Wafer pick-and-place debugging auxiliary tool and wafer pick-and-place debugging system
By using wafer pick-and-place debugging auxiliary tools during chip manufacturing, the problem of inaccurate adjustment of the robot in the wafer conveying box is solved, and the robot is taught in the vertical and horizontal directions is realized, which reduces the risk of wafer damage and improves the reliability of the production process.
Patent Information
- Application Number
- CN202421180626.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-27
AI Technical Summary
During chip manufacturing, it is difficult for the robot to accurately adjust the wafer when transferring it to different positions, resulting in possible collisions or scratches with the wafer, increasing the risk of damage. The prior art relies on human eye observation and measurement, with low accuracy, and the process is cumbersome and costly when using other ranging methods.
It provides a wafer pick-and-place debugging auxiliary tool, including disk-shaped parts and limit blocks. Through the debugging auxiliary tool, the robot can be accurately adjusted by teaching vertically and horizontally in the wafer conveying box. The tool uses the receiving slot formed by the limit block to help the robot center vertically and horizontally to ensure proper positioning during the actual production process.
Through the use of this tool, the probability of damage to the wafer during pick-up and placement can be significantly reduced, ensuring the accurate position of the robot in the wafer conveying box, avoiding collisions and scratches, and improving the reliability and efficiency of the production process.
Smart Images
Figure CN222636762U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip manufacturing, and more specifically, to a wafer placement debugging auxiliary tool and a wafer placement debugging system. Background Art
[0002] During chip manufacturing and debugging, wafers need to be transferred to different locations with the help of manipulators and wafer transfer boxes. Since wafers are high-precision devices, any slight collision or scratch may cause irreparable damage to them. Therefore, in the process of transferring wafers, it is necessary to ensure that the manipulator and the wafer transfer box cooperate properly, that is, after the manipulator enters the wafer transfer box, it should maintain the same distance from the upper and lower wafer surfaces to prevent collision or scratches with the wafers, and be in the center of the wafer in the horizontal direction to ensure that it can maintain balance after lifting the wafer to prevent the wafer from falling.
[0003] To ensure that the robot can be accurately in the above-mentioned target position, corresponding debugging must be carried out before production, that is, the wafer transfer box is placed in the standard production position, and then the teach pendant is used to adjust the position of the robot, and finally the adjusted position information is written into the controller.
[0004] However, in the prior art, it is usually necessary to rely on human observation to confirm whether the manipulator has been adjusted into place. This method is not accurate in measurement, especially because the vertical spacing of the wafers in the wafer transfer box is small, which can easily cause the manipulator to be closer to one side of the wafer, thereby increasing the risk of collision or scratching the wafer; in addition, it is also easy to cause the manipulator to deviate from the center of the wafer in the horizontal direction, thereby increasing the risk of the wafer falling after lifting the wafer. In addition, if the position of the manipulator is determined by using a ruler or laser distance measurement, the use process will be cumbersome and costly, making it difficult to popularize in actual production. Utility Model Content
[0005] The purpose of the embodiments of the present application is to provide a wafer pick-and-place debugging auxiliary tool and a wafer pick-and-place debugging system, which can be used to assist in teaching the vertical and horizontal position of a robot in a wafer transfer box. The robot can be precisely adjusted through observation by the human eye, thereby ensuring that the robot after teaching is in the proper position during the actual production process, thereby minimizing damage to the wafer.
[0006] In the first aspect, the present application provides a wafer placement debugging auxiliary tool, including a disk-shaped member and a limit block. The disk-shaped member includes a disk and a boss, and the boss is fixedly arranged on one side of the disk; the boss includes two straight edges parallel to the first direction; in the direction of the center line of the disk extending along the second direction, the straight edges are at a predetermined distance from the center of the disk; the projection contour of the boss on the disk surface does not exceed the contour boundary of the disk surface; the limit block is arranged on at least one side surface of the disk-shaped member; a receiving groove extending along the first direction is formed between the limit blocks on the same side surface of the disk-shaped member; the projection of the midpoint of the receiving groove along the second direction on the disk surface is on the center line of the disk extending along the first direction.
[0007] The first direction is perpendicular to the second direction and both are parallel to the surface of the disk.
