Bending-resistant LED support and LED device

Abstract

The utility model discloses a bending-resistant LED support and an LED device. The bending-resistant LED support comprises a support body, metal layers arranged on the support body, and a plurality of insulating river channels arranged between the metal layers. The insulating river channel is arranged in the corner direction of the metal layer, and the metal layer is divided into a first electrical connection part and more than one second electrical connection part based on the insulating river channel; the second electrical connection part is located at the corner position of the metal layer, and the middle position of the first electrical connection part is provided with a chip installation area. The insulating river channel is arranged at the corner position of the metal layer of the support body to form the first electrical connection part and the second electrical connection part, so that the first electrical connection part can cover most of the area of the support body, the structural rigidity of the support body is improved, the risk that the support body is bent and broken due to stress is reduced, and the service life of the support body is prolonged. The overall structural stability of the LED device is improved, and it is ensured that the LED device has a good light emitting efficiency.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of LED packaging, and in particular to an anti-bending bracket and an LED device. Background Art

[0002] At present, LED device brackets are mainly made of materials such as PCT, EMC, SMC, PPA and ceramics, so that the brackets have good heat resistance to meet the normal use of LED devices under high temperature conditions.

[0003] The existing LED bracket divides the metal layer into multiple independent pads by setting an insulating channel to facilitate the solid-die installation of the LED chip. However, due to the high brittleness of materials such as PCT, EMC, and SMC, the pad structure formed by the current through-type insulating channel causes the existing LED bracket to bend and break easily under the action of external forces during use, affecting the overall structural stability and light output efficiency of the LED device. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art. The utility model provides a bending-resistant bracket and an LED device. The first electrical connection part formed based on the insulating channel can cover most areas of the bracket body, reduce the risk of bending and breaking of the bracket body under force, improve the overall structural stability of the LED device, and ensure that the LED device has good light output efficiency.

[0005] The utility model provides an anti-bending LED bracket, which comprises: a bracket body, a metal layer arranged on the bracket body, and a plurality of insulating channels arranged between the metal layers;

[0006] The insulating channel is arranged in the corner direction of the metal layer, and the metal layer is divided into a first electrical connection portion and one or more second electrical connection portions based on the insulating channel;

[0007] The second electrical connection portion is located at a corner of the metal layer, and a chip mounting area is disposed in the middle of the first electrical connection portion.

[0008] Furthermore, any of the insulating channels is an L-shaped structure, and two ends of the L-shaped structure are correspondingly connected to two adjacent sides of the metal layer.

[0009] Furthermore, the material of the anti-bending LED bracket is one of PCT, EMC, SMC, PPA, and ceramic.

[0010] Furthermore, at least one of the second electrical connection portions has an electrical property opposite to that of the first electrical connection portion.

[0011] The utility model also provides an LED device, which comprises: the anti-bending LED bracket and one or more LED chips;

[0012] The LED chip is disposed on the first electrical connection portion, the LED chip is electrically connected to the first electrical connection portion based on a bonding wire, and the LED chip is electrically connected to the second electrical connection portion based on a bonding wire.

[0013] Furthermore, the support body forms a single crystal pad structure based on the first electrical connection portion and the second electrical connection portion;

[0014] Or the bracket body forms a polycrystalline pad structure based on the first electrical connection part and the plurality of the second electrical connection parts.

[0015] Furthermore, the distance between any two adjacent LED chips is d, and the value range of d is: 50 μm<d≤200 μm.

[0016] Furthermore, the LED device is provided with a plurality of bonding wires, wherein the plurality of bonding wires include at least one long-distance bonding wire and at least one short-distance bonding wire;

[0017] The long distance bonding wire spans over the short distance bonding wire.

[0018] Further, the long distance welding line includes a first vertical section, a first curved section, a first flat section and a first inclined section;

[0019] The first vertical section is connected to one end of the first flat section based on the first curved section, and the other end of the first flat section is connected to the first inclined section.

[0020] Further, the short distance welding line includes a second gentle section;

[0021] The horizontal height of the first flat section is greater than the horizontal height of the second flat section, and the length of the first flat section is greater than the length of the second flat section.

