Polishing device

Abstract

The utility model discloses a polishing device which comprises a jig assembly used for containing a substrate slice, a polishing assembly and a first driving assembly, the polishing assembly comprises a polishing wheel and a plurality of polishing pads, the polishing wheel is located above the jig assembly, and the first driving assembly is connected with the polishing wheel to drive the polishing wheel to rotate. A plurality of discharging grooves penetrating through the two ends of the polishing wheel are formed in the side face of the periphery of the polishing wheel, the multiple discharging grooves are formed around the axis of the polishing wheel at intervals, a boss is formed between every two adjacent discharging grooves, the polishing pads are installed on the corresponding bosses, and a first included angle is formed between the projection, in the first direction, of the axis of each discharging groove and the axis of the polishing wheel. The discharging grooves penetrate through the two ends of the polishing wheel and are arranged around the axis at intervals, and when the polishing wheel rotates, the polishing pad makes contact with the substrate sheet and extrudes the polishing liquid, so that generated waste chips and the polishing liquid move in the length direction of the discharging grooves, and the polishing liquid generated in the polishing process is discharged through the discharging grooves.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing, in particular to a polishing device. Background Art

[0002] In the semiconductor manufacturing and precision machining industries, polishing technology is one of the key steps to improve the surface quality and precision of components. Polishing substrates, such as silicon wafers or other semiconductor materials, are in contact with polishing pads under high-speed rotation and pressure to remove microscopic surface unevenness and achieve highly smooth surface requirements. However, this process is accompanied by the generation of a large amount of fine and sticky waste chips, which include polishing pad wear particles, detached layers of the polished material, and polishing liquid residues. Traditional waste chip disposal methods, such as relying on gravity to fall naturally or simple dust collection systems, are often difficult to cope with the need to remove waste chips during polishing. If the waste chips cannot be discharged in time, they may re-adhere to the surface of the workpiece, causing scratches or contamination. In severe cases, they may block the internal channels of the equipment, increase maintenance costs, and even affect processing accuracy and yield. Utility Model Content

[0003] The technical problem to be solved by the utility model is that the traditional chip removal method relying on natural falling due to gravity or a simple dust collection system is difficult to meet the requirement of clearing waste chips during polishing.

[0004] In order to solve the above technical problems, the utility model provides a polishing device, including a jig assembly for placing a substrate sheet, a polishing assembly and a first driving assembly, the polishing assembly including a polishing wheel and a plurality of polishing pads, the polishing wheel being located above the jig assembly, the first driving assembly being connected to the polishing wheel to drive the polishing wheel to rotate, the outer peripheral side surface of the polishing wheel having a plurality of discharge grooves arranged through both ends of the polishing wheel, the plurality of discharge grooves being arranged at intervals around the axis of the polishing wheel, and a boss being formed between two adjacent discharge grooves, the polishing pad being installed on the corresponding boss, and a first angle being formed between the projection of the axis of the discharge groove in the first direction and the axis of the polishing wheel.

[0005] In some embodiments, the first angle is 7°-13°.

[0006] In some embodiments, the discharge groove includes a first side wall and a second side wall arranged opposite to each other, and the first side wall and the second side wall define a groove opening facing away from the axial direction of the polishing wheel, and the width of the groove gradually increases upward from the bottom of the discharge groove, so that a second angle is formed between the extension line of the first side wall and the extension line of the second side wall, and the angle of the second angle is 20°-27°.

[0007] In some embodiments, the first driving component includes a mounting seat, a rotating shaft, a first rocker arm, a second rocker arm and a driving structure, the two ends of the polishing wheel are respectively connected to one end of the first rocker arm and one end of the second rocker arm, the rotating shaft passes through the mounting seat, and the two ends of the rotating shaft are respectively rotatably connected to the first rocker arm and the second rocker arm, the driving structure is installed on the first rocker arm, and the driving structure is connected to the polishing wheel to drive the polishing wheel to rotate.