[0008] In an implementable solution, the limit block includes two groups of limit blocks, namely, a first limit block and a second limit block. The first limit block is arranged on the side of the disk facing away from the boss, and the second limit block is arranged on the side of the boss facing away from the disk; the first limit block is axially symmetrically distributed relative to the center line of the disk extending along the first direction; the second limit block is axially symmetrically distributed relative to the center line of the boss extending along the first direction; the projection contour of the first limit block on the surface of the disk does not exceed the contour boundary of the surface of the disk; the projection contour of the second limit block on the surface of the boss does not exceed the contour boundary of the surface of the boss.
[0009] In an implementable solution, the limit block is arranged on the side of the disk facing away from the boss; the limit block is axially symmetrically distributed relative to the center line of the disk extending along the first direction; the projection contour of the limit block on the disk surface does not exceed the contour boundary of the disk surface.
[0010] In an implementable solution, the limit block is arranged on the side of the boss facing away from the disk; the limit block is axially symmetrically distributed relative to the center line of the boss extending along the first direction; the projection contour of the limit block on the boss surface does not exceed the contour boundary of the boss surface.
[0011] In one feasible solution, one or more hole structures are provided on the disk-shaped member.
[0012] In one feasible solution, the hole structure is distributed in a centrally symmetrical manner relative to the center position of the disk-shaped member.
[0013] In one feasible solution, a detachable counterweight is provided on the disc-shaped member.
[0014] In an implementable solution, the counterweight block is arranged on a side of the disc facing away from the boss and on a side of the limit block away from the center of the disc, and is centrally symmetrically distributed relative to the center of the disc.
[0015] In an operative solution, a detachable counterweight is provided on the disc-shaped member, the counterweight is installed in at least one hole structure, and is centrally symmetrically distributed relative to the center position of the disc-shaped member.
[0016] In the second aspect, the present application also provides a wafer pick-and-place debugging system, which includes the wafer pick-and-place debugging auxiliary tool in the aforementioned scheme, and also includes a wafer transfer box and a robot.
[0017] Compared with the prior art, the beneficial effects of this application include at least:
[0018] When the wafer handling and debugging auxiliary tool of the present application is used, two debugging auxiliary tools are placed in adjacent card slots in the wafer transfer box. When the robot is teaching, the relative surfaces of the upper and lower debugging auxiliary tools are used to limit the position of the robot in the vertical direction, so that the robot can be accurately located in the center of the gap between the upper wafer and the lower wafer after teaching. Therefore, the wafer handling and debugging auxiliary tool of the present application can be used to simulate the actual wafer to realize the teaching process of the robot, so that the technician can easily observe whether the robot is centered in the vertical direction, so as to reduce the probability of damaging the wafer during the wafer handling process.
[0019] In addition, in the present application, under the action of the accommodating groove formed by the limit block on the disc-shaped part, the wafer picking and placing debugging auxiliary tool can also realize the teaching of the robot in the horizontal center position, ensuring that the robot after teaching can be located directly below the wafer after entering the wafer transfer box, and can maintain the weight balance on the left and right sides after lifting the wafer, thereby preventing the wafer from falling from the robot and avoiding unnecessary losses. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of a wafer picking and placing debugging auxiliary tool with limit blocks arranged on both sides of a disk-shaped member according to an embodiment of the present application;
[0022] Figure 2 for Figure 1 The main view of the wafer placement debugging auxiliary tool;
[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of a wafer picking and placing debugging auxiliary tool with a limit block set on one side of a disk according to an embodiment of the present application;
[0024] Figure 4 for Figure 3 The main view of the wafer placement debugging auxiliary tool;
[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of a wafer picking and placing debugging auxiliary tool with a limit block set on one side of a boss according to an embodiment of the present application;
[0026] Figure 6 for Figure 5 The main view of the wafer placement debugging auxiliary tool;
[0027] Figure 7 It is a schematic diagram of the three-dimensional structure of a wafer picking and placing debugging auxiliary tool with a counterweight block arranged on the surface of a disk according to an embodiment of the present application;
[0028] Figure 8 It is a schematic diagram of the three-dimensional structure of a wafer picking and placing debugging auxiliary tool with a counterweight block arranged in a hole structure according to an embodiment of the present application;
[0029] Fig. 9 for Figure 1 Schematic diagram of the use status of the wafer placement debugging auxiliary tool;
[0030] Fig.10 for Figure 3 Schematic diagram of the use status of the wafer placement debugging auxiliary tool;
[0031] Fig.11 for Figure 5 Schematic diagram of the use status of the wafer placement debugging auxiliary tool;
[0032] Fig.12 for Figure 1 A partial schematic diagram of the use status of the wafer placement debugging auxiliary tool (including the robot);
[0033] In the figure: 1. disc-shaped member; 2. disc; 3. boss; 4. limit block; 5. first limit block; 6. second limit block; 7. hole structure; 8. counterweight; 9. wafer transfer box; 10. robot; 11. receiving slot; 12. first receiving slot; 13. second receiving slot; 14. receiving channel; 15. straight edge; L1, first direction; L2, second direction. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0035] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0036] like Figure 1-Figure 8 As shown, the present application first provides a wafer placement debugging auxiliary tool, including a disc 1 and a limit block 4. The first direction is defined as L1 and the second direction is defined as L2. Figure 1 Indicates the middle direction.