[0022] The utility model provides an anti-bending bracket and an LED device. An insulating channel is arranged at the corner position of the metal layer of the bracket body to form a first electrical connection part and a second electrical connection part, so that the first electrical connection part can cover most areas of the bracket body, thereby improving the structural rigidity of the bracket body, thereby reducing the risk of bending and breaking of the bracket body under force, improving the overall structural stability of the LED device, and ensuring that the LED device has good light output efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 This is a schematic diagram of the structure of the anti-bending LED bracket in the embodiment of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the LED device in the second embodiment of the present utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the LED device in the embodiment of the utility model;

[0027] Figure 4 It is a structural side view of the LED device in the embodiment of the utility model;

[0028] Figure 5 It is a structural side view of the LED device from another perspective in the embodiment of the utility model. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1:

[0031] Figure 1 A schematic structural diagram of an anti-bending LED bracket in an embodiment of the utility model is shown, wherein the anti-bending LED bracket comprises: a bracket body 1 , a metal layer 3 arranged on the bracket body 1 , and a plurality of insulating channels 2 arranged between the metal layers 3 .

[0032] Specifically, any of the insulating channels 2 is arranged at a corner position of the metal layer 3 , and the metal layer 3 is divided into a first electrical connection part 31 and a plurality of second electrical connection parts 32 based on the plurality of insulating channels 2 , and the second electrical connection parts 32 are arranged around the first electrical connection part 31 .

[0033] Furthermore, a chip mounting area is provided in the middle of the first electrical connection portion 31, and the chip mounting area is used to place and install LED chips. The LED chips are concentrated in the middle of the first electrical connection portion 31, so as to improve the light output efficiency of the LED chips.

[0034] Specifically, any of the insulating channels 2 is an L-shaped structure, and the two ends of the L-shaped structure are correspondingly connected to two adjacent sides of the metal layer 3. Based on the L-shaped structure, the corner position of the metal layer 3 is divided into a second electrical connection part 32, so as to electrically connect the LED chip to the metal layer 3.

[0035] Furthermore, by arranging a plurality of L-shaped insulating channels 2 distributed at the corner positions of the metal layer 3, the insulating channels 2 do not divide the middle area of ​​the metal layer 3, thereby avoiding the situation where the insulating channels 2 penetrate the metal layer 3, so that the first electrical connection part 31 formed in the middle of the metal layer 3 can cover the top surface of the bracket all around, and can support the bracket, thereby improving the force uniformity and force stability of the bracket, and avoiding bending and breaking of the bracket.

[0036] Specifically, the material of the anti-bending LED bracket can be one of poly 1,4-cyclohexylene dimethylene terephthalate (PCT), epoxy molding compound (EMC), sheet molding compound (SMC), polyphthalamide (PPA), and ceramic. The PCT, EMC, SMC, PPA and ceramic materials have good heat resistance and are brittle, and are prone to bending and breaking under stress. By arranging a plurality of insulating channels 2 distributed at the corner positions, the integrity of the middle area of ​​the metal layer 3 is retained, so that the first electrical connection part 31 can cover most of the top surface of the bracket, thereby improving the overall rigidity of the bracket, thereby improving the anti-bending performance of the bracket and reducing the risk of bending and breaking of the bracket under stress.

[0037] Specifically, at least one of the second electrical connection parts 32 has an electrical opposite connection to the pad of the first electrical connection part 31, that is, one of the several second electrical connection parts 32 is set as a common pole pad, so that several LED chips of the bracket body can form a common pole connection relationship, thereby improving the convenience of circuit arrangement of the LED device.

[0038] An embodiment of the utility model provides a bending-resistant LED bracket, which is provided with an insulating channel 2 at the corner position of the metal layer 3 of the bracket body 1 to form a first electrical connection part 31 and one or more second electrical connection parts 32, so that the first electrical connection part 31 can cover most areas of the bracket body 1, thereby improving the structural rigidity of the bracket body 1 and reducing the risk of bending and breaking of the bracket body 1 under stress.

