Wafer box

Abstract

The utility model provides a wafer box, which comprises a wafer bearing chamber, an air inlet cavity and an air outlet cavity, and is characterized in that the wafer bearing chamber comprises a plurality of bearing parts arranged at intervals, and each bearing part is provided with at least one adsorption air passage; the air inlet cavity is adjacent to the wafer bearing chamber, and a plurality of first air channels communicating the wafer bearing chamber with the air inlet cavity are arranged between the air inlet cavity and the wafer bearing chamber. The first air channels penetrate through the bearing part in the horizontal direction. The air outlet cavity is adjacent to the wafer bearing chamber, a plurality of second air channels communicating the wafer bearing chamber with the air outlet cavity are arranged between the air outlet cavity and the wafer bearing chamber, the first air channels penetrate through the bearing part in the horizontal direction, the adsorption air channels are opened from the surface, bearing wafers, of the bearing part, and the bottoms of the adsorption air channels are communicated with the first air channels and / or the second air channels; the first air channel and the second air channel are oppositely arranged in the horizontal direction, and the transverse section size of the adsorption air channel is smaller than the longitudinal section size of the first air channel and the longitudinal section size of the second air channel. According to the wafer box provided by the utility model, the cleanliness of the internal wafer is ensured, and the risk of fragmentation of the wafer in the cleaning process is avoided at the same time.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor technology, in particular to a wafer box. Background Art

[0002] As semiconductor processes become increasingly complex, the steps are numerous, and the chip production cycle increases, the time wafers spend in the wafer box is getting longer and longer, and they are increasingly affected by the wafer box environment. If the environment inside the wafer box is poor, the number of dust particles falling on the wafers will increase, which will cause abnormalities in subsequent processes and make it impossible to make normal process structures, seriously affecting the wafer yield. Therefore, the environmental quality inside the wafer box is particularly important.

[0003] In the prior art, nitrogen is introduced into the wafer box on the machine to ventilate the wafer box to ensure dryness inside the wafer box. However, there is a lack of a filtering device at the end of the wafer box, and the cleanliness of the gas entering the wafer box cannot be guaranteed. In addition, when nitrogen is introduced into the wafer box on the machine, the gas is directly blown into the wafer box, and there is no device for uniform airflow inside the wafer box. There is a risk of blowing the wafer crooked and causing breakage. Therefore, the current technology cannot solve the problem of poor environment inside the wafer box.

[0004] In view of this, there is an urgent need for a wafer box that can keep the internal wafers clean while keeping the wafer positions fixed. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer box for solving the problem that the internal environment of the wafer box is poor and the wafers are easily broken during the cleaning process in the prior art.

[0006] In order to achieve the above-mentioned object and other related objects, the utility model provides a wafer box, comprising:

[0007] The wafer loading chamber comprises a plurality of loading parts arranged at intervals, each of the loading parts being provided with at least one adsorption air channel;

[0008] An air inlet cavity is adjacent to the wafer carrying chamber, and a plurality of first air passages connecting the wafer carrying chamber and the air inlet cavity are provided between the air inlet cavity and the wafer carrying chamber, and the first air passages penetrate the carrying portion in a horizontal direction;

[0009] An air outlet cavity is adjacent to the wafer carrying chamber, and a plurality of second air ducts connecting the wafer carrying chamber and the air outlet cavity are arranged between the air outlet cavity and the wafer carrying chamber, the second air ducts penetrate the carrying part in the horizontal direction, the adsorption air duct opens from the surface of the carrying part carrying the wafer, and the bottom of the adsorption air duct is connected with the first air duct and / or the second air duct, the first air duct and the second air duct are arranged correspondingly in the horizontal direction, and the transverse cross-sectional dimensions of the adsorption air duct are smaller than the longitudinal cross-sectional dimensions of the first air duct and the second air duct.

[0010] Optionally, the wafer carrying chamber and the air inlet cavity share a first side wall, the wafer carrying chamber and the air outlet cavity share a second side wall, and the first side wall and the second side wall are fixed on the wafer box.

[0011] Optionally, the bearing portion includes a first boss fixed on the first side wall and a second boss fixed on the second side wall, and the number of the first bosses is equal to the number of the second bosses and corresponds one to one.

[0012] Optionally, the first air duct runs through the first side wall and the first boss in a horizontal direction; and the second air duct runs through the second side wall and the second boss in a horizontal direction.

[0013] Optionally, a protruding portion is further provided below the bearing portion, and the first air channel and / or the second air channel are located in the protruding portion and penetrate the protruding portion in a horizontal direction.