[0037] The disk-shaped member 1 includes a disk 2 and a boss 3, wherein the boss 3 is fixedly arranged on one side of the disk 2; the boss 3 includes two straight edges 15 parallel to the first direction L1; in the direction of the center line of the disk 2 extending along the second direction L2, the straight edge 15 is at a predetermined distance from the edge of the disk 2; the projection contour of the boss 3 on the surface of the disk 2 does not exceed the contour boundary of the surface of the disk 2. The limit block 4 is arranged on at least one side surface of the disk-shaped member 1; a receiving groove 11 extending along the first direction L1 is formed between the limit blocks 4 on the same side surface of the disk-shaped member 1; the projection of the midpoint of the receiving groove 11 along the second direction L2 on the surface of the disk 2 is located on the center line of the disk 2 extending along the first direction L1. The first direction L1 is perpendicular to the second direction L2, and both are parallel to the surface of the disk 2.
[0038] like Figure 9-11 As shown, when in use, the wafer placement debugging auxiliary tool is placed in the wafer conveying box 9, and a plurality of vertically arranged card slots are arranged on the inner wall of the wafer conveying box 9. The spacing between the two straight edges 15 of the boss 3 can be set to meet: just enough to be placed between the relative card slots of the same height of the wafer conveying box 9, that is, the spacing between the two straight edges 15 of the boss 3 is basically equal to the spacing between the card slots of the same height, so that the debugging auxiliary tool can be placed in the center of the wafer conveying box 9 by means of the cooperation between the straight edges 15 and the card slots, which provides convenience for subsequent teaching.
[0039] like Figure 9-11As shown, when in use, two wafer placement debugging auxiliary tools are generally used in sets. After the two wafer placement debugging auxiliary tools are respectively placed in the two upper and lower adjacent card slots of the wafer transfer box 9, the lower surface of the boss 3 of the debugging auxiliary tool at the upper side, the upper surface of the disc 2 of the debugging auxiliary tool at the lower side, and the receiving groove 11 between the limit blocks 4 together form a receiving channel 14. The vertical center position of this receiving channel 14 is used to simulate the center position of the gap between actual adjacent wafers in the vertical direction, and the horizontal center position of this receiving channel 14 (i.e., the horizontal center position of the receiving groove 11) is used to simulate the horizontal center position of the actual wafer.
[0040] like Fig.12 As shown, when the robot 10 is taught, the robot 10 enters the accommodating channel 14. When the robot 10 deviates from the center position in the vertical direction and / or the horizontal direction, it will touch the auxiliary tool, causing it to produce a displacement observable to the human eye. At this time, the position of the robot 10 is adjusted until the robot 10 can smoothly enter and exit the accommodating channel 14 without any contact. At this time, the position of the robot 10 reaches the target requirement. When the robot 10 is controlled according to the aforementioned teaching data for actual production, there will be no collision or scratch between the robot 10 and the wafer, and the robot 10 can stably and reliably hold up the wafer for transmission without causing the wafer to fall.
[0041] In summary, when the robot 10 is teaching, the surfaces of the upper and lower debugging aids are used to limit the position of the robot 10 in the vertical direction, so that the robot 10 can be accurately located in the center of the gap between the upper wafer and the lower wafer after teaching. Therefore, the wafer handling and placement debugging aid of the present application can be used to simulate the actual wafer to implement the teaching process of the robot 10, so that the technician can easily observe whether the robot 10 is centered in the vertical direction, so as to reduce the probability of damaging the wafer during the wafer handling process.
[0042] At the same time, under the action of the accommodating groove 11 formed by the limit block 4 on the disc-shaped member 1, the wafer placement and debugging auxiliary tool can also realize the teaching of the robot 10 in the horizontal center position, ensuring that the robot 10 after teaching can be located directly below the wafer after entering the wafer transfer box 9, and can maintain the weight balance on the left and right sides after lifting the wafer, thereby preventing the wafer from falling from the robot 10 and avoiding unnecessary losses.