[0039] Embodiment 2:

[0040] Figure 2 A structural schematic diagram of an LED device in an embodiment of the utility model is shown, wherein the LED device comprises an anti-bending LED bracket and an LED chip arranged on the bracket, wherein the LED bracket comprises a bracket body 1, and the bracket body 1 is a single crystal pad structure, that is, the metal layer 3 of the bracket body 1 forms a first electrical connection part 31 and a second electrical connection part 32 based on an insulating channel 2, the LED chip is welded and fixed in the middle position of the first electrical connection part 31, the positive terminal of the LED chip is electrically connected to the first electrical connection part 31 based on a welding wire, and the negative terminal of the LED chip is electrically connected to the second electrical connection part 32 based on a welding wire.

[0041] Further, according to actual packaging requirements, the positive terminal of the LED chip can be electrically connected to the second electrical connection part 32 based on a welding wire, and the negative terminal of the LED chip can be electrically connected to the first electrical connection part 31 based on a welding wire.

[0042] For details, please refer to Figure 2 The insulating channel 2 is arranged at the upper right corner of the metal layer 3 of the bracket body 1, so that the second electrical connection part 32 is formed at the upper right corner of the bracket body 1, so that the first electrical connection part 31 can cover most of the top area of ​​the bracket body 1, and the first electrical connection part 31 is connected to the four sides of the bracket body 1, thereby improving the reliability of the connection between the first electrical connection part 31 and the bracket body 1, thereby improving the overall structural stability of the bracket body 1 and reducing the risk of bending and rupture of the bracket body 1 under stress.

[0043] Furthermore, the LED chip and the first electrical connection part 31 are fixed by an insulating bonding adhesive. The insulating adhesive can be a silicone bonding adhesive with good bonding properties, so that the LED chip can be firmly adhered to the bracket body 1, and the insulating bonding adhesive has good heat resistance and anti-aging properties, which can reduce the risk of aging between the LED chip bonding position and the bracket body 1, and at the same time reduce the risk of the LED chip peeling off from the bracket body 1.

[0044] An embodiment of the utility model provides an LED device, in which an L-shaped insulating channel 2 is arranged at a corner position of a metal layer 3 of a bracket body 1 to form a first electrical connection portion 31 and a second electrical connection portion 32, so that the first electrical connection portion 31 can cover most areas of the bracket body 1, thereby improving the structural rigidity of the bracket body 1, thereby reducing the risk of bending and breaking of the bracket body 1 under stress, improving the overall structural stability of the LED device, and ensuring the light output efficiency of the LED device.

[0045] Embodiment three:

[0046] Figure 3 The schematic diagram of the structure of the LED device in the embodiment of the utility model is shown. Figure 4 The structure side view of the LED device in the embodiment of the utility model is shown. Figure 5 The LED device in the embodiment of the utility model is shown in another side view of the structure of the LED device from another perspective. The LED device comprises an anti-bending bracket and a plurality of LED chips arranged on the bracket.

[0047] The anti-bending LED bracket includes a bracket body 1, a metal layer 3 is arranged on the bracket body 1, a plurality of insulating channels 2 are arranged on the metal layer 3, and the metal layer 3 is divided into a first electrical connection part 31 and three second electrical connection parts 32 arranged around the first electrical connection part 31 based on the insulating channels 2.

[0048] Specifically, a plurality of LED chips are arranged on the bracket body 1, and the plurality of LED chips are arranged in the middle position of the first electrical connection part 31 to improve the light output efficiency of the LED device. The spacing between any two adjacent LED chips is d, and the value range of d is: 50μm<d≤200μm, so that the spacing between the LED chips meets the solid crystal requirements of the LED chips, and avoids the situation where the solid crystal glue between adjacent LED chips caused by the solid crystal equipment in the solid crystal device contacts each other, so as to ensure that the LED chip has a good solid crystal effect. At the same time, avoid excessive spacing between LED chips to ensure that the light color mixing effect between multiple LED chips meets the display requirements of the LED device and improves the light output efficiency of the LED device.

