Molding film mechanism for packaging film and packaging machine

Abstract

A molding film mechanism for a packaging film is provided with a film drawing frame, molding film plates arranged up and down, a film guide rod matched with the upper molding film plate and a guide plate matched with the lower molding film plate. Wherein the mold film plate, the guide plate and the film guide rod are connected to the same side of the film drawing frame; and after being unfolded, the double-layer laminated film is oppositely folded and separated by the film guide rod and the guide plate along the fold line of the film, so that a single-layer film bin with a flat C-shaped structure is formed. According to the film forming mechanism for the packaging film, the structure is simple, control is easy, film packaging of a special structure can be rapidly and accurately obtained, the formed film bin can package most of the surface of a silicon wafer, the packaged film bin is of a single-side opening structure, part of the silicon wafer is exposed outside, follow-up unpacking is facilitated, the film forming effect is good and stable, and the film forming efficiency is high. And the molding efficiency is high. The utility model further provides a packaging machine provided with the mold film mechanism.

Description

Technical Field

[0001] The present application belongs to the technical field of silicon wafer packaging, and in particular relates to a film forming mechanism for packaging film and a packaging machine provided with the film forming mechanism. Background Art

[0002] When packaging silicon wafers, they are completely wrapped in a film. However, this wrapping method is not convenient for subsequent unpacking, which makes unpacking difficult and damages the silicon wafers. How to prepare a film-forming structure for packaging film that is easy to unpack is an important key to improving packaging quality and unpacking efficiency, as well as ensuring the quality of silicon wafers. Summary of the invention

[0003] The present application provides a film forming mechanism for packaging film and a packaging machine provided with the film forming mechanism, which solves the technical problems in the prior art of the packaging film fully covering the silicon wafers, such as the difficulty in unpacking and the damage to the silicon wafers during unpacking.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A film forming mechanism for packaging film comprises a film drawing frame, film forming plates arranged up and down, a film guiding rod matched with the upper film forming plate, and a guide plate matched with the lower film forming plate; wherein the film forming plate, the guide plate and the film guiding rod are all connected to the same side of the film drawing frame; after the double-layer superimposed film is unfolded, it is folded in opposite directions by the film guiding rod and the guide plate along the fold line of the film to form a single-layer film bin with a flat C-shaped structure.

[0006] Furthermore, the membrane silo is constructed as a long silo with one side closed and the other three sides open, and its length direction is consistent with the length direction of the silicon wafer;

[0007] Preferably, the width of the membrane bin is smaller than the width of the silicon wafer and not smaller than 3 / 4 of the width of the silicon wafer 30 .

[0008] Furthermore, the film-drawing frame comprises an upper film-drawing frame and a lower film-drawing frame, the upper film plate and the film-guiding rod are connected to the upper film-drawing frame; the lower film plate and the guide plate are connected to the lower film-drawing frame.

[0009] Furthermore, the upper film frame and the lower film frame are connected by a guide column; an adjustable screw is provided on the lower film frame, which cooperates with the fixed block on the upper film frame, and the height of the screw is rotated to adjust the height between the upper film frame and the lower film frame;

[0010] Preferably, the pull-down film frame also has an adjustable chassis for adjusting its width and a vertically adjustable frame for adjusting its height.

[0011] Furthermore, rollers arranged opposite to each other are respectively arranged on the upper film frame and the lower film frame, and the rollers are connected through gear assemblies arranged on the sides of the upper film frame and the lower film frame, and are driven to rotate by a cylinder arranged on the top of the upper film frame.

[0012] Furthermore, the diaphragm plates are all of right-angled trapezoidal structure, with one side of the long right-angled section close to the closed fold line side of the membrane bin and the inclined side arranged toward the opening side of the membrane bin.

[0013] Furthermore, two cross-placed film guide rods are provided below the upper film plate, and the intersection point is located at the long right angle of the film plate; the gap between the film guide rod and the upper film plate is passed through by a single side of the film bin;

[0014] Preferably, the intersecting sections of the film-guiding rods are all straight lines, and the non-intersecting sections are cambered curves, which are mounted on the film-drawing frame via fixing rods.

