Rapid installation clamp for metallographic mold of scanning electron microscope

By designing a metallographic mold for scanning electron microscopes, the problem of sample contamination caused by sticking conductive tape is solved by using the combination of an insulated observation stand and conductive copper foil, and a cleaner and economical observation process is achieved.

CN222637217UActive Publication Date: 2025-03-18CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202421081677.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-17
Publication Date
2025-03-18
Estimated Expiration
2034-05-17

AI Technical Summary

Technical Problem

In the prior art, when observing by scanning electron microscope, sticking conductive tape is prone to cause sample contamination.

Method used

A scanning electron microscope metallographic mold quick-install fixture, including an insulated observation stand and conductive copper foil, was designed. The conductive copper foil is movably arranged on the insulated observation table, pressed on the observation object during observation, instead of the conductive tape.

Benefits of technology

It avoids contamination of the observation object, and the conductive copper foil can be reused, saving costs, and has stronger conductivity and clearer imaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to microscopic observation and analysis of a metallographic mold, in particular to a rapid installation clamp for a scanning electron microscope metallographic mold, which comprises an insulating observation table and a conductive copper foil, and the conductive copper foil is movably arranged on the insulating observation table so as to be pressed on an observed object during observation, so that the technical problem that the observed object is easily polluted due to the fact that a conductive adhesive tape is pasted during observation in the prior art is solved.
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