[0049] The metal layer 3 of the bracket body 1 forms a three-crystal pad structure based on the first electrical connection part 31 and the second electrical connection part 32, that is, three LED chips are arranged on the first electrical connection part 31, and the three LED chips include a red light chip 5, a blue light chip 4 and a green light chip 6. The red light chip 5, the blue light chip 4 and the green light chip 6 are arranged in a middle area of ​​the first electrical connection part 31, and the red light chip 5, the blue light chip 4 and the green light chip 6 are arranged in a herringbone shape, so that the red light chip 5, the blue light chip 4 and the green light chip 6 achieve a good light color mixing effect, thereby improving the light output display effect of the LED device.

[0050] Specifically, the red chip 5, the blue chip 4 and the green chip 6 are all dual-electrode chips, and the red chip 5, the blue chip 4 and the green chip 6 are electrically connected to the three-crystal pad structure of the bracket body 1 based on the welding wire. By means of the welding wire connection, the red chip 5, the blue chip 4 and the green chip 6 can be fixed on the first electrical connection part 31 of the bracket body 1 by the insulating crystal bonding glue, thereby reducing the risk of aging and cracking of the connection glue layer between the LED chip and the first electrical connection part 31, and improving the connection stability between the LED chip and the first electrical connection part 31.

[0051] For further information, please refer to Figure 3 The second electrical connection part 32 located at the lower right position of the bracket body has electrical opposite properties to the first electrical connection part 31, that is, the second electrical connection part 32 located at the lower right position of the bracket body is a common electrode pad, thereby realizing the common electrode connection between the red light chip 5, the blue light chip 4 and the green light chip 6, so as to arrange the circuits of the LED chips in the LED device.

[0052] Specifically, a plurality of LED chips in the LED device are provided with a plurality of welding wires, the plurality of welding wires including short-distance welding wires and long-distance welding wires spanning above the short-distance welding wires, the long-distance welding wires including a first vertical section 751, a first curved section 752, a first flat section 753 and a first inclined section 754, the short-distance welding wires including a second vertical section 721, a second curved section 722, a second flat section 723 and a second inclined section 724, the first vertical section 751 is connected to one end of the first flat section 753 based on the first curved section 752, and the other end of the first flat section 753 is connected to the first inclined section 754.

[0053] The connection relationship between the second vertical section 721, the second curved section 722, the second flat section 723 and the second inclined section 724 can refer to the connection relationship between the first vertical section 751, the first curved section 752, the first flat section 753 and the first inclined section 754, which will not be repeated here.

[0054] Specifically, the horizontal height of the first flat section 753 is greater than the horizontal height of the second flat section 723, and the length of the first flat section 753 is greater than the length of the second flat section 723, so that the long-distance welding wire can cross the short-distance welding wire to complete the wire bonding operation to meet the wire bonding operation of the LED chip in the LED device.

[0055] Specifically, several LED chips in the LED device are wire-bonded in a preset order to form several short-distance welding wires and one long-distance welding wire. In this embodiment, the LED device is provided with a first welding wire 71, a second welding wire 72, a third welding wire 73, a fourth welding wire 74, a fifth welding wire 75, and a sixth welding wire 76. The first welding wire 71, the second welding wire 72, the third welding wire 73, the fourth welding wire 74, the fifth welding wire 75, and the sixth welding wire 76 are wire-bonded in sequence to avoid mutual interference during the bonding process.

[0056] Further, the blue light chip 4 is electrically connected to the second electrical connection portion 32 at the lower right of the bracket body 1 based on the first welding wire 71, and the blue light chip 4 is electrically connected to the second electrical connection portion 32 at the upper right of the bracket body 1 based on the second welding wire 72;

[0057] The red light chip 5 is electrically connected to the second electrical connection portion 32 at the lower right of the bracket body 1 based on the fifth welding wire 75, and the red light chip 5 is electrically connected to the second electrical connection portion 32 at the upper left of the bracket body 1 based on the sixth welding wire 76;

[0058] The green chip 6 is electrically connected to the second electrical connection portion 32 at the lower right of the bracket body 1 based on the third welding wire 73, and the green chip 6 is electrically connected to the first electrical connection portion 31 based on the fourth welding wire 74, thereby realizing the common connection structure of the red chip 5, the blue chip 4 and the green chip 6.

