Multifunctional microsphere cross-linking curing instrument

Abstract

The multifunctional microsphere cross-linking curing instrument comprises a curing disc which is provided with a coil pipe groove for embedding a coil pipe; comprising a light source and a temperature regulation and control module, the light source irradiates the microspheres embedded in the coil pipe of the coil pipe groove to cure the microspheres, the temperature regulation and control module indirectly controls the temperature of the coil pipe embedded in the coil pipe groove by controlling the temperature of the curing disc, and temperature curing is conducted on the microspheres in the coil pipe. The multifunctional microsphere cross-linking curing instrument provided by the utility model is provided with the light source and the temperature regulation and control module, when the multifunctional microsphere cross-linking curing instrument is used, the coil pipe is embedded into the coil pipe groove of the curing disc, the light source is utilized to irradiate microspheres in the coil pipe to cure the microspheres when light curing is needed, and the temperature regulation and control module is utilized to adjust the temperature of the microspheres when temperature curing is needed. The temperature regulation and control module is used for controlling the temperature of the curing disc and indirectly controlling the temperature of the coil pipe, so that the microspheres in the coil pipe are cured at a certain temperature, and the functions are diversified.

Description

Technical Field

[0001] The utility model relates to the technical field of microsphere cross-linking and curing, in particular to a multifunctional microsphere cross-linking and curing instrument. Background Art

[0002] The microsphere cross-linking curing device is a device for cross-linking and curing microspheres. It includes a coil and a curing unit. When in use, the microspheres are pumped into the coil, and the curing unit cures the microspheres in the coil. There are generally two ways to cure microspheres, namely light curing and temperature curing. Light curing refers to curing the microspheres in the coil by irradiating them with a light source, and temperature curing refers to controlling the temperature of the coil with a temperature control module so that the microspheres in the coil are cured at a certain temperature. Existing microsphere cross-linking curing devices can only perform light curing or temperature curing, and their functions are single. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a multifunctional microsphere cross-linking curing device, which can perform both light curing and temperature curing on the microspheres in the coil.

[0004] In order to solve the above technical problems, the utility model discloses a multifunctional microsphere cross-linking curing instrument, which includes a curing disk, which has a coil groove for the coil to be embedded; and includes a light source and a temperature control module. The light source irradiates the microspheres in the coil embedded in the coil groove to cure them, and the temperature control module indirectly controls the temperature of the coil embedded in the coil groove by controlling the temperature of the curing disk, thereby temperature curing the microspheres in the coil.

[0005] Furthermore, a reflective cover is sleeved around the light source to reflect the light irradiated to the light source, and the opening of the reflective cover faces the coil groove of the curing disk so that the reflected light can be emitted from the opening to the coil groove of the curing disk.

[0006] Furthermore, a heat dissipation module is provided for dissipating heat from the light source.

[0007] Furthermore, the heat dissipation module includes a fin-type heat dissipation block that is close to the light source for heat conduction; and / or the heat dissipation module includes a heat dissipation fan that draws away the heat from the light source.

[0008] Furthermore, it includes a support frame, the curing disk is detachably placed on the support frame, the temperature control surface of the temperature control module is close to the support frame, and the temperature of the curing disk is indirectly controlled by controlling the temperature of the support frame.

[0009] Furthermore, a heat-conducting material is filled between the temperature-control surface of the temperature-control module and the support frame; and / or a heat-conducting film is attached to the surface of the support frame in contact with the curing plate.

[0010] Furthermore, the method includes pushing the temperature control surface of the temperature control module to a pushing member close to the support frame.

[0011] Furthermore, the temperature control module is a heating module, and the pushing member is an elastic insulation board.

[0012] Furthermore, the temperature control module is specifically a PI heating film, and its heating surface is attached to the curing disk.

[0013] Furthermore, it includes the coil; the coil groove is specifically opened on the top of the curing plate, the light source is arranged above the curing plate and emits light downward; the light source is an ultraviolet light source.

[0014] The multifunctional microsphere cross-linking curing instrument provided by the utility model is provided with both a light source and a temperature control module. When in use, the coil is embedded in the coil groove of the curing disk. When light curing is required, the light source is used to irradiate the microspheres in the coil to cure them. When temperature curing is required, the temperature control module is used to control the temperature of the curing disk, indirectly controlling the temperature of the coil so that the microspheres in the coil are cured at a certain temperature. The instrument has various functions. Since the coil is embedded in the coil groove of the curing disk, when the temperature control module indirectly controls the temperature of the coil through the curing disk, the groove wall of the coil groove acts as a heat-conducting wall, which contacts and conducts heat with the coil, so that the curing disk and the coil have a large contact area and a good temperature control effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the curing instrument with its cover opened, with the perspective of looking at the curing instrument from obliquely above.

