Ultrasonic sensor based on U-shaped groove bonding pad
By setting grooves in the sound-absorbing material of the ultrasonic sensor and designing U-shaped groove pads on the PCB board, the problem of position deviation of the PCB board in the prior art is solved, and the automatic assembly and welding of the ultrasonic sensor is realized, which improves production efficiency and reduces costs.
Patent Information
- Application Number
- CN202421016070.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-11
AI Technical Summary
When fixing PCB boards, existing ultrasonic sensors have position deviations due to manual adjustments, which cannot achieve automated welding, affecting production efficiency and cost.
The ultrasonic sensor design based on the U-slot pad is adopted. By setting grooves in the sound-absorbing material and designing the U-slot pad on the PCB board, the leads are automatically positioned and soldered.
It realizes automatic assembly and welding of PCB boards, improves production efficiency and reduces production costs.
Smart Images
Figure CN222638785U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of ultrasonic sensors, in particular to an ultrasonic sensor based on a U-shaped groove pad. Background Art
[0002] At present, ultrasonic sensors are filled with sound-absorbing materials and then assembled on PCB boards, which are fixed with glass glue. When glass glue is used to fix the PCB board, the PCB board will deflect in different directions if the position is adjusted manually. The amount of glass glue affects the height position of the final assembly of the PCB board. Therefore, the PCB board can only be assembled manually, that is, the PCB board cannot be positioned and can only be manually adjusted. The amount of glass glue affects the height position of the PCB board assembly. The position of the PCB board has a large deviation, which makes it difficult to position the positive and negative leads, and ultimately makes it impossible to achieve automated welding. Utility Model Content
[0003] The utility model provides an ultrasonic sensor based on a U-shaped groove pad to solve the above problem.
[0004] The utility model is realized by the following technical solutions:
[0005] An ultrasonic sensor based on a U-shaped groove pad, comprising:
[0006] A shell, wherein a chip and a sound absorbing material are sequentially installed from one end of the shell to the other end, and a groove for embedding a PCB is provided in the sound absorbing material;
[0007] A PCB board, wherein two U-shaped U-shaped slot pads for welding leads are recessed inward on the same side of the PCB board, one end of the lead is welded to the U-shaped slot pad, and the other end of the lead is welded to the chip, the PCB board is embedded in the groove of the sound absorbing material, and the U-shaped slot pad is exposed on the surface of the sound absorbing material;
[0008] A terminal wire, one end of which is welded to the PCB board, and the other end of which is connected to a circuit device using an ultrasonic sensor.
[0009] As an optimization, the shell includes a shell and a shell cover, the shell is a hollow structure with one end closed and the other end open, the shell cover is fixedly connected to the open end of the shell, a chip is fixedly installed on the inner side wall of the closed end of the shell, and the sound-absorbing material is filled in the shell and covers the chip, and the sound-absorbing material is recessed in the direction of the closed end of the shell and is provided with a groove for embedding the PCB.
[0010] As an optimization, two leads are provided, and the two leads are respectively welded on the U-shaped groove pad.
[0011] As an optimization, the inner side wall of the closed end of the shell is planar.
[0012] As an optimization, the distance from any position of the U-shaped groove pad to the inner wall of the closed end of the shell is greater than the distance from the surface of the sound absorbing material away from the closed end of the shell to the inner wall of the closed end of the shell.
[0013] As an optimization, the shell cover is fixedly connected to the open end of the shell body by welding.
[0014] As an optimization, the shell is made of aluminum.
[0015] As an optimization, the sound absorbing material is polyester foam.
[0016] As an optimization, the sound absorbing material is polyurethane foam.
[0017] As an optimization, the sound absorbing material is polystyrene foam.