[0008] In some embodiments, the driving structure includes a first driving member, a driving wheel, a synchronous belt and a driven wheel. The first driving member is installed on the first rocker arm, and the driving shaft of the first driving member is connected to the driving wheel. The driving wheel and the driven wheel are synchronously linked through the synchronous belt, and the driven wheel is connected to the polishing wheel.

[0009] In some embodiments, a second driving assembly is further included, the first driving assembly further includes a connecting shaft, the two ends of the connecting shaft are respectively connected to the other end of the first swing rod and the other end of the second swing rod, and the rotating shaft is located between the polishing wheel and the connecting shaft, and the second driving assembly is connected to the connecting shaft to control the polishing assembly to move back and forth between a first position and a second position;

[0010] When the polishing assembly is located at the first position, a space for loading and unloading the substrate sheet is formed between the polishing assembly and the fixture assembly; when the polishing assembly is located at the second position, the polishing assembly is in contact with the substrate sheet.

[0011] In some embodiments, the second drive assembly includes a support column, a second drive member, a connecting rod and a pressing head, the second drive member is mounted on the support column, the output shaft of the second drive member is connected to the connecting rod, the connecting rod is connected to the pressing head, and the pressing head is connected to the connecting shaft.

[0012] In some embodiments, the second driving assembly further includes a pressure sensor, and the pressure sensor is disposed between the connecting rod and the pressing head to detect the pressing pressure of the pressing head.

[0013] In some embodiments, the jig assembly includes a jig base, a third driving member and a vacuum adsorption member, the third driving member is connected to the jig base to drive the jig base to rotate, the jig base is provided with an adsorption port, and the vacuum adsorption member is installed in the jig base and connected to the adsorption port to adsorb the substrate sheet.

[0014] In some embodiments, the fixture assembly further includes a fourth driving member and a mounting base, the third driving member is mounted on the mounting base, and the fourth driving member is connected to the mounting base to drive the fixture base to slide back and forth along the second direction.

[0015] Compared with the prior art, the polishing device of the utility model has the following beneficial effects:

[0016] The discharge grooves of the embodiment of the utility model pass through both ends of the polishing wheel and are arranged at intervals around the axis. When the polishing wheel rotates, the polishing pad contacts the substrate sheet and squeezes the polishing liquid, so that the generated waste chips and polishing liquid move along the length direction of the discharge groove, so as to discharge the liquid (such as polishing liquid) generated during the polishing process through the discharge groove, and can also cooperate with the boss structure to guide the waste chips to move axially to avoid the accumulation of waste chips. The problem that the traditional chip discharge method that relies on natural falling due to gravity or a simple dust collection system is difficult to meet the need for clearing waste chips during polishing is solved. In addition, the angle setting between the axis of the discharge groove and the axis of the polishing wheel helps to generate centrifugal force when the polishing wheel rotates, further promotes the effective discharge of liquid and waste chips, and reduces the risk of waste chips re-adhering to the surface of the substrate sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a polishing device provided by an embodiment of the utility model;

[0018] Figure 2 It is a structural schematic diagram of a polishing assembly, a first driving assembly and a second driving assembly provided by an embodiment of the utility model;

[0019] Figure 3 It is a structural schematic diagram of a polishing assembly and a first driving assembly provided by an embodiment of the utility model;

[0020] Figure 4 It is a structural schematic diagram of a second driving assembly provided in an embodiment of the utility model;

[0021] Figure 5 It is a structural schematic diagram of a fixture assembly provided by an embodiment of the utility model;

[0022] Figure 6 It is a structural schematic diagram of a polishing assembly provided in an embodiment of the utility model;

[0023] Figure 7 It is a schematic diagram of the first angle structure of the polishing assembly provided by the embodiment of the utility model;

[0024] Figure 8 It is a side view of the polishing assembly provided by the embodiment of the utility model;