[0016] Figure 2 This is a schematic diagram of the curing instrument with its cover opened, with the perspective of looking at the curing instrument from obliquely below.

[0017] Figure 3 It is an exploded view of the support frame, curing plate, coil, pressure plate, mounting frame, PI heating film and elastic insulation board.

[0018] Figure 4 This is a schematic diagram of the curing instrument after the lid is closed, and the perspective in the figure is looking at the curing instrument from an oblique rear side.

[0019] Figure 5 This is a top view of the curing instrument with the lid closed.

[0020] Figure 6 yes Figure 5 CC section view of the vehicle, showing only the part above the base.

[0021] Figure 7 yes Figure 6 A partial enlarged picture of Figure 6 The A part.

[0022] Figure 8 yes Figure 6 A partial enlarged picture of Figure 6 Part B. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with specific implementation methods.

[0024] Microsphere cross-linking curing instrument Figure 1 , including a base 8, a support frame 4 is provided on the top of the base 8, a curing plate 1 is placed on the top of the support frame 4, a coil groove 11 is opened on the top of the curing plate 1, and a light-transmitting coil 9 is embedded in the coil groove 11. The curing plate 1 is installed with a light-transmitting pressing plate 10 on the top of the coil 9 by magnetic attraction to prevent the coil 9 from accidentally falling out of the coil groove 11. A shell 81 is installed on the base 8, and a cover 810 is hinged on the top of the shell 81. The cover 810 can be rotated to cover, and after covering, Figure 4 See Figure 2 , Figure 3 The curing device is provided with an ultraviolet light source 2 and a temperature control module 3, which can perform both light curing and temperature curing on the microspheres in the coil 9, and has various functions. Specifically, the microspheres are pumped into the coil 9 from the inlet end 91 of the coil 9, and move along the coil 9. The user first covers the cover 810, and then either uses the ultraviolet light source 2 to irradiate the microspheres in the coil 9 to perform light curing on the microspheres, or uses the temperature control module 3 to control the temperature of the curing disk 1, and indirectly controls the temperature of the coil 9, so that the microspheres in the coil 9 are temperature cured at a certain temperature. The cured microspheres leave the coil 9 from the outlet end 92 of the coil 9.

[0025] See Figure 1 and Figure 2 A fixed cover 21 is installed on the top of the shell 81, and the ultraviolet light source 2 is installed in the fixed cover 21. In this embodiment, an ultraviolet lamp board 2 is used as the ultraviolet light source 2. The ultraviolet lamp board 2 is located above the curing disk 1, with its front side facing downward, and is provided with 5 rows and 5 columns of 25 ultraviolet lamps 20. An opening 211 is opened at the bottom of the fixed cover 21, and the opening 211 faces the coil groove 11 of the curing disk 1. A touch screen 80 is embedded in the front side of the base 8, and the touch screen 80 is electrically connected to the ultraviolet lamp board 2. When the microspheres in the coil 9 need to be photocured, the user operates the touch screen 80 to power on the ultraviolet lamp board 2, and the ultraviolet lamp board 2 acts as an ultraviolet light source, and the 25 ultraviolet lamps 20 on the front side emit ultraviolet light downward. Most of the ultraviolet light is directed downward through the opening 211 of the fixed cover 21 to the curing groove 11 of the curing plate 1, irradiating the coil 9 embedded in the curing groove 11 and the microspheres in the coil 9, so that the microspheres in the coil 9 are cured; a small part of the ultraviolet light is directed to the side of the ultraviolet lamp board 2, as shown in FIG. Figure 6 and Figure 7The fixed cover 21 on the side of the UV lamp panel 2 is used as a reflector to reflect the light directed to the side of the UV lamp panel 2. After multiple reflections, the light will be projected from the opening 211 of the fixed cover 21 to the coil groove 11 of the curing disk 1. When the UV lamp panel 2 is powered on, it will generate a lot of heat. For this reason, the curing device is provided with a heat dissipation module 22 inside the fixed cover 21 to dissipate heat for the UV lamp 20. Figure 6 The heat dissipation module 22 includes a fin-shaped heat dissipation block 221 attached to the back of the ultraviolet lamp board 2, and also includes a heat dissipation fan 222 installed above the fin-shaped heat dissipation block 221. The touch screen 80 (see Figure 2 ) is electrically connected to the cooling fan 222. Figure 4 , Figure 5 and Figure 6 The housing 81 has an air inlet 811 on the back and an air outlet 812 on the top. The air inlet 811 and the air outlet 812 lead to the interior of the fixed cover 21 and are aligned with the heat dissipation module 22. The fin-type heat dissipation block 221 is attached to the back of the UV lamp board 2, and the heat of the UV lamp board 2 is transferred to the fins 223. The outside air enters the interior of the fixed cover 21 from the air inlet 811, and becomes hot air after absorbing the heat of the fins 223. The user operates the touch screen 80 (see FIG. Figure 2 ) starts the heat dissipation fan 222 to draw away the hot air from the bottom to the top, and the hot air is discharged from the air outlet 812. The heat of the hot air comes from the ultraviolet lamp board 2, so the heat dissipation fan 222 essentially draws away the hot air from the ultraviolet lamp board 2, thereby dissipating the heat for the ultraviolet lamp board 2.

