Adhesive film laminating module and adhesive film laminating device

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to an adhesive film laminating module and an adhesive film laminating device, the adhesive film laminating module comprises a first mounting rack, and a support assembly, a laminating assembly and a recovery assembly which are fixed on the first mounting rack; the supporting assembly is used for placing a film roll and guiding the film roll; the attaching assembly is arranged beside the supporting assembly. The recycling assembly is arranged beside the laminating assembly; the laminating assembly comprises a stripping plate, an air blowing mechanism and a film pressing mechanism; the stripping plate is arranged beside the supporting assembly, a tip is arranged on one side of the stripping plate, the blowing mechanism is arranged on one side of the stripping plate, and the film pressing mechanism is arranged on the other side of the stripping plate and located above the tip. According to the invention, the stripping plate is arranged to separate the adhesive film from the bottom film, the blowing mechanism blows the adhesive film, and the film pressing mechanism rapidly presses the adhesive film on the surfaces of the wafer and the support ring, so that the operation is convenient and rapid, and the damage to the wafer caused by dust contamination on the surface of the adhesive film is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a film laminating module and a film laminating device. Background Art

[0002] In the semiconductor chip manufacturing process, after the wafer is ground and thinned, the grinding protection film on the front of the wafer is torn off, and then the wafer and the support ring are bonded together through the cut film to protect the wafer in the process, assist in positioning during wafer processing, and support during wafer transmission. In the prior art, it takes a long time to remove the film from the base film and press it on the surface of the wafer and the support ring, which can easily cause the film to be contaminated with dust and cause damage to the wafer. Therefore, it is necessary to design a new solution to solve the above problems. Utility Model Content

[0003] The utility model aims to provide a film laminating module and a film laminating device, aiming to solve the technical problems in the prior art that wafer lamination takes a long time and is easily contaminated with dust, thus causing wafer damage.

[0004] To achieve the above-mentioned purpose, the embodiment of the utility model provides a film laminating module, which is used to separate the film and the bottom film of the film roll and press the film onto the surface of the wafer and the support ring, and the film laminating module comprises: a first mounting frame and a support assembly, a laminating assembly and a recovery assembly fixed on the first mounting frame; the support assembly is used to place the film roll and guide the film roll; the laminating assembly is arranged at the side of the support assembly, and is used to separate the film and the bottom film of the film roll; the recovery assembly is arranged at the side of the laminating assembly, and is used to recover the bottom film;

[0005] The bonding component includes a stripping plate, an air blowing mechanism and a film pressing mechanism; the stripping plate is arranged on the side of the support component, and a tip is arranged on one side of the stripping plate for separating the adhesive film from the base film; the air blowing mechanism is arranged on one side of the stripping plate for blowing up the adhesive film after the adhesive film and the base film are separated; the film pressing mechanism is arranged on the other side of the stripping plate and located above the tip, and is used to press the blown adhesive film onto the surface of the wafer and the support ring.

[0006] As a preferred solution, the adhesive film laminating module further includes a static electricity elimination component, and the static electricity elimination component is arranged on the first mounting frame and located beside the film pressing mechanism.

[0007] As a preferred embodiment, the recovery component includes: a film collecting roller, a pressure roller, a first tension roller and a bottom film recovery roller; the film collecting roller is rotatably arranged at the side of the laminating component; the pressure roller is arranged at the side of the film collecting roller, and an adjustment gap for the bottom film to pass through is formed between the pressure roller and the film collecting roller; the first tension roller is movably arranged on the first mounting frame and is located at the side of the pressure roller; the bottom film recovery roller is rotatably arranged at the side of the first tension roller.

[0008] As a preferred solution, the supporting assembly includes a film placing roller, a film placing motor and a first guide roller group; the film placing roller is arranged on the first mounting frame for placing a pre-cut film roll; the film placing motor is arranged on the first mounting frame, and the film placing motor drives the film placing roller to rotate; the first guide roller group is arranged on the first mounting frame and is located beside the film placing roller for guiding the film roll.

[0009] The embodiment of the utility model also provides a film laminating device, including a film cutting module, a tension adjustment module and the film laminating module; the film cutting module includes a second mounting frame, a film roll fixing component and a film cutting component, the film roll fixing component is arranged on the second mounting frame and is used to place the uncut film roll; the film cutting component is arranged on the side of the film roll fixing component and is used to pre-cut the film roll; the tension adjustment module is arranged between the film cutting module and the film laminating module, the tension adjustment module includes a third mounting frame, a waste film separation component, a guide component and a tension adjustment component; the waste film separation component is arranged on the third mounting frame and is located on the side of the film cutting component, the guide component is arranged on the side of the waste film separation component and is used to guide the film roll to the support component, and the tension adjustment component is arranged on the side of the guide component and is used to adjust the tension of the film roll.