[0014] Optionally, the air inlet cavity is provided with at least one air inlet hole connected to the outside, and the air outlet cavity is provided with at least one air outlet hole connected to the outside.

[0015] Optionally, a first filtering device is further provided on the air inlet; and a second filtering device is further provided on the air outlet.

[0016] Optionally, a plurality of the adsorption air channels arranged at intervals are provided on the bearing portion, and the adsorption air channels are arranged along the extension direction of the first air channel and / or the second air channel.

[0017] Optionally, there are a plurality of adsorption air channels connected to each of the first air channels or the second air channels, and the plurality of adsorption air channels are arranged in an arc shape on the supporting portion, and the openings of the arc shape are facing the center of the wafer box.

[0018] Optionally, the air inlet cavity and the air outlet cavity share a partition, and the partition is fixed on the wafer box.

[0019] As described above, the wafer box of the utility model has the following beneficial effects: by arranging the wafer carrying chamber and the air inlet cavity and the air outlet cavity respectively adjacent to the wafer carrying chamber in the wafer box, and respectively arranging a plurality of first air channels connecting the wafer carrying chamber and the air inlet cavity between the air inlet cavity and the wafer carrying chamber, and arranging a plurality of second air channels connecting the wafer carrying chamber and the air outlet cavity between the air outlet cavity and the wafer carrying chamber, and arranging the first air channels and the second air channels to correspond to each other in the horizontal direction, the air flow balance in the wafer carrying chamber is ensured, and the surface of the wafer is fully cleaned; by arranging the adsorption air channel on the carrying part, which is open from the surface of the carrying part carrying the wafer and the bottom is connected to the first air channel and / or the second air channel, and the transverse cross-sectional size of the adsorption air channel is smaller than the longitudinal cross-sectional size of the first air channel and the second air channel, while ensuring the cleaning of the surface of the wafer, the risk of the wafer shaking and generating fragments during the process of blowing the cleaning gas to the wafer is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a schematic diagram of the appearance structure of the wafer box of the present invention.

[0021] Figure 2 Shown is a front cross-sectional schematic diagram of a wafer box of the present invention.

[0022] Figure 3 Shown is a partial structural schematic diagram of a wafer box of the present invention.

[0023] Figure 4 Shown is a top cross-sectional schematic diagram of a wafer box of the present invention.

[0024] Component number description

[0025] 1 Wafer Load Chamber

[0026] 11 Load-bearing unit

[0027] 111 Adsorption Airway

[0028] 12 First boss

[0029] 13 Second boss

[0030] 14 Protrusion

[0031] 2 Intake cavity

[0032] 21 First Airway

[0033] 22 Air Inlet

[0034] 3. Vent cavity

[0035] 31 Second Airway

[0036] 32 Vent

[0037] 4 First side wall

[0038] 5 Second side wall

[0039] 6. Fixing structure

[0040] 61 Rubber cushion

[0041] 7 Wafer

[0042] 8. Partition DETAILED DESCRIPTION

[0043] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0044] See also Figures 1 to 4 It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.

[0045] Embodiment 1

[0046] This embodiment provides a wafer box, such as Figure 1-Figure 3As shown, there are respectively a schematic diagram of the appearance structure of the wafer box, a schematic diagram of a main cross-section of the wafer box, and a schematic diagram of a partial structure of the wafer box, wherein the wafer box comprises: a wafer carrying chamber 1, an air inlet cavity 2, and an air outlet cavity 3, wherein the wafer carrying chamber 1 comprises a plurality of carrying portions 11 arranged at intervals, and each of the carrying portions 11 is provided with at least one adsorption air channel 111; the air inlet cavity 2 is adjacent to the wafer carrying chamber 1, and a plurality of first air channels 21 connecting the wafer carrying chamber 1 and the air inlet cavity 2 are provided between the air inlet cavity 2 and the wafer carrying chamber 1, and the first air channels 21 penetrate the carrying portion 11 in the horizontal direction; the air outlet cavity 3 is connected to the wafer carrying chamber 1 by the air inlet cavity 2. The wafer carrying chamber 1 is adjacent to the wafer carrying chamber 1, and a plurality of second air ducts 31 connecting the wafer carrying chamber 1 and the air outlet cavity 3 are arranged between the air outlet cavity 3 and the wafer carrying chamber 1, the second air ducts 31 penetrate the carrying portion 11 in the horizontal direction, the adsorption air duct 111 opens from the surface of the carrying portion 11 carrying the wafer 7 and the bottom of the adsorption air duct 111 is connected to the first air duct 21 and / or the second air duct 31, the first air duct 21 and the second air duct 31 are arranged correspondingly in the horizontal direction and the transverse cross-sectional dimensions of the adsorption air duct 111 are smaller than the longitudinal cross-sectional dimensions of the first air duct 21 and the second air duct 31.

