PCB support structure

Abstract

The utility model provides a PCB (Printed Circuit Board) support structure. The PCB support structure comprises a PCB, a support and a radiator, the PCB circuit board is arranged on the bracket; the PCB is provided with a heating element, and the heating element is wrapped by a pouring sealant. And the radiator is arranged on the bracket and is in contact with the pouring sealant. The PCB support structure provided by the utility model can solve the problems that the heat dissipation effect of the PCB is general and the material cost is high.

Description

Technical Field

[0001] The present application belongs to the technical field of mounting brackets, and in particular, relates to a PCB circuit board bracket structure. Background Art

[0002] With the rapid development of electronic science and technology, electronic components, components, instruments and meters are widely used in the electronics industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the influence of the working environment and improve the electrical performance and stability of electronic components, it is often necessary to perform potting protection on electronic devices. Potting is one of the important processes in the assembly of electronic components. It is an operation process in which potting materials are filled into the gaps of electronic components by mechanical or manual methods, and processed and formed under certain conditions to isolate the electronic components and circuits inside the components from the environment. At present, electronic components and integrated circuits are rapidly developing in the direction of high performance, density, high precision and high power, which will inevitably lead to a significant increase in the heat generation of electronic components. At the same time, the miniaturization of electronic components has sharply reduced its heat dissipation space, and the heat dissipation channels are relatively crowded, resulting in a large amount of heat accumulation. If the heat cannot be effectively conducted out in time, the operating temperature of the circuit will rise rapidly, resulting in the possibility of failure of electronic components increasing exponentially, seriously affecting the stability and reliability of electronic components, and even shortening the service life of electronic equipment.

[0003] The conventional welding position of high-temperature components on existing PCBs (welded on the upper surface of the PCB) has a general heat dissipation effect, and the existing PCB brackets are often matched to the size of the entire PCB. The size of the bracket is determined by the size of the supported PCB, so that the area below the PCB that is not so necessary to be potted is also potted, resulting in high material costs.

[0004] Therefore, how to provide a PCB bracket structure to solve the above-mentioned problems has become an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the present application is to provide a PCB circuit board bracket structure, which is used to solve the problems of general heat dissipation effect and high material cost of the PCB circuit board.

[0006] In a first aspect, the present application provides a PCB circuit board bracket structure, the PCB circuit board bracket structure comprising: a PCB circuit board, a bracket and a heat sink;

[0007] The PCB circuit board is arranged on the bracket;

[0008] The PCB circuit board is provided with a heating element, and the heating element is wrapped by a potting glue;

[0009] The heat sink is arranged on the bracket and is in contact with the potting glue.

[0010] In an implementation of the first aspect, the heating element is reversely soldered to the lower surface of the PCB circuit board.

[0011] In an implementation of the first aspect, the bracket includes a positioning structure for ensuring that the potting glue is accurately filled around the heating element during the potting process to avoid overflowing to unnecessary areas.

[0012] In an implementation of the first aspect, the positioning structure includes an adjustable fence or partition, which is used to adjust according to the size and position of different heating elements to achieve accurate local potting of the potting glue.

[0013] In an implementation manner of the first aspect, the heating element includes at least a sampling resistor and a transistor.

[0014] In an implementation of the first aspect, the bracket can be detachably mounted on the PCB circuit board and the heat sink.

[0015] In an implementation of the first aspect, a hollow structure is formed between the PCB circuit board and the bracket.

[0016] In an implementation manner of the first aspect, the bracket is a plastic bracket.

[0017] In an implementation of the first aspect, the potting glue is made of a material with high thermal conductivity.

[0018] In an implementation of the first aspect, a contact surface between the heat sink and the potting compound is provided with a heat conduction structure, and the heat conduction structure adopts a concave-convex structure design or a microchannel design to improve heat dissipation efficiency.

[0019] As described above, the PCB circuit board bracket structure described in the present application has the following beneficial effects: compact structure, utilizing the space between the PCB and the bracket to improve power density; flexible design of the bracket structure, significantly reducing material costs and improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a schematic diagram of the PCB circuit board bracket structure described in an embodiment of the present application.

[0021] Figure 2 Shown is a schematic diagram of the heating element welding method described in an embodiment of the present application.