[0018] Compared with the prior art, the utility model has the following advantages and beneficial effects:
[0019] The utility model optimizes the structure of the PCB board of the ultrasonic sensor, designs the lead pad of the PCB board into a U-shaped groove structure, and the U-shaped groove pad is used to position the lead; one end of the lead is firstly welded to the chip, and then a mold designed according to the shape and size of the PCB board is placed in the shell (the mold needs to be suspended and fixed, and the mold can be suspended by a mechanical arm), and then the sound-absorbing material is filled, and the mold is taken out after the sound-absorbing material is fully solidified, and a groove with the same shape, size and position as the PCB board is formed on the surface of the sound-absorbing material, and then the PCB board is placed in the groove to ensure the assembly position of the PCB board; then two positive and negative lead wires are placed in the corresponding U-shaped groove pads, the lead positions are fixed, and then they can be directly welded; in this way, the entire assembly process can be automated, and finally the purpose of improving product production efficiency and reducing production costs is achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The drawings described herein are used to provide a further understanding of the embodiments of the present utility model, constitute a part of this application, and do not constitute a limitation of the embodiments of the present utility model. In the drawings:
[0021] Figure 1 This is a schematic diagram of the structure of an ultrasonic sensor based on a U-shaped groove pad according to the utility model;
[0022] Figure 2 This is a schematic diagram of the structure of the PCB board of the utility model;
[0023] Figure 3 for Figure 1 Cross-sectional view without terminal wires.
[0024] Marks and corresponding parts names in the attached drawings:
[0025] 1-shell, 2-PCB board, 2a-U-slot pad, 3-lead, 4-sound absorbing material, 5-terminal wire, 6-welding material, 7-chip. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with embodiments and drawings. The schematic implementation manner of the utility model and its description are only used to explain the utility model and are not intended to limit the utility model.
[0027] This embodiment 1 provides an ultrasonic sensor based on a U-shaped groove pad, such as Figure 1-Figure 3 As shown, including:
[0028] The shell is provided with a chip 7 and a sound absorbing material 4 in sequence from one end to the other end of the shell, and a groove for embedding the PCB board 2 is provided in the sound absorbing material 4; the shell is made of aluminum. Of course, other materials that can be used as the shell of the ultrasonic sensor can also be used.
[0029] In this embodiment, the housing includes a shell 1 and a shell cover (not marked in the figure), the shell cover is provided with a hole through which the terminal wire passes, the shell 1 is a hollow structure with one end closed and the other end open, the shell cover is fixedly connected to the open end of the shell 1 by welding, and the inner side wall of the closed end of the shell 1 is flat. The shell cover is fixedly connected to the open end of the shell 1, a chip 7 is fixedly installed on the inner side wall of the closed end of the shell 1, and the sound absorbing material is filled in the shell 1 and covers the chip, and the sound absorbing material is recessed in the direction of the closed end of the shell 1 and is provided with a groove for embedding the PCB board 2.
[0030] The sound-absorbing material can be foam plastic, which is a common sound-absorbing material, and common ones include polyurethane foam, polyester foam and polystyrene foam, etc. Foam plastic has good sound absorption and damping properties, and can effectively absorb sound and reduce vibration noise.
[0031] PCB board 2, two U-shaped U-shaped slot pads 2a for welding leads 3 are recessed inward on the same side of the PCB board 2, one end of the leads 3 is welded to the U-shaped slot pad 2a, and the other end of the leads 3 is welded to the chip 7, the PCB board 2 is embedded in the groove of the sound absorbing material, and the U-shaped slot pads 2a are exposed on the surface of the sound absorbing material; that is, in this embodiment, the distance from any point on the surface of the sound absorbing material away from the closed end of the shell to the inner side wall of the closed end of the shell is the same, that is, the surface of the sound absorbing material is flat, and the distance from any position of the U-shaped slot pad 2a to the inner side wall of the closed end of the shell 1 is greater than the distance from the surface of the sound absorbing material 4 away from the closed end of the shell 1 to the inner side wall of the closed end of the shell 1. That is, if the opening of the U-shaped slot pad 2a faces upward, the bottom of the U-shaped slot pad 2a is also above the surface of the sound absorbing material.
[0032] In this embodiment, two leads 3 are provided, and the two leads 3 are respectively welded to the U-shaped groove pad 2a through welding materials 6. The welding material can be solder paste or other weldable materials.
[0033] A terminal wire 5, one end of which is welded to the PCB board 2, and the other end of which is connected to a circuit device using an ultrasonic sensor.