[0026] See Figure 3 A graphite thermal conductive film 41 is sandwiched between the curing disk 1 and the support frame 4, and the graphite thermal conductive film 41 is attached to the top surface of the support frame 4. A mounting frame 42 is detachably installed below the support frame 4 by means of bolt connection, and the temperature control module 3 is arranged on the inner side of the mounting frame 42. The present embodiment adopts the PI heating film 3 as the temperature control module 3, and the PI heating film 3 is an existing heating module. An elastic thermal insulation board 6 is also provided on the inner side of the mounting frame 42, and the elastic thermal insulation board 6 is located below the PI heating film 3. The elastic thermal insulation board 6 is an asbestos board or a glass fiber wool board, and can also be made of other elastic thermal insulation materials. The elastic thermal insulation board 6 is used as a pushing piece to push the PI heating film 3 upwards until it is close to the support frame 4. Figure 8 , thermal conductive silicone grease (not shown in the figure) is filled between the heating surface 31 on the top of the PI heating film 3 and the support frame 4. The thermal conductive silicone grease is used as a heat-conducting material to conduct heat between the heating surface 31 on the top of the PI heating film 3 and the support frame 4. A temperature sensor 40 is provided inside the support frame 4. The temperature sensor 40 indirectly detects the temperature of the curing disk 1 by detecting the temperature of the support frame 4, and in this way indirectly detects the temperature of the coil 9 on the curing disk 1. The curing instrument is provided with a controller (not shown in the figure), which is electrically connected to the PI heating film 3 and the temperature sensor 40, and is also electrically connected to the touch screen 80 (see Figure 2 ).See Figure 2 , Figure 8 When the microspheres in the coil 9 need to be cured by temperature, the user sets the curing temperature (for example, 50 to 60 degrees Celsius) on the touch screen 80, and the touch screen 80 sends the temperature information to the controller. The temperature sensor 40 detects the temperature of the coil 9 and sends the temperature information to the controller. The controller compares and finds that the temperature of the coil 9 is lower than the curing temperature, and then controls the PI heating film 3 to be energized and heated. The PI heating film 3 indirectly controls the temperature of the curing disk 1 by controlling the temperature of the support frame 4, and then indirectly controls the temperature of the coil 9 embedded in the coil groove 11. Specifically: the PI heating film 3 serves as a temperature control module, and the heating surface 31 on its top serves as a temperature control surface, which is close to the support frame 4 to heat the support frame 4. During this process, the elastic insulation cotton 6 padded under the PI heating film 3 can isolate the bottom surface of the PI heating film 3 from the outside world to prevent heat from leaking from the bottom surface of the PI heating film 3; the support frame 4 transfers heat to the curing disk 1, and during this process, the graphite thermal conductive film 41 sandwiched between the two can achieve a good thermal conductivity effect; the curing disk 1 transfers heat to the coil 9 to heat the coil 9. During this process, since the coil 9 is embedded in the coil groove 11 of the curing disk 1, the groove wall 111 of the coil groove 11 serves as a heat conduction wall, which contacts and conducts heat with the coil 9, so the curing disk 1 and the coil 9 have a large contact area and a good temperature control effect. The controller reversely adjusts the heating power of the PI heating film 3 according to the detection result of the temperature sensor 40, so that the coil 9 can be maintained near the curing temperature after being heated to the curing temperature, so that the microspheres in the coil 9 can be temperature-cured at the curing temperature.

