SMD piezoelectric buzzer structure

Abstract

The utility model relates to the technical field of buzzing pieces, in particular to an SMD (Surface Mount Device) piezoelectric type buzzing piece structure, which comprises a shell and a main body forming a piezoelectric type buzzer and used for bearing all parts, the PCB is arranged in the shell in an adhesive mode and used for communication between the buzzing piece and external signals; the piezoelectric buzzer is used for converting electric energy into sound energy and generating a sound signal; a mounting groove is formed in the PCB; a piezoelectric buzzing sheet is arranged in the mounting groove; a metal strip is arranged on the upper surface of the piezoelectric buzzer; pAD bonding pads are fixedly connected to the positions, corresponding to the piezoelectric buzzing piece and the metal strip, of the PCB. Compared with a complex lead and PIN tin soldering connection mode in the prior art, the automatic chip mounting and reflow soldering integrated molding can be easily realized, the equipment cost and the labor cost are saved, the processing period is shortened, the production efficiency is improved, and the production cost is reduced. And the market competitiveness is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of buzzer pieces, in particular to an SMD piezoelectric buzzer piece structure. Background Art

[0002] The piezoelectric buzzer is mainly composed of a multivibrator, a piezoelectric buzzer, an impedance matcher, a resonance box and a shell.

[0003] In traditional acoustic alarms, the buzzer is glued to the outer casing with glue, and the positive and negative poles of the buzzer are guided to the PCB board through leads, and then communicate with external signals through the PIN pins on the PCB board; while the piezoelectric buzzer requires multiple cutting and guiding of the raw materials during assembly and preparation.

[0004] In the current existing technology, Figure 5 As shown, when installing the piezoelectric buzzer, the PCB board needs to be cut to fit the protective shell, and then the leads need to be welded and the PIN pins need to be inserted and welded. Since the leads are soft conductive materials, they need to be guided during welding so that the soldering process can be carried out. This is relatively cumbersome, resulting in increased labor costs and equipment costs, and cannot meet the production needs of manufacturers. Utility Model Content

[0005] To this end, the technical problem to be solved by the utility model is to overcome the problem in the prior art that when installing the buzzer piece of the piezoelectric buzzer, the PCB board needs to be cut first to make it fit the protective shell, and then the leads are welded and the PIN pins are inserted and welded. Since the leads are soft conductive materials, they need to be guided during welding before the soldering process can be carried out, which is relatively cumbersome, resulting in increased labor costs and equipment costs, and cannot meet the production needs of manufacturers.

[0006] In order to solve the above technical problems, the utility model provides an SMD piezoelectric buzzer structure, including:

[0007] The shell constitutes the main body of the piezoelectric buzzer and is used to carry various components;

[0008] PCB, glued and set inside the shell, used for the buzzer to communicate with external signals;

[0009] Piezoelectric buzzer, used to convert electrical energy into sound energy and generate sound signals;

[0010] The PCB is provided with an installation groove; a piezoelectric buzzer is arranged inside the installation groove; a metal strip is arranged on the upper surface of the piezoelectric buzzer; PAD pads are fixedly connected to the positions of the PCB board corresponding to the piezoelectric buzzer and the metal strip; the piezoelectric buzzer and the metal strip are both soldered to the PAD pads.

[0011] In one embodiment of the utility model, six substrate antennae are fixedly connected to the piezoelectric buzzer, and the piezoelectric buzzer is connected to the pad by soldering via the substrate antennae.

[0012] In one embodiment of the present invention, the substrate antenna is made of metal, preferably copper.

[0013] In one embodiment of the utility model, the substrate antennae are fixedly connected to the upper surface of the piezoelectric buzzer in a circular array at equal intervals; and the metal strip is located on the upper surface of the piezoelectric buzzer.

[0014] In an embodiment of the present invention, two ends of the metal strip are electrically connected to the piezoelectric buzzer and the PCB respectively, and both are soldered via pads.

[0015] In one embodiment of the present invention, the thickness of the piezoelectric buzzer is the same as the thickness of the mounting groove, and the size of the piezoelectric buzzer is the same as the size of the mounting groove.

[0016] In one embodiment of the utility model, the PCB is fixedly connected to the housing through the cooperation of screws and threaded holes or is glued with soft glue.

[0017] In an embodiment of the present invention, the PCB is circular or rectangular; and the mounting groove is circular.

[0018] The above technical solution of the utility model has the following advantages compared with the prior art:

[0019] The utility model discloses an SMD piezoelectric buzzer structure, which opens a mounting groove on the PCB, installs the piezoelectric buzzer inside the groove, and uses metal strips instead of leads and PIN needles to communicate with external signals, which not only avoids the problem of easy aging and disconnection of traditional leads, but also makes the integration between the PCB and the piezoelectric buzzer higher, and is thinner and lighter than the prior art using leads and PIN needles, which is conducive to catering to the current lightweight market. At the same time, by opening a mounting groove on the PCB, the metal strip and the soldering process are used to complete the installation and fixation between the PCB and the piezoelectric buzzer. During production, it is particularly suitable for production line processing technology, and welding and assembly can be completed without complex mechanical motion trajectories. Compared with the complex lead and PIN needle soldering connection method in the prior art, it can easily realize automatic patch and reflow soldering integrated molding, saving equipment cost and labor cost, shortening the processing cycle, and greatly improving market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below according to specific embodiments of the utility model in combination with the accompanying drawings.