[0025] In the figure, 1, substrate sheet; 2, fixture assembly; 21, fixture base; 22, third driving member; 23, fourth driving member; 24, mounting base; 3, polishing assembly; 31, polishing wheel; 311, discharge groove; 3111, first side wall; 3112, second side wall; 3113, notch; 312, boss; 32, polishing pad; 4, first driving assembly; 41, mounting seat; 42, rotating shaft; 43, first swing arm; 44, second swing arm; 45, driving structure; 451, first driving member; 452, driving wheel; 453, synchronous belt; 454, driven wheel; 46, connecting shaft; 5, second driving assembly; 51, support column; 52, second driving member; 53, connecting rod; 54, pressure head; 55, pressure sensor; R1, first angle; R2, second angle. DETAILED DESCRIPTION

[0026] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0027] like Figure 1 , Figure 6 and Figure 7 As shown, the utility model provides a polishing device, including a fixture assembly 2 for placing a substrate sheet 1, a polishing assembly 3 and a first driving assembly 4, the polishing assembly 3 including a polishing wheel 31 and a plurality of polishing pads 32, the polishing wheel 31 is located above the fixture assembly 2, the first driving assembly 4 is connected to the polishing wheel 31 to drive the polishing wheel 31 to rotate, the outer peripheral side surface of the polishing wheel 31 has a plurality of discharge grooves 311 arranged through both ends of the polishing wheel 31, the plurality of discharge grooves 311 are arranged at intervals around the axis of the polishing wheel 31, and a boss 312 is formed between two adjacent discharge grooves 311 to provide an installation space for the polishing pad 32, so that the polishing pad 32 is installed on the corresponding boss 312, and at the same time, the space between the bosses 312 provides a discharge channel (that is, the discharge groove 311) for waste chips and polishing liquid, the polishing wheel 31 is responsible for driving the polishing pad 32 to rotate and apply pressure to polish the substrate sheet 1, and a first angle R1 is formed between the projection of the axis of the discharge groove 311 in the first direction and the axis of the polishing wheel 31.

[0028] Based on the above structure, the discharge groove 311 runs through both ends of the polishing wheel 31 and is arranged at intervals around the axis. When the polishing wheel 31 rotates, the polishing pad 32 contacts the substrate sheet 1 and squeezes the polishing liquid, so that the generated waste chips and polishing liquid move along the length direction of the discharge groove 311, so as to discharge the liquid (such as polishing liquid) generated during the polishing process through the discharge groove 311, and can also cooperate with the boss 312 structure to guide the waste chips to move axially to avoid the accumulation of waste chips. In addition, the angle setting between the axis of the discharge groove 311 and the axis of the polishing wheel 31 helps to generate centrifugal force when the polishing wheel 31 rotates, further promotes the effective discharge of liquid and waste chips, and reduces the risk of waste chips re-adhering to the surface of the substrate sheet 1.

[0029] It should be noted that the first direction of this embodiment is a direction facing directly toward the corresponding discharge slot 311 .

[0030] In some embodiments, the first angle R1 is 7°-13°. Based on the above angles, when the polishing wheel 31 rotates at high speed, sufficient centrifugal force is generated during the polishing process, while avoiding excessively large angles that cause the polishing liquid or waste chips to slow down the flow rate during the discharge process due to increased friction or air resistance, thereby promoting the discharge of the polishing liquid and waste chips.

[0031] like Figure 8 As shown, the discharge groove 311 includes a first side wall 3111 and a second side wall 3112 that are arranged opposite to each other. The first side wall 3111 and the second side wall 3112 define a notch 3113 whose opening faces away from the axis direction of the polishing wheel 31. The width of the notch 3113 gradually increases from the bottom of the groove of the discharge groove 311 to the top, so that a second angle R2 is formed between the extension line of the first side wall 3111 and the extension line of the second side wall 3112. The angle of the second angle R2 is 20°-27°. In this embodiment, as the width of the notch 3113 gradually increases upward, the resistance of liquid flow is reduced, so that the polishing liquid and waste chips are more easily taken out to avoid accumulation in the groove. In addition, the larger notch 3113 at the top can prevent larger particles of waste chips from being stuck at the notch 3113, reducing the possibility of clogging of the discharge groove 311 and ensuring the discharge of the polishing liquid and waste chips.