[0047] Specifically, the size, shape and model of the wafer box can be selected according to actual conditions and are not limited here.

[0048] As an example, the wafer carrying chamber 1 and the air inlet chamber 2 share a first side wall 4, and the wafer carrying chamber 1 and the air outlet chamber 3 share a second side wall 5, and the first side wall 4 and the second side wall 5 are fixed on the wafer box.

[0049] Specifically, the first side wall 4 and the wafer box together form the air inlet cavity 2 ; the second side wall 5 and the wafer box together form the air inlet cavity 3 .

[0050] Specifically, the first side wall 4 and the second side wall 5 are both fixed to the wafer box through a fixing structure 6 .

[0051] Specifically, a colloid cushion 61 is provided in the fixing structure 6 .

[0052] Specifically, the shape of the colloid pad 61 includes a U shape or other suitable shapes.

[0053] Specifically, the material of the colloid cushion 61 includes rubber or other suitable materials.

[0054] Specifically, while meeting the performance of the wafer box, the size, shape and material of the first side wall 4 can be selected according to actual conditions, and are not limited here; the size, shape and material of the second side wall 5 can be selected according to actual conditions, and are not limited here.

[0055] Specifically, the first side wall 4 and the second side wall 5 are fixed inside the wafer box through the fixing structure 6, and the first side wall 4 and the second side wall 5 are movable and removable, so that the wafer box can be cleaned and installed and replaced more conveniently.

[0056] Specifically, by arranging the colloid pad 61 inside the fixing structure 6, the first side wall 4 and the second side wall 5 are sealed and fixed, and the first side wall 4 and the second side wall 5 can be shock-absorbing during the transportation of the wafer box, thereby preventing dust particles from being generated due to the shaking and friction between the first side wall 4 and the second side wall 5 and the wafer box, thereby preventing the internal environment of the wafer box from being polluted.

[0057] Specifically, the number of the first air channels 21 is equal to the number of the second air channels 31 and corresponds one to one in the horizontal direction, ensuring the airflow balance of the clean gas inside the wafer carrying chamber 1, and each of the wafers 7 can be exposed to the cleaning airflow, which is conducive to more thorough cleaning.

[0058] Specifically, under the condition that the performance of the wafer box is met, the number of the first air ducts 21 can be selected according to actual conditions and is not limited here; the number of the second air ducts 31 can be selected according to actual conditions and is not limited here.

[0059] As an example, the air inlet cavity 2 is provided with at least one air inlet hole 22 communicating with the outside, and the air outlet cavity 3 is provided with at least one air outlet hole 32 communicating with the outside.

[0060] Specifically, the air inlet 22 is used to introduce the cleaning gas into the air inlet cavity 2, and the air outlet 32 ​​is used to discharge the cleaning gas after cleaning the wafer.

[0061] As an example, the air inlet 22 is further provided with a first filtering device (not shown in the figure); the air outlet 32 ​​is further provided with a second filtering device (not shown in the figure).

[0062] Specifically, by providing the first filter device on the air inlet 22 and providing the second filter device on the air outlet 32, external dust particles can be prevented from entering the interior of the wafer box, thereby ensuring the cleanliness of the interior of the wafer box.

[0063] Specifically, the first filter device and the second filter device are detachably connected to the wafer box by means of snaps or the like, and may also be integrally formed with the wafer box.

[0064] As an example, a protruding portion 14 is further provided below the bearing portion 11 (the protruding portion 14 is a part of the bearing portion 11 ), and the first air channel 21 and / or the second air channel 31 are located in the protruding portion 14 and penetrate through the protruding portion 14 .

[0065] Specifically, the carrying portion 11 is used to carry the wafer 7 , and the wafer 7 is placed on the upper surface of the carrying portion. The adsorption air channel 111 adsorbs the bottom of the wafer 7 at the opening of the adsorption portion 111 .

[0066] Specifically, under the condition that the performance of the wafer box is met, the number and shape of the adsorption air channels 111 can be selected according to actual conditions and are not limited here.