[0021] Figure 1 It is a three-dimensional diagram of the utility model;

[0022] Figure 2 It is an exploded view of the utility model;

[0023] Figure 3 It is a top view of the utility model;

[0024] Figure 4 It is a front view of the utility model;

[0025] Figure 5 It is a prior art cross-sectional view of the utility model;

[0026] Explanation of the reference numerals in the specification: 1. PCB; 11. Housing; 2. Mounting slot; 3. Piezoelectric buzzer; 4. Metal strip; 44. Lead; 441. PIN needle; 5. Solder pad; 51. Substrate antenna. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0028] Reference Figures 1 to 5 As shown, the utility model is an SMD piezoelectric buzzer structure, comprising:

[0029] The housing 11 constitutes the main body of the piezoelectric buzzer and is used to carry various components;

[0030] PCB1, glued and arranged inside the housing 11, is used for the buzzer to communicate with external signals;

[0031] The piezoelectric buzzer 3 is used to convert electrical energy into sound energy to generate sound signals;

[0032] The PCB1 is provided with a mounting groove 2; a piezoelectric buzzer 3 is arranged inside the mounting groove 2; a metal strip 4 is arranged on the upper surface of the piezoelectric buzzer 3; the positions of the PCB1 corresponding to the piezoelectric buzzer 3 and the metal strip 4 are fixedly connected with PAD pads 5; the piezoelectric buzzer 3 and the metal strip 4 are both soldered to the PAD pads 5.

[0033] During operation, in order to solve the problem in the prior art that the piezoelectric buzzer needs to first cut the PCB1 board to make it fit the protective shell 11 when installing the buzzer, and then perform the process of welding the lead 44 and inserting the PIN pin and welding. Since the lead 44 is a soft conductive material, it needs to be guided during welding before the soldering process can be performed, which is relatively cumbersome, resulting in increased labor costs and equipment costs, and cannot meet the production needs of manufacturers. The utility model designs a PCB1. During specific operations, a mounting groove 2 is opened on the PCB1, and the piezoelectric buzzer 3 is installed inside it, and a metal strip 4 is used instead of the lead 44 and the PIN pin 441 to communicate with the external signal. This not only avoids the problem that the traditional lead 44 is easily aged and disconnected, but also makes the integration between the PCB1 and the piezoelectric buzzer 3 higher. Figure 4 and Figure 5 As shown, it is thinner and lighter than the prior art using leads 44 and PIN needles 441, which is conducive to catering to the current lightweight market. At the same time, by opening a mounting groove 2 on PCB1, the metal strip 4 and the soldering process are used to complete the installation and fixation between PCB1 and the piezoelectric buzzer 3. During production, it is particularly suitable for production line processing technology, and welding and assembly can be completed without complex mechanical motion trajectories. Compared with the complex soldering connection method of leads 44 and PIN needles 441 in the prior art, it can easily realize automatic patch and reflow soldering integrated molding, saving equipment cost and labor cost, shortening the processing cycle, and greatly improving market competitiveness.

[0034] Reference Figure 1 and Figure 2 As shown, in one embodiment of the present utility model, six substrate antennae 51 are fixedly connected to the piezoelectric buzzer piece 3 , and the piezoelectric buzzer piece 3 is soldered to the pad 5 via the substrate antennae 51 .

[0035] During operation, six metal substrate antennae 51 can be used to accurately position and install during assembly and welding, thereby achieving rapid patching between the piezoelectric buzzer 3 and the PCB1, avoiding misaligned welding, and completing a fixed connection between the piezoelectric buzzer 3 and the PCB1.

[0036] Reference Figure 2 As shown, in one embodiment of the present invention, the substrate antenna 51 is made of metal, preferably copper.

[0037] Reference Figure 2 As shown, in one embodiment of the present utility model, the substrate antennae 51 are fixedly connected to the upper surface of the piezoelectric buzzer piece 3 in a circular array at equal intervals; the metal strip 4 is located on the upper surface of the piezoelectric buzzer piece 3.

[0038] Reference Figure 2As shown, in one embodiment of the present invention, two ends of the metal strip 4 are electrically connected to the piezoelectric buzzer 3 and the PCB 1 respectively, and are both soldered via the pad 5 .

[0039] Reference Figure 4 As shown, in one embodiment of the present utility model, the thickness of the piezoelectric buzzer piece 3 is the same as the thickness of the mounting groove 2 , and the size of the piezoelectric buzzer piece 3 is the same as the size of the mounting groove 2 .

[0040] Reference Figure 5 As shown, in one embodiment of the present utility model, the PCB 1 is fixedly connected to the housing 11 through the cooperation of screws and threaded holes or is glued with soft glue.

