Multilayer circuit board

Abstract

The utility model discloses a multilayer circuit board which comprises a circuit board structure, bearing strips are arranged at the bottom of the circuit board structure at equal intervals, a mounting mechanism is arranged at the bottom of each bearing strip, and each mounting mechanism comprises a sliding groove formed in the bottom of the corresponding bearing strip; the plurality of positioning assemblies slide in the inner cavity of the sliding groove, and the positioning assemblies are used for adsorbing and fixing the circuit board structure; and the multiple rubber blocks are fixed to the bottom of the inner wall of the sliding groove at equal intervals, a protection mechanism is arranged on the top of the circuit board structure, and multiple bearing mechanisms are arranged on the outer wall of the protection mechanism in a rectangular array mode. According to the utility model, the bearing strip, the mounting mechanism, the protection mechanism and the bearing mechanism are arranged in a matched manner, so that the positioning assembly can be stably adsorbed on the parts of different electric appliances, the circuit board can be quickly stabilized, the influence of external parts on the surface of the multilayer circuit board is reduced through the protection mechanism, and the practicability of the multilayer circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board. Background Art

[0002] A multi-layer circuit board is a multi-layer wiring layer with a dielectric layer between every two layers. The dielectric layer can be made very thin. A multi-layer circuit board has at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.

[0003] Application No. 202122386830.0 discloses a multi-layer circuit board, including an upper circuit board, a middle circuit board, a lower circuit board, a bolt, the top of which passes through the lower circuit board, the middle circuit board and the upper circuit board in turn, a nut one, which is installed on the top of the bolt through a thread, a bottom plate, which is arranged below the lower circuit board, and a shock absorbing mechanism, which is arranged between the lower circuit board and the bottom plate. The upper circuit board, the middle circuit board and the lower circuit board are fixed together by the cooperation of the bolt and the nut one. The above-mentioned practical upper circuit board, the middle circuit board and the lower circuit board have a stable structure. However, in real life, in order to improve the precision of the circuit board, the structure on the circuit board is relatively tight, and the circuit board is interspersed and supported by bolts, which not only occupies the space of the components on the circuit board, but also the circuit board needs to be stabilized on the electrical appliance through external connectors. The installation convenience of the circuit board is reduced, affecting the practicality of the multi-layer circuit board. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-layer circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: a multilayer circuit board, comprising: a circuit board structure, the bottom of the circuit board structure is equidistantly provided with bearing bars, the bottom of the bearing bars is provided with a mounting mechanism, and the mounting mechanism comprises:

[0006] A slide groove, which is provided at the bottom of the bearing bar;

[0007] A plurality of positioning components, wherein the plurality of positioning components slide in the inner cavity of the slide slot, and the positioning components are used for adsorption and fixation of the circuit board structure;

[0008] A plurality of rubber blocks are fixed at equal distances on the bottom of the inner wall of the slide slot. A protection mechanism is arranged on the top of the circuit board structure. A plurality of bearing mechanisms are arranged on the outer wall of the protection mechanism in a rectangular array.

[0009] Preferably, the circuit board structure includes:

[0010] A first substrate, wherein a lower surface of the first substrate is fixedly connected to the tops of the plurality of supporting bars;

[0011] a second substrate, the second substrate being disposed above the first substrate;

[0012] a third substrate, the third substrate being disposed above the second substrate;

[0013] A plurality of dielectric layers are arranged between the two first substrates and the second substrate and between the second substrate and the third substrate.

[0014] Preferably, the positioning component comprises:

[0015] Positioning rods, a plurality of said positioning rods are arranged in the inner cavity of the slide slot, and said positioning rods are slidably interlaced with the inner cavity of the slide slot;

[0016] A suction cup, the suction cup being fixed to the bottom end of the positioning rod;

[0017] A plurality of positioning grooves are respectively arranged on both sides of the bottom of the positioning rod, and the rubber block is movably engaged with the inner cavity of the positioning groove.