[0010] As a preferred embodiment, the film cutting assembly includes a film cutting bottom roller, a film cutting roller, a film cutting motor, a film cutting knife and an adjustment mechanism; the film cutting bottom roller and the film cutting roller are both rotatably arranged side by side on the second mounting frame, and a film cutting gap is formed between the film cutting roller and the film cutting bottom roller for the film roll to pass through; the film cutting motor is arranged on the second mounting frame and drives the film cutting roller and the film cutting bottom roller to rotate; the film cutting knife is embedded in the film cutting roller and exposed on the surface of the film cutting roller; the adjustment mechanism is connected to the film cutting roller and is used to adjust the spacing of the film cutting gap.

[0011] As a preferred solution, the tension adjustment assembly includes a guide rail, a slider, a second tension roller and a detection assembly; the guide rail is fixed on the third mounting frame, one end of the slider is movably arranged on the guide rail, and the second tension roller is arranged at the other end of the slider; the detection assembly is arranged on the side of the second tension roller, and is used to control the start and stop of the equipment according to the position of the second tension roller.

[0012] As a preferred solution, the detection component includes a third sensor, a fourth sensor and a fifth sensor, the third sensor, the fourth sensor and the fifth sensor are all arranged on a third mounting frame, the third sensor and the fourth sensor are located on the side of the guide rail, the third sensor is arranged above the fourth sensor, the third sensor and the fourth sensor are used to detect the position information of the second tension roller and control the start and stop of the equipment; the fifth sensor is located between the third sensor and the fourth sensor, and the fifth sensor is used to detect whether there is a rubber film on the second tension roller.

[0013] As a preferred solution, the waste film separation assembly includes a separation roller, a waste film recovery roller and a waste film recovery motor; the separation roller is arranged on the third mounting frame, the waste film recovery roller is arranged on the side of the separation roller, and a separation gap is formed between the waste film recovery roller and the separation roller for the film roll to pass through; the output shaft of the waste film recovery motor is connected to a swing arm, and the swing arm is connected to the waste film recovery roller.

[0014] The above one or more technical solutions in the adhesive film laminating module and the adhesive film laminating device provided by the embodiment of the utility model have at least one of the following technical effects:

[0015] In the present application, a peeling plate is set to separate the adhesive film and the base film, the blowing mechanism blows up the adhesive film, and at the same time the film pressing mechanism quickly presses the adhesive film onto the surface of the wafer and the support ring, which is convenient and quick, and avoids dust contamination on the surface of the adhesive film and damage to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the overall structure of the adhesive film laminating module provided in an embodiment of the utility model;

[0018] Figure 2A schematic diagram of the structure of the adhesive film laminating module in use state provided by an embodiment of the utility model;

[0019] Figure 3 for Figure 2 The enlarged schematic diagram of the M in the middle;

[0020] Figure 4 A schematic diagram of the structure of the film cutting module provided in an embodiment of the utility model;

[0021] Figure 5 A schematic diagram of the structure of the tension adjustment module provided in an embodiment of the utility model;

[0022] Figure 6 A schematic diagram of the structure of the adhesive film laminating device provided in an embodiment of the utility model in use state.

[0023] Among them, the reference numerals in the figure are:

[0024] 100-film laminating module; 110-first mounting frame; 120 supporting assembly; 121-film placing roller; 122-film placing motor; 123-first guide roller group; 130-laminating assembly; 131-peeling plate; 132-blowing mechanism; 133-film pressing mechanism; 134-tip; 135-film pressing roller; 136-film pressing cylinder; 137-film pressing gap; 140-recovery assembly; 141-film collecting roller; 142-pressing roller; 143-first tension roller; 144-bottom film recovery roller; 145-adjusting gap; 146-first sensor; 147-second sensor; 150-static elimination assembly;

[0025] 200-film cutting module; 210-second mounting frame; 220-film roll fixing assembly; 221-fixing roller; 222-film roll motor; 223-second guide roller group; 230-die cutting assembly; 231-die cutting bottom roller; 232-film cutting roller; 233-film cutting motor; 234-film cutting knife; 235-adjusting mechanism; 236-die cutting gap;

[0026] 300-tension adjustment module; 310-third mounting frame; 320-waste film separation assembly; 321-separation roller; 322-waste film recovery roller; 323-waste film recovery motor; 324-separation gap; 325-swing arm; 330-guide assembly; 340-tension adjustment assembly; 341-guide rail; 342-slider; 343-second tension roller; 344-detection assembly; 345-third sensor; 346-fourth sensor; 347-fifth sensor. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0028] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0030] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0031] In one embodiment of the present invention, Figure 1-Figure 3 As shown, a film bonding module 100 is provided, which is used to separate the film a and the base film b of the film roll A and press the film a onto the surface of the wafer and the support ring, including: a first mounting frame 110 and a support assembly 120, a bonding assembly 130 and a recovery assembly 140 fixed on the first mounting frame 110.

