Pasting assembly for COB packaging substrate

Abstract

The utility model discloses a pasting component for a COB packaging substrate, which relates to the technical field of COB pasting, and comprises a hole frame provided with a sucker assembly, a pair of guide side frames and a metal supporting plate arranged below the hole frame in parallel, the sucker assembly is provided with a plurality of suckers capable of ascending and descending, and the metal supporting plate is arranged below the hole frame in parallel. Synchromesh gears are rotationally arranged on the inner sides of the guide side frames, servo motors connected with the synchromesh gears are arranged on the outer sides of the guide side frames, the synchromesh gears are located between the hole frame and the metal supporting plate, and meshing teeth meshed with the synchromesh gears are arranged at the bottoms of the two sides of the hole frame and the tops of the two sides of the metal supporting plate; the hole frame and the metal supporting plate achieve synchronous reverse movement through the synchronous gear, the number of servo motors is reduced, and therefore the hardware cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of COB patches, in particular to a pasting component for a COB packaging substrate. Background Art

[0002] The silicon wafer process on the COB board first covers the silicon wafer placement points on the substrate surface with thermally conductive epoxy resin, then directly places the silicon wafer on the substrate surface, heat treats it until the silicon wafer is firmly fixed to the substrate, and then uses wire bonding to directly establish an electrical connection between the silicon wafer and the substrate.

[0003] At present, for the lamination of silicon wafers, a suction cup device is usually operated manually or by a robot to suck up a single or multiple silicon wafers, and then the single or multiple silicon wafers are laminated to the substrate. Since the lamination area needs to make way for the robot and the suction cup device, the loading of the substrate and the silicon wafer needs to be completed by different loading mechanisms in sequence, which not only affects the production efficiency, but also makes the lamination equipment structure more complicated and the hardware cost higher. Utility Model Content

[0004] The purpose of the utility model is to provide a covering component for a COB packaging substrate to solve the above technical problems.

[0005] Based on the above purpose, the utility model provides a pasting assembly for a COB packaging substrate, including a hole frame provided with a suction cup assembly, the suction cup assembly having a plurality of suction cups capable of lifting and lowering, and also including a guide side frame and a metal support plate arranged parallel to the bottom of the hole frame, the guide side frame is provided with a pair of, the inner side of the guide side frame is rotatably provided with a synchronous gear, and the outer side of the guide side frame is provided with a servo motor connected to the synchronous gear;

[0006] The synchronous gear is located between the hole frame and the metal support plate, and the bottoms of both sides of the hole frame and the tops of both sides of the metal support plate are provided with meshing teeth meshing with the synchronous gear.

[0007] Furthermore, an embedding hole for inserting a synchronous gear is provided on the inner side of the guide side frame, and an axial hole connected to the embedding hole is provided on the outer side of the guide side frame, and the motor shaft of the servo motor passes through the axial hole and is connected to the synchronous gear.

[0008] Furthermore, a pair of mutually parallel slide grooves are arranged on the inner side of the guide side frame, and both of the pair of slide grooves are connected to the embedding holes, and the hole frame and the two sides of the metal support plate are respectively slidably arranged in the pair of slide grooves.

[0009] Furthermore, a pair of the slide grooves penetrate the top and bottom of the guide side frame respectively, and the top and bottom of the guide side frame are detachably provided with anti-jump plates.

[0010] Furthermore, a plurality of synchronous gears are provided on the guide side frame, and at least one of the synchronous gears is connected to a servo motor.

[0011] Furthermore, a synchronous gear located at one end of the guide side frame is connected to a servo motor, and the servo motors on the guide side frames on both sides are located at different ends.

[0012] Furthermore, an upper limit baffle is provided on the guide side frame and located at one end of one of the slide slots, and a lower limit baffle is provided on the guide side frame and located at the other end of the other slide slot.

[0013] Furthermore, the hole frame and the metal support plate are both in an "I" shape, and two notches are provided between the two sides of the hole frame and the metal support plate, which are located at the front end and the rear end respectively.

[0014] Beneficial effects of the utility model:

[0015] The utility model realizes synchronous opposite movements of the hole frame and the metal support plate through synchronous gears on the guide side frames on both sides, so that the hole frame and the metal support plate can be respectively moved to above the silicon wafer loading position for placing silicon wafers and below the substrate loading position for placing substrates, so as to realize automatic loading of silicon wafers and substrates, and the hole frame and the metal support plate realize synchronous opposite movements with the help of synchronous gears, which is beneficial to reduce the number of servo motors, thereby reducing hardware costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 For the utility model Figure 1 The main view;

[0019] Figure 3 It is a schematic diagram of the position of the synchronous gear of the utility model;