[0032] like Figure 3 As shown, the first driving assembly 4 includes a mounting seat 41, a rotating shaft 42, a first swing rod 43, a second swing rod 44 and a driving structure 45. The mounting seat 41 provides a stable foundation for supporting the remaining components of the first driving assembly 4. The two ends of the polishing wheel 31 are respectively connected to one end of the first swing rod 43 and one end of the second swing rod 44. The rotating shaft 42 passes through the mounting seat 41, and the two ends of the rotating shaft 42 are respectively rotatably connected to the first swing rod 43 and the second swing rod 44. The driving structure 45 is installed on the first swing rod 43, and the driving structure 45 is connected to the polishing wheel 31 to drive the polishing wheel 31 to rotate.

[0033] It should be noted that in this embodiment, the first swing arm 43 and the second swing arm 44 are arranged so that the polishing wheel 31 can swing up and down within a certain range, so that the polishing pad 32 can better fit the surface of the substrate 1, thereby improving the polishing effect or facilitating the loading and unloading of the substrate 1.

[0034] In some embodiments, the driving structure 45 includes a first driving member 451, a driving wheel 452, a synchronous belt 453 and a driven wheel 454. The first driving member 451 is used to provide driving force, start and maintain the rotational movement of the entire polishing wheel 31. It is installed on the first swing rod 43, and the driving shaft of the first driving member 451 is connected to the driving wheel 452, ensuring that the rotational power of the first driving member 451 can be transmitted to the driving wheel 452. The driving wheel 452 and the driven wheel 454 are synchronously linked through the synchronous belt 453, and the driven wheel 454 is connected to the polishing wheel 31, so that the driven wheel 454 can receive the rotational power from the synchronous belt 453, thereby driving the polishing wheel 31 to rotate. This indirect drive method is conducive to reducing vibration, improving the stability of the polishing process, and is easy to adjust and maintain. The first driving member 451 of this embodiment is a motor.

[0035] Read also Figure 1 , further comprising a second driving assembly 5, the first driving assembly 4 further comprising a connecting shaft 46, both ends of the connecting shaft 46 are respectively connected to the other end of the first swing rod 43 and the other end of the second swing rod 44, and the rotating shaft 42 is located between the polishing wheel 31 and the connecting shaft 46, the second driving assembly 5 is connected to the connecting shaft 46 to control the polishing assembly 3 to move back and forth between a first position and a second position;

[0036] When the polishing assembly 3 is in the first position, a space for loading and unloading the substrate sheet 1 is formed between the polishing assembly 3 and the fixture assembly 2; that is, in the unloading stage before the start of polishing or after the end of polishing, the polishing assembly 3 moves to this position to facilitate loading or unloading of the substrate sheet 1, while avoiding unnecessary wear of the polishing wheel 31 or damage to the finished surface. When the polishing assembly 3 is in the second position, the polishing assembly 3 is in contact with the substrate sheet 1; that is, when polishing is actually carried out, the polishing assembly 3 is lowered to be in close contact with the substrate sheet 1, ensuring uniform pressure during polishing and the removal of waste chips and polishing liquid.

