereby preventing damage to the circuit board.

[0027] Embodiment 2

[0028] On the basis of the first embodiment, a limiting mechanism 3 is provided on one side of the stand 201, and the limiting mechanism 3 is composed of a support frame 301, a limiting plate 302, a support spring 303 and a moving frame 304. One side of the two stands 201 is welded with a support frame 301, the inner part of the support frame 301 is slidably connected with the limiting plate 302, and a support spring 303 is welded between the limiting plate 302 and the support frame 301, and the top ends of the two support arms 203 are welded with a moving frame 304, and the moving frame 304 is set to an inverted "U" shape structure, and an inclined surface is set at one end of the limiting plate 302 close to the support arm 203;

[0029] Since the limit plate 302 is elastically connected to the support frame 301 through the support spring 303, and an inclined surface is provided at one end of the limit plate 302 close to the movable frame 304, when the movable frame 304 is pulled to make the support arm 203 deflect around the support shaft 202, the limit plate 302 can be used to limit the movable frame 304, so that the support arm 203 is in a vertical state, thereby facilitating the stacking and positioning of the circuit boards and preventing obstruction to the operation.

[0030] In actual use, the high-order HDI circuit boards are stacked and placed in position, and then the limit plate 302 can be pulled outward to release the limit on the movable frame 304. At this time, the support arm 203 and the positioning plate 204 will be reset under the action of the torsion spring 205, so that the positioning plate 204 can be used to position the multi-layer circuit board so that the contact surfaces between the multi-layer circuit boards are completely in contact. Then the hot riveting head contacts and heats the circuit board at the groove of the auxiliary plate 1, so that different circuit boards are bonded together through the semi-cured sheet, and finally the riveted circuit board and the semi-cured sheet are moved to the press to be pressed into a multi-layer board. The contents not described in detail in this description belong to the prior art known to professional and technical personnel in this field.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-order HDI interlayer alignment auxiliary device for a printed circuit board, characterized in that: The printed circuit board high-order HDI interlayer alignment auxiliary device comprises: an auxiliary plate (1), both sides of the auxiliary plate (1) are provided with positioning mechanisms (2), the positioning mechanisms (2) include a support shaft (202) and a torsion spring (205), both sides of the auxiliary plate (1) are provided with a stand (201), the stand (201) is rotatably connected to a support arm (203), and one end of the support arm (203) is provided with a positioning plate (204).

2. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 1, characterized in that: A support shaft (202) connected to the stand (201) via a bearing is provided at one end of the support arm (203) close to the stand (201), and a torsion spring (205) is provided between the support arm (203) and the stand (201).

3. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 2, characterized in that: The support arm (203) and the stand (201) form an elastic structure through a torsion spring (205), and two groups of the support arm (203) and the torsion spring (205) are symmetrically arranged about the central axis of the auxiliary plate (1).

4. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 1, characterized in that: The positioning plates (204) are arranged in two groups symmetrically about the central axis of the auxiliary plate (1), and an elastic pad is arranged at one end of the positioning plate (204) close to the auxiliary plate (1).

5. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 1, characterized in that: A limiting mechanism (3) is provided on one side of the stand (201), and the limiting mechanism (3) is composed of a supporting frame (301), a limiting plate (302), a supporting spring (303) and a moving frame (304).

6. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 5, characterized in that: A support frame (301) is welded to one side of the two upright frames (201), a limit plate (302) is slidably connected inside the support frame (301), and a support spring (303) is welded between the limit plate (302) and the support frame (301).

7. The high-order HDI interlayer alignment auxiliary device for a printed circuit board according to claim 6, characterized in that: The top ends of the two support arms (203) are welded to a moving frame (304), the moving frame (304) is arranged as an inverted "U"-shaped structure, and an inclined surface is arranged at one end of the limiting plate (302) close to the support arm (203).

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