[0022] Figure 3 Shown is a schematic diagram of the partial enclosed fence described in an embodiment of the present application.

[0023] Figure 4 The figure shows a rear view of the embodiment of the present application applied in the field of frequency converter.

[0024] Component number description

[0025] 11 PCB circuit board

[0026] 111 PCB circuit board upper surface

[0027] 112 PCB circuit board bottom surface

[0028] 12 Bracket

[0029] 13 Radiator

[0030] 14 Potting glue

[0031] 21 Heating element

[0032] 31 Partial potting fence DETAILED DESCRIPTION

[0033] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0034] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0035] The following embodiments of the present application provide a PCB circuit board bracket structure, which solves the heat dissipation problem and material cost problem of the PCB.

[0036] The principle and implementation method of a PCB circuit board bracket structure of this embodiment will be described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can understand the PCB circuit board bracket structure of this embodiment without creative work.

[0037] See also Figure 1 to Figure 2 , this embodiment provides a PCB circuit board bracket structure, the PCB circuit board bracket structure includes: a PCB circuit board 11, a bracket 12 and a heat sink 13;

[0038] The PCB circuit board 11 is arranged on the bracket 12;

[0039] The PCB circuit board 11 is provided with a heating element 21, and the heating element 21 is wrapped by a potting glue 14;

[0040] The heat sink 13 is disposed on the bracket 12 and is in contact with the potting compound 14 .

[0041] Specifically, the bracket 12 can be detachably mounted on the PCB circuit board 11 and the radiator 13; further, the combination of the PCB circuit board 11, the bracket 12 and the radiator 13 allows modular replacement and quick maintenance.

[0042] See also Figure 2 , Figure 2 It is shown as a schematic diagram of the heating element welding method, wherein the heating element 21 is reversely welded to the lower surface 112 of the PCB circuit board 11, wherein the heating element 21 at least includes a sampling resistor and a transistor. Since the operating temperature of the existing PCB sampling resistor is very high, the heat dissipation effect of the conventional welding position (welded on the upper surface 111 of the PCB) is general, so by reversely welding the heating element 21 to the lower surface 112 of the PCB, the element can be closer to the radiator, which can reduce the distance of heat transfer and thus improve the heat dissipation efficiency; secondly, the traditional front welding may generate a large thermal resistance due to the long distance between the element and the radiator, while reverse welding helps to reduce this thermal resistance, so that the heat can be conducted out faster. Finally, the components can be concentrated in a smaller area of ​​the PCB by reverse welding, which can improve the power density of the entire circuit, that is, it can withstand higher power per unit area.

[0043] See also Figure 3 , Figure 3 It is shown as a schematic diagram of a local potting fence, and the bracket 12 includes a positioning structure for ensuring that the potting compound 14 is accurately filled around the heating element 21 during the potting process to avoid overflowing to unnecessary areas. Specifically, the positioning structure includes an adjustable local potting fence 31 or partition, which is used to adjust according to the size and position of different heating elements 21 to achieve accurate local potting of the potting compound. That is, the bracket 12 provided in the present application can realize the design of different positioning mechanisms according to the specific structure of the upper PCB circuit board 11 to suit different upper structures. At the same time, the design of the bracket allows unnecessary areas to be excluded during the potting process to reduce the amount of potting compound used. The present application can reduce the amount of potting compound used by local potting, which can reduce material costs, while also reducing material waste, in line with environmental protection concepts.

[0044] In one embodiment, the contact surface of the heat sink 13 and the potting compound 14 is provided with a heat conduction structure, and the heat conduction structure adopts a concave-convex structure design or a microchannel design to improve the heat dissipation efficiency. Among them, the potting compound 14 adopts a material with high thermal conductivity, which can further avoid direct exposure of components and circuits, thereby improving waterproof, dustproof and moisture-proof performance, and can also play a role in fixing internal components, reducing the risk of failure caused by vibration or movement during use.