[0015] Furthermore, the guide plate is placed on one side of the long right-angle side of the lower diaphragm plate, and the gap between the guide plate and the lower diaphragm plate is passed through by the other single side of the diaphragm bin;

[0016] Preferably, the length of the guide plate is greater than the length of the long right-angle side of the lower diaphragm.

[0017] Furthermore, a positioning rod is provided on a side of the guide plate away from the diaphragm plate, and the length of the positioning rod is greater than the length of the guide plate.

[0018] A packaging machine is provided with the film forming mechanism as described above.

[0019] The film forming mechanism for packaging film designed by the present application has a simple structure and is easy to control, and can quickly and accurately obtain a film package with a specially designed structure. The formed film bin can wrap most of the surface of the silicon wafer. The film bin after packaging is a single-side opening structure, and part of the silicon wafer is exposed to the outside, which is convenient for subsequent unpacking. The film forming effect is good and stable, and the forming efficiency is high. The present application also proposes a packaging machine provided with the film forming mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a three-dimensional diagram of a film forming mechanism according to an embodiment of the present application;

[0021] Figure 2 is a top view of a mold film mechanism according to an embodiment of the present application;

[0022] Figure 3 It is a schematic diagram of the change from a double-layer stacked film to a single-layer film bin in one embodiment of the present application;

[0023] Figure 4 This is a schematic diagram of silicon wafers packaged in a film bin according to an embodiment of the present application.

[0024] Figure 5 This is a partial three-dimensional diagram of a film forming mechanism according to an embodiment of the present application;

[0025] Figure 6 It is a three-dimensional diagram of a pull-up film frame according to an embodiment of the present application;

[0026] Figure 7 It is a three-dimensional diagram of a pull-down film frame according to an embodiment of the present application.

[0027] In the figure:

[0028] 100, film forming mechanism 10, film pulling frame 11, upper film pulling frame

[0029] 12. Pull-down film frame 13. Guide column 14. Screw

[0030] 15. Adjustable chassis 16. Adjustable frame 17. Roller

[0031] 18. Cylinder 19. Gear assembly 20. Diaphragm plate

[0032] 30, silicon wafer 40, membrane chamber 50, membrane guide rod 1

[0033] 60, film guide rod 2 70, guide plate 80, positioning rod DETAILED DESCRIPTION

[0034] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] This embodiment provides a film forming mechanism 100 for packaging film, such as Figure 1-2 As shown, it includes a film-drawing frame 10, film plates 20 placed up and down, a film-guiding rod matched with the upper film plate 20, and a guide plate 70 matched with the lower film plate 20; wherein the film plate 20, the guide plate 70 and the film-guiding rod are all connected to the film-drawing frame 10 and are placed on the same side of the film-drawing frame 10. After the double-layer stacked film is unfolded, it enters from the side of the film plate 20, and is then folded in reverse along the fold line of the film by the film-guiding rod and the guide plate 70 to form a single-layer film bin 40 with a flat C-shaped structure. Part of the width of the silicon wafer 30 is wrapped inside it along the width direction of the silicon wafer 30, and the change process of the forming film bin 40 is shown as follows. Figure 4 shown.

[0036] like Figure 3-4 As shown, the membrane bin 40 is constructed as a long silo which is closed on one side and open on the other three sides, and its length direction is consistent with the length direction of the silicon wafer 30, and the width of the membrane bin 40, that is, the dimension along the width direction of the conveyor belt, is smaller than the dimension of the silicon wafer 30 along the width direction of the conveyor belt, so that the membrane bin 40 wraps most of the width of the silicon wafer 30 in its bin.

[0037] The open side of the double-layer folded film is the entrance to the film bin 40 that faces away from the film bin. After being separated at the back side at the fold line, one single side passes through the gap between the film guide rod and the upper film plate 20, and the other single side passes through the gap between the guide plate 70 and the lower film plate 20, forming a flat C-shaped film bin 40, which can then half-wrap the conveyor belt and the silicon wafer 30.

[0038] like Figure 4 As shown, the arrow indicates the direction of silicon wafer transmission. After the film bin 40 is sealed and cut by the film cutter for the first time, it will be shaped into a single-corner open film bin 40, which is the port and solid line end that are first sealed and cut along the transmission direction in the figure. After the second sealing and cutting, the surface of the other solid line end in the film bin 40 is sealed, leaving only the end surface where the exposed section of the silicon wafer 30 is open. That is, the length L1 of the film bin 40 can completely wrap the length L of the silicon wafer 30, while the width W1 of the film bin 40 is smaller than the width W of the silicon wafer 30 and exposes part of the width W of the silicon wafer 30 outside.