[0020] Figure 4 It is a structural schematic diagram of the guide side frame of the utility model;

[0021] Figure 5 It is a structural schematic diagram of the hole frame and the metal support plate of the utility model;

[0022] The numbers in the figure are:

[0023] 1-suction cup assembly; 2-hole frame; 3-suction cup; 4-guide side frame; 5-metal support plate; 6-synchronous gear; 7-servo motor; 8-meshing gear; 9-embedded hole; 10-shaft hole; 11-slide groove; 12-stop plate; 13-upper limit baffle; 14-lower limit baffle. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figures 1 to 5 As shown, a pasting assembly for a COB packaging substrate includes a hole frame 2 provided with a suction cup assembly 1, the suction cup assembly 1 has a plurality of suction cups 3 that can be lifted and lowered, and also includes a guide side frame 4 and a metal support plate 5 arranged parallel to the bottom of the hole frame 2, the guide side frame 4 is provided with a pair of synchronous gears 6 rotatably arranged on the inner side of the guide side frame 4, and a servo motor 7 connected to the synchronous gear 6 is arranged on the outer side of the guide side frame 4;

[0026] The synchronous gear 6 is located between the hole frame 2 and the metal support plate 5 , and meshing teeth 8 meshing with the synchronous gear 6 are provided at the bottom of both sides of the hole frame 2 and the top of both sides of the metal support plate 5 .

[0027] Specifically, when loading, the servo motor 7 drives the synchronous gear 6 to rotate in the forward direction, so that the hole frame 2 and the metal pallet 5 that overlap or align in the vertical direction move away from each other, so as to facilitate the loading of the silicon wafer and the substrate. After the hole frame 2 adsorbs the silicon wafer and the substrate is placed on the metal pallet 5, the servo motor 7 drives the synchronous gear 6 to rotate in the reverse direction, so that the hole frame 2 and the metal pallet 5 are reset, so that the silicon wafer is aligned with the substrate, and the suction cup assembly 1 drives the suction cup 3 to descend and releases the adsorbed suction cup 3 to the substrate to achieve the adhesion of the silicon wafer and the substrate. After the adhesion of the silicon wafer and the substrate is completed, the servo motor 7 drives the synchronous gear 6 to rotate in the forward direction, so that the silicon wafer and the substrate attached to the metal pallet 5 are exposed, so as to facilitate the transfer.

[0028] The utility model realizes synchronous opposite movement of the hole frame 2 and the metal pallet 5 through the synchronous gears 6 on the guide side frames 4 on both sides, so that the hole frame 2 and the metal pallet 5 can be moved respectively to the upper side of the silicon wafer loading position for placing silicon wafers and the lower side of the substrate loading position for placing substrates, so as to realize automatic loading of silicon wafers and substrates, and the hole frame 2 and the metal pallet 5 realize synchronous opposite movement with the help of the synchronous gears 6, which is conducive to reducing the number of servo motors 7, thereby reducing hardware costs.

[0029] In addition, the metal support plate 5 is made of metal material, so that after the substrate and the silicon wafer are laminated, the metal support plate 5 can be heated by a heating component under the metal support plate 5 to achieve heat treatment.

[0030] The inner side of the guide side frame 4 is provided with an embedding hole 9 for inserting the synchronous gear 6, so that the synchronous gear 6 is embedded in the guide side frame 4, avoiding the collision between the base on the metal support plate 5 and the synchronous gear 6, and also contributing to the beauty of the covering component. Correspondingly, the outer side of the guide side frame 4 is provided with an axial hole 10 connected to the embedding hole 9, and the motor shaft of the servo motor 7 passes through the axial hole 10 and is connected to the synchronous gear 6.

[0031] Further optimized in the above embodiment is that a pair of mutually parallel slide grooves 11 are provided on the inner side of the guide side frame 4, and the pair of slide grooves 11 are both connected to the embedding hole 9, and the two sides of the hole frame 2 and the metal support plate 5 are respectively slidably set in the pair of slide grooves 11, that is, the hole frame 2 and the metal support plate 5 are laterally positioned by the groove wall on the outer side of the slide groove 11.

[0032] What is further optimized in the above embodiment is that a pair of slide grooves 11 respectively penetrate the top and bottom of the guide side frame 4, and the top and bottom of the guide side frame 4 are removably provided with a stop plate 12, that is, the positioning of the self-disc frame and the metal pallet 5 in the vertical direction is realized, and the stop plate 12 is used to keep the hole frame 2 and the metal pallet 5 engaged with the synchronous gear 6, which also facilitates the disassembly of the hole frame 2 and the metal pallet 5.