[0059] Furthermore, the second welding wire 72 is a short-distance welding wire, and the fifth welding wire 75 is a long-distance welding wire. In this embodiment, after the fifth welding wire 75 crosses the second welding wire 72 and the blue light chip 4, the red light chip 5 is electrically connected to the second electrical connection portion 32 at the lower right of the bracket body 1. By completing the bonding operation of the second welding wire 72, the bonding operation of the fifth welding wire 75 is performed in the subsequent bonding process, avoiding collision and interference between the porcelain nozzle of the bonding equipment and the welding wire, thereby improving the reliability of the bonding operation of the LED device.

[0060] Furthermore, the long-distance welding wire can be set on a thicker LED chip, so that the horizontal height of the starting point of the long-distance welding wire is higher than the horizontal height of the starting point of the short-distance welding wire, thereby reducing the welding length of the first vertical section 751 in the long-distance welding wire, reducing the risk of collapse of the long-distance welding wire, and improving the stability of the wiring operation in the LED device.

[0061] The embodiment of the utility model provides an LED device, wherein the LED device forms a first electrical connection part 31 located in the middle and a second electrical connection part 32 located in the four corners by setting an insulating channel 2 at the corner position of the metal layer 3 of the bracket body 1, thereby avoiding the situation where the metal layer 3 on the bracket body 1 is penetrated and divided, and improving the bending resistance of the bracket. At the same time, a long-distance welding wire is set to realize the electrical connection between the LED chip and each electrical connection part, thereby improving the welding wire connection stability and reliability of the LED chip in the LED device, thereby improving the overall structural stability and reliability of the LED device, and improving the light output efficiency of the LED device.

[0062] In addition, the above is a detailed introduction to an anti-bending LED bracket and LED device provided in the embodiments of the utility model. Specific examples are used in this article to illustrate the principles and implementation methods of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A bending-resistant LED bracket, characterized in that: The anti-bending LED bracket comprises: a bracket body, a metal layer arranged on the bracket body, and a plurality of insulating channels arranged between the metal layers; The insulating channel is arranged in the corner direction of the metal layer, and the metal layer is divided into a first electrical connection portion and one or more second electrical connection portions based on the insulating channel; The second electrical connection portion is located at a corner of the metal layer, and a chip mounting area is disposed in the middle of the first electrical connection portion.

2. The anti-bending LED bracket according to claim 1, characterized in that: Any of the insulating channels is an L-shaped structure, and two ends of the L-shaped structure are correspondingly connected to two adjacent sides of the metal layer.

3. The anti-bending LED bracket according to claim 1, characterized in that: The material of the anti-bending LED bracket is one of PCT, EMC, SMC, PPA and ceramic.

4. The anti-bending LED bracket according to claim 1, characterized in that: At least one of the second electrical connection portions has an electrical property opposite to that of the first electrical connection portion.

5. An LED device, characterized in that: The LED device comprises: the anti-bending LED bracket according to any one of claims 1 to 4 and one or more LED chips; The LED chip is disposed on the first electrical connection portion, the LED chip is electrically connected to the first electrical connection portion based on a bonding wire, and the LED chip is electrically connected to the second electrical connection portion based on a bonding wire.

6. The LED device according to claim 5, characterized in that The support body forms a single crystal pad structure based on the first electrical connection portion and the second electrical connection portion; Or the bracket body forms a polycrystalline pad structure based on the first electrical connection part and the plurality of the second electrical connection parts.

7. The LED device according to claim 5, characterized in that The distance between any two adjacent LED chips is d, and the value range of d is: 50 μm<d≤200 μm.

8. The LED device according to claim 5, characterized in that A plurality of bonding wires are arranged in the LED device, and the plurality of bonding wires include at least one long-distance bonding wire and at least one short-distance bonding wire; The long distance bonding wire spans over the short distance bonding wire.

9. The LED device according to claim 8, characterized in that The long distance welding line comprises a first vertical section, a first curved section, a first flat section and a first inclined section; The first vertical section is connected to one end of the first flat section based on the first curved section, and the other end of the first flat section is connected to the first inclined section.

10. The LED device according to claim 9, characterized in that The short distance welding line includes a second gentle section; The horizontal height of the first flat section is greater than the horizontal height of the second flat section, and the length of the first flat section is greater than the length of the second flat section.

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