[0032] The support assembly 120 is used to place the film roll A and guide the film roll A. In this embodiment, the support assembly 120 includes a film placing roller 121, a film placing motor 122 and a first guide roller group 123. The film placing roller 121 is arranged on the first mounting frame 110, and is used to place the pre-cut film roll A. The film placing motor 122 is arranged on the first mounting frame 110, and the film placing motor 122 drives the film placing roller 121 to rotate, so that the film roll A on the film placing roller 121 rotates to place the film. The first guide roller group 123 is arranged on the first mounting frame 110 and is located beside the film placing roller 121. The first guide roller group 123 includes a plurality of guide rollers, and the plurality of guide rollers are arranged in parallel at intervals on the support assembly 120, and are used to guide the film roll A.

[0033] The laminating assembly 130 is arranged at the side of the supporting assembly 120, and is used to separate the adhesive film a and the base film b of the film roll A. The laminating assembly 130 includes a stripping plate 131, a blowing mechanism 132, and a film pressing mechanism 133. The stripping plate 131 is arranged at the side of the supporting assembly 120, and a tip 134 is arranged on one side of the stripping plate 131, and is used to separate the adhesive film a from the base film b. The blowing mechanism 132 is arranged on one side of the stripping plate 131, and is used to blow up the adhesive film a after the adhesive film a and the base film b are separated. The film pressing mechanism 133 is arranged on the other side of the stripping plate 131 and is located above the tip 134, and the film pressing mechanism 133 includes a film pressing roller 135 and a film pressing cylinder 136. The lamination roller 135 is located beside the tip 134, and a lamination gap 137 is formed between the lamination roller 135 and the tip 134 for the adhesive film a to pass through; the lamination cylinder is arranged on the first mounting frame 110 and connected to the lamination roller 135, and is used to drive the lamination roller 135, and press the adhesive film a that passes through the lamination gap 137 and is blown up by the blowing mechanism 132 onto the surface of the wafer and the support ring.

[0034] The recycling assembly 140 is arranged beside the laminating assembly 130 and is used to recycle the bottom film b. The recycling assembly 140 includes a film collection roller 141, a pressure roller 142, a first tension roller 143 and a bottom film recycling roller 144. The film collection roller 141 is rotatably arranged beside the supporting assembly 120. The pressure roller 142 is arranged beside the film collection roller 141, and an adjustment gap 145 is formed between the pressure roller 142 and the film collection roller 141 for the bottom film b to pass through. The first tension roller 143 is movably arranged on the first mounting frame 110 and is located beside the pressure roller 142; the bottom film recycling roller 144 is rotatably arranged beside the first tension roller 143. In this embodiment, the recovery component 140 is also provided with a first sensor 146 and a second sensor 147. The first sensor 146 and the second sensor 147 are arranged at the upper and lower ends of the first tension roller 143 for detecting the activity of the first tension roller 143, thereby adjusting the tension of the bottom film b.

[0035] The adhesive film laminating module 100 further includes a static electricity elimination component 150 , which is disposed on the first mounting frame 110 and located beside the film pressing mechanism 133 , and is used to eliminate static electricity on the adhesive film a blown up by the blowing mechanism 132 .

[0036] In one embodiment of the present invention, Figure 4-Figure 6 As shown, a film laminating device is provided, including a film cutting module 200 , a tension adjustment module 300 and a film laminating module 100 .

[0037] The film cutting module 200 includes a second mounting frame 210, a film roll fixing assembly 220 and a film cutting assembly 230. The film roll fixing assembly 220 is disposed on the second mounting frame 210 and is used to place the uncut film roll A. The film cutting assembly 230 is disposed beside the film roll fixing assembly 220 and is used to pre-cut the film roll A.

[0038] Specifically, the film roll fixing assembly 220 includes a fixed roller 221, a film roll motor 222, and a second guide roller group 223. The fixed roller 221, the film roll motor 222, and the second guide roller group 223 are all arranged on the second mounting frame 210. The film roll motor 222 drives the fixed roller 221 to rotate, and the second guide roller group 223 is arranged beside the fixed roller 221 to guide the film roll A.