[0039] Preferably, the width W1 of the film bin 40 is smaller than the width W of the silicon wafer 30 and not smaller than 3 / 4 of the width W of the silicon wafer 30, that is, part of the silicon wafer 30 is wrapped in the film bin 40, so that a small part of the width of the silicon wafer 30 is exposed, that is, not wrapped by the film, and the unwrapped side end is the side of the silicon wafer 30 away from the film feeding mechanism, and the partial exposure is not guaranteed, which is convenient for the subsequent film removal operation and will not damage the surface quality of the silicon wafer 30. The direction of the arrow in the figure is the transmission and movement direction of the silicon wafer 30, the thick line end in the film bin 40 is the sealing cut, and the double dashed line end is the opening end. After the quality of the silicon wafer 30 is protected to the maximum extent and it is wrapped with a film, it is convenient for subsequent manual unpacking.

[0040] The film bin 40 is a flat silo structure, with only the fold line edge being a closed edge, and the other three sides being open edges. When the previous group of silicon wafers is moved away, the film bin 40 near one end of the film pulling frame 10 is sealed, and the film bin 40 is configured as a single corner edge being a sealed structure before the silicon wafers 30 enter the bin, and the other corner edge is an open structure. After the next group of silicon wafers 30 enter the film bin 40, they are sealed again by the film cutting machine, and the film bin 40 is formed into an independent packaging film with one side open and three sides closed, such as Figure 4 After thermoforming, the single-sided opening surface is tightly attached to the upper and lower planes of the silicon wafer, making it easy to unpack when opening the film later.

[0041] The double-layer stacked film is unfolded by the film feeding mechanism and conveyed to the side of the film assembly, that is, unfolded along the side of the silicon wafer 30 in the transmission direction. This is a conventional structure in the art and is omitted in the drawings.

[0042] like Figure 5As shown, the film-pulling frame 10 is a structure with adjustable positions up and down and left and right, and the upper film plate 20 and the lower film plate 20 are aligned and placed on the upper and lower sides of the conveyor belt. The film guide rod is located below the upper film plate 20 and a gap is reserved, and the guide plate 70 is placed above the lower film plate 20 and a gap is reserved. One side of the film bin 40 passes through the gap between the film guide rod and the upper film plate 20, and the other side crosses the guide plate 70 and passes along the lower film plate 20, and half of the silicon wafer 30 on the conveyor belt is wrapped therein.

[0043] like Figure 6-7 As shown, the film frame 10 includes an upper film frame 11 and a lower film frame 12, and the upper film plate 20 and the film guide rod are both connected to the upper film frame 11; the lower film plate 20 and the guide plate 70 are both connected to the lower film frame 12. The upper film frame 11 and the lower film frame 12 are connected through a guide column 13; the conveyor belt passes through the middle of the upper film frame 11 and the lower film frame 12 to send the silicon wafer 30 into the film cutting machine. An adjustable screw 14 is provided on one side of the lower film frame 12, which cooperates with the fixed block on the upper film frame 11, and the upper film frame 11 and the lower film frame 12 are adjustable through the guide column 13. The height of the screw 14 can be rotated, so that the height between the upper film frame 11 and the lower film frame 12 can be adjusted along the height direction of the guide column 13 to adjust the height of the film bin 40, that is, to adjust the thickness of the silicon wafer 30.

[0044] The pull-down film frame 12 is also provided with an adjustable chassis 15 for adjusting the width of the pull-down film frame 10 across the conveyor belt, and a vertical adjustable frame 16 for adjusting the height of the pull-down film frame 12. The adjustable chassis 15 can be used to adjust the width of the film bin 40; the vertical adjustable frame 16 can be used to adjust the position height of the lower film plate 20 to reduce the height between the lower film plate 20 and the conveyor belt, thereby adjusting the height of the film bin 40. The adjustable chassis 15 and the vertical adjustable frame 16 are both installed and adjusted by the position of the long strip holes provided thereon through the cooperation of bolts and nuts.