[0037] like Figure 2 and Figure 4As shown, the second drive assembly 5 includes a support column 51, a second drive member 52, a connecting rod 53 and a pressure head 54. The support column 51 is used to install other parts of the second drive assembly 5 to ensure the stability of the entire mechanism. The second drive member 52 is installed on the support column 51. The output shaft of the second drive member 52 is connected to the connecting rod 53, and the connecting rod 53 is connected to the pressure head 54. The connecting rod 53 transmits the driving force generated by the second drive member 52 to the pressure head 54. The pressure head 54 is connected to the connecting shaft 46 to apply the force transmitted by the connecting rod 53 to the connecting shaft 46, thereby controlling the up and down swing of the polishing assembly 3. In this embodiment, the polishing assembly 3 can be accurately moved between the first position and the second position through the drive of the second drive member 52 and the transmission of the connecting rod 53 and the pressure head 54, ensuring the flexibility and safety of the processing. The second drive member 52 of this embodiment is a cylinder.

[0038] In some embodiments, the second drive assembly 5 also includes a pressure sensor 55, which is disposed between the connecting rod 53 and the pressure head 54 to detect the downward pressure of the pressure head 54, thereby ensuring accurate pressure control during the polishing process and avoiding poor polishing effects such as scratches, rough surfaces or uneven polishing due to excessively high or low pressure.

[0039] Read also Figure 5 The jig assembly 2 includes a jig base 21, a third driving member 22 and a vacuum adsorption member. The third driving member 22 is connected to the jig base 21 to drive the jig base 21 to rotate. In this embodiment, by rotating the jig base 21, different surfaces of the substrate sheet 1 can be exposed to the polishing pad 32 in sequence, so as to achieve continuous or alternating processing of multiple surfaces of the substrate sheet 1. In addition, during the polishing process, the surface of the substrate sheet 1 can be uniformly stressed by rotating the jig base 21 to avoid local overheating or over-polishing. The third driving member 22 of this embodiment is a rotating motor.

[0040] The fixture base 21 of the present embodiment is provided with a suction port, and a vacuum suction piece is installed in the fixture base 21 and communicated with the suction port to suction the substrate sheet 1 and fix the substrate sheet 1 .

[0041] In some embodiments, the jig assembly 2 further includes a fourth drive member 23 and a mounting base 24, the third drive member 22 is mounted on the mounting base 24, and the fourth drive member 23 is connected to the mounting base 24 to drive the jig base 21 to slide back and forth along the second direction. This embodiment can easily adapt to the polishing of different substrate sheets 1 by sliding to adjust the position of the jig base 21, thereby improving the versatility and flexibility of the device. The fourth drive member 23 of this embodiment is a linear motor, and the second direction is the length direction of the linear motor.

[0042] The specific operation process of this embodiment is as follows:

[0043] The substrate sheet 1 is mounted on the fixture base 21, and the substrate sheet 1 is fixed by vacuum adsorption provided by the fixture base 21. The first driving member 451 drives the active wheel 452 to rotate, and the synchronous belt 453 transmits force to drive the driven wheel 454 to rotate, so that the polishing wheel 31 drives the polishing pad 32 to rotate; then the second driving member 52 drives the connecting rod 53 to rise and drives the first swing rod 43 and the second swing rod 44 to rotate, so that the polishing wheel 31 moves down to the polishing pad 32 to contact the substrate sheet 1, and the third driving member 22 and the fourth driving member 23 cooperate to move, driving the substrate sheet 1 to rotate or linearly reciprocate to perform related polishing operations.

[0044] In summary, the embodiment of the utility model provides a polishing device, wherein the discharge groove 311 passes through both ends of the polishing wheel 31 and is arranged at intervals around the axis. When the polishing wheel 31 rotates, the polishing pad 32 contacts the substrate sheet 1 and squeezes the polishing liquid, so that the generated waste chips and the polishing liquid are formed to move along the length direction of the discharge groove 311, so as to discharge the liquid (such as the polishing liquid) generated during the polishing process through the discharge groove 311, and can also cooperate with the boss 312 structure to guide the waste chips to move axially to avoid the accumulation of waste chips. In addition, the angle setting between the axis of the discharge groove 311 and the axis of the polishing wheel 31 helps to generate centrifugal force when the polishing wheel 31 rotates, further promotes the effective discharge of liquid and waste chips, and reduces the risk of waste chips re-adhering to the surface of the substrate sheet 1.