[0039] Specifically, the film cutting assembly 230 includes a film cutting bottom roller 231, a film cutting roller 232, a film cutting motor 233, a film cutting knife 234 and an adjusting mechanism 235. The film cutting bottom roller 231 and the film cutting roller 232 are both rotatably arranged side by side on the second mounting frame 210, and a film cutting gap 236 is formed between the film cutting roller 232 and the film cutting bottom roller 231 for the film roll A to pass through. The film cutting motor 233 is arranged on the second mounting frame 210 and drives the film cutting roller 232 and the film cutting bottom roller 231 to rotate. The film cutting knife 234 is embedded in the film cutting roller 232 and exposed on the surface of the film cutting roller 232. When the film cutting motor 233 drives the film cutting roller 232 to rotate, the film cutting knife 234 cuts the adhesive film a on the surface of the film roll A and divides it into a covering film and a waste film. The coating is circular and is used to be pressed on the surface of the wafer and the support ring, and the waste film is the remaining part of the adhesive film after removing the coating. The adjustment mechanism 235 is connected to the film cutting roller 232 and is used to adjust the spacing of the film cutting gap 236.

[0040] The tension adjustment module 300 is disposed between the film cutting module 200 and the film laminating module 100, and is used to adjust the tension of the film roll A and the film feeding speed. The tension adjustment module 300 includes a third mounting frame 310, a waste film separation assembly 320, a guide assembly 330, and a tension adjustment assembly 340. The waste film separation assembly 320 is disposed on the third mounting frame 310 and is located beside the film cutting assembly 230, the guide assembly 330 is disposed beside the waste film separation assembly 320 and is used to guide the film roll A to the supporting assembly 120, and the tension adjustment assembly 340 is disposed beside the guide assembly 330 and is used to adjust the tension of the film roll A.

[0041] The waste film separation assembly 320 includes a separation roller 321, a waste film recovery roller 322 and a waste film recovery motor 323. The separation roller 321 is disposed on the third mounting frame 310, the waste film recovery roller 322 is disposed beside the separation roller 321, and a separation gap 324 is formed between the waste film recovery roller 322 and the separation roller 321 for the film roll A to pass through. The output shaft of the waste film recovery motor 323 is connected to a swing arm 325, and the swing arm 325 is connected to the waste film recovery roller 322.

[0042] Specifically, the tension adjustment assembly 340 includes a guide rail 341, a slider 342, a second tension roller 343 and a detection assembly 344. The guide rail 341 is fixed to the third mounting frame 310, one end of the slider 342 is movably disposed on the guide rail 341, and the second tension roller 343 is disposed at the other end of the slider 342. The detection assembly 344 is disposed beside the second tension roller 343, and is used to control the start and stop of the device according to the position of the second tension roller 343.

[0043] Furthermore, the detection component 344 includes a third sensor 345, a fourth sensor 346 and a fifth sensor 347, and the third sensor 345, the fourth sensor 346 and the fifth sensor 346 are all arranged on the third mounting frame 310. The third sensor 345 and the fourth sensor 346 are located beside the guide rail 341, and the third sensor 345 is arranged above the fourth sensor 346. The third sensor 345 and the fourth sensor 346 are used to detect the position information of the second tension roller 343 and control the start and stop of the device. The fifth sensor 346 is located between the third sensor 345 and the fourth sensor 346, and the fifth sensor 346 is used to detect whether there is a film a on the second tension roller 343.

[0044] When the equipment is running, the film laminating module 100 continuously feeds the film, and the film feeding speed of the tension adjustment module 300 is set slightly faster than that of the film laminating module 100 to ensure that the film feeding of the film laminating module 100 will not be affected by the pulling force on the film due to the failure of the tension adjustment module 300 or other factors, thereby affecting the film laminating quality.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A film laminating module, used for separating the film and the base film of a film roll and pressing the film onto the surface of a wafer and a support ring, the film laminating module comprising: A first mounting frame and a supporting assembly, a laminating assembly and a recycling assembly fixed on the first mounting frame; The support assembly is used to place the film roll and guide the film roll; the laminating assembly is arranged beside the support assembly and is used to separate the adhesive film and the base film of the film roll; the recycling assembly is arranged beside the laminating assembly and is used to recycle the base film; It is characterized in that the bonding component includes a stripping plate, an air blowing mechanism and a film pressing mechanism; the stripping plate is arranged on the side of the support component, and a tip is arranged on one side of the stripping plate for separating the adhesive film from the base film; the air blowing mechanism is arranged on one side of the stripping plate for blowing up the adhesive film after the adhesive film and the base film are separated; the film pressing mechanism is arranged on the other side of the stripping plate and is located above the tip, and is used to press the blown adhesive film onto the surface of the wafer and the support ring.