[0045] The width of the film-pulling frame 10 is set to span the width of the conveyor belt and is placed on the upper and lower sides of the conveyor belt. It can adjust the height spacing between the upper and lower film plates 20 based on the position height of the conveyor belt or the height of the packaged silicon wafer 30 to adapt to film bins 40 with different thickness requirements.

[0046] Rollers 17 are provided on the upper film frame 11 and the lower film frame 12 respectively, which are used to drive the film bin 40 to move up and down. The rollers 17 are connected by gear assemblies 19 disposed on the sides of the upper film frame 11 and the lower film frame 12. The gear assemblies 19 are driven to rotate by the cylinder 18 disposed on the top of the upper film frame 11, so as to drive the rollers 17 disposed in the corresponding position to rotate, thereby driving the film bin 40 to move forward. Accordingly, the conveyor belt drives the silicon wafer to move forward together, so as to keep the film bin 40 and the silicon wafer 30 moving together for transmission.

[0047] The upper and lower molded film plates 20 are both right-angled trapezoidal structures, and are arranged on the upper film frame 11 and the lower film frame 12 in a top-to-bottom position, and are placed on the upper and lower sides of the conveyor belt. The right-angled sides of the molded film plates 20 are fixed on the film frame 10; and the long right-angled sides are arranged close to the folding line side of the film bin 40, and the oblique angled sides are arranged toward the side of the inlet of the film bin 40.

[0048] There are two film guide rods, which are cross-arranged below the upper film plate 20, and the intersection is located at the long right angle of the film plate 20; the two film guide rods are film guide rod 1 50 arranged along the transmission direction of the conveyor belt and film guide rod 2 60 arranged along the width direction of the conveyor belt. The two film guide rods are cross-vertically located on the side of the upper film plate 20 close to the silicon wafer 30, and the two film guide rods are arranged at the same height and are configured with a gap with the upper film plate 20. Among them, the film guide rod 1 50 is located on the long side of the upper film plate 20, and the film guide rod 2 60 is located on the side of the upper film plate 20 close to the film drawing frame 10.

[0049] In this embodiment, the intersection sections of the film guide rod 1 50 and the film guide rod 2 60 are both straight lines, and the non-intersection sections are cambered curves. The purpose is not only to limit the range of film movement in the film bin 40, but also to facilitate the installation of its main body on the upper film frame 11 through the fixing rod.

[0050] At the same time, the guide plate 70 is placed above the long right-angle side of the lower film plate 20 and close to one side of the film feeding mechanism. It is vertically arranged below the film guide rod 50, with the purpose of supporting the height of the folding line corner in the film bin 40 so that its lower side can pass under the conveyor belt and unfold through the lower film plate 20. The guide plate 70 is arranged with a gap between the lower film plate 20 and is located at the long side of the lower film plate 20. One end of the guide plate 70 is fixed to the film pulling frame 10, and the other end is fixed to the fixed frame of the conveyor belt.

[0051] like Figure 1 and Figure 3 As shown, in order to further ensure that the double-layered film will not be stuck and deformed when being molded into a single-layer film bin, a positioning rod 80 is provided on the outer side of the guide plate 70, that is, on the side away from the film forming plate 20, and its length is greater than the length of the guide plate 75, which is used to position and tighten the double-layered film on the film feeding mechanism to prevent it from sticking to the film bin 40 after being folded. The positioning rod 80 is located between the height of the film guide rod 50 and the guide plate 70, one end of which is fixed to the pull-down film frame 12, and the other end is fixed to the fixed frame of the conveyor belt.

[0052] When forming the film, the double-layer stacked film is unfolded and enters from the side of the film plate 20, and is then folded in half along the fold line of the film by the film guide rod and the guide plate 70. One side of the film passes through the gap between the film guide rod and the upper film plate 20, and the other side crosses the guide plate 70 and passes through the gap between the guide plate 70 and the lower film plate 20, forming a flat C-shaped single-layer film bin 40 that can half-wrap the silicon wafer 30 on the conveyor belt.