[0018] Preferably, the protection mechanism comprises:

[0019] A protection plate, the protection plate being arranged above the third substrate;

[0020] A plurality of connection components, wherein the plurality of connection components are arranged in a rectangular array on the lower surface of the protective plate;

[0021] A plurality of connection holes are arranged in a rectangular array on the side of the protective plate, and the connection holes are connected to the top of the supporting mechanism.

[0022] Preferably, the connection assembly comprises:

[0023] A heat dissipation rod and a heat dissipation pad, wherein the top end of the heat dissipation rod is fixed to the lower surface of the protective plate, and the heat dissipation pad is fixed to the middle part of the heat dissipation rod.

[0024] Preferably, the bearing mechanism comprises:

[0025] A fixing ring, the fixing ring being movably engaged with the inner cavity of the connecting hole;

[0026] A support column, wherein the support column is fixed to the bottom of the fixing ring;

[0027] A fixed ball, the fixed ball being fixed to the bottom end of the support column;

[0028] A plurality of ferrules are fixed on the upper surface of the third substrate in a rectangular array;

[0029] A plurality of card slots are arranged in a circular array on the top of the card sleeve.

[0030] Preferably, the fixed ball is inserted and clamped in the inner cavity of the ferrule, and the bottom of the pillar is slidably inserted and connected with the top of the ferrule.

[0031] Technical effects and advantages of the utility model:

[0032] The utility model adopts a configuration mode in which a bearing bar, a mounting mechanism, a protective mechanism and a bearing mechanism are matched with each other, and utilizes a positioning component so that the positioning component can slide freely in the inner cavity of a slide groove, so that the positioning component can be stably adsorbed on the parts of different electrical appliances, so that the circuit board can be quickly stabilized, and the waste of space is reduced. Moreover, through the protective mechanism, the influence of external parts on the surface of the multi-layer circuit board is reduced, thereby improving the practicality of the multi-layer circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0034] Figure 2 It is a schematic diagram of the overall front structure of the utility model.

[0035] Figure 3 For this utility model Figure 1 Schematic diagram of the local enlarged structure at point A in the middle.

[0036] Figure 4 For this utility model Figure 2 Schematic diagram of the local enlarged structure at point B in the middle.

[0037] Figure 5 It is a schematic diagram of the front structure of the load-bearing bar of the utility model.

[0038] In the figure: 1. circuit board structure; 11. first substrate; 12. second substrate; 13. third substrate; 14. dielectric layer; 2. bearing bar; 3. mounting mechanism; 31. slide groove; 32. positioning assembly; 321. positioning rod; 322. suction cup; 323. positioning groove; 33. rubber block; 4. protection mechanism; 41. protection plate; 42. connecting assembly; 421. heat dissipation rod; 422. heat dissipation pad; 43. connecting hole; 5. bearing mechanism; 51. fixing ring; 52. pillar; 53. fixing ball; 54. sleeve; 55. slot. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] The utility model provides Figure 1-5 A multilayer circuit board shown in the figure comprises: a circuit board structure 1, bearing bars 2 are equidistantly arranged at the bottom of the circuit board structure 1, the circuit board structure 1 comprises: a first substrate 11, a second substrate 12, a third substrate 13 and a plurality of dielectric layers 14, the lower surface of the first substrate 11 is fixedly connected to the tops of the plurality of bearing bars 2, the second substrate 12 is arranged above the first substrate 11, the third substrate 13 is arranged above the second substrate 12, the plurality of dielectric layers 14 are arranged between the two first substrates 11 and the second substrate 12 and between the second substrate 12 and the third substrate 13, and the first substrate 11, the second substrate 12 and the third substrate 13 can be stably bonded together through the dielectric layers 14, thereby reducing the space occupied by components on the circuit board and making the structure of the multilayer circuit board stable;