[0043] In addition, wafer placement and debugging auxiliary tools can be placed on each slot of the wafer transfer box 9. After the position of the robot 10 is debugged, all wafer storage positions of the wafer transfer box 9 can be continuously tested to ensure that the robot 10 can meet the requirements in the entire wafer transfer box 9.
[0044] The present application also provides a wafer pick-up and placement debugging system, which includes at least two wafer pick-up and placement debugging auxiliary tools provided in this embodiment, and also includes a wafer transfer box 9 and a robot 10.
[0045] In order to explain the structure and working principle of the wafer handling and debugging auxiliary tool of the present application in more detail, as well as the design method of the wafer handling and debugging auxiliary tool, the present application provides the following embodiments. It should be noted that the technical features and technical solutions in the following embodiments can be used in combination with each other without conflict.
[0046] Example 1
[0047] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer placement debugging auxiliary tool, including a disk-shaped member 1 and a limit block 4. The disk-shaped member 1 includes a disk 2 and a boss 3, and the boss 3 is fixedly arranged on one side of the disk 2; the boss 3 includes two straight edges 15 parallel to the first direction L1; in the direction of the center line of the disk 2 extending along the second direction L2, the straight edges 15 are at a predetermined distance from the edge of the disk 2, and the projection contour of the boss 3 on the surface of the disk 2 does not exceed the contour boundary of the surface of the disk 2.
[0048] The stoppers 4 are arranged on both side surfaces of the disk-shaped member 1; a receiving groove 11 extending along the first direction L1 is formed between the stoppers 4 on the same side surface of the disk-shaped member 1, and the projection of the midpoint of the receiving groove 11 along the second direction L2 on the surface of the disk 2 is located on the center line of the disk 2 extending along the first direction L1. The first direction L1 is perpendicular to the second direction L2, and both are parallel to the surface of the disk 2.
[0049] Specifically, the limit block 4 includes two groups of limit blocks, namely, a first limit block 5 and a second limit block 6. Among them, the first limit block 5 is arranged on the side of the disk 2 facing away from the boss 3, and the second limit block 6 is arranged on the side of the boss 3 facing away from the disk 2. The first limit block 5 is axially symmetrically distributed relative to the center line of the disk 2 extending along the first direction L1, and the second limit block 6 is axially symmetrically distributed relative to the center line of the boss 3 extending along the first direction L1. The projection contour of the first limit block 5 on the surface of the disk 2 does not exceed the contour boundary of the surface of the disk 2; the projection contour of the second limit block 6 on the surface of the boss 3 does not exceed the contour boundary of the surface of the boss 3. The first limit block 5 arranged on the side of the disk 2 facing away from the boss 3 forms a first accommodating groove 12 facing upward, and the second limit block 6 arranged on the side of the boss 3 facing away from the disk 2 forms a second accommodating groove 13 facing downward.
[0050] When using, Fig. 9As shown, after two wafer placement and debugging auxiliary tools are placed in two upper and lower adjacent card slots of the wafer transfer box 9, the upward first receiving slot 12 and the downward second receiving slot 13 jointly form a receiving channel 14. The vertical center position of the receiving channel 14 is used to simulate the vertical center position between actual adjacent wafers, and the horizontal center position of the receiving channel 14 (i.e., the horizontal center position of the receiving slot 11) is used to simulate the horizontal center position of the actual wafer.
[0051] In this embodiment, if Fig. 9 As shown, the height of the boss 3 is less than the thickness of the disk 2, and the difference between the height and the thickness of the disk 2 should be the actual thickness of the wafer to ensure that the receiving channel 14 is located at the center of the gap between the upper and lower wafer surfaces in the vertical direction.
[0052] In this embodiment, if Fig.12 As shown, the thickness of the manipulator 10 in the vertical direction is less than the height of the aforementioned accommodating channel 14, and the width of the manipulator 10 in the horizontal direction is less than the width of the accommodating channel 14 between the limit blocks 4, so there is a certain distance between the manipulator 10 and the wafer placement debugging auxiliary tool in both the vertical and horizontal directions. For example, for a wafer placement debugging auxiliary tool, the sum of the distances between the manipulator 10 and the upper and lower wafer placement debugging auxiliary tool surfaces in the vertical direction can be controlled within 1-3 mm, and the sum of the distances in the horizontal direction can be controlled within 1-3 mm.