[0045] See also Figure 4 , Figure 4 The display shows the assembled rear view of the application in the field of inverters. In the field of inverter technology, such as the field of air conditioning inverters, the heat dissipation problem of PCB may be manifested in the following aspects: The circuit is easy to be damaged: The high-voltage to low-voltage external mainboard circuit in the inverter air conditioner is easy to be damaged due to poor heat dissipation, which is a common weakness of the inverter air conditioner. Insufficient heat dissipation efficiency: Traditional heat dissipation methods such as adding heat sinks and relying on the convection wind of the external fan to dissipate heat have the problem of insufficient efficiency, especially when working in high temperature or closed environment, the heat dissipation effect is not good. Material limitation: The widely used PCB board material may have limitations in heat dissipation performance, which requires improving the heat dissipation efficiency by improving materials or design. High-performance components generate large heat: High-performance processors, MOSFETs, high-power LEDs, IGBTs and other components used in modern electronic devices generate large heat, which puts higher requirements on the heat dissipation of PCBs. Equipment miniaturization leads to heat dissipation difficulties: With the miniaturization and precision of electronic equipment, the heat dissipation space becomes more limited, which makes heat dissipation a more difficult problem. The impact of temperature on performance and reliability: The working performance of electronic chips is greatly affected by temperature. Excessive temperature will significantly reduce the reliability of the system, which is not conducive to the promotion and use of inverter air conditioners. Therefore, it is proposed to apply this application in the field of frequency converter technology:

[0046] The heating element of the upper PCB circuit board is reversely welded to the lower surface of the PCB circuit board, that is, the surface near the radiator, and a fence for local potting is formed by cooperating with the bracket suitable for the welding position of the high-temperature element. The heating element is wrapped with potting potting glue, and the temperature is directly conducted to the radiator substrate below through the heat conduction structure of the contact surface of the radiator and the potting glue, thereby quickly reducing the temperature inside the inverter. In the field of inverters, the application can improve the flow of current and reduce energy loss by reverse welding the circuit board, thereby improving the energy efficiency of the entire system. By optimizing the circuit layout, reducing electromagnetic interference and improving the integrity of the signal, the stability and reliability of the system are enhanced. Due to the improvement of the heat dissipation effect and the reduction of electromagnetic interference, it helps to extend the service life of the inverter and related electronic equipment. In addition, one of the core functions of the inverter is to adjust the running speed of the motor. The reverse welding circuit board can help achieve more accurate speed control due to its optimized design. Secondly, through local potting, the overall structure of the electronic components can be enhanced to make them more resistant to external shocks and vibrations. This can significantly improve the durability and reliability of the inverter, which is a device that is often in working state and may be subject to external physical influences. The use of potting glue is critical to ensure that the inverter can work normally in harsh environments and effectively improve its protection performance.

[0047] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0048] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A PCB circuit board support structure, characterized in that: The PCB circuit board bracket structure comprises: a PCB circuit board, a bracket and a radiator; The PCB circuit board is arranged on the bracket; The PCB circuit board is provided with a heating element, and the heating element is wrapped by a potting glue; The heat sink is arranged on the bracket and is in contact with the potting glue.

2. The PCB circuit board support structure according to claim 1, characterized in that: The heating element is reversely soldered to the lower surface of the PCB circuit board.

3. The PCB circuit board support structure according to claim 1, characterized in that: The bracket includes a positioning structure for ensuring that the potting glue is accurately filled around the heating element during the potting process to avoid overflowing to unnecessary areas.

4. The PCB circuit board support structure according to claim 3, characterized in that: The positioning structure includes an adjustable fence or partition, which is used to adjust according to the size and position of different heating elements to achieve accurate local potting of the potting glue.

5. The PCB circuit board support structure according to claim 1, characterized in that: The heating element at least includes a sampling resistor and a transistor.

6. The PCB circuit board support structure according to claim 1, characterized in that: The bracket can be detachably mounted on the PCB circuit board and the radiator.

7. The PCB circuit board support structure according to claim 1, characterized in that: A hollow structure is formed between the PCB circuit board and the bracket.

8. The PCB circuit board support structure according to claim 1, characterized in that: The bracket is a plastic bracket.

9. The PCB circuit board support structure according to claim 1, characterized in that: The potting glue is made of a material with high thermal conductivity.

10. The PCB circuit board support structure according to claim 1, characterized in that: The contact surface between the heat sink and the potting glue is provided with a heat conduction structure, and the heat conduction structure adopts a concave-convex structure design or a microchannel design to improve the heat dissipation efficiency.

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