[0041] Further, a mounting mechanism 3 is provided at the bottom of the bearing bar 2, and the mounting mechanism 3 includes: a slide groove 31, a plurality of positioning components 32 and a plurality of rubber blocks 33. The bearing bar 2 is made of rubber material, and the slide groove 31 is opened at the bottom of the bearing bar 2. Through the opening of the slide groove 31, it is convenient to pull the inner cavity of the bearing bar 2. The slide groove 31 is a long groove structure, and a plurality of positioning components 32 slide in the inner cavity of the slide groove 31. The positioning component 32 is used for adsorption and fixation of the circuit board structure 1. A plurality of rubber blocks 33 are equidistantly fixed to the bottom of the inner wall of the slide groove 31, and the rubber blocks 33 are semicircular convex structures.

[0042] Specifically, the positioning assembly 32 includes: a positioning rod 321, a suction cup 322 and a plurality of positioning grooves 323. The plurality of positioning rods 321 are all arranged in the inner cavity of the slide groove 31. The positioning rod 321 is made of hard plastic. The positioning rod 321 is slidably and interlacedly connected with the inner cavity of the slide groove 31. The suction cup 322 is fixed to the bottom end of the positioning rod 321. The plurality of positioning grooves 323 are respectively arranged on both sides of the bottom of the positioning rod 321. The rubber block 33 is movably engaged with the inner cavity of the positioning groove 323. Through the engagement of the rubber block 33 with the inner cavity of the positioning groove 323, the suction cup 322 can be moved to different parts of the inner cavity of the bearing bar 2. By pressing the circuit board structure 1, the suction cup 322 can quickly adsorb the electrical appliance, which is convenient for stabilizing the position of the circuit board structure 1 on the top of the bearing bar 2.

[0043] Furthermore, a protective mechanism 4 is provided on the top of the circuit board structure 1, and the protective mechanism 4 includes: a protective plate 41, a plurality of connection components 42 and a plurality of connection holes 43. The protective plate 41 is provided above the third substrate 13, and the protective plate 41 is a hollow plate structure, so that it does not affect the heat dissipation of the circuit board structure 1, and can also protect the upper surface of the third substrate 13, so that the external circuits and the like do not affect the stability of the components on the third substrate 13. The plurality of connection components 42 are provided in a rectangular array on the lower surface of the protective plate 41, and the plurality of connection holes 43 are provided in a rectangular array on the side of the protective plate 41;

[0044] Specifically, the connection component 42 includes: a heat dissipation rod 421 and a heat dissipation pad 422. The top of the heat dissipation rod 421 is fixed to the lower surface of the protective plate 41, and the heat dissipation pad 422 is fixed to the middle of the heat dissipation rod 421. The heat dissipation rod 421 is made of aluminum alloy, and the heat dissipation pad 422 is a soft film structure that is easy to conduct heat, so that the components on the third substrate 13 can fit with the heat dissipation pad 422, so that the heat on the components can be transferred from the heat dissipation pad 422 to the protective plate 41 for heat dissipation.

[0045] Furthermore, the outer wall of the protection mechanism 4 is provided with a plurality of bearing mechanisms 5 in a rectangular array, the connection hole 43 is connected to the top of the bearing mechanism 5, and the bearing mechanism 5 includes: a fixing ring 51, a pillar 52, a fixing ball 53, a clamping sleeve 54 and a plurality of slots 55, the fixing ring 51 is movably clamped in the inner cavity of the connection hole 43, the pillar 52 is fixed to the bottom of the fixing ring 51, the fixing ball 53 is fixed to the bottom end of the pillar 52, a plurality of clamping sleeves 54 are fixed to the upper surface of the third substrate 13 in a rectangular array, and a plurality of slots 55 are arranged in a ring. The shaped array is opened at the top of the card sleeve 54, the fixed ball 53 is inserted and connected to the inner cavity of the card sleeve 54, the bottom of the support 52 is slidably inserted and connected with the top of the card sleeve 54, and the card slot 55 is set to allow the fixed ball 53 to be squeezed on the top of the card sleeve 54, so that the fixed ball 53 can be inserted into the inner cavity of the card sleeve 54. Through the support 52, it is convenient to support the position of the protective plate 41, so that the circuit board can be protected, and it can reduce the large pieces of dust and dirt that can fall onto the upper surface of the circuit board structure 1, thereby improving the practicality of the circuit board.