[0053] In this embodiment, if Figure 1 , Figure 3 and Figure 5 As shown, one or more hole structures 7 may be provided on the disc-shaped member 1. Due to the influence of shape and material, the wafer handling and debugging auxiliary tool may be heavier than the actual wafer, so the hole structure 7 may be provided to reduce its weight, thereby better simulating the actual wafer. It should be noted that the hole structure 7 may be a through hole or a blind hole.
[0054] In this embodiment, if Figure 1 and Figure 3 As shown, the hole structure 7 can be distributed in a central symmetrical manner relative to the center position of the disk-shaped member 1. This distribution method can ensure that the weight of the wafer pick-up and placement debugging auxiliary tool is evenly distributed. It should be noted that if a vacuum adsorption type manipulator 10 is used, it should be avoided to set the hole structure 7 at the center position of the disk-shaped member 1, so as to avoid the manipulator 10 being unable to normally transfer the wafer pick-up and placement debugging auxiliary tool.
[0055] In this embodiment, if Figure 7 and Figure 8 As shown, a detachable counterweight 8 may be provided on the disc 1. Due to the influence of shape and material, the wafer handling and debugging auxiliary tool may be lighter than the actual wafer, so the counterweight 8 may be provided to increase its weight, thereby better simulating the actual wafer.
[0056] In this embodiment, if Figure 7 As shown, the counterweight block 8 can be arranged on the side of the disc 2 facing away from the boss 3, and on the side of the limit block 4 away from the center position of the disc 2, and is distributed in a centrally symmetrical manner relative to the center position of the disc-shaped member 1. This distribution method can ensure that the weight distribution of the wafer placement and debugging auxiliary tool is uniform.
[0057] In this embodiment, if Figure 8 As shown, the counterweight 8 can be installed in the hole structure 7 and is centrally symmetrically distributed relative to the center position of the disc 1. The counterweight 8 can be installed in the hole structure 7 by bonding or riveting, and its exposed part is flush with the surface of the disc 1 to avoid interfering with the operation of the manipulator 10.
[0058] Example 2
[0059] like Figure 3 and Figure 4 As shown, this embodiment provides a wafer placement debugging auxiliary tool, which is different from the embodiment 1 in that: the limit block 4 of this embodiment is arranged on the side of the disk 2 facing away from the boss 3, while the boss 3 is not provided with a limit block on the side facing away from the disk 2. The limit blocks 4 are axially symmetrically distributed relative to the center line of the disk 2 extending along the first direction L1; the projection contour of the limit blocks 4 on the surface of the disk 2 does not exceed the contour boundary of the surface of the disk 2, so as to prevent the wafer placement debugging auxiliary tool from being unable to be placed in the wafer transfer box 9.
[0060] When using, Fig.10 As shown, after two wafer placement debugging auxiliary tools are placed in two adjacent upper and lower slots of the wafer transfer box 9, the receiving slot 11 of the lower debugging auxiliary tool and the lower surface of the boss 3 of the upper debugging auxiliary tool together form a receiving channel 14. The vertical center position of this receiving channel 14 is used to simulate the center position between actual adjacent wafers in the vertical direction, and the horizontal center position of this receiving channel 14 (i.e., the horizontal center position of the receiving slot 11) is used to simulate the horizontal center position of the actual wafer.
[0061] Example 3
[0062] like Figure 5 and Figure 6 As shown, this embodiment provides a wafer placement debugging auxiliary tool, which is different from the embodiment 1 in that: the limit block 4 of this embodiment is arranged on the side of the boss 3 facing away from the disc 2, while the disc 2 is not provided with a limit block on the side facing away from the boss 3. The limit blocks 4 are axially symmetrically distributed relative to the center line of the boss 3 extending along the first direction L1; the projection contour of the limit blocks 4 on the surface of the boss 3 does not exceed the contour boundary of the surface of the boss 3, so as to prevent the wafer placement debugging auxiliary tool from being unable to be placed in the wafer transfer box 9.
[0063] When using, Fig.10 As shown, after two wafer placement debugging auxiliary tools are placed in two upper and lower adjacent card slots of the wafer transfer box 9, the upper surface of the disc 2 of the lower debugging auxiliary tool and the receiving slot 11 of the upper debugging auxiliary tool together form a receiving channel 14. The vertical center position of this receiving channel 14 is used to simulate the vertical center position between actual adjacent wafers, and the horizontal center position of this receiving channel 14 (i.e., the horizontal center position of the receiving slot 11) is used to simulate the horizontal center position of the actual wafer.