2. The adhesive film laminating module according to claim 1, characterized in that: The adhesive film laminating module also includes a static electricity elimination component, which is arranged on the first mounting frame and located beside the film pressing mechanism.

3. The adhesive film laminating module according to claim 1, characterized in that: The recovery component includes: a film collecting roller, a pressure roller, a first tension roller and a bottom film recovery roller; the film collecting roller is rotatably arranged on the side of the laminating component; the pressure roller is arranged on the side of the film collecting roller, and an adjustment gap for the bottom film to pass through is formed between the pressure roller and the film collecting roller; the first tension roller is movably arranged on the first mounting frame and is located on the side of the pressure roller; the bottom film recovery roller is rotatably arranged on the side of the first tension roller.

4. The adhesive film laminating module according to any one of claims 1 to 3, characterized in that: The supporting assembly includes a film placing roller, a film placing motor and a first guide roller group; the film placing roller is arranged on the first mounting frame, and is used for placing a pre-cut film roll; the film placing motor is arranged on the first mounting frame, and the film placing motor drives the film placing roller to rotate; the first guide roller group is arranged on the first mounting frame and is located beside the film placing roller, and is used for guiding the film roll.

5. A film laminating device, characterized in that: It includes a film cutting module, a tension adjustment module and the film laminating module as described in any one of claims 1 to 3; the film cutting module includes a second mounting frame, a film roll fixing component and a film cutting component, the film roll fixing component is arranged on the second mounting frame and is used to place an uncut film roll; the film cutting component is arranged on the side of the film roll fixing component and is used to pre-cut the film roll; the tension adjustment module is arranged between the film cutting module and the film laminating module, the tension adjustment module includes a third mounting frame, a waste film separation component, a guide component and a tension adjustment component; the waste film separation component is arranged on the third mounting frame and is located on the side of the film cutting component, the guide component is arranged on the side of the waste film separation component and is used to guide the film roll to the supporting component, and the tension adjustment component is arranged on the side of the guide component and is used to adjust the tension of the film roll.

6. The adhesive film laminating device according to claim 5, characterized in that: The film cutting assembly includes a film cutting bottom roller, a film cutting roller, a film cutting motor, a film cutting knife and an adjustment mechanism; the film cutting bottom roller and the film cutting roller are both rotatably arranged side by side on the second mounting frame, and a film cutting gap is formed between the film cutting roller and the film cutting bottom roller for the film roll to pass through; the film cutting motor is arranged on the second mounting frame and drives the film cutting roller and the film cutting bottom roller to rotate; the film cutting knife is embedded in the film cutting roller and exposed on the surface of the film cutting roller; the adjustment mechanism is connected to the film cutting roller and is used to adjust the spacing of the film cutting gap.

7. The adhesive film laminating device according to claim 5, characterized in that: The tension adjustment assembly includes a guide rail, a slider, a second tension roller and a detection assembly; the guide rail is fixed on the third mounting frame, one end of the slider is movably arranged on the guide rail, and the second tension roller is arranged at the other end of the slider; the detection assembly is arranged on the side of the second tension roller, and is used to control the start and stop of the equipment according to the position of the second tension roller.

8. The adhesive film laminating device according to claim 7, characterized in that: The detection component includes a third sensor, a fourth sensor and a fifth sensor, the third sensor, the fourth sensor and the fifth sensor are all arranged on a third mounting frame, the third sensor and the fourth sensor are located on the side of the guide rail, the third sensor is arranged above the fourth sensor, the third sensor and the fourth sensor are used to detect the position information of the second tension roller and control the start and stop of the equipment; the fifth sensor is located between the third sensor and the fourth sensor, and the fifth sensor is used to detect whether there is a rubber film on the second tension roller.

9. The adhesive film laminating device according to any one of claims 5 to 8, characterized in that: The waste film separation assembly includes a separation roller, a waste film recovery roller and a waste film recovery motor; the separation roller is arranged on the third mounting frame, the waste film recovery roller is arranged on the side of the separation roller, and a separation gap is formed between the waste film recovery roller and the separation roller for the film roll to pass through; the output shaft of the waste film recovery motor is connected to a swing arm, and the swing arm is connected to the waste film recovery roller.

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