[0034] The manufacturing process of the structure of the utility model is:
[0035] The positive and negative leads on the ultrasonic sensor chip are automatically welded to the chip, a mold with the same shape as the PCB board is placed inside the shell of the ultrasonic sensor, and then the sound-absorbing material is automatically filled (the leads must extend out of the sound-absorbing material). After the sound-absorbing material is solidified, the mold is taken out to form a groove with the same shape, size and position as the PCB board. The PCB board is automatically assembled into the groove and the leads are placed in the corresponding U-groove pads of the PCB board, and finally automatically welded.
[0036] The utility model optimizes the structure of the PCB board of the ultrasonic sensor, designs the lead pad of the PCB board into a U-shaped groove structure, and the U-shaped groove pad is used to position the lead; thus, the entire assembly process can be automated, and ultimately the purpose of improving product production efficiency and reducing production costs is achieved.
[0037] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0038] It should also be noted that, in this specification, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0039] At the same time, the devices used in this specification are all existing devices, and those skilled in the art can obtain them through purchase, reference, etc.
[0040] In summary, although the utility model has been disclosed in the above embodiments, it is not intended to limit the utility model. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the utility model shall be determined by the scope of the attached patent application.
[0041] Those skilled in the art should understand that within the scope of the claims and their equivalents, various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors.
[0042] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only the specific implementation method of the utility model and is not used to limit the protection scope of the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.
Claims
1. An ultrasonic sensor based on a U-shaped groove pad, characterized in that: include: A shell, wherein a chip (7) and a sound absorbing material (4) are sequentially installed from one end of the shell to the other end, and a groove for embedding a PCB board (2) is provided in the sound absorbing material (4); A PCB board (2), wherein two U-shaped U-shaped groove pads (2a) for welding leads (3) are recessed inwardly on the same side of the PCB board (2), one end of the lead (3) is welded to the U-shaped groove pad (2a), and the other end of the lead (3) is welded to the chip (7), the PCB board (2) is embedded in the groove of the sound absorbing material, and the U-shaped groove pads (2a) are exposed on the surface of the sound absorbing material; A terminal wire (5), one end of which is welded to the PCB board (2), and the other end of which is connected to a circuit device using an ultrasonic sensor.
2. The ultrasonic sensor based on the U-shaped groove pad according to claim 1, characterized in that: The housing comprises a shell (1) and a shell cover; the shell (1) is a hollow structure with one end closed and the other end open; the shell cover is fixedly connected to the open end of the shell (1); a chip (7) is fixedly mounted on the inner side wall of the closed end of the shell (1); the sound absorbing material is filled in the shell (1) and covers the chip; the sound absorbing material is recessed in the direction of the closed end of the shell (1) and is provided with a groove for embedding the PCB board (2).
3. The ultrasonic sensor based on the U-shaped groove pad according to claim 1, characterized in that: Two lead wires (3) are provided, and the two lead wires (3) are respectively welded on the U-shaped groove welding pad (2a).
4. The ultrasonic sensor based on the U-shaped groove pad according to claim 2, characterized in that: The inner side wall of the closed end of the shell (1) is planar.
5. The ultrasonic sensor based on the U-shaped groove pad according to claim 4, characterized in that: The distance from any position of the U-shaped groove welding pad (2a) to the inner side wall of the closed end of the shell (1) is greater than the distance from the surface of the sound absorbing material (4) away from the closed end of the shell (1) to the inner side wall of the closed end of the shell (1).
6. The ultrasonic sensor based on the U-shaped groove pad according to claim 2, characterized in that: The shell cover is fixedly connected to the open end of the shell (1) by welding.
7. The ultrasonic sensor based on the U-shaped groove pad according to claim 2, characterized in that: The shell is made of aluminum.
8. The ultrasonic sensor based on the U-shaped groove pad according to claim 1, characterized in that: The sound absorbing material (4) is polyester foam.
9. The ultrasonic sensor based on a U-shaped groove pad according to claim 1, characterized in that: The sound absorbing material (4) is polyurethane foam.
10. The ultrasonic sensor based on the U-shaped groove pad according to claim 1, characterized in that: The sound absorbing material (4) is polystyrene foam.