[0045] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A polishing device, characterized in that: It includes a jig assembly for placing a substrate sheet, a polishing assembly and a first driving assembly, the polishing assembly includes a polishing wheel and a plurality of polishing pads, the polishing wheel is located above the jig assembly, the first driving assembly is connected to the polishing wheel to drive the polishing wheel to rotate, the outer peripheral side of the polishing wheel has a plurality of discharge grooves arranged through both ends of the polishing wheel, the plurality of discharge grooves are arranged at intervals around the axis of the polishing wheel, and a boss is formed between two adjacent discharge grooves, the polishing pad is installed on the corresponding boss, and a first angle is formed between the projection of the axis of the discharge groove in the first direction and the axis of the polishing wheel.

2. The polishing device according to claim 1, characterized in that: The first angle is in the range of 7°-13°.

3. The polishing device according to claim 1 or 2, characterized in that: The discharge groove includes a first side wall and a second side wall arranged opposite to each other, and the first side wall and the second side wall define a groove opening facing away from the axial direction of the polishing wheel, and the width of the groove gradually increases upward from the bottom of the discharge groove, so that a second angle is formed between the extension line of the first side wall and the extension line of the second side wall, and the angle of the second angle is 20°-27°.

4. The polishing device according to claim 1, characterized in that: The first driving component includes a mounting seat, a rotating shaft, a first rocker arm, a second rocker arm and a driving structure. The two ends of the polishing wheel are respectively connected to one end of the first rocker arm and one end of the second rocker arm. The rotating shaft passes through the mounting seat, and the two ends of the rotating shaft are respectively rotatably connected to the first rocker arm and the second rocker arm. The driving structure is installed on the first rocker arm, and the driving structure is connected to the polishing wheel to drive the polishing wheel to rotate.

5. The polishing device according to claim 4, characterized in that: The driving structure includes a first driving member, a driving wheel, a synchronous belt and a driven wheel. The first driving member is installed on the first rocker arm, and the driving shaft of the first driving member is connected to the driving wheel. The driving wheel and the driven wheel are synchronously linked through the synchronous belt, and the driven wheel is connected to the polishing wheel.

6. The polishing device according to claim 4, characterized in that: It also includes a second driving assembly, the first driving assembly also includes a connecting shaft, the two ends of the connecting shaft are respectively connected to the other end of the first swing rod and the other end of the second swing rod, and the rotating shaft is located between the polishing wheel and the connecting shaft, and the second driving assembly is connected to the connecting shaft to control the polishing assembly to move back and forth between a first position and a second position; When the polishing assembly is located at the first position, a space for loading and unloading the substrate sheet is formed between the polishing assembly and the fixture assembly; when the polishing assembly is located at the second position, the polishing assembly is in contact with the substrate sheet.

7. The polishing device according to claim 6, characterized in that: The second driving assembly includes a support column, a second driving member, a connecting rod and a pressing head. The second driving member is installed on the support column, the output shaft of the second driving member is connected to the connecting rod, the connecting rod is connected to the pressing head, and the pressing head is connected to the connecting shaft.

8. The polishing device according to claim 7, characterized in that: The second driving assembly further includes a pressure sensor, which is disposed between the connecting rod and the pressure head to detect the downward pressure of the pressure head.

9. The polishing device according to claim 1, characterized in that: The jig assembly includes a jig base, a third driving member and a vacuum adsorption member. The third driving member is connected to the jig base to drive the jig base to rotate. The jig base is provided with an adsorption port. The vacuum adsorption member is installed in the jig base and communicated with the adsorption port to adsorb the substrate sheet.

10. The polishing device according to claim 9, characterized in that: The fixture assembly further includes a fourth driving member and a mounting base, the third driving member is mounted on the mounting base, and the fourth driving member is connected to the mounting base to drive the fixture base to slide back and forth along the second direction.

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