[0046] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multilayer circuit board, comprising: A circuit board structure (1), characterized in that bearing bars (2) are equidistantly arranged at the bottom of the circuit board structure (1), a mounting mechanism (3) is arranged at the bottom of the bearing bar (2), and the mounting mechanism (3) comprises: A slide groove (31), wherein the slide groove (31) is provided at the bottom of the bearing bar (2); A plurality of positioning components (32), wherein the plurality of positioning components (32) slide in the inner cavity of the slide groove (31), and the positioning components (32) are used for adsorption and fixation of the circuit board structure (1); A plurality of rubber blocks (33) are fixed at equal distances to the bottom of the inner wall of the slide groove (31); a protective mechanism (4) is arranged on the top of the circuit board structure (1); and a plurality of bearing mechanisms (5) are arranged on the outer wall of the protective mechanism (4) in a rectangular array.

2. A multilayer circuit board according to claim 1, characterized in that: The circuit board structure (1) comprises: A first substrate (11), the lower surface of the first substrate (11) being fixedly connected to the tops of the plurality of supporting bars (2); A second substrate (12), the second substrate (12) being arranged above the first substrate (11); A third substrate (13), the third substrate (13) being arranged above the second substrate (12); A plurality of dielectric layers (14) are provided between the two first substrates (11) and the second substrate (12) and between the second substrate (12) and the third substrate (13).

3. A multilayer circuit board according to claim 2, characterized in that: The positioning assembly (32) comprises: Positioning rods (321), wherein a plurality of the positioning rods (321) are disposed in the inner cavity of the slide groove (31), and the positioning rods (321) are slidably interlaced with the inner cavity of the slide groove (31); A suction cup (322), wherein the suction cup (322) is fixed to the bottom end of the positioning rod (321); A plurality of positioning grooves (323) are respectively provided on both sides of the bottom of the positioning rod (321); the rubber block (33) is movably engaged with the inner cavity of the positioning groove (323).

4. A multilayer circuit board according to claim 2, characterized in that: The protection mechanism (4) comprises: A protective plate (41), wherein the protective plate (41) is arranged above the third substrate (13); A plurality of connection components (42), wherein the plurality of connection components (42) are arranged in a rectangular array on the lower surface of the protection plate (41); A plurality of connection holes (43), the plurality of connection holes (43) are opened in a rectangular array on the side of the protection plate (41), and the connection holes (43) are connected to the top of the supporting mechanism (5).

5. A multilayer circuit board according to claim 4, characterized in that: The connection assembly (42) comprises: A heat dissipation rod (421) and a heat dissipation pad (422), wherein the top end of the heat dissipation rod (421) is fixed to the lower surface of the protective plate (41), and the heat dissipation pad (422) is fixed to the middle of the heat dissipation rod (421).

6. A multilayer circuit board according to claim 4, characterized in that: The carrying mechanism (5) comprises: A fixing ring (51), the fixing ring (51) being movably engaged with the inner cavity of the connecting hole (43); A support (52), wherein the support (52) is fixed to the bottom of the fixing ring (51); A fixing ball (53), wherein the fixing ball (53) is fixed to the bottom end of the support column (52); A ferrule (54), wherein a plurality of ferrules (54) are fixed on the upper surface of the third substrate (13) in a rectangular array; A plurality of card slots (55) are provided in a circular array on the top of the card sleeve (54).

7. A multilayer circuit board according to claim 6, characterized in that: The fixed ball (53) is inserted and clamped in the inner cavity of the clamping sleeve (54), and the bottom of the support (52) is slidably inserted and connected with the top of the clamping sleeve (54).

Images