[0027] See Figure 3 , since the curing disk 1 is placed on the support frame 4 and is detachable, the user can remove the original curing disk 1 from the support frame 4 and replace it with a new curing disk 1 with other coil grooves 11. Since the graphite thermal conductive film 41 is attached to the top surface of the support frame 4 instead of the bottom surface of the curing disk 1, when the user takes away the original curing disk 1, the curing disk 1 will not take away the graphite thermal conductive film 41, so when the user replaces the curing disk 1, there is no need to prepare a new graphite thermal conductive film 41. If the microspheres need to be cured at a lower temperature, the user removes the mounting frame 42 together with the PI heating film 3 and the elastic insulation board 6 thereon, and then installs a semiconductor refrigeration module under the support frame 4. The semiconductor refrigeration module serves as a temperature control module to cool the support frame 4, and indirectly cools the curing disk 1 and the coil 9 on the curing disk 1, so that the microspheres in the coil 9 are cured at a lower temperature.

[0028] See Figure 1 and Figure 2In this embodiment, the ultraviolet light source 3 is used to photo-cure the microspheres. The coil groove 11 is opened on the top of the curing plate 1, and the ultraviolet light source 3 is arranged above the curing plate 1 to emit light downward. In other embodiments, a visible light source or an infrared light source can be used to photo-cure the microspheres, or the coil groove can be changed to be opened at the bottom of the curing plate, and correspondingly, the light source can be changed to be arranged below the curing plate to emit light upward.

[0029] Non-preferred embodiments see Figure 6 : The heat dissipation module 22 can be changed to be provided with only a fin-type heat dissipation block 221 or only a heat dissipation fan 222. The reflective cover 21 and the heat dissipation module 22 can also be omitted, and the UV plate 2 can be directly installed on the shell 81; the curing disk 1 can be changed to be fixed on the support frame 4; an ordinary elastic plate can be used as a pushing member to replace the elastic insulation plate 6.

[0030] The above is only an implementation method of the invention, and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the invention, which still fall within the scope of patent protection.

Claims

1. Multifunctional microsphere cross-linking curing instrument, characterized by: The invention comprises a curing plate, which has a coil groove for the coil to be embedded; a light source and a temperature control module, the light source irradiates the microspheres in the coil embedded in the coil groove to cure the microspheres; the temperature control module indirectly controls the temperature of the coil embedded in the coil groove by controlling the temperature of the curing plate, and performs temperature curing on the microspheres in the coil.

2. The microsphere cross-linking curing device according to claim 1, characterized in that: A reflective cover is sleeved around the light source to reflect the light irradiated to the light source, and the opening of the reflective cover faces the coil groove of the curing disk so that the reflected light can be emitted from the opening to the coil groove of the curing disk.

3. The microsphere cross-linking curing device according to claim 1, characterized in that: A heat dissipation module is provided for dissipating heat from the light source.

4. The microsphere cross-linking curing device according to claim 3, characterized in that: The heat dissipation module includes a fin-shaped heat dissipation block that is close to the light source for heat conduction; and / or the heat dissipation module includes a heat dissipation fan that draws away the heat from the light source.

5. The microsphere cross-linking curing apparatus according to claim 1, characterized in that: It comprises a support frame, on which a curing plate is detachably placed, and a temperature control surface of a temperature control module is closely attached to the support frame, so that the temperature of the curing plate is indirectly controlled by controlling the temperature of the support frame.

6. The microsphere cross-linking curing apparatus according to claim 5, characterized in that: A heat-conducting material is filled between the temperature-control surface of the temperature-control module and the support frame; and / or a heat-conducting film is attached to the surface of the support frame in contact with the curing plate.

7. The microsphere cross-linking curing apparatus according to claim 5, characterized in that: The method includes pushing the temperature control surface of the temperature control module to a pushing piece close to the support frame.

8. The microsphere cross-linking curing device according to claim 7, characterized in that: The temperature control module is a heating module, and the pushing piece is an elastic insulation board.

9. The microsphere cross-linking curing apparatus according to claim 1, characterized in that: The temperature control module is specifically a PI heating film, and its heating surface is attached to the curing plate.

10. The microsphere cross-linking curing apparatus according to claim 1, characterized in that: The invention comprises the coil; the coil groove is specifically opened on the top of the curing plate; the light source is arranged above the curing plate and emits light downward; the light source is an ultraviolet light source.

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