[0041] During operation, fixing the PCB1 and the housing 11 by a combination of screws and threads can improve the connection strength, and fixing the PCB1 and the housing 11 by soft glue is beneficial to avoid rust and facilitate later maintenance, and the assembly is faster and lighter.

[0042] Reference Figure 1 As shown, in one embodiment of the present utility model, the PCB 1 is circular or rectangular; the mounting groove 2 is circular.

[0043] During operation, by setting the PCB1 to a circular or rectangular shape and setting the mounting groove 2 to a circular or other regular shape, it is beneficial to the clamping and installation process of the production line, and automated patch can be easily realized.

[0044] Working principle:

[0045] In the prior art, when installing the buzzer piece of the piezoelectric buzzer, it is necessary to first cut the PCB1 board to make it fit the protective shell 11, and then perform the process of welding the lead 44 and inserting the PIN pin and welding. Since the lead 44 is a soft conductive material, it needs to be guided during welding before the soldering process can be performed, which is relatively cumbersome, resulting in increased labor costs and equipment costs, and cannot meet the production needs of manufacturers. The utility model designs a PCB1. During the specific operation, by opening a mounting groove 2 on the PCB1, the piezoelectric buzzer piece 3 is installed inside it, and the metal strip 4 is used instead of the lead 44 and the PIN pin 441 to communicate with the external signal, which not only avoids the problem that the traditional lead 44 is easy to age and disconnect , and the integration between PCB1 and piezoelectric buzzer 3 is higher, which is lighter and thinner than the prior art using lead 44 and PIN needle 441, which is conducive to catering to the current lightweight market. At the same time, by opening the installation slot 2 on the PCB1, the metal strip 4 and the soldering process are used to complete the installation and fixation between PCB1 and piezoelectric buzzer 3. During production, it is particularly suitable for production line processing technology, and welding and assembly can be completed without complex mechanical motion tracks. Compared with the complex soldering connection method of lead 44 and PIN needle 441 in the prior art, it can easily realize automatic patch and reflow soldering integrated molding, saving equipment cost and labor cost, shortening the processing cycle, and greatly improving market competitiveness;

[0046] By using six metal substrate antennae 51, precise positioning and installation can be performed during assembly and welding, so as to achieve rapid patching between the piezoelectric buzzer 3 and the PCB1, avoid misaligned welding, and complete the fixed connection between the piezoelectric buzzer 3 and the PCB1; the fixation between the PCB1 and the housing 11 by a combination of screws and threads can improve the connection strength, and the fixation between the PCB1 and the housing 11 by soft glue is conducive to avoiding rust and facilitating later maintenance, and the assembly is faster and lighter; by setting the PCB1 to a circle or rectangle and setting the installation groove 2 to a regular shape such as a circle, it is conducive to the clamping and installation process of the production line, and automatic patching can be easily realized.

[0047] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the protection scope of the invention of the utility model.

Claims

1. An SMD piezoelectric buzzer structure, comprising: A housing (11), constituting the main body of the piezoelectric buzzer and used for carrying various components; A PCB (1) is glued and arranged inside the housing (11) and is used for the buzzer to communicate with external signals; A piezoelectric buzzer (3) is used to convert electrical energy into acoustic energy to generate an acoustic signal; Features: The PCB (1) is provided with a mounting groove (2); a piezoelectric buzzer (3) is arranged inside the mounting groove (2); a metal strip (4) is arranged on the upper surface of the piezoelectric buzzer (3); PAD pads (5) are fixedly connected to positions of the PCB (1) corresponding to the piezoelectric buzzer (3) and the metal strip (4); the piezoelectric buzzer (3) and the metal strip (4) are both soldered to the PAD pads (5).

2. The SMD piezoelectric buzzer structure according to claim 1, characterized in that: Six substrate antennae (51) are fixedly connected to the piezoelectric buzzer (3), and the piezoelectric buzzer (3) is connected to the pad (5) by soldering via the substrate antennae (51).

3. The SMD piezoelectric buzzer structure according to claim 2, characterized in that: The substrate antenna (51) is made of metal.

4. The SMD piezoelectric buzzer structure according to claim 3, characterized in that: The substrate antennae (51) are fixedly connected to the upper surface of the piezoelectric buzzer (3) in a circular array at equal intervals; and the metal strip (4) is located on the upper surface of the piezoelectric buzzer (3).

5. The SMD piezoelectric buzzer structure according to claim 4, characterized in that: The two ends of the metal strip (4) are electrically connected to the piezoelectric buzzer (3) and the PCB (1) respectively, and are both soldered via the soldering pad (5).

6. The SMD piezoelectric buzzer structure according to claim 5, characterized in that: The thickness of the piezoelectric buzzer (3) is the same as the thickness of the mounting groove (2), and the size of the piezoelectric buzzer (3) is the same as the size of the mounting groove (2).

7. The SMD piezoelectric buzzer structure according to claim 6, characterized in that: The PCB (1) is fixedly connected to the housing (11) through the cooperation of screws and threaded holes or is glued with soft glue.

8. The SMD piezoelectric buzzer structure according to claim 7, characterized in that: The PCB (1) is circular or rectangular; and the mounting groove (2) is circular.

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