[0053] During packaging, after the film bin 40 is sealed and cut for the first time by the film cutting machine, it will be shaped into a single-corner open film bin 40, which is the port and solid line end that are first sealed and cut along the transmission direction in the figure. After the second sealing and cutting, the surface of the other solid line end in the film bin 40 is sealed, leaving only the end surface where the exposed section of the silicon wafer 30 is open.

[0054] The packaging film forming mechanism designed by the present application is used to form silicon wafers of different shapes and sizes, and can form the silicon wafers according to the shape requirements, identify the silicon wafers and automatically adjust, and can form the silicon wafers on one side or on both sides. The structure is simple and easy to control, the forming effect is good and stable, and the quality of the silicon wafers can be guaranteed. The present application also proposes a production line equipped with the forming mechanism.

[0055] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A film forming mechanism for packaging film, used for forming a film bin for silicon wafer packaging, characterized in that: It has a film-pulling frame, upper and lower film-forming plates, a film-guiding rod matched with the upper film-forming plate, and a guide plate matched with the lower film-forming plate; wherein the film-forming plate, the guide plate and the film-guiding rod are all connected to the same side of the film-pulling frame; after the double-layered film is unfolded, it is folded in opposite directions along the fold line of the film by the film-guiding rod and the guide plate to form a single-layer film bin with a flat C-shaped structure.

2. A film forming mechanism for packaging film according to claim 1, characterized in that: The membrane silo is constructed as a long silo with one side closed and the other three sides open, and its length direction is consistent with the length direction of the silicon wafer.

3. A film forming mechanism for packaging film according to claim 2, characterized in that: The width of the membrane bin is smaller than the width of the silicon wafer and not smaller than 3 / 4 of the width of the silicon wafer.

4. A film forming mechanism for packaging film according to any one of claims 1 to 3, characterized in that: The film-drawing frame comprises an upper film-drawing frame and a lower film-drawing frame, wherein the upper film plate and the film-guiding rod are connected to the upper film-drawing frame; and the lower film plate and the guide plate are connected to the lower film-drawing frame.

5. A film forming mechanism for packaging film according to claim 4, characterized in that: The upper film frame and the lower film frame are connected by a guide column; an adjustable screw is provided on the lower film frame, which cooperates with the fixed block on the upper film frame, and the height of the screw is rotated to adjust the height between the upper film frame and the lower film frame.

6. A film forming mechanism for packaging film according to claim 4, characterized in that: The pull-down film frame also has an adjustable chassis for adjusting its width and a vertically adjustable frame for adjusting its height.

7. A film forming mechanism for packaging film according to claim 4, characterized in that: The upper film frame and the lower film frame are respectively provided with rollers arranged opposite to each other. The rollers are connected through gear assemblies arranged on the sides of the upper film frame and the lower film frame, and are driven to rotate by a cylinder arranged on the top of the upper film frame.

8. A film forming mechanism for packaging film according to any one of claims 1-3, 5-7, characterized in that: The diaphragm plates are all of right-angle trapezoidal structure, with one side of the long right-angle section close to the closed fold line side of the membrane bin and the inclined side arranged toward the opening side of the membrane bin.

9. A film forming mechanism for packaging film according to claim 8, characterized in that: Two crossed film guide rods are arranged below the upper film plate, and the intersection point is located at the long right angle of the film plate; the gap between the film guide rod and the upper film plate is passed through by a single side of the film bin.

10. A film forming mechanism for packaging film according to claim 9, characterized in that: The intersecting sections of the film-guiding rods are all straight lines, and the non-intersecting sections are cambered curves, which are mounted on the film-drawing frame through fixing rods.

11. A film forming mechanism for packaging film according to claim 9 or 10, characterized in that: The guide plate is placed on one side of the long right-angle side of the lower diaphragm plate, and the gap between the guide plate and the lower diaphragm plate is passed through by the other single side of the diaphragm bin.

12. A film forming mechanism for packaging film according to claim 11, characterized in that: The length of the guide plate is greater than the length of the long right-angle side of the lower diaphragm plate.

13. A film forming mechanism for packaging film according to any one of claims 1-3, 5-7, 9-10, and 12, characterized in that: A positioning rod is arranged on one side of the guide plate away from the diaphragm plate, and the length of the positioning rod is greater than the length of the guide plate.

14. A packaging machine, characterized in that: The device is provided with a film forming mechanism as described in any one of claims 1 to 13.

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