[0067] Specifically, by setting the adsorption air channel 111 to open from the surface of the supporting part supporting the wafer and the bottom to be connected with the first air channel 21 or the second air channel 31 respectively, the air path size (such as cross-sectional area) of the clean gas used to purge the surface of the wafer 7 can be larger than the air path size (such as cross-sectional area) used to adsorb the wafer 7, and since the transverse cross-sectional size (cross-sectional area) of the adsorption air channel 111 is smaller than the longitudinal cross-sectional size (cross-sectional area) of the first air channel 21 and the second air channel 31, due to the Bernoulli principle, under the action of the gas pressure difference, that is, when the first air channel 21 and the second air channel 31 corresponding to each other have an airflow for purge the wafer 7, a negative pressure will be generated at the top opening of the adsorption air channel 111 to adsorb the wafer 7, thereby ensuring the cleanliness of the surface of the wafer 7 and avoiding the wafer 7 from shaking relative to the supporting part 11 and thus generating the risk of fragmentation.

[0068] Specifically, by setting an adsorption air channel 111 on the carrying part 11, when cleaning the surface of the wafer 7 in the wafer box, the cleaning gas enters the air inlet cavity 2 from the air inlet hole 22, and then passes through the first air channel 21 to purge the surface of the wafer 7 placed on the carrying part 11. At this time, the adsorption air channel 111 set on the carrying part 11 adsorbs the wafer 7 under the action of the gas pressure difference. After the cleaning gas purges the surface of the wafer 7, it enters the air outlet cavity 3 through the second air channel 31 and is discharged from the wafer box from the air outlet hole 32.

[0069] As an example, the bearing portion 1 includes a first boss 12 fixed on the first side wall 4 and a second boss 13 fixed on the second side wall 5 , and the number of the first bosses 12 is equal to the number of the second bosses 13 and corresponds one to one.

[0070] As an example, the first air duct 21 penetrates the first side wall 4 and the first boss 12 in the horizontal direction; the second air duct 31 penetrates the second side wall 5 and the second boss 13 in the horizontal direction.

[0071] Specifically, the bearing portion 11 may be an integrated arrangement, or may be a structural design of a first boss 12 fixed to the first side wall 4 and a second boss 13 fixed to the second side wall 5, which may be selected according to actual conditions.

[0072] Specifically, by configuring the supporting portion 1 to include a first boss 12 fixed on the first side wall 4 and a second boss 13 fixed on the second side wall 5 , the wafer 7 is adsorbed and fixed, and the structure of the wafer box is simplified, thereby reducing the design cost.

[0073] As an example, a plurality of adsorption air channels 111 are arranged at intervals on the carrier portion 11, and the adsorption air channels 111 are arranged along the extension direction of the first air channel 21 and / or the second air channel 31, that is, a plurality of adsorption air channels 111 can be provided and arranged along the air flow direction, thereby increasing the adsorption effect on the wafer 7 (not shown in the figure).

[0074] As an example (not shown in the figure), the plurality of adsorption air channels 111 corresponding to each of the first air channels 21 or the second air channels 31 are arranged in an arc shape on the supporting portion 11, and the openings of the arc shape are facing the center of the wafer box (in this way, the adsorption of the wafer 7 can be achieved along the edge of the wafer 7, and the adsorption effect on the wafer 7 can also be increased).

[0075] As an example, the air inlet cavity 2 and the air outlet cavity 3 share a partition plate 8, and the partition plate 8 is fixed on the wafer box.

[0076] Specifically, at least a portion of the edge of the carrying portion 11 is arc-shaped to match the edge of the wafer 7 .

[0077] Specifically, Figure 4 As shown, it is a schematic diagram of a top cross-section of the wafer box. When the edge of the supporting portion 11 is at least partially arc-shaped to match the edge of the wafer 7, the partition 8, the supporting portion 11 and the wafer box together form the air inlet cavity 2; the partition 8, the supporting portion 11 and the wafer box together form the air inlet cavity 3.

[0078] Specifically, the length of the carrying portion 11 at least covers half of the circumference of the wafer 7 .

[0079] Specifically, by setting the supporting portion 11 to be at least partially arc-shaped matching the edge of the wafer 7 or making the length of the supporting portion 11 cover at least half of the circumference of the wafer 7, and the adsorption air channel 111 is arranged in an arc shape on the supporting portion 11 along the extension direction of the first air channel 21 and / or the second air channel 31, the adsorption air channel 111 on the supporting portion 11 can better adsorb the wafer 7, thereby improving the adsorption effect of the adsorption air channel 111.