[0033] Among them, a plurality of synchronous gears 6 are arranged on the guide side frame 4, and since the plurality of synchronous gears 6 on the same side are linked through the hole frame 2 and the metal support plate 5, at least one synchronous gear 6 is connected to the servo motor 7. Moreover, when each guide side frame 4 is provided with a servo motor 7, the synchronous gear 6 at one end of the guide side frame 4 is connected to the servo motor 7, and the servo motors 7 on the guide side frames 4 on both sides are located at different ends, so as to ensure that the hole frame 2 and the positioning plate move to both ends respectively, and both sides of the hole frame 2 and the metal support plate 5 are always connected to the synchronous gear 6 connected to the servo motor 7, so as to ensure that the forces on both sides of the hole frame 2 and the metal support plate 5 are uniform.

[0034] What is further optimized in the above embodiment is that an upper limit baffle 13 is provided on the guide side frame 4 and located at one end of one of the slide grooves 11, and a lower limit baffle 14 is provided on the guide side frame 4 and located at the other end of the other slide groove 11. When the hole frame 2 and the metal support plate 5 collide with the upper limit baffle 13 and the lower limit baffle 14 respectively, the suction cup 3 on the hole frame 2 is aligned with the base on the metal support plate 5, thereby realizing auxiliary positioning of the hole frame 2 and the metal support plate 5.

[0035] The hole frame 2 and the metal support plate 5 are both in the shape of an "I". Two notches are provided between the two sides of the hole frame 2 and the metal support plate 5, respectively located at the front end and the rear end. The suction cup 3 and the base are located between the notches at both ends. The longer sides of the hole frame 2 and the metal support plate 5 are for maintaining the engagement with the synchronous gears 6 located at both ends, and the notches at both ends are for facilitating the transfer of the base after mounting.

[0036] It is known from common technical knowledge that the present invention can be implemented by other embodiments that do not deviate from its spirit or essential features. Therefore, the embodiments disclosed above are only illustrative in all respects and are not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are included in the present invention.

Claims

1. A laminating assembly for a COB packaging substrate, comprising a hole frame (2) provided with a suction cup assembly (1), wherein the suction cup assembly (1) has a plurality of suction cups (3) capable of being raised and lowered, characterized in that: It also includes a guide side frame (4) and a metal support plate (5) arranged parallel to the bottom of the hole frame (2), wherein the guide side frame (4) is provided with a pair of guide side frames, a synchronous gear (6) is rotatably arranged on the inner side of the guide side frame (4), and a servo motor (7) connected to the synchronous gear (6) is arranged on the outer side of the guide side frame (4); The synchronous gear (6) is located between the hole frame (2) and the metal support plate (5), and meshing teeth (8) meshing with the synchronous gear (6) are provided at the bottom of both sides of the hole frame (2) and the top of both sides of the metal support plate (5).

2. A coating assembly for a COB packaging substrate according to claim 1, characterized in that: An embedding hole (9) for inserting a synchronous gear (6) is provided on the inner side of the guide side frame (4), and an axial hole (10) communicating with the embedding hole (9) is provided on the outer side of the guide side frame (4); a motor shaft of the servo motor (7) passes through the axial hole (10) and is connected to the synchronous gear (6).

3. A coating assembly for a COB packaging substrate according to claim 2, characterized in that: A pair of mutually parallel slide grooves (11) are arranged on the inner side of the guide side frame (4), and the pair of slide grooves (11) are both connected to the embedding hole (9), and the two sides of the hole frame (2) and the metal support plate (5) are respectively slidably arranged in the pair of slide grooves (11).

4. A coating assembly for a COB packaging substrate according to claim 3, characterized in that: A pair of slide grooves (11) respectively penetrate the top and bottom of the guide side frame (4), and a stop plate (12) is detachably provided on the top and bottom of the guide side frame (4).

5. The coating assembly for a COB packaging substrate according to claim 1, characterized in that: A plurality of synchronous gears (6) are provided on the guide side frame (4), and at least one of the synchronous gears (6) is connected to a servo motor (7).

6. A coating assembly for a COB packaging substrate according to claim 5, characterized in that: The synchronous gear (6) located at one end of the guide side frame (4) is connected to the servo motor (7), and the servo motors (7) on the guide side frames (4) on both sides are located at different ends.

7. The coating assembly for a COB packaging substrate according to claim 3, characterized in that: An upper limit baffle (13) is provided on the guide side frame (4) and located at one end of one of the slide slots (11), and a lower limit baffle (14) is provided on the guide side frame (4) and located at the other end of the other slide slot (11).

8. The coating assembly for a COB packaging substrate according to claim 1, characterized in that: The hole frame (2) and the metal support plate (5) are both in an "I" shape, and two notches are provided between the two sides of the hole frame (2) and the metal support plate (5), located at the front end and the rear end respectively.

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