[0064] Example 4
[0065] like Fig.12 As shown, this embodiment provides a wafer placement debugging system, including at least two wafer placement debugging auxiliary tools, and also includes a wafer transfer box 9 and a robot 10. The wafer placement debugging auxiliary tools can be the wafer placement debugging auxiliary tools provided in Embodiments 1 to 3.
[0066] In addition, the wafer pick-and-place debugging system may also include a teaching pendant to assist in teaching the robot 10. Alternatively, a teaching pendant may not be used, and an electronic device that can be used to write a program may be used to assist the staff in teaching the robot 10.
[0067] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer placement debugging auxiliary tool, characterized in that: include: A disc-shaped member (1) comprises a disc (2) and a boss (3), wherein the boss (3) is fixedly arranged on one side of the disc (2); the boss (3) comprises two straight edges (15) parallel to a first direction; in the direction of a centerline of the disc (2) extending along a second direction, the straight edges (15) are at a predetermined distance from the center of the disc (2); and the projection contour of the boss (3) on the surface of the disc (2) does not exceed the contour boundary of the surface of the disc (2); A limit block (4) is arranged on at least one side surface of the disk-shaped member (1); a receiving groove (11) extending along a first direction is formed between the limit blocks (4) on the same side surface of the disk-shaped member (1); the projection of the midpoint of the receiving groove (11) along the second direction on the surface of the disk (2) is located on the center line of the disk (2) extending along the first direction; The first direction is perpendicular to the second direction, and both are parallel to the surface of the disk (2).
2. The wafer placement debugging auxiliary tool according to claim 1, characterized in that: The limit block (4) comprises two groups of limit blocks, namely a first limit block (5) and a second limit block (6); wherein the first limit block (5) is arranged on a side of the disc (2) facing away from the boss (3), and the second limit block (6) is arranged on a side of the boss (3) facing away from the disc (2); The first limit blocks (5) are axially symmetrically distributed relative to a center line of the disk (2) extending along the first direction; The second limit block (6) is axially symmetrically distributed relative to a center line of the boss (3) extending along the first direction; The projection contour of the first limiting block (5) on the surface of the disk (2) does not exceed the contour boundary of the surface of the disk (2); The projection contour of the second limiting block (6) on the surface of the boss (3) does not exceed the contour boundary of the surface of the boss (3).
3. The wafer placement debugging auxiliary tool according to claim 1, characterized in that: The limit block (4) is arranged on a side of the disc (2) facing away from the boss (3); The limit blocks (4) are axially symmetrically distributed relative to a center line of the disk (2) extending along the first direction; The projection contour of the limiting block (4) on the surface of the disc (2) does not exceed the contour boundary of the surface of the disc (2).
4. The wafer placement debugging auxiliary tool according to claim 1, characterized in that: The limit block (4) is arranged on a side of the boss (3) facing away from the disc (2); The limit blocks (4) are axially symmetrically distributed relative to a center line of the boss (3) extending along the first direction; The projection contour of the limiting block (4) on the surface of the boss (3) does not exceed the contour boundary of the surface of the boss (3).
5. The wafer placement debugging auxiliary tool according to claim 1, characterized in that: One or more hole structures (7) are arranged on the disc-shaped member (1).
6. The wafer placement debugging auxiliary tool according to claim 5, characterized in that: The hole structure (7) is distributed in a centrally symmetrical manner relative to the central position of the disk-shaped member (1).
7. The wafer placement debugging auxiliary tool according to claim 1, characterized in that: A detachable counterweight block (8) is arranged on the disc-shaped member (1).
8. The wafer placement debugging auxiliary tool according to claim 7, characterized in that: The counterweight block (8) is arranged on a side of the disc (2) facing away from the boss (3), and is located on a side of the limit block (4) away from the center position of the disc (2), and is centrally symmetrically distributed relative to the center position of the disc-shaped member (1).
9. The wafer placement debugging auxiliary tool according to claim 5 or 6, characterized in that: A detachable counterweight (8) is provided on the disc-shaped member (1); the counterweight (8) is installed in at least one of the hole structures (7) and is centrally symmetrically distributed relative to the central position of the disc-shaped member (1).
10. A wafer pick-and-place debugging system, characterized in that: It comprises a wafer placement and debugging auxiliary tool as claimed in any one of claims 1 to 9, and also comprises a wafer transfer box (9) and a robot (10).