[0080] The wafer box of this embodiment is provided with the first air channel 21 connecting the wafer carrying chamber 1 and the air inlet chamber 2, and the second air channel 31 connecting the wafer carrying chamber 1 and the air outlet chamber 3 inside the wafer box, and the adsorption air channel 111 is provided on the carrying part 11, which is opened from the surface of the carrying part 11 carrying the wafer 7 and the bottom is respectively connected with the first air channel 21 and the second air channel 31, so that the air path size (cross-sectional area of ​​the ventilation path) of the cleaning gas used for blowing the surface of the wafer 7 is larger than the air path size (cross-sectional area of ​​the ventilation path) used for adsorbing the wafer 7, and because the transverse cross-sectional size of the adsorption air channel 111 is smaller than the longitudinal cross-sectional size of the first air channel 21 and the second air channel 31, the wafer 7 is adsorbed under the action of the gas pressure difference, so that the surface of the wafer 7 is cleaned while avoiding the risk of fragmentation caused by shaking of the wafer 7.

[0081] In summary, the wafer box of the utility model is provided with an air inlet cavity and an air outlet cavity respectively adjacent to the wafer carrying chamber inside the wafer box, and a plurality of first air channels connecting the wafer carrying chamber and the air inlet cavity are respectively provided between the air inlet cavity and the wafer carrying chamber, and a plurality of second air channels connecting the wafer carrying chamber and the air outlet cavity are provided between the air outlet cavity and the wafer carrying chamber, and the positions of the first air channel and the second air channel in the horizontal direction correspond one to one, thereby ensuring the air flow balance in the wafer carrying chamber and achieving full cleaning of the surface of the wafer, and providing an adsorption air channel on the carrying part which is open on the surface of the wafer carried by the self-carrying part and the bottom is connected with the first air channel and / or the second air channel, and the transverse cross-sectional size of the adsorption air channel is smaller than the longitudinal cross-sectional size of the first air channel and the second air channel, while ensuring the cleaning of the surface of the wafer, the risk of wafer position shaking and generating debris is avoided during the process of cleaning gas purging the wafer. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0082] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer box, characterized in that: include: The wafer loading chamber comprises a plurality of loading parts arranged at intervals, each of the loading parts being provided with at least one adsorption air channel; An air inlet cavity is adjacent to the wafer carrying chamber, and a plurality of first air passages connecting the wafer carrying chamber and the air inlet cavity are provided between the air inlet cavity and the wafer carrying chamber, and the first air passages penetrate the carrying portion in a horizontal direction; An air outlet cavity is adjacent to the wafer carrying chamber, and a plurality of second air ducts connecting the wafer carrying chamber and the air outlet cavity are arranged between the air outlet cavity and the wafer carrying chamber, the second air ducts penetrate the carrying part in the horizontal direction, the adsorption air duct opens from the surface of the carrying part carrying the wafer, and the bottom of the adsorption air duct is connected with the first air duct and / or the second air duct, the first air duct and the second air duct are arranged correspondingly in the horizontal direction, and the transverse cross-sectional dimensions of the adsorption air duct are smaller than the longitudinal cross-sectional dimensions of the first air duct and the second air duct.

2. The wafer box according to claim 1, characterized in that: The wafer carrying chamber and the air inlet cavity share a first side wall, and the wafer carrying chamber and the air outlet cavity share a second side wall. The first side wall and the second side wall are fixed on the wafer box.

3. The wafer box according to claim 2, characterized in that: The bearing portion includes a first boss fixed on the first side wall and a second boss fixed on the second side wall, and the number of the first bosses is equal to the number of the second bosses and corresponds one to one.

4. The wafer box according to claim 3, characterized in that: The first air duct penetrates the first side wall and the first boss in a horizontal direction; the second air duct penetrates the second side wall and the second boss in a horizontal direction.

5. The wafer box according to claim 1, characterized in that: A protruding portion is further provided below the bearing portion, and the first air channel and / or the second air channel are located in the protruding portion and penetrate the protruding portion in a horizontal direction.

6. The wafer box according to claim 1, characterized in that: The air inlet cavity is provided with at least one air inlet hole connected to the outside, and the air outlet cavity is provided with at least one air outlet hole connected to the outside.

7. The wafer box according to claim 6, characterized in that: The air inlet is also provided with a first filtering device; the air outlet is also provided with a second filtering device.

8. The wafer box according to claim 1, characterized in that: The bearing portion is provided with a plurality of the adsorption air channels arranged at intervals, and the adsorption air channels are arranged along the extension direction of the first air channel and / or the second air channel.

9. The wafer box according to claim 1, characterized in that: There are a plurality of adsorption air channels connected to each of the first air channels or the second air channels, and the plurality of adsorption air channels are arranged in an arc shape on the supporting portion, and the openings of the arc shape are facing the center of the wafer box.

10. The wafer cassette according to any one of claims 1 to 9, characterized in that: The air inlet cavity and the air outlet cavity share a partition plate, and the partition plate is